An integrated circuit chip packaging and processing equipment

Abstract

This invention discloses an integrated circuit chip packaging and processing equipment, belonging to the field of chip packaging and processing technology. It includes a support base, a base at the top of the support base, a chip body at the top of the base, and an assembly mechanism for packaging the chip body at the top of the base. A sealing mechanism is provided on the outer side of the base, including a sealing component assembled and installed at the top of the base. The sealing component includes a rectangular ring tube at the top of the base, with a glue inlet on the surface of the rectangular ring tube near the outer side of the chip body. This invention utilizes the rectangular ring tube, glue inlet tube, and glue outlet tube, along with a glue dispenser and a glue replenishment box, to form a closed-loop glue supply circuit. Excess glue overflowing from the packaging is collected and returned through the glue outlet space and glue outlet tube, achieving automatic recycling of excess packaging glue. Simultaneously, a motor drives gear meshing to drive the stirring wire to slide back and forth, with the help of a limiting rotating wheel for limiting and guiding, continuously agitating the packaging glue inside the rectangular ring tube, preventing the glue powder from settling and clumping, and preventing viscosity imbalance.

Description

Technical Field

[0001] This invention relates to the field of chip packaging and processing technology, and in particular to an integrated circuit chip packaging and processing equipment. Background Technology

[0002] Integrated circuit chip packaging is a core process in semiconductor chip manufacturing. It primarily involves sealing the bare chip with adhesive, providing insulation, reinforcing its structure, and isolating it from moisture. This protects the internal circuitry and metal wires from external dust, moisture, mechanical impacts, and corrosive media, while also improving the overall structural strength and stability of the chip and extending its lifespan. It is a crucial process for ensuring the electrical performance and yield of integrated circuit chips. Traditional encapsulation methods often employ a single-point direct-injection method, which cannot uniformly inject adhesive around the chip's periphery. This easily leads to problems such as insufficient localized adhesive filling, adhesive breaks, missing adhesive at corners, and encapsulation gaps and voids. Furthermore, excess encapsulation adhesive drips directly and is wasted during the injection process, making it impossible to filter, recycle, or achieve closed-loop reuse. This results in significant adhesive waste, high production costs, and the dripping residue can contaminate equipment surfaces and chip components, reducing product cleanliness. Summary of the Invention

[0003] The purpose of this invention is to provide an integrated circuit chip packaging and processing equipment to solve the problems mentioned in the background art, which are that the single-point direct injection adhesive supply mode cannot uniformly inject adhesive around the outer periphery of the chip body, and is prone to local insufficient adhesive filling, adhesive breaks, missing adhesive at the edges and corners, and encapsulation gaps and voids.

[0004] To achieve the above objectives, the present invention provides the following technical solution: an integrated circuit chip packaging and processing equipment, including a support base, a base at the top of the support base, a chip body at the top of the base, an assembly mechanism for packaging the chip body at the top of the base, a sealing mechanism on the outer side of the base, the sealing mechanism including a sealing assembly assembled and installed at the top of the base, the sealing assembly including a rectangular ring tube at the top of the base, the rectangular ring tube having a glue inlet on its surface near the outer side of the chip body, a glue feeder fixedly installed at the top of the support base, the glue feeder being connected to the rectangular ring tube via a glue inlet pipe, a glue replenishment box fixedly installed at the top of the support base, and the glue replenishment box being connected to the input end of the glue feeder, a glue outlet pipe being connected to the end of the rectangular ring tube away from the glue inlet pipe, the free end of the glue outlet pipe being connected to the input end of the glue feeder, and a collection cylinder for collecting materials being provided on the glue outlet pipe.

[0005] As a preferred embodiment of the present invention, a partition is fixedly installed inside the rectangular ring tube away from the glue inlet, and a glue outlet space is formed between the partition and the inside of the rectangular ring tube. A glue outlet is opened on the surface of the rectangular ring tube near the glue outlet space, and the glue outlet is used to export the excess glue generated by the outer packaging of the chip body to the glue outlet tube, so that the glue can form a circulation inside the rectangular ring tube.

[0006] As a preferred embodiment of the present invention, a soft rubber pad is fixedly installed on the surface of the partition located inside the dispensing space, and a pressure plate is fixedly installed on the surface of the soft rubber pad near the dispensing port for sealing the dispensing port. A second spring is fixedly installed between the pressure plate and the inner wall of the soft rubber pad for pressurizing and supporting the dispensing area on the outside of the chip body, so that the glue can be stably filled in the outer area of ​​the chip body.

