Preparation device and method of overhead high-voltage conductor surface microstructure

Abstract

The application belongs to the technical field of high-voltage conductor surface microstructure preparation, and relates to a preparation device and a preparation method of an overhead high-voltage conductor surface microstructure. The device comprises a guide module, a stamping module and two winding modules. The guide module and the stamping module are arranged between the two winding modules, and the two winding modules are used for winding storage of the conductor before and after processing. The guide module is used for positioning the conductor at the same position as the axis of the stamping module, so as to facilitate the stamping of the conductor surface by the stamping module to process and form a surface microstructure. The wire after twisting is positioned and extruded by the guide module, the stamping module and the two winding modules, so that the microstructure is prepared on the wire surface. The surface microstructure can effectively improve the anti-icing performance of the surface coating of the overhead high-voltage conductor, thereby improving the stability of the power system.

Description

Technical Field

[0001] This invention belongs to the field of high-voltage conductor surface microstructure preparation technology, specifically relating to a preparation device and method for preparing surface microstructures of overhead high-voltage conductors. Background Technology

[0002] In modern power transmission systems, overhead high-voltage conductors serve as core components, undertaking a significant portion of power transmission. However, overhead conductors are prone to icing under harsh weather conditions, particularly extreme weather events such as snow and freezing rain. The accumulation of ice and snow not only significantly increases the weight of the conductors but can also reduce their mechanical strength, potentially leading to breakage or even power outages. Therefore, preventing ice and snow buildup on conductor surfaces to ensure the stability and safety of the power system has become a pressing technical challenge.

[0003] Currently, common techniques for solving the icing problem include heating wires, mechanical vibration, using de-icing robots, and applying anti-icing coatings. Heating wires can generate heat through electric current to prevent ice and snow from adhering, but high energy consumption and complex installation and maintenance limit this method for large-scale applications. While mechanical vibration and de-icing robots can remove existing ice and snow, they require significant equipment investment and cannot effectively prevent the re-adhesion of ice and snow in the long term. Furthermore, although anti-icing coatings can reduce ice and snow adhesion, the coating has weak adhesion to the wire surface, poor durability, and is prone to peeling off, and its effectiveness gradually diminishes over long-term use.

[0004] In recent years, researchers have also attempted to improve the anti-icing performance of conductor surface coatings by fabricating microstructures on the conductor surface. Microstructured surfaces can increase the adhesion of hydrophobic and anti-icing coatings, thereby effectively reducing ice and snow adhesion. However, existing microstructure fabrication methods, such as photolithography and electron beam etching, while successfully fabricating microstructures in laboratory environments, are complex, costly, and difficult to mass-produce, thus limiting their widespread application in large-scale power systems and rendering them impractical.

[0005] Therefore, finding an efficient, low-cost, and easily scaled-up microstructure preparation method has become a key issue in improving the anti-icing performance of overhead high-voltage conductors. This invention provides a novel apparatus and method for preparing microstructures on the surface of overhead high-voltage conductors. By uniformly and stably forming microstructures on the conductor surface, it not only significantly improves the anti-icing, anti-freezing rain, and self-cleaning properties of the conductor surface coating, but also offers lower production costs and higher production efficiency, meeting the needs of large-scale industrial production and solving the problem of the limited application of microstructure preparation in existing technologies. Summary of the Invention

[0006] This invention provides a device and method for preparing microstructures on the surface of overhead high-voltage conductors. The device and method use a guide module, an imprinting module, and two winding modules to position and extrude the shaped wire after stranding, so that the microstructure is prepared on the surface of the shaped wire. The surface microstructure can effectively improve the anti-icing performance of the coating on the surface of overhead high-voltage conductors, thereby improving the stability of the power system.

[0007] To solve the above problems, the technical solution provided by the present invention is as follows: An apparatus for preparing surface microstructures of overhead high-voltage conductors includes a guiding module, an imprinting module, and two winding modules. The guiding module and the imprinting module are disposed between the two winding modules. The two winding modules are used to wind and store the conductor before and after processing. The guiding module is used to position the conductor at the same position as the axis of the imprinting module, so that the imprinting module can imprint the conductor to form surface microstructures.

