An automatic and chemical polishing method based on direct current power regulation

Abstract

This invention discloses an automated and chemical polishing method based on DC power supply control, relating to the field of metal surface treatment technology. The method includes: placing the workpiece to be polished as the anode in an electrolytic cell; applying preset electrical parameters through a DC power supply to trigger an electrochemical dissolution reaction; simultaneously or alternately performing mechanical or fluid-assisted polishing to remove reaction products; real-time monitoring of process parameters such as current density, electrolyte potential, temperature, or surface roughness and feeding them back to the control system; the system dynamically adjusting the power output parameters or polishing parameters based on the monitoring data and preset endpoint conditions, until the polishing endpoint is reached, at which point it automatically terminates. This invention achieves high efficiency, stability, and automation of the polishing process through the synergistic effect of electrochemical and mechanical polishing and intelligent closed-loop control, effectively improving polishing efficiency and surface quality consistency.

Description

Technical Field

[0001] This invention relates to the field of surface treatment technology for metal and alloy materials, specifically to an automated and chemical polishing method based on DC power supply control. Background Technology

[0002] Traditional chemical or electrochemical polishing methods suffer from problems such as unstable processes, poor consistency in polishing quality, over-reliance on operator experience, and low levels of automation. Simple mechanical polishing, on the other hand, easily creates stress layers or scratches on the surface. While there are attempts to combine the two in existing technologies, most rely on simple timing control and lack real-time sensing and intelligent feedback adjustment of the polishing process, making it difficult to achieve precise, stable, and efficient automated polishing. Summary of the Invention

[0003] The technical problem to be solved by this invention is to overcome the above-mentioned technical defects and provide an adjustable pressure abdominal binder after cesarean section.

[0004] To achieve the above objectives, the present invention provides the following technical solution: An automated and chemical polishing method based on DC power supply control, the method comprising the following steps: S1: Installation and configuration steps: Place the workpiece to be polished as the anode in an electrolytic cell containing polishing liquid, and configure the cathode to form a complete electrolytic circuit; S2: Electrochemical dissolution step: Turn on the DC power supply, connect its positive electrode to the anode and its negative electrode to the cathode, and apply a preset voltage or current to the anode to controllably trigger the electrochemical dissolution reaction on the workpiece surface; S3: Mechanical / fluid-assisted polishing step: During or between the electrochemical dissolution process, the workpiece surface is polished by mechanical polishing tools or fluid jetting devices to remove reaction products and micro-protrusions. S4: Real-time monitoring and feedback steps: During the polishing process, at least one process parameter is monitored in real time by a sensor. The process parameter includes current density, electrolyte potential, temperature or workpiece surface roughness, and the monitoring data is fed back to the control system. S5: Endpoint Judgment and Execution Steps: The control system compares the real-time monitoring data with the preset polishing endpoint conditions to make a judgment; if the endpoint is not reached, the output parameters of the DC power supply and / or the action parameters of the mechanical and fluid-assisted polishing are dynamically adjusted, and the process returns to step S4; if the endpoint is reached, step S6 is executed. S6: Termination Step: Automatically cut off the output of the DC power supply and stop the mechanical / fluid-assisted polishing action to complete the polishing process.

[0005] Furthermore, step S0 is included before step S1: polishing environment preparation step; step S0 specifically involves: selecting and configuring an acidic polishing liquid system or an alkaline polishing liquid system according to the material properties of the workpiece to be polished.

[0006] Furthermore, when performing step S0a to prepare the acidic polishing slurry, the method is further defined as follows: The acidic polishing solution contains at least one of sulfuric acid, phosphoric acid, nitric acid, or oxalic acid, at a concentration of 5 wt% to 40 wt%. The DC power supply adopts a constant voltage mode in step S2, and the controlled voltage range is 3V to 12V. In step S4, the electrolyte potential is monitored and controlled within the overpassivation potential range of the material.

[0007] Furthermore, when performing step S0b to prepare the alkaline polishing solution, the method is further defined as follows: The alkaline polishing solution contains at least one of sodium hydroxide, potassium hydroxide, or sodium carbonate, with a concentration of 10 wt% to 30 wt%. The DC power supply adopts constant current mode in step S2, controlling the current density to be 1A / dm³. 2 Up to 5A / dm 2 ; In step S4, the electrolyte temperature is monitored and maintained within the range of 50°C to 80°C.

[0008] Furthermore, the mechanical / fluid-assisted polishing in step S3 includes at least one of the following methods: a: Use a motor-driven polishing wheel, polishing cloth, or polishing brush to perform contact grinding on the workpiece surface; b: Polishing liquid or gas, with or without abrasive, is sprayed onto the workpiece surface through a nozzle with a programmable movement trajectory.