[0007] As a preferred embodiment of the present invention, an arc-shaped guide plate is fixedly installed in the glue filling area near the outer side of the rectangular ring tube, which is used to forcefully fill the glue inside the rectangular ring tube under pressure, and the surface of the guide plate is provided with multiple through holes.

[0008] As a preferred embodiment of the present invention, an agitating wire is slidably installed inside the rectangular ring tube to agitate the glue inside the rectangular ring tube. A motor is fixedly installed on the outer surface of the rectangular ring tube, and a rolling gear is fixedly installed on the output shaft of the motor. Multiple tooth grooves are formed on the outer surface of the agitating wire, and the rolling gear meshes with the tooth grooves on the outer surface of the agitating wire. A reinforcing rib is provided in the middle position of the agitating wire to increase its strength.

[0009] As a preferred embodiment of the present invention, a plurality of limiting wheels are fixedly installed on the surface of the partition near the agitating wire, and the limiting wheels slide on the surface of the agitating wire to limit the agitating wire.

[0010] As a preferred embodiment of the present invention, a lifting component is provided at the top of the support base, a top plate is installed at the top of the lifting component, a hydraulic cylinder is fixedly installed on the surface of the top plate, a pressure stabilizing mechanism is provided at the bottom of the top plate, the pressure stabilizing mechanism includes an air collection box fixedly installed at the output end of the hydraulic cylinder, a limit slide rod is fixedly installed on the surface of the top plate, the air collection box slides on the surface of the limit slide rod, a plurality of telescopic components are connected to the bottom of the air collection box, an assembly mechanism for packaging the chip body is provided at the bottom of the telescopic components, an air pump is fixedly installed at the top of the air collection box, the output end of the air pump is connected to the interior of the air collection box through an air inlet pipe, a pressure relief pipe is connected to the top of the air collection box, and a one-way overflow valve with adjustable opening pressure is provided on the pressure relief pipe, the output end of the pressure relief pipe of the air collection box is connected to the soft rubber pad cavity inside the rectangular ring tube through a flexible auxiliary air pipe, for cooperating with the second spring to drive the pressure plate to adjust the opening and closing of the glue outlet.

[0011] As a preferred embodiment of the present invention, a sealing slide plate is slidably installed inside the air collection box, and the sealing slide plate slides inside the air collection box to seal the air inlet end of the telescopic component. The top of the sealing slide plate has multiple vent holes, and the vent holes are connected to the inside of the telescopic component to drive the telescopic component to extend and retract. A first spring is fixedly installed between the top of the sealing slide plate and the inner wall of the air collection box, and is used to control the movement of the sealing slide plate by the air pressure output by the air pump, so that multiple telescopic components can extend and retract synchronously.

[0012] As a preferred embodiment of the present invention, the assembly mechanism includes a cover plate disposed at the bottom of the telescopic member for encapsulating the chip body. The bottom end of the cover plate has a venting groove, a thin film is disposed on the surface of the cover plate near the chip body, and a rubber pad for reinforcing the adhesive seal is disposed at the edge of the cover plate near the chip body.

[0013] As a preferred embodiment of the present invention, a pad is fixedly installed at the free end of the telescopic member, and the pad is made of magnetic material. A pin is fixedly installed at the bottom end of the pad, and a support clamp is fixedly installed at the top end of the cover plate. Multiple magnetic plates are fixedly installed on the surface of the support clamp near the pad, and the pad and the magnetic plates are magnetically connected. A pin hole is opened at the top end of the magnetic plate, and the pin is inserted into the pin hole.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. This invention utilizes a rectangular ring tube, an inlet tube, an outlet tube, and a collection cylinder, along with a glue dispenser and a replenishment box, to form a closed-loop glue supply circuit. Excess glue overflowing from the encapsulation process is collected and returned through the outlet space and outlet tube, achieving automatic recycling of excess encapsulation glue. This significantly reduces glue consumable costs and prevents residual glue from contaminating equipment and chips. Simultaneously, a motor drives gear meshing to drive the agitator wire to slide back and forth, and with the limit wheel for limiting and guiding, continuously agitates the encapsulation glue inside the rectangular ring tube. This prevents the glue powder from settling and clumping, and viscosity imbalance, ensuring uniform flow rate throughout the ring-shaped glue injection area, and improving the airtightness of the chip encapsulation.

[0016] 2. This invention relies on the air-deformation of the soft rubber pad in conjunction with the elastic push plate of the second spring to adaptively close / open the dispensing port. When dispensing is stopped, the dispensing port is automatically sealed to suppress glue dripping. At the same time, the arc-shaped guide plate on the inner side of the rectangular ring tube squeezes and guides the dispensing glue. The glue seeps into the chip corner gaps through the through hole under pressure. Simultaneously, elastic pressure is applied to the dispensing area to support it. This can expel air trapped inside the glue layer, reduce defects such as missing glue, voids, and delamination, and significantly improve the density and structural strength of the chip encapsulation glue.