[0008] Furthermore, both winding modules include a wire support assembly and a climbing frame; the wire support assembly includes a roll frame, a guide roller, a first drive motor, and a tension sensor. The two ends of the guide roller are rotatably mounted on the roll frame using bearings, and one end of the guide roller passes through the roll frame and is connected to the first drive motor. The tension sensor is mounted on the shaft of the guide roller, and calculates the wire tension by detecting the torque on the guide roller shaft, and transmits the result to the control module. A climbing rod is rotatably mounted on the climbing frame, and the climbing rod is at the same height as the axis of the guide module.

[0009] Furthermore, the guide module includes a positioning cylinder, and a first positioning transmission assembly and a second positioning transmission assembly respectively installed on the front and rear sides of the positioning cylinder; the first positioning transmission assembly and the second positioning transmission assembly have the same structure, both including a gear ring, multiple first gears, multiple positioning screws and multiple limiting seats; Multiple screw holes are radially opened on the radial cross section of the positioning cylinder, and multiple positioning screws are threadedly connected to the screw holes one by one. Each limiting seat is fastened to the positioning cylinder, and the outer end of the positioning screw passes through the limiting seat. Each of the first gears is threadedly connected to the positioning screw, and each of the first gears is located between the limiting seat and the positioning cylinder; the gear ring is rotatably mounted on the positioning cylinder, and the teeth of the gear ring mesh with the plurality of first gears for transmission; The gear rings of the first positioning transmission assembly and the second positioning transmission assembly are rigidly connected by a synchronizing rod. A second drive motor is provided on the outside of one of the positioning screws of the first positioning transmission assembly, and the second drive motor is connected to the positioning screw in a transmission connection. The inner ends of each set of positioning screws located on the same axis are rotatably mounted on the same arc-shaped limiting plate, which is used to clamp and guide the wire; a pressure sensor is mounted on the arc-shaped limiting plate, and the second drive motor and the pressure sensor are both electrically connected to the control module; When the second drive motor starts, it drives the positioning screw located below it to rotate, which in turn drives the first gear and the gear ring to rotate. After the first gear rotates, it drives the positioning screw connected to it to rotate closer to or away from the axis of the positioning cylinder, thereby realizing the clamping, positioning or releasing of wires of different diameters.

[0010] Furthermore, the embossing module includes a fixed base, a gear transmission assembly, an embossing ring plate, a first guide hole, and a second guide hole. The fixed base has a through groove in the middle and a U-shaped groove at the top. The first guide hole and the second guide hole are respectively located on the fixed base at the left and right sides of the U-shaped groove. The gear transmission assembly includes a first bevel gear and a second bevel gear that mesh vertically; the first bevel gear is rotatably mounted on the outlet end of the first guide hole, and the second bevel gear is rotatably mounted on the lower surface of the U-shaped groove; a third drive motor is vertically mounted in the through groove, and the output shaft of the third drive motor passes through the U-shaped groove and is connected to the second bevel gear; The first bevel gear has a wire hole at its shaft center, and the embossing ring plate is radially detachably mounted on the inner circumferential surface of the wire hole by fasteners; the third drive motor is also connected to the control module.

[0011] Furthermore, the control module includes a microcontroller, which is electrically connected to the tension sensor, the pressure sensor, the first drive motor, the second drive motor, and the third drive motor, respectively. The microcontroller is used to adjust the speed and start / stop status of the first drive motor, the second drive motor, and the third drive motor according to the wire tension signal detected by the tension sensor and the pressure signal detected by the pressure sensor, so as to achieve stable winding, clamping and positioning of the wire, and surface microstructure processing.

[0012] Furthermore, the inner circumferential surface of the embossing ring plate is provided with V-shaped protrusions, trapezoidal protrusions, rectangular protrusions, or arc-shaped protrusions.

[0013] Furthermore, the guide module, the embossing module, and the two winding modules are made of one of the following materials: tungsten-based cemented carbide, titanium-based cemented carbide, chromium-based cemented carbide, mold steel, and polycrystalline diamond.

[0014] Furthermore, the conductor is a shaped wire, which is a stranded wire with a gap between the individual wires of less than 0.6 mm. The individual wires of the shaped wire are one of Z-shaped wire, T-shaped wire, S-shaped wire, V-shaped wire, L-shaped wire, W-shaped wire or M-shaped wire; the shaped wire is one of aluminum stranded wire, copper stranded wire, aluminum alloy stranded wire, aluminum-clad steel stranded wire or steel-cored aluminum stranded wire.

