A detection device and method for reconfigurable reflective array cells

Abstract

The application belongs to the technical field of large-scale flat plate reflection array fault detection, and particularly relates to a detection device and method for a reconfigurable reflection array unit, the device comprising an isolation chip, a driving chip, a main control chip and a test circuit, the isolation chip is used for receiving test instructions issued by a computer and converting the test instructions into driving signals; the driving chip is connected with the isolation chip and is used for converting the driving signals into level signals; the main control chip is connected with the driving chip and is used for generating pin control signals; the test circuit is connected with the main control chip and is used for collecting pin current values in the reconfigurable reflection array unit; the device further comprises a power supply circuit, the power supply circuit supplies power to the isolation chip, the driving chip and the main control chip respectively, and the application can realize detection on the working condition of a large-scale reconfigurable reflection array unit, and has a simple structure and higher efficiency.

Description

Technical Field

[0001] This invention belongs to the field of fault detection technology for large-scale flat panel reflective arrays, and specifically relates to a detection device and method for reconfigurable reflective array elements. Background Technology

[0002] With the rapid development of technologies such as phased array antennas, reconfigurable smart surfaces (RIS), and spaceborne / airborne radar, ultra-large-scale planar reflector arrays are increasingly widely used in communication, remote sensing, and electronic warfare due to their advantages such as flexible and controllable beams, low profile, and easy conformal characteristics. Ultra-large-scale planar reflector arrays are typically composed of tens of thousands or even hundreds of thousands of "reconfigurable reflector elements" arranged in a periodic or quasi-periodic manner. Each element integrates active switching devices, which independently adjust the phase, amplitude, or polarization of the incident electromagnetic wave by controlling the bias voltage or current state of the control unit pins, thereby achieving high-performance radiation characteristics such as beam scanning, shaping, and multi-beaming.

[0003] In large-scale engineering fabrication, the aforementioned reconfigurable units are typically soldered onto multilayer printed circuit boards (PCBs) or dielectric substrates using surface mount technology (SMT) or micro-assembly processes. However, due to the small unit size, extremely high array density, and differences in the thermal expansion coefficients of the substrates, the stability of the mounting process is difficult to achieve the theoretically ideal level. In actual production and after initial assembly, batch failures of unit pins often occur, mainly manifested as: (1) open circuits between pins and pads; (2) short circuits between adjacent units or adjacent pads. These faults will directly lead to amplitude and phase distribution distortion of the reflector array, causing sidelobe level elevation, beam pointing deviation, and gain reduction, and in severe cases, even making the entire array unable to function properly.

[0004] Currently, for pin-level fault detection in large-scale reflective arrays, the industry mainly relies on manual inspection using microscopes, multimeters, or JTAG (Joint Technical Aspect-Oriented Gravity) methods. However, due to the large number of elements and their compact spatial arrangement, manual contact testing is not only extremely time-consuming but also prone to causing secondary damage to adjacent intact elements, and it is difficult to cover inner layers or hidden wiring nodes. To solve these problems, the current solution is to use electrical scanning or infrared thermal imaging for non-contact positioning, but its practical application is limited by insufficient element-level spatial resolution, thermal coupling interference, and the inability to directly distinguish fault types. Therefore, there is an urgent need for a detection device and method that can quickly, automatically, and non-destructively identify pin faults in reconfigurable elements of large-scale planar reflective arrays. Summary of the Invention

[0005] The purpose of this invention is to provide a detection device and method for reconfigurable reflective array elements, so as to solve one or more technical problems existing in the prior art, and at least provide a beneficial option or create conditions.