[0017] 3. This invention uses an air pump to fill the air collection box with a stable airflow. The air pressure pushes the sealing slide plate to compress the first spring and move it downward at a uniform speed. The airflow is distributed equally to each telescopic component through the evenly distributed vent holes on the sealing slide plate. All telescopic components are controlled to extend and retract synchronously, balancing the air pressure and airflow of each group of telescopic components. This solves the problems of asynchronous movement, jamming, and skewed downward pressing of telescopic components in traditional equipment, ensuring that the encapsulation cover is pressed down vertically and stably, and avoiding cover displacement, squeezing, or bumping the chip body.

[0018] 4. This invention allows for the rapid discharge of trapped air from the sealed encapsulation cavity via a vent groove at the bottom of the cover plate. The inner film isolates impurities and dust, while the edge rubber pads adhere to the upper surface of the rectangular ring tube to seal assembly gaps. Combined with pressurized colloid, a double seal is achieved, which can accelerate the discharge of trapped air from the encapsulation cavity and further reduce the generation of air bubbles in the colloid layer. At the same time, the multi-layer sealing structure prevents moisture, corrosive media, and dust from intruding into the encapsulation, protecting the chip circuit and pins.

[0019] 5. This invention uses a magnetic pad and a magnetic plate to magnetically attract and adhere to each other, and with the help of a pin and a pin hole for insertion and positioning, the cover plate and the bottom of the telescopic component can be quickly assembled. During disassembly, the mold can be disassembled and replaced by directly separating the magnetic structure. Different specifications of packaged cover plates can be quickly replaced, which is suitable for multi-size chip packaging processing and effectively improves the overall processing and production efficiency of chip packaging. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a side view of the structure of the present invention;

[0022] Figure 3 This is a schematic diagram of the gas collection box structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the telescopic component structure of the present invention;

[0024] Figure 5 This is a schematic diagram of the cover plate structure of the present invention;

[0025] Figure 6 This is a schematic diagram of the sealing mechanism of the present invention;

[0026] Figure 7 This is a schematic diagram of the sealing assembly of the present invention;

[0027] Figure 8 This is a schematic diagram of the internal structure of the rectangular ring tube of the present invention;

[0028] Figure 9 For the present invention Figure 8 Schematic diagram of the structure at point A in the diagram;

[0029] Figure 10 This is a schematic diagram of the sealing assembly of the present invention;

[0030] Figure 11 This is a schematic diagram of the stirring wire structure of the present invention.

[0031] In the diagram: 1. Support base; 2. Lifting component; 3. Top plate; 4. Hydraulic cylinder; 5. Pressure stabilizing mechanism; 51. Limiting slide bar; 52. Air pump; 53. Air collection box; 54. Telescopic component; 55. Sealing slide plate; 56. First spring; 57. Pad; 58. Magnetic plate; 59. Support clamp; 6. Assembly mechanism; 61. Cover plate; 62. Ventilation groove; 63. Membrane; 64. Rubber pad; 7. Chip body; 8. Sealing... 81. Sealing mechanism; 82. Glue supply box; 83. Glue inlet pipe; 84. Sealing assembly; 841. Rectangular ring pipe; 842. Pressure plate; 843. Second spring; 844. Soft rubber pad; 845. Limiting wheel; 846. Stirring wire; 847. Rolling gear; 848. Motor; 849. Guide plate; 8410. Reinforcing rib; 8411. Partition plate; 85. Glue outlet pipe; 86. Collection cylinder; 9. Base. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Please see Figure 1-11 This invention provides an integrated circuit chip packaging and processing apparatus, including a support base 1, a base 9 at the top of the support base 1, a chip body 7 at the top of the base 9, an assembly mechanism 6 for packaging the chip body 7 at the top of the base 9, and a sealing mechanism 8 on the outer side of the base 9. The sealing mechanism 8 includes a sealing assembly 84 assembled and installed at the top of the base 9, and the sealing assembly 84 includes a rectangular annular tube 841 disposed at the top of the base 9, close to the chip body 7. The outer surface is provided with a glue inlet. A glue feeder 82 is fixedly installed on the top of the support base 1. The glue feeder 82 is connected to the rectangular ring pipe 841 through the glue inlet pipe 83. A glue replenishment box 81 is fixedly installed on the top of the support base 1 and is connected to the input end of the glue feeder 82. A glue outlet pipe 85 is connected to the end of the rectangular ring pipe 841 away from the glue inlet pipe 83. The free end of the glue outlet pipe 85 is connected to the input end of the glue feeder 82, and a collection cylinder 86 for collecting materials is provided on the glue outlet pipe 85.