[0015] Furthermore, the cross-sectional dimensions of the profile range from 10mm to 50mm; the surface microstructure is a ring array microstructure; the shape of the ring array microstructure is one or more of the following: V-shaped microstructure, trapezoidal microstructure, rectangular microstructure, and arc-shaped microstructure; the period of the ring array microstructure ranges from 1000nm to 1mm.

[0016] A method for preparing microstructures on the surface of an overhead high-voltage conductor includes: Step 1: Install the two winding modules at both ends of the device, and install the guide module and the imprinting module in sequence in the middle area; connect the microcontroller to the tension sensor, pressure sensor, first drive motor, second drive motor and third drive motor respectively to complete the initial configuration of the control module; Step 2: Introduce the wire to be processed into the guide roller of the winding module at one end, start the first drive motor to drive the guide roller to wind the wire; the tension sensor detects the torque on the guide roller shaft in real time, calculates the wire tension and transmits it to the control module, the control module adjusts the speed of the first drive motor according to the preset tension threshold to keep the wire tension stable; Step 3: After the wire enters the guide module, the second drive motor is started, which drives the corresponding positioning screw to rotate. Through the meshing transmission of the first gear and the gear ring, the positioning screw is driven to move towards the axis of the positioning cylinder, so that the arc-shaped limiting plate at the inner end of the positioning screw clamps the wire. The pressure sensor detects the clamping pressure of the arc-shaped limiting plate on the wire and transmits the signal to the control module. The control module adjusts the output of the second drive motor according to the pressure feedback to ensure stable clamping of wires of different diameters. Step 4: After the wire is positioned at the same position as the axis of the imprinting module, the third drive motor is started. Its output shaft drives the first bevel gear to rotate through the second bevel gear, which in turn drives the imprinting ring plate to rotate radially. The imprinting ring plate performs imprinting processing on the surface of the wire to form a preset surface microstructure. Step 5: The wire after embossing is led out from the guide roller of the winding module at the other end. The first drive motor continues to drive the guide roller to wind and collect the wire, completing the preparation of the microstructure on the surface of the wire. During the microstructure preparation process, the wire pulling speed ranges from 5 to 30 m / min.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: The guide module, through the meshing transmission structure of the gear ring, the first gear and the positioning screw, can flexibly adjust the radial position of the positioning screw to achieve precise clamping and positioning of wires of different diameters, ensuring that the wires are aligned with the axis of the imprinting module, and improving the accuracy and consistency of microstructure processing; The two winding modules are responsible for winding and storing the wires before and after processing, respectively. Together with the continuous operation of the guiding module and the imprinting module, the microstructure of the wire surface can be prepared automatically and continuously, which greatly improves production efficiency. The embossing module uses the perpendicular meshing of the first bevel gear and the second bevel gear to drive the radial rotation of the embossing ring plate. Combined with the adjustment of the third drive motor by the control module, the rotation speed of the embossing ring plate and the embossing parameters can be precisely controlled to ensure that the shape and periodic parameters of the surface annular array microstructure meet the design requirements. The control module uses feedback signals from tension and pressure sensors to adjust the speed and start / stop status of the first, second, and third drive motors in real time, automatically maintaining stable wire tension and appropriate clamping pressure, reducing manual intervention and improving the stability and reliability of the processing. The mold materials cover a variety of high-performance materials such as tungsten-based hard alloy and polycrystalline diamond, and the profiles cover a variety of types such as aluminum stranded wire and steel-cored aluminum stranded wire. The equipment can be adapted to the processing needs of different overhead high-voltage conductors. By preparing V-shaped, trapezoidal and other ring array structures, the superhydrophobic, superoleophobic, anti-icing, anti-freezing rain, anti-fog, anti-fouling and self-cleaning properties of the coating on the conductor can be significantly improved, meeting the usage requirements of overhead high voltage conductors in complex environments. The wire drawing speed in the preparation method ranges from 5 to 30 m / min, which can be flexibly adjusted according to the wire material and microstructure precision requirements to balance processing efficiency and surface quality and adapt to the production needs of different scenarios. Attached Figure Description

[0018] Figure 1 This is an overall schematic diagram of the present invention.

[0019] Figure 2 This is an enlarged schematic diagram of the guide module of the present invention.

[0020] Figure 3 This is a schematic cross-sectional view of the guide module of the present invention.

[0021] Figure 4 This is a schematic diagram of an embossing ring plate according to the present invention.

[0022] Figure 5 This is a schematic diagram of the finished product of the present invention. Figure 1 .