[0009] Furthermore, the dynamic adjustment in steps S4 and S5 specifically involves: The control system has a built-in PID controller or a pre-trained process model. When the real-time monitored surface roughness value deviates from the preset trajectory, the control system adjusts the pulse duty cycle of the DC power supply or the pressure of the mechanical polishing tool to bring the roughness value back to the preset trajectory.

[0010] Furthermore, including: An electrolytic cell system used to contain polishing fluid and to mount the workpiece and cathode; A DC power supply module, the output of which is electrically connected to the workpiece and the cathode; A mechanical / fluid polishing actuator is used to apply an auxiliary polishing effect to the surface of the workpiece; A multi-sensor monitoring module is used to acquire electrochemical, thermodynamic, and surface state parameters during the polishing process in real time. The central control unit is connected to the DC power supply module, the polishing execution unit and the monitoring module respectively, and is configured to execute the steps of the method as described in claim 1, and realize closed-loop control based on feedback data.

[0011] The advantages of this invention compared to existing technologies are: 1. This invention significantly improves polishing efficiency and shortens processing time through the synergistic effect of electrochemical dissolution and mechanical / fluid-assisted polishing.

[0012] 2. Real-time monitoring and intelligent feedback control ensure a stable polishing process and good surface roughness consistency.

[0013] 3. The entire process, from environmental selection to endpoint determination, is automated, reducing human intervention and simplifying operations.

[0014] 4. The entire polishing slurry system and process parameters are applicable to a variety of metals and alloys.

[0015] 5. Closed-loop control is adopted to reduce polishing fluid consumption and waste liquid discharge, thereby reducing environmental pollution. Attached Figure Description

[0016] Figure 1 This is an overall flowchart of the present invention; Figure 2 This is a flowchart of the acidic environment polishing process of the present invention; Figure 3 This is a flowchart of the alkaline environment polishing process of the present invention; Figure 4 This is a flowchart of the polishing environment preparation steps of the present invention; Figure 5 This is a flowchart of the intelligent feedback adjustment process of the present invention. Detailed Implementation

[0017] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. Identical components are indicated by the same reference numerals.

[0018] It should be noted that the terms “front,” “back,” “left,” “right,” “up,” and “down” used in the following description refer to the directions shown in the attached diagram, while the terms “inside” and “outside” refer to the directions toward or away from the geometric center of a specific component, respectively.

[0019] To make the content of this invention easier to understand, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0020] like Figure 1 and Figure 5 As shown, the technical solution of the present invention is an automated and chemical polishing method based on DC power supply regulation.

[0021] The polishing method of this application embodiment may include a sequence of steps S1 to S6. It is understood that the core of this method lies in forming a closed-loop control system that includes execution, monitoring, judgment, feedback, and adjustment. It should be noted that the order of steps described in this embodiment is logical; in practice, S3 and S2 may be performed partially simultaneously.

[0022] Specifically, in S1, it is necessary to ensure that the relative position and spacing between the workpiece and the cathode are set reasonably.

[0023] In one embodiment of this application, step S0 is added before S1. Selecting the polishing slurry system based on the material is a prerequisite for ensuring the effectiveness of the method. It should be noted that the selection of the acidic or alkaline system described in this embodiment is based on conventional choices made according to the chemical properties of the material.

[0024] In one embodiment of this application, the feedback loop formed by S4 and S5 is key to achieving intelligent control. It should be noted that the PID controller or process model described in this embodiment is a commonly used technique in the art for achieving precise control.

[0025] In one embodiment of this application, the apparatus may include an electrolytic cell system, a DC power supply module, a mechanical / fluid polishing execution unit, a multi-sensor monitoring module, and a central control unit. It is understood that these modules are electrically and signal-connected to form a complete execution system. It should be noted that the central control unit described in this embodiment may be a PLC, an industrial computer, or an embedded system.

[0026] In one embodiment of this application, the electrolytic cell 1 may be made of corrosion-resistant materials such as PP or PVC, or, for example, a transparent material may be used for easy observation.

[0027] In another embodiment of this application, the mechanical polishing wheel is driven by a servo motor, and its pressure can be precisely controlled by a pneumatic system.

[0028] In this embodiment, the method is automated through the combination of the aforementioned hardware and software.

[0029] As a possible solution, the polishing fluid can be circulated and filtered to keep it clean.

[0030] As another possible option, a waste liquid treatment unit can be provided.

[0031] Example 1: Taking the polishing of a 304 stainless steel workpiece as an example. The workpiece size is 100mm × 100mm. An acidic polishing solution of 15% sulfuric acid and 10% phosphoric acid was used. The power supply was a constant voltage of 6V. Mechanical assistance was achieved using a polishing cloth at a pressure of 0.1MPa. The key monitoring parameters were current density and electrolyte potential. After 8 minutes of polishing, the surface roughness Ra decreased from 0.8μm to 0.05μm.