[0034] After the equipment starts, the glue tank 81 continuously supplies encapsulation adhesive to the glue dispenser 82, ensuring a sufficient supply of adhesive. The glue dispenser 82 generates conveying pressure, delivering the adhesive through the glue inlet pipe 83 to the inside of the rectangular ring pipe 841. The rectangular ring pipe 841 is arranged around the outside of the chip body 7, with a glue inlet on the side of the pipe closest to the chip. The adhesive flows out from the glue inlet, completing the ring-shaped glue application along the outer periphery of the chip. During the encapsulation process, excess adhesive exceeding the filling requirements flows into the end area of ​​the rectangular ring pipe 841, then enters the glue outlet pipe 85, flows through the collection cylinder 86 on the glue outlet pipe 85 for temporary storage, and finally flows back to the input end of the glue dispenser 82. The entire pipeline forms a continuous circulation loop, continuously completing the entire process of glue replenishment, glue application, excess glue recovery, and glue reuse during continuous equipment operation. The ring-shaped glue outlet can simultaneously apply glue around the chip, ensuring comprehensive and uniform glue distribution.

[0035] In some embodiments, a partition 8411 is fixedly installed inside the rectangular annular tube 841 away from the glue inlet, and a glue outlet space is formed between the partition 8411 and the interior of the rectangular annular tube 841. A glue outlet is provided on the surface of the rectangular annular tube 841 near the glue outlet space, and the glue outlet is used to export excess glue generated by the outer packaging of the chip body 7 to the glue outlet tube 85, so that the glue can form a circulation inside the rectangular annular tube 841.

[0036] A partition 8411 is fixedly installed inside the rectangular ring tube 841, dividing the inner cavity of the rectangular ring tube 841 into two independent areas: a main flow area and a dispensing space. During normal dispensing, the encapsulating adhesive flows in the main flow area on one side of the partition 8411, flowing out from the inlet and filling the area around the chip. When the adhesive is saturated, excess adhesive overflows across the flow area and enters the dispensing space on the other side of the partition 8411, preventing adhesive accumulation around the chip and avoiding problems such as adhesive layer protrusion and poor appearance. The rectangular ring tube 841 has a dispensing port on its wall corresponding to the dispensing space. Excess adhesive entering the dispensing space flows into the dispensing pipe 85 through the dispensing port, and then flows along the pipe to the collection cylinder 86 and the dispensing machine 82, so that the adhesive forms a complete and orderly circulation in the rectangular ring tube 841 and the external pipes.

[0037] In some embodiments, a soft rubber pad 844 is fixedly installed on the surface of the partition 8411 inside the dispensing space, and a pressure plate 842 is fixedly installed on the surface of the soft rubber pad 844 near the dispensing port for sealing the dispensing port. A second spring 843 is fixedly installed between the pressure plate 842 and the inner wall of the soft rubber pad 844 for pressurizing and supporting the dispensing area on the outside of the chip body 7, so that the glue can be stably filled in the area on the outside of the chip body 7.

[0038] During normal glue injection, the glue inside the pipeline has a certain delivery pressure. The pressure acts on the surface of the pressure plate 842, pushing the pressure plate 842 to the side of the soft rubber pad 844, simultaneously compressing the second spring 843. The glue outlet is in a fully open state, and the overflow glue can flow out smoothly from the glue outlet and complete the backflow. The elastic pressure structure continuously applies pressure to the glue injection area, improving the glue filling density and reducing voids inside the glue layer. The soft rubber pad 844 provides sealing protection for the second spring 843. When the glue injection process stops, the glue pressure in the pipeline drops accordingly. The soft rubber pad 844, combined with the elastic restoring force of the second spring 843, pushes the pressure plate 842 to move in the opposite direction, tightly sealing the glue outlet and preventing residual glue in the pipeline from leaking or dripping from the glue outlet.

[0039] In some embodiments, an arc-shaped guide plate 849 is fixedly installed on the adhesive filling area near the outer side of the rectangular ring tube 841, which is used to forcefully fill the adhesive inside the rectangular ring tube 841 under pressure, and the surface of the guide plate 849 is provided with multiple through holes.