[0023] Figure 6 This is an enlarged schematic diagram of the embossing module of the present invention.

[0024] Figure 7 This is a schematic diagram of the finished product of the present invention. Figure 2 .

[0025] The attached diagram shows: 1: Guide module, 2: Imprinting module, 3: Winding module, 4: Roller frame, 5: Guide roller, 6: First drive motor, 7: Climbing rod, 8: Positioning cylinder, 9: Gear ring, 10: First gear, 11: Positioning screw, 12: Limiting seat, 13: Screw hole, 14: Synchronizing rod, 15: Second drive motor, 16: Arc-shaped limiting plate, 17: Fixed seat, 18: First bevel gear, 19: Second bevel gear, 20: Imprinting ring plate, 21: Wire, 22: Second guide hole, 23: Third drive motor, 24: U-shaped groove, 25: Wire hole. Detailed Implementation

[0026] To further illustrate the technical means and effects of the present invention in order to achieve the intended purpose, the following detailed description of the specific implementation methods, structures, features and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0027] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate.

[0028] It should be noted that, in this application, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit the present invention.

[0029] Example 1 like Figure 1-7 As shown, this embodiment provides a device for preparing surface microstructures of overhead high-voltage conductors, including a guide module 1, an imprinting module 2, and two winding modules 3. The guide module 1 and the imprinting module 2 are disposed between the two winding modules 3. The two winding modules 3 are used to wind and store the conductor before and after processing, respectively. The guide module 1 is used to position the conductor at the same position as the axis of the imprinting module 2, so that the imprinting module 2 can imprint the conductor to form surface microstructures.

[0030] Specifically, the two winding modules 3 have identical structures, both including a wire support assembly and a climbing frame. The wire support assembly includes a winding drum frame 4, a guide roller 5, a first drive motor 6, and a tension sensor. The two ends of the guide roller 5 are rotatably mounted on the winding drum frame 4 using bearings, and one end of the guide roller 5's shaft passes through the winding drum frame 4 and connects to the output shaft of the first drive motor 6. The tension sensor is mounted on the shaft of the guide roller 5. In actual operation, the wire winding around the guide roller 5 generates radial force, which in turn causes torque on the shaft of the guide roller 5. The tension sensor detects this torque and, combined with the radius of the guide roller 5, accurately calculates the wire tension and transmits the tension signal to the control module. A climbing rod 7 is rotatably mounted on the climbing frame. The climbing rod 7 is at the same height as the axis of the guide module 1, thus providing support and preventing sagging during long-distance wire transmission.

[0031] The guide module 1 includes a positioning cylinder 8, and a first positioning transmission assembly and a second positioning transmission assembly respectively installed on the front and rear sides of the positioning cylinder 8. The first positioning transmission assembly and the second positioning transmission assembly have the same structure, both including a gear ring 9, three first gears 10, three positioning screws 11, and three limiting seats 12.

[0032] Three screw holes 13 are radially provided on the radial section of the positioning cylinder 8. The three positioning screws 11 are threadedly connected to the screw holes 13 in a corresponding manner. Each limiting seat 12 is fastened to the outer periphery of the positioning cylinder 8, and the outer end of the positioning screw 11 passes through the limiting seat 12.

[0033] Each of the first gears 10 is threadedly connected to the corresponding positioning screw 11 and is located between the limiting seat 12 and the positioning cylinder 8; the gear ring 9 is rotatably mounted on the outer wall of the positioning cylinder 8, and the teeth of the gear ring 9 mesh with the multiple first gears 10 for transmission.

[0034] The gear rings 9 of the first and second positioning transmission assemblies are rigidly connected by a synchronizing rod 14 to ensure synchronous transmission. A second drive motor 15 is provided on the outer side of one of the positioning screws 11 of the first positioning transmission assembly, and the second drive motor 15 is drivenly connected to the positioning screw 11.

[0035] The inner ends of each set of positioning screws 11 located on the same axis are rotatably mounted on the same arc-shaped limiting plate 16, which is used to clamp and guide the wire. A pressure sensor is installed on the arc-shaped limiting plate 16, and both the second drive motor 15 and the pressure sensor are electrically connected to the control module.