[0032] For example, if abnormal fluctuations in current density are detected, the control system can automatically fine-tune the voltage or pause the process for inspection.

[0033] It should be noted that in the above embodiments, the control method can be automatically controlled by the central control unit 8. The control method of the central control unit 8 can be implemented by simple programming by those skilled in the art, which is common knowledge in the art. Furthermore, this application is mainly used to protect the integrated innovation of the method and device, so this application will not explain the control method and circuit connection in detail.

[0034] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0035] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0036] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. An automated and chemical polishing method based on DC power supply control, characterized in that, The method includes the following steps: S1: Installation and configuration steps: Place the workpiece to be polished as the anode in an electrolytic cell containing polishing liquid, and configure the cathode to form a complete electrolytic circuit; S2: Electrochemical dissolution step: Turn on the DC power supply, connect its positive electrode to the anode and its negative electrode to the cathode, and apply a preset voltage or current to the anode to controllably trigger the electrochemical dissolution reaction on the workpiece surface; S3: Mechanical / fluid-assisted polishing step: During or between the electrochemical dissolution process, the workpiece surface is polished by mechanical polishing tools or fluid jetting devices to remove reaction products and micro-protrusions. S4: Real-time monitoring and feedback steps: During the polishing process, at least one process parameter is monitored in real time by a sensor. The process parameter includes current density, electrolyte potential, temperature or workpiece surface roughness, and the monitoring data is fed back to the control system. S5: Endpoint Judgment and Execution Steps: The control system compares the real-time monitoring data with the preset polishing endpoint conditions to make a judgment; if the endpoint is not reached, the output parameters of the DC power supply and / or the action parameters of the mechanical and fluid-assisted polishing are dynamically adjusted, and the process returns to step S4; if the endpoint is reached, step S6 is executed. S6: Termination Step: Automatically cut off the output of the DC power supply and stop the mechanical / fluid-assisted polishing action to complete the polishing process.

2. The method according to claim 1, characterized in that, Before step S1, there is also step S0: polishing environment preparation step; step S0 specifically involves: selecting and configuring an acidic polishing liquid system or an alkaline polishing liquid system according to the material properties of the workpiece to be polished.

3. The method according to claim 2, characterized in that, When performing step S0a to prepare the acidic polishing solution, the method is further defined as follows: The acidic polishing solution contains at least one of sulfuric acid, phosphoric acid, nitric acid, or oxalic acid, at a concentration of 5 wt% to 40 wt%. The DC power supply adopts a constant voltage mode in step S2, and the controlled voltage range is 3V to 12V. In step S4, the electrolyte potential is monitored and controlled within the overpassivation potential range of the material.

4. The method according to claim 2, characterized in that, When performing step S0b to prepare the alkaline polishing solution, the method is further defined as follows: The alkaline polishing solution contains at least one of sodium hydroxide, potassium hydroxide, or sodium carbonate, with a concentration of 10 wt% to 30 wt%. The DC power supply adopts constant current mode in step S2, controlling the current density to be 1A / dm³. 2 Up to 5A / dm 2 ; In step S4, the electrolyte temperature is monitored and maintained within the range of 50°C to 80°C.

5. The method according to any one of claims 1 to 4, characterized in that, The mechanical / fluid-assisted polishing in step S3 includes at least one of the following methods: a: Use a motor-driven polishing wheel, polishing cloth, or polishing brush to perform contact grinding on the workpiece surface; b: Polishing liquid or gas, with or without abrasive, is sprayed onto the workpiece surface through a nozzle with a programmable movement trajectory.

6. The method according to any one of claims 1 to 4, characterized in that, The dynamic adjustment in steps S4 and S5 specifically refers to: The control system has a built-in PID controller or a pre-trained process model. When the real-time monitored surface roughness value deviates from the preset trajectory, the control system adjusts the pulse duty cycle of the DC power supply or the pressure of the mechanical polishing tool to bring the roughness value back to the preset trajectory.

7. An automated chemical polishing apparatus for implementing the method according to any one of claims 1 to 6, characterized in that, include: An electrolytic cell system used to contain polishing fluid and to mount the workpiece and cathode; A DC power supply module, the output of which is electrically connected to the workpiece and the cathode; A mechanical / fluid polishing actuator is used to apply an auxiliary polishing effect to the surface of the workpiece; A multi-sensor monitoring module is used to acquire electrochemical, thermodynamic, and surface state parameters during the polishing process in real time. The central control unit is connected to the DC power supply module, the polishing execution unit and the monitoring module respectively, and is configured to execute the steps of the method as described in claim 1, and realize closed-loop control based on feedback data.

Images