[0040] In this process, when the encapsulating adhesive flows within the rectangular annular tube 841 and towards the chip area, it first contacts the arc-shaped guide plate 849. The arc-shaped plate changes the direction of the adhesive flow and exerts a squeezing effect on the fluid, increasing the adhesive pressure. The pressurized adhesive then passes through the various through-holes on the guide plate 849, spraying and penetrating outwards in a multi-point splitting manner. Under pressure, it fully fills the corners and gaps on the outer side of the chip, completing the entire pressurized encapsulation process. This ensures that the adhesive fully covers the encapsulation area, further optimizing the uniformity of adhesive application, effectively reducing defects such as air bubbles and insufficient material in the adhesive layer, and improving the integrity of the encapsulation.

[0041] In some embodiments, an agitator 846 is slidably installed inside the rectangular annular tube 841 to agitate the glue inside the rectangular annular tube 841. A motor 848 is fixedly installed on the outer surface of the rectangular annular tube 841, and a rolling gear 847 is fixedly installed on the output shaft of the motor 848. The outer surface of the agitator 846 has multiple toothed grooves, and the rolling gear 847 meshes with the toothed grooves on the outer surface of the agitator 846. A reinforcing rib 8410 is provided at the middle position of the agitator 846 to increase the strength of the agitator 846.

[0042] The stirring wire (846) is made of flexible spring steel wire with high elasticity and resilience. The motor 848 drives the rolling gear 847 to rotate in a circular motion. Through the meshing of the gear and tooth groove, the stirring wire 846 is driven to slide back and forth in an arc along the circumferential path of the rectangular annular tube 841 within the tube. The stirring wire 846 is in constant contact with the encapsulated adhesive inside the tube, continuously stirring and agitating the adhesive during the reciprocating motion to prevent the adhesive from separating and the powder from settling, thus stabilizing the adhesive viscosity and performance. To prevent the stirring wire 846 from buckling and jamming during sliding, all four corners of the rectangular annular tube 841 are designed with large arc transition angles, and the sliding stroke length of the stirring wire 846 is less than the straight-line distance between two adjacent arc transition angles. A reinforcing rib 8410 is provided in the middle of the stirring wire 846 to enhance the overall structural strength of the member during long-distance reciprocating sliding, preventing deformation and breakage under stress, and ensuring continuous and stable stirring.

[0043] In some embodiments, a plurality of limiting rollers 845 are fixedly installed on the surface of the partition 8411 near the stirring wire 846. The limiting rollers 845 slide on the surface of the stirring wire 846 to limit the stirring wire 846.

[0044] When the motor (848) drives the rolling gear (847) to switch between forward and reverse slightly, it drives the flexible stirring wire 846 to slide smoothly along the arc-shaped inner wall of the rectangular ring tube 841 and the limiting wheels (845) at the four turns, thereby eliminating the dead points in spatial motion. The limiting wheels 845 limit the stirring wire 846 in the form of rolling contact from the radial direction. The frictional resistance is small, which restricts the stirring wire 846 from swinging left and right or deviating radially during the sliding process, so that the stirring wire 846 always moves along the preset straight trajectory, avoiding hard friction and collision between the stirring wire 846 and the inner wall of the rectangular ring tube 841 and the partition 8411, thus protecting the rectangular ring tube 841, the partition 8411 and the stirring wire 846.

[0045] In some embodiments, a lifting component 2 is provided at the top of the support base 1, a top plate 3 is mounted at the top of the lifting component 2, a hydraulic cylinder 4 is fixedly mounted on the surface of the top plate 3, and a pressure stabilizing mechanism 5 is provided at the bottom of the top plate 3. The pressure stabilizing mechanism 5 includes an air collection box 53 fixedly mounted at the output end of the hydraulic cylinder 4, a limiting slide rod 51 is fixedly mounted on the surface of the top plate 3, the air collection box 53 slides on the surface of the limiting slide rod 51, and a plurality of telescopic members 54 are connected and installed at the bottom of the air collection box 53. The bottom of the telescopic members 54 is provided with a function for adjusting the pressure of the air collection box 53. The chip body 7 is packaged by an assembly mechanism 6. An air pump 52 is fixedly installed at the top of the gas collection box 53. The output end of the air pump 52 is connected to the inside of the gas collection box 53 through an air inlet pipe. A pressure relief pipe is connected to the top of the gas collection box 53, and a one-way overflow valve with adjustable opening pressure is provided on the pressure relief pipe. The output end of the pressure relief pipe of the gas collection box 53 is connected to the inner cavity of the soft rubber pad 844 inside the rectangular ring pipe 841 through a flexible auxiliary air pipe, which is used to work with the second spring (843) to drive the pressure plate 842 to adjust the opening and closing of the glue outlet.