[0036] When the second drive motor 15 starts, it drives the positioning screw 11 below it to rotate. Due to the threaded engagement, the first gear 10 on the positioning screw 11 rotates, which in turn drives the gear ring 9 to rotate. The rotation of the gear ring 9 drives all the other first gears 10 to rotate synchronously. The rotation of the other first gears 10 then drives the positioning screw 11, which is threaded to it, to move closer to or rotate away from the axis of the positioning cylinder 8 within the screw hole 13. Through this linkage mechanism, multiple arc-shaped limiting plates 16 can synchronously retract towards the center or expand outward, achieving flexible clamping, positioning, or releasing of wires of different diameters. Pressure sensors are installed on the arc-shaped limiting plates 16 to detect the clamping pressure and transmit it to the control module, preventing excessive clamping force from damaging the wires or insufficient clamping force from causing inaccurate positioning.

[0037] The embossing module 2 includes a fixed base 17, a gear transmission assembly, multiple embossing ring plates 20, a first guide hole 21, and a second guide hole 22. The fixed base 17 has a through slot in the middle and a U-shaped groove 24 at its top. The first guide hole 21 and the second guide hole 22 are respectively located on the left and right sides of the U-shaped groove 24 on the fixed base 17, for guiding the insertion and exit of wires.

[0038] The gear transmission assembly includes a first bevel gear 18 and a second bevel gear 19 that mesh vertically; the first bevel gear 18 is rotatably mounted on the outlet end of the first guide hole 21, and the second bevel gear 19 is rotatably mounted on the lower surface of the U-shaped groove 24; a third drive motor 23 is vertically mounted in the through groove, and the output shaft of the third drive motor 23 passes through the U-shaped groove 24 and is connected to the second bevel gear 19.

[0039] The first bevel gear 18 has a wire hole at its shaft center, and the imprinting ring plate 20 is radially detachably mounted on the wire hole 25 by a set screw fastener; the third drive motor 23 is also connected to the control module. When the third drive motor 23 starts, through the reversing action of the bevel gear pair, it drives the first bevel gear 18 and the imprinting ring plate 20 to rotate at high speed around the wire, thereby imprinting the surface of the wire circumferentially. It should be noted that in this embodiment, due to the use of gear transmission to drive the imprinting ring plate to rotate, combined with the axial linear pull of the wire, a spiral periodic imprinting mechanism is formed: When the third drive motor starts, the first bevel gear and its imprinting ring plate are driven to rotate at high speed N around the wire through the reversing action of the bevel gear pair. At the same time, the wire is pulled forward at a uniform axial pulling speed V under the traction of the winding module, passing through the wire hole 25. The circumferential rotation of the imprinting ring plate 20 and the linear axial motion of the wire combine to form a helical feed motion, thereby continuously rolling out a helical microstructure on the surface of the wire. The axial period of the helical microstructure, i.e., the pitch P, is determined by the formula P=V / N. In this embodiment, the wire pulling speed V is controlled within the range of 5 to 30 m / min, and the third drive motor 23 controls the rotation speed N of the imprinting ring plate 20 to be steplessly adjustable within the range of 100 to 5000 r / min, so that the axial period P can accurately match the design requirements of 1000nm to 1mm. In addition, the imprinting ring plate 20 in this application has a thickness of at least 1cm and is detachably installed at the wire hole 25 for replacement to process microstructures of different shapes for wires of different sizes.

[0040] As a preferred embodiment, the inner circumference of the embossing ring 20 is provided with V-shaped protrusions, trapezoidal protrusions, rectangular protrusions, or arc-shaped protrusions to match microstructures with different shape requirements. The high-wear components in the guide module 1, embossing module 2, and winding module 3 that are in direct contact with the wires are made of one of the following materials: tungsten-based cemented carbide, titanium-based cemented carbide, chromium-based cemented carbide, mold steel, and polycrystalline diamond, to ensure a long service life for the device.

[0041] The control module includes a microcontroller, specifically a PLC or a microcontroller. The microcontroller is electrically connected to the tension sensor, the pressure sensor, the first drive motor 6, the second drive motor 15, and the third drive motor 23. The microcontroller adjusts the speed and start / stop status of the first drive motor 6, the second drive motor 15, and the third drive motor 23 based on the wire tension signal detected by the tension sensor and the pressure signal detected by the pressure sensor, thereby achieving stable winding, clamping, positioning, and surface microstructure processing of the wire.

