Substrate support apparatus, semiconductor processing apparatus, and method of use

By adjusting the substrate tilt using an elastic component driven by a linear actuator, the problem of reduced accuracy caused by wear of the support component is solved, maintenance costs are reduced, and process uniformity and wafer yield are improved.

CN122161370APending Publication Date: 2026-06-05ADVANCED MICRO FAB EQUIP INC CHINA

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ADVANCED MICRO FAB EQUIP INC CHINA
Filing Date
2024-12-03
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In existing semiconductor processing equipment, the hinges of the support components are prone to wear after long-term operation, which leads to reduced accuracy of substrate position adjustment and high maintenance costs.

Method used

The elastic components driven by linear actuators, including springs and bending springs, adjust the tilt of the base plate through elastic deformation, avoiding hinge wear and ensuring accuracy.

Benefits of technology

This technology enables high-precision adjustment of substrate tilt, reduces maintenance costs, and improves the uniformity of process results and wafer fabrication yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a substrate supporting device, a semiconductor processing device and a using method. The substrate supporting device comprises a bearing plate, a supporting rod arranged on the bearing plate and used for supporting a substrate, a plurality of linear actuators, a guide rod of the linear actuator reciprocally moving along a vertical direction, the guide rod being connected with the bearing plate through an elastic assembly, and the guide rod moving to drive the elastic assembly to elastically deform, so that the bearing plate and the substrate are inclined to adjust the inclination of the substrate. The elastic assembly comprises a first supporting plate fixedly connected with the guide rod, a second supporting plate oppositely arranged with the first supporting plate and fixedly connected with the bearing plate, a spring fixed between the first supporting plate and the second supporting plate, and a plurality of curved elastic sheets fixedly connected with the first supporting plate and the second supporting plate. The application can not only guarantee the adjustment accuracy of the inclination of the substrate, but also effectively reduce the maintenance cost.
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