[0046] Among them, the lifting component 2 drives the top plate 3 and all the components above it to complete the overall lifting action and achieve height alignment; the output end of the hydraulic cylinder 4 is connected to the air collection box 53, which can drive the air collection box 53 to move up and down independently; the air collection box 53 is slidably sleeved on the outside of the limiting slide rod 51, and is guided by the limiting slide rod 51 during the movement to prevent the air collection box 53 from deviating. The air pump 52 delivers compressed gas into the gas collection box 53 through the air inlet pipe, and the air pressure inside the box gradually increases. The gas is diverted to the multiple telescopic components 54 connected to the bottom of the gas collection box 53, pushing the telescopic components 54 to extend and retract. This, in turn, causes the assembly mechanism 6 at the bottom of the telescopic components 54 to press down, completing the encapsulation and pressing of the chip body 7. The top of the gas collection box 53 is connected to a pressure relief pipe with a set threshold one-way valve. This set threshold is set to be greater than the pressure stabilizing pressure required by the pressing assembly mechanism 6, and the air pressure thrust of its overflow guide relief air chamber is greater than the initial preload force of the second spring 843. This ensures that only after the encapsulation action has actually occurred and the pressure has been pressed, will the excess air pressure trigger the opening of the lower glue outlet, maintaining the air pressure inside the box within a safe and stable range. By setting a flexible auxiliary air pipe to connect the gas collection box 53 to the soft rubber pad, the upper pneumatic pressure stabilizing mechanism 5 and the lower adaptive sealing component 84 form a pneumatic linkage coupling. When the pressure sealing begins and the air pressure in the gas collection box 53 increases, the air pressure not only controls the upper telescopic component 54 to press down synchronously, but also its overflow air pressure serves as the power source for the expansion of the lower soft rubber pad. This achieves synchronization of 'upper pressure sealing' and 'lower adhesive outlet adaptive opening' in terms of time axis and energy source, avoiding action lag caused by the independent operation of each mechanism.

[0047] In some embodiments, a sealing slide plate 55 is slidably installed inside the air collection box 53, and the sealing slide plate 55 slides inside the air collection box 53 to seal the air inlet end of the telescopic member 54. The top of the sealing slide plate 55 has multiple vent holes, and the vent holes communicate with the interior of the telescopic member 54 to drive the telescopic member 54 to extend and retract. A first spring 56 is fixedly installed between the top of the sealing slide plate 55 and the inner wall of the air collection box 53 to control the movement of the sealing slide plate 55 by the air pressure output by the air pump 52, so that the multiple telescopic members 54 extend and retract synchronously.

[0048] In this process, the air pump 52 continuously fills the air collection box 53 with air, and the air pressure inside the box continuously increases. The air pressure pushes the sealing slide plate 55 downward, simultaneously compressing the first spring 56. The high-pressure gas in the air collection box 53 is evenly distributed through all the vents on the sealing slide plate 55 and evenly delivered to the interior of each telescopic component 54, so that all telescopic components 54 receive the same amount of air pressure thrust, and then extend outward synchronously, driving the assembly mechanism 6 to press down. When the air pump 52 stops supplying air and the air pressure inside the box drops, the first spring 56 uses its elastic tension to drive the sealing slide plate 55 to return to its original position upward, and the air pressure inside the telescopic component 54 decreases accordingly. All telescopic components 54 retract synchronously, completing one reciprocating action. Throughout the process, the actions of multiple sets of telescopic components 54 are synchronized, ensuring the stability of the cover plate 61 in sealing the chip body 7.

[0049] In some embodiments, the assembly mechanism 6 includes a cover plate 61 disposed at the bottom of the telescopic member 54 for encapsulating the chip body 7. The bottom end of the cover plate 61 is provided with a venting groove 62. A thin film 63 is disposed on the surface of the cover plate 61 near the chip body 7. A rubber pad 64 for reinforcing the glue seal is disposed at the edge of the cover plate 61 near the chip body 7.

[0050] When the telescopic component 54 pushes the cover plate 61 downwards, the cover plate 61 covers the chip body 7 and the encapsulation area, forming a sealed encapsulation cavity. The venting groove 62 at the bottom of the cover plate 61 quickly guides and expels air trapped within the sealed cavity, preventing air from becoming trapped inside the adhesive layer and forming bubbles. A thin film 63 is attached to the inner side of the cover plate 61. During the pressing process, the thin film 63 isolates external dust and impurities, preventing contaminants from contacting the chip circuitry. Rubber pads 64 are added to the edges of the cover plate 61. After the cover plate 61 is pressed down, the rubber pads 64 tightly adhere to the contact surface, filling the assembly gaps and forming a multi-layered sealing structure with the encapsulation adhesive, providing all-around sealing protection for the encapsulation area.