[0042] In terms of control logic, the microcontroller is not only used to adjust the clamping and winding states according to tension and pressure signals, but more importantly, it realizes closed-loop synchronous control of the spiral cycle: when the tension fluctuation of the conductor causes a slight change in the drawing speed V, the microcontroller receives the speed feedback from the tension sensor in real time, and automatically adjusts the speed N of the third drive motor 23 proportionally according to the relationship P=V / N. This linkage control completely eliminates the uneven density of the spiral microstructure caused by the elastic deformation or slippage of the conductor, ensuring the absolute consistency of the microstructure cycle on long-distance conductors.

[0043] The conductor described in this embodiment is a shaped wire, specifically a stranded wire with a gap between individual wires of less than 0.6 mm. The shape of the individual wires is one of Z-shaped, T-shaped, S-shaped, V-shaped, L-shaped, W-shaped, or M-shaped wires. The material is one of aluminum stranded wire, copper stranded wire, aluminum alloy stranded wire, aluminum-clad steel stranded wire, or steel-cored aluminum stranded wire. The cross-sectional size of the shaped wire ranges from 10 mm to 50 mm.

[0044] The surface microstructure formed after processing by this device is a ring array microstructure, and its specific shape is one or more of the following: V-shaped microstructure, trapezoidal microstructure, rectangular microstructure and arc-shaped microstructure; the period range of the ring array microstructure is precisely controlled between 1000nm and 1mm.

[0045] This device employs rotary extrusion embossing, a cold plastic deformation process rather than material cutting. During the embossing process, the metal grains on the surface of the conductor are extruded and reshaped along the contours of the microstructure, preserving the continuous streamline structure of the metal surface and eliminating microcracks, tear bands, or burrs caused by cutting. Simultaneously, the intense plastic deformation causes work hardening of the surface metal, refining the grains and significantly improving the mechanical strength and wear resistance of the microstructure itself, making it less prone to wear-off under the long-term aerobatic vibrations of overhead lines.

[0046] Furthermore, the spiral microstructure prepared in this application forms continuous spiral guiding grooves on the surface of the conductor. Under the action of wind and rain, this spiral channel can generate a directional centrifugal guiding effect, forcing water droplets and dirt to quickly detach from the surface of the conductor along the spiral trajectory, exhibiting anti-fouling and self-cleaning capabilities.

[0047] When supercooled water droplets or frost condense on the surface of the conductor, the spiral microstructure physically disrupts the basis for the continuous growth of ice crystals in the circumferential direction. Due to the anisotropic adhesion force at various points in the spiral grooves, even a slight wind force or the natural de-icing jump of the conductor can easily cause the newly formed thin ice to experience stress concentration along the spiral interface and fracture brittlely, significantly reducing the bonding force between the ice layer and the conductor, thus achieving a passive anti-icing effect.

[0048] For conductors that require subsequent coating with superoleophobic or hydrophobic coatings, the coating can penetrate deep into the spiral grooves before curing and form a strong mechanical interlocking force after curing. This solves the technical problem of coating peeling and flaking of high-voltage conductors under extreme wind and frost conditions, and ensures that superhydrophobic and anti-icing properties are maintained for a long time.

[0049] Example 2 This embodiment provides a method for preparing microstructures on the surface of overhead high-voltage conductors, including the following steps: Step 1: Install the two winding modules 3 at both ends of the device, and install the guide module 1 and the imprinting module 2 in sequence in the middle area; connect the microcontroller to the tension sensor, pressure sensor, first drive motor 6, second drive motor 15 and third drive motor 23 respectively to complete the initial configuration of the control module.

[0050] Step 2: The wire to be processed is introduced into the guide roller 5 of the winding module 3 at the unwinding end, and the first drive motor 6 is started to drive the guide roller 5 for wire winding and unwinding. During the winding process, the tension sensor detects the torque on the shaft of the guide roller 5 in real time, calculates the current wire tension, and transmits it to the control module. The control module compares the real-time tension with the preset tension threshold and dynamically adjusts the speed of the first drive motor 6 to maintain a constant wire tension throughout the entire processing, preventing the wire from shaking or breaking.

[0051] Step 3: After the wire enters the guide module 1, the control module starts the second drive motor 15. The second drive motor 15 drives the corresponding positioning screw 11 to rotate. Through the meshing transmission of the first gear 10 and the gear ring 9, it drives the multiple circumferentially distributed positioning screws 11 to move synchronously towards the axis of the positioning cylinder 8, so that the arc-shaped limiting plate 16 at the inner end of the positioning screw 11 fits and clamps the wire. During this process, the pressure sensor detects the clamping pressure of the arc-shaped limiting plate 16 on the wire in real time and feeds it back to the control module. When the pressure reaches the preset safe clamping threshold, the control module controls the second drive motor 15 to stop, ensuring stable and damage-free clamping and positioning of wires of different diameters.

