Liquid cooling heat dissipation chip structure and packaging method thereof
By forming accommodating channels within the chip and injecting coolant, the heat dissipation problem of high-power chips is solved, achieving efficient heat dissipation and improving the chip's computing performance and data processing speed.
Patent Information
- Application Number
- CN202610240923.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-28
- Publication Date
- 2026-07-10
AI Technical Summary
In existing technologies, chip heat causes a decrease in computing performance and a slowdown in data processing speed. Furthermore, the efficiency of traditional air cooling has reached its physical limit and cannot effectively solve the heat dissipation problem of high-power chips.
Microchannels are reserved inside the chip as accommodating holes, and coolant is poured in to form liquid cooling columns. Heat is then carried away by a cooling fan, shortening the heat transfer path, reducing the number of thermal interface layers, and improving heat dissipation efficiency.
By using liquid cooling, the chip's computing performance and data processing speed are significantly improved, supporting the heat dissipation requirements of high-power AI chips, saving energy and reducing carbon emissions, and increasing computing power density.