[0051] In some embodiments, a pad 57 is fixedly installed at the free end of the telescopic member 54, and the pad 57 is made of magnetic material. A pin is fixedly installed at the bottom end of the pad 57, and a support clamp 59 is fixedly installed at the top end of the cover plate 61. A plurality of magnetic plates 58 are fixedly installed on the surface of the support clamp 59 near the pad 57, and the pad 57 is magnetically connected to the magnetic plates 58. A pin hole is opened at the top end of the magnetic plate 58, and the pin is inserted into the pin hole.

[0052] During assembly, the cover plate 61 is lifted below the pad 57. The magnetic attraction between the pad 57 and the magnetic plate 58 causes them to automatically fit and align. At the same time, the pin on the pad 57 is precisely inserted into the pin hole of the magnetic plate 58. The magnetic attraction and the insertion of the pin and the pin hole form a magnetic locking groove structure, which realizes the firm connection and positioning of the cover plate 61 and the telescopic component 54, ensuring the installation and positioning accuracy of the chip body 7.

[0053] Working principle: After the equipment is started, the lifting component 2 drives the top plate 3 and all components above it to complete the overall lifting action, achieving height alignment; the output end of the hydraulic cylinder 4 is connected to the air collection box 53, which can drive the air collection box 53 to move up and down independently; the air collection box 53 is slidably sleeved outside the limiting slide rod 51, and is guided by the limiting slide rod 51 during the movement to prevent the air collection box 53 from deviating. The air pump 52 delivers compressed gas into the air collection box 53 through the air inlet pipe, and the air pressure inside the box gradually increases. The gas is diverted to the multiple telescopic parts 54 connected to the bottom of the air collection box 53, pushing the telescopic parts 54 to perform telescopic movement, thereby driving the assembly mechanism 6 at the bottom of the telescopic parts 54 to press down, completing the encapsulation and pressing of the chip body 7; the glue supply machine 82 operates to generate conveying pressure, and delivers glue through the glue inlet pipe 83 to the inside of the rectangular ring pipe 841. The rectangular ring pipe 841 is arranged around the outside of the chip body 7, and the glue inlet is opened on the side of the pipe near the chip. The glue flows out from the glue inlet and completes the ring glue injection along the outer periphery of the chip. During the encapsulation process, excess adhesive exceeding the filling requirements flows into the end area of ​​the rectangular ring tube 841, then enters the dispensing tube 85, flows through the collection cylinder 86 on the dispensing tube 85 for temporary storage, and finally flows back to the input end of the dispensing machine 82. The entire pipeline forms a continuous circulation loop, continuously completing the entire process of adhesive replenishment, dispensing, overflow adhesive recovery, and adhesive reuse during continuous equipment operation. The surrounding dispensing system can simultaneously dispense adhesive around the chip, ensuring comprehensive and uniform adhesive coverage.

[0054] The above are merely specific embodiments of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on the present invention to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of the present invention.

Claims

1. An integrated circuit chip packaging and processing equipment, comprising a support base (1), characterized in that: The support base (1) has a base (9) at its top, a chip body (7) at its top, and an assembly mechanism (6) for encapsulating the chip body (7) at its top. A sealing mechanism (8) is provided on the outside of the base (9). The sealing mechanism (8) includes a sealing assembly (84) assembled and installed on the top of the base (9). The sealing assembly (84) includes a rectangular ring tube (841) at the top of the base (9). The rectangular ring tube (841) has an adhesive inlet on its surface near the outside of the chip body (7). A glue feeder (82) is fixedly installed at the top of the support base (1). The glue feeder (82) is connected to the rectangular ring pipe (841) through the glue inlet pipe (83). A glue replenishment box (81) is fixedly installed at the top of the support base (1), and the glue replenishment box (81) is connected to the input end of the glue feeder (82). A glue outlet pipe (85) is connected to the end of the rectangular ring pipe (841) away from the glue inlet pipe (83). The free end of the glue outlet pipe (85) is connected to the input end of the glue feeder (82), and a collection cylinder (86) for collecting materials is provided on the glue outlet pipe (85).

2. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: A partition (8411) is fixedly installed inside the rectangular ring tube (841) away from the glue inlet, and a glue outlet space is formed between the partition (8411) and the inside of the rectangular ring tube (841). A glue outlet is opened on the surface of the rectangular ring tube (841) near the glue outlet space, and the glue outlet is used to export the excess glue generated by the outer packaging of the chip body (7) to the glue outlet tube (85), so that the glue can form a circulation inside the rectangular ring tube (841).