[0052] Step 4: After the conductor is precisely positioned at the same position as the axis of the first bevel gear 18 of the embossing module 2, the control module starts the third drive motor 23. The output shaft of the third drive motor 23 drives the first bevel gear 18 to rotate via the second bevel gear 19, which in turn drives the multiple embossing ring plates 20 on it to rotate radially around the conductor at high speed. As the conductor moves forward at a constant speed, the rotating embossing ring plates 20 continuously extrude the surface of the conductor, forming a ring array surface microstructure with a preset period and shape on the outer periphery of the conductor.

[0053] Step 5: The embossed wire passes through the embossing module 2 and is led out from the guide roller 5 of the winding module 3 at the take-up end. The first drive motor 6 continues to run, neatly winding and storing the processed wire. Throughout the entire microstructure preparation process, by coordinating the wire feeding and take-up speeds, the wire pulling speed is strictly controlled within the range of 5–30 m / min, completing the continuous and automated preparation of the microstructure on the wire surface.

[0054] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A device for preparing microstructures on the surface of overhead high-voltage conductors, characterized in that, It includes a guide module, an imprinting module, and two winding modules. The guide module and the imprinting module are disposed between the two winding modules. The two winding modules are used to wind and store the wire before and after processing. The guide module is used to position the wire at the same position as the axis of the imprinting module, so that the imprinting module can imprint the wire to form a surface microstructure.

2. The apparatus for preparing microstructures on the surface of overhead high-voltage conductors according to claim 1, characterized in that, Both winding modules include a conductor support assembly and a climbing frame. The conductor support assembly includes a drum frame, a guide roller, a first drive motor, and a tension sensor. The two ends of the guide roller are rotatably mounted on the drum frame using bearings, and one end of the guide roller passes through the drum frame and is connected to the first drive motor. The tension sensor is mounted on the shaft of the guide roller and calculates the conductor tension by detecting the torque on the guide roller shaft, and transmits the calculation to the control module. A climbing rod is rotatably mounted on the climbing frame, and the climbing rod is at the same height as the axis of the guide module.

3. The apparatus for preparing microstructures on the surface of overhead high-voltage conductors according to claim 2, characterized in that, The guide module includes a positioning cylinder, and a first positioning transmission assembly and a second positioning transmission assembly respectively installed on the front and rear sides of the positioning cylinder; the first positioning transmission assembly and the second positioning transmission assembly have the same structure, each including a gear ring, multiple first gears, multiple positioning screws and multiple limiting seats; Multiple screw holes are radially opened on the radial cross section of the positioning cylinder, and multiple positioning screws are threadedly connected to the screw holes one by one. Each limiting seat is fastened to the positioning cylinder, and the outer end of the positioning screw passes through the limiting seat. Each of the first gears is threadedly connected to the positioning screw, and each of the first gears is located between the limiting seat and the positioning cylinder; the gear ring is rotatably mounted on the positioning cylinder, and the teeth of the gear ring mesh with the plurality of first gears for transmission; The gear rings of the first positioning transmission assembly and the second positioning transmission assembly are rigidly connected by a synchronizing rod. A second drive motor is provided on the outside of one of the positioning screws of the first positioning transmission assembly, and the second drive motor is connected to the positioning screw in a transmission connection. The inner ends of each set of positioning screws located on the same axis are rotatably mounted on the same arc-shaped limiting plate, which is used to clamp and guide the wire; a pressure sensor is installed on the arc-shaped limiting plate, and the second drive motor and the pressure sensor are both electrically connected to the control module.

4. The apparatus for preparing microstructures on the surface of overhead high-voltage conductors according to claim 3, characterized in that, The embossing module includes a fixed base, a gear transmission assembly, an embossing ring plate, a first guide hole, and a second guide hole. The fixed base has a through groove in the middle and a U-shaped groove at the top. The first guide hole and the second guide hole are respectively located on the fixed base at the left and right sides of the U-shaped groove. The gear transmission assembly includes a first bevel gear and a second bevel gear that mesh vertically; the first bevel gear is rotatably mounted on the outlet end of the first guide hole, and the second bevel gear is rotatably mounted on the lower surface of the U-shaped groove; a third drive motor is vertically mounted in the through groove, and the output shaft of the third drive motor passes through the U-shaped groove and is connected to the second bevel gear; The first bevel gear has a wire hole at its shaft center, and the embossing ring plate is radially detachably mounted on the inner circumferential surface of the wire hole by fasteners; the third drive motor is also connected to the control module.

