A method and system for adaptive adjustment of heat dissipation performance of a die bonding glue finished product

Abstract

This invention discloses an adaptive adjustment method and system for the heat dissipation performance of die-attach adhesive, relating to the field of die-attach adhesive technology. The method includes: obtaining the heat dissipation requirements parameters of the target electronic component and the amount of die-attach adhesive used; optimizing the specifications and filling amount of silver nanowires within the die-attach adhesive to obtain multiple optimized combinations; optimizing the dispersion process parameters of the silver nanowires within the die-attach adhesive; further optimizing based on other multiple optimized combinations; calculating multiple heat dissipation ratio coefficients, and selecting the optimized combination with the largest heat dissipation ratio coefficient and optimized dispersion process parameters as the optimal die-attach adhesive adjustment scheme. This solves the technical problem of existing die-attach adhesive heat dissipation performance adjustment methods failing to adaptively optimize and adjust the filling amount and parameters of silver nanowires within the die-attach adhesive according to the actual heat changes during electronic device operation, resulting in significantly insufficient heat dissipation performance. It achieves the technical effect of optimizing the silver nanowire distribution strategy and improving the heat dissipation performance of the finished die-attach adhesive.

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