3. The integrated circuit chip packaging and processing equipment according to claim 2, characterized in that: A soft rubber pad (844) is fixedly installed on the surface of the partition (8411) inside the dispensing space. A pressure plate (842) is fixedly installed on the surface of the soft rubber pad (844) near the dispensing port to seal the dispensing port. A second spring (843) is fixedly installed between the pressure plate (842) and the inner wall of the soft rubber pad (844) to pressurize and support the dispensing area on the outside of the chip body (7), so that the glue can be stably filled in the area on the outside of the chip body (7).

4. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: An arc-shaped guide plate (849) is fixedly installed on the glue filling area near the outside of the chip body (7) of the rectangular ring tube (841) for forcibly filling the glue inside the rectangular ring tube (841) under pressure, and the surface of the guide plate (849) is provided with multiple through holes.

5. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: A stirring wire (846) is slidably installed inside the rectangular ring tube (841) to stir the glue inside the rectangular ring tube (841). A motor (848) is fixedly installed on the outer surface of the rectangular ring tube (841). A rolling gear (847) is fixedly installed on the output shaft of the motor (848). Multiple tooth grooves are opened on the outer surface of the stirring wire (846), and the rolling gear (847) meshes with the tooth grooves on the outer surface of the stirring wire (846). A reinforcing rib (8410) is provided in the middle position of the stirring wire (846) to increase the strength of the stirring wire (846).

6. The integrated circuit chip packaging and processing equipment according to claim 2, characterized in that: The partition (8411) has a plurality of limiting wheels (845) fixedly installed on the surface of the agitator (846). The limiting wheels (845) slide on the surface of the agitator (846) to limit the agitator (846).

7. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: The top of the support base (1) is provided with a lifting component (2), the top of the lifting component (2) is installed with a top plate (3), a hydraulic cylinder (4) is fixedly installed on the surface of the top plate (3), and a pressure stabilizing mechanism (5) is provided at the bottom of the top plate (3). The pressure stabilizing mechanism (5) includes an air collection box (53) fixedly installed at the output end of the hydraulic cylinder (4). A limit slide rod (51) is fixedly installed on the surface of the top plate (3), and the air collection box (53) slides on the surface of the limit slide rod (51). A plurality of telescopic components (54) are connected to the bottom of the air collection box (53). The bottom end is provided with an assembly mechanism (6) for packaging the chip body (7). The top end of the gas collection box (53) is fixedly installed with an air pump (52). The output end of the air pump (52) is connected to the inside of the gas collection box (53) through an air inlet pipe. The top end of the gas collection box (53) is connected with a pressure relief pipe, and the pressure relief pipe is provided with a one-way overflow valve with adjustable opening pressure. The output end of the pressure relief pipe of the gas collection box (53) is connected to the inner cavity of the soft rubber pad (844) inside the rectangular ring pipe (841) through a flexible auxiliary air pipe, which is used to work with the second spring (843) to drive the pressure plate (842) to adjust the opening and closing of the glue outlet.

8. The integrated circuit chip packaging and processing equipment according to claim 7, characterized in that: A sealing slide plate (55) is slidably installed inside the air collection box (53), and the sealing slide plate (55) slides inside the air collection box (53) to seal the air inlet end of the telescopic component (54). The top of the sealing slide plate (55) is provided with multiple vent holes, and the vent holes are connected to the inside of the telescopic component (54) to drive the telescopic component (54) to extend and retract. A first spring (56) is fixedly installed between the top of the sealing slide plate (55) and the inner wall of the air collection box (53) to control the movement of the sealing slide plate (55) by the air pressure output by the air pump (52), so that multiple telescopic components (54) extend and retract synchronously.

9. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: The assembly mechanism (6) includes a cover plate (61) for encapsulating the chip body (7) at the bottom of the telescopic member (54). The bottom of the cover plate (61) is provided with a venting groove (62). A thin film (63) is provided on the surface of the cover plate (61) near the chip body (7). A rubber pad (64) for reinforcing the glue seal is provided at the edge of the cover plate (61) near the chip body (7).

10. An integrated circuit chip packaging and processing equipment according to claim 9, characterized in that: The free end of the telescopic component (54) is fixedly installed with a pad (57), and the pad (57) is made of magnetic material. The bottom end of the pad (57) is fixedly installed with a pin. The top end of the cover plate (61) is fixedly installed with a support clamp (59). Multiple magnetic plates (58) are fixedly installed on the surface of the support clamp (59) near the pad (57), and the pad (57) and the magnetic plates (58) are magnetically connected. The top end of the magnetic plate (58) is provided with a pin hole, and the pin is inserted into the pin hole.

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