5. The apparatus for preparing microstructures on the surface of overhead high-voltage conductors according to claim 4, characterized in that, The control module includes a microcontroller, which is electrically connected to the tension sensor, the pressure sensor, the first drive motor, the second drive motor, and the third drive motor, respectively. The microcontroller is used to adjust the speed and start / stop status of the first drive motor, the second drive motor, and the third drive motor according to the wire tension signal detected by the tension sensor and the pressure signal detected by the pressure sensor, so as to achieve stable winding, clamping and positioning of the wire and surface microstructure processing.

6. The apparatus for preparing microstructures on the surface of overhead high-voltage conductors according to claim 5, characterized in that, The inner circumferential surface of the embossing ring plate is provided with V-shaped protrusions, trapezoidal protrusions, rectangular protrusions or arc-shaped protrusions.

7. The apparatus for preparing microstructures on the surface of overhead high-voltage conductors according to claim 6, characterized in that, The guide module, embossing module, and two winding modules are made of one of the following materials: tungsten-based cemented carbide, titanium-based cemented carbide, chromium-based cemented carbide, mold steel, and polycrystalline diamond.

8. The apparatus for preparing microstructures on the surface of overhead high-voltage conductors according to claim 7, characterized in that, The conductor is a shaped wire, which is a stranded wire with a gap between the individual wires of less than 0.6 mm. The individual wires of the shaped wire are one of Z-shaped wire, T-shaped wire, S-shaped wire, V-shaped wire, L-shaped wire, W-shaped wire or M-shaped wire; the shaped wire is one of aluminum stranded wire, copper stranded wire, aluminum alloy stranded wire, aluminum-clad steel stranded wire or steel-cored aluminum stranded wire.

9. The apparatus for preparing microstructures on the surface of overhead high-voltage conductors according to claim 8, characterized in that, The cross-sectional dimensions of the profile range from 10 mm to 50 mm; the surface microstructure is a ring array microstructure; the shape of the ring array microstructure is one or more of the following: V-shaped microstructure, trapezoidal microstructure, rectangular microstructure and arc-shaped microstructure; the period of the ring array microstructure ranges from 1000 nm to 1 mm.

10. A method for preparing microstructures on the surface of an overhead high-voltage conductor, comprising the apparatus for preparing microstructures on the surface of an overhead high-voltage conductor as described in any one of claims 1-9, characterized in that, include: Step 1: Install the two winding modules at both ends of the device, and install the guide module and the imprinting module in sequence in the middle area; The microcontroller is electrically connected to the tension sensor, pressure sensor, first drive motor, second drive motor, and third drive motor respectively to complete the initial configuration of the control module. Step 2: Introduce the wire to be processed into the guide roller of the winding module at one end, and start the first drive motor to drive the guide roller to wind the wire; The tension sensor detects the torque on the guide roller shaft in real time, calculates the conductor tension and transmits it to the control module. The control module adjusts the speed of the first drive motor according to the preset tension threshold to keep the conductor tension stable. Step 3: After the wire enters the guide module, the second drive motor is started, which drives the corresponding positioning screw to rotate. Through the meshing transmission of the first gear and the gear ring, the positioning screw is driven to move towards the axis of the positioning cylinder, so that the arc-shaped limiting plate at the inner end of the positioning screw clamps the wire. The pressure sensor detects the clamping pressure of the arc-shaped limiting plate on the wire and transmits the signal to the control module. The control module adjusts the output of the second drive motor according to the pressure feedback to ensure stable clamping of wires of different diameters. Step 4: After the wire is positioned at the same position as the axis of the imprinting module, the third drive motor is started. Its output shaft drives the first bevel gear to rotate through the second bevel gear, which in turn drives the imprinting ring plate to rotate radially. The imprinting ring plate performs imprinting processing on the surface of the wire to form a preset surface microstructure. Step 5: The wire after embossing is led out from the guide roller of the winding module at the other end. The first drive motor continues to drive the guide roller to wind and collect the wire, completing the preparation of the microstructure on the surface of the wire. During the microstructure preparation process, the wire pulling speed ranges from 5 to 30 m / min.

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