[0006] To achieve the above objectives, according to one aspect of the present invention, a detection device for reconfigurable reflective array elements is provided, comprising: an isolation chip and a driver chip that convert test instructions sent by a computer into drive level signals, then a main control chip that receives and controls the pins of the reconfigurable reflective array elements, and then the main control chip that sends and reports the collected pin sample values ​​to a computer, thereby detecting the operation of a large number of reconfigurable reflective array elements through the programming function of a main control chip and a monitoring chip. The device comprises: an isolation chip, a driver chip, a main control chip, and a test circuit. Isolation chip, driver chip, main control chip, and test circuit; The isolation chip receives test commands from the computer and converts them into drive signals; The driver chip, connected to the isolation chip, converts the drive signal into a level signal. The main control chip is connected to the driver chip, receives the level signal sent by the driver chip, and generates pin control signals based on the level signal; The test circuit is connected to the main control chip, receives the pin control signals of the main control chip, acquires the pin current values ​​of the reconfigurable reflective array unit based on the pin control signals, and transmits the pin current values ​​back to the main control chip. The device also includes a power supply circuit, which provides power to the isolation chip, the driver chip, the main control chip, and the test circuit.

[0007] Furthermore, the power supply circuit is a DC power supply circuit, including: a voltage regulator and an external DC power supply, and the power supply circuit achieves power supply by outputting a target level.

[0008] Furthermore, the main control chip also transmits the pin current values ​​returned by the test circuit back to the computer via the driver chip and the isolation chip.

[0009] Furthermore, the device is connected to a computer via a serial cable to obtain test commands issued by the computer and pin current values ​​reported by the test circuit.

[0010] Furthermore, the main control chip generates a level signal based on the pin current value and sends it back to the driver chip, the driver chip generates a drive signal and sends it back to the isolation chip, and the isolation chip generates a return signal and sends it back to the computer.

[0011] Furthermore, the test circuit includes at least two acquisition paths.

[0012] Furthermore, the acquisition path is used to acquire the pin current value of the reconfigurable reflective array unit. Different acquisition paths include different sampling resistors and current monitoring chips with different voltage resolutions, and the acquired pin current value is transmitted back to the main control chip through the output circuit.

[0013] According to another aspect of the present invention, a method for detecting reconfigurable reflective array elements is also provided, the method comprising: The computer issues test commands and generates drive signals through the isolation chip; The driver chip generates a level signal based on the drive signal; The main control chip generates pin control signals based on level signals; The main control chip controls the pins of the reconfigurable reflective array unit based on pin control signals; The test circuit acquires the pin current values ​​of the reconfigurable reflective array unit based on the pin control signals; The computer calculates the sampled value based on the pin current value and outputs the pin test result based on the inclusion relationship between the sampled value and the preset interval.

[0014] Furthermore, the method by which the main control chip controls the reconfigurable reflective array unit based on the pin control signal includes: the main control chip powering on the reconfigurable reflective array unit based on the pin control signal, and controlling the corresponding pin voltage of the reconfigurable reflective array unit to be a first voltage or a second voltage.

[0015] Furthermore, the power-on operation method includes powering on the reconfigurable reflective array unit via a power supply circuit.

[0016] Furthermore, the method for controlling the pin voltage of the reconfigurable reflective array unit to be a first voltage or a second voltage includes: the main control chip performs a power-on operation on the pin of the reconfigurable reflective array unit based on the pin control signal, records the pin voltage of the reconfigurable reflective array unit after power-on as the second voltage, and records the pin voltage of the reconfigurable reflective array unit before power-on as the first voltage.

[0017] Furthermore, the method by which the test circuit acquires the pin current value of the reconfigurable reflective unit based on the pin control signal includes: the test circuit selects different acquisition paths based on different pin voltages to acquire the first current value or the second current value of the corresponding pin of the reconfigurable reflective unit.

[0018] Furthermore, the method by which the test circuit selects different acquisition paths based on different pin output voltages to acquire the first current value or the second current value of the corresponding pin of the reconfigurable reflective array element includes: When the pin voltage of the reconfigurable reflective array unit is the first voltage, the first path is selected to collect the first current value; When the pin voltage of the reconfigurable reflective array element is the second voltage, the second path is selected to collect the second current value; The pin current values ​​collected by each acquisition channel are sent back to the main control chip.

[0019] Furthermore, the method for the computer to calculate the sampled value based on the pin current value includes: Calculate the current change based on the first current value and the second current value; Calculate voltage changes based on current changes and sampling resistors in the acquisition path; The sampled value is calculated based on the voltage change and the minimum voltage resolution of the monitoring chip in the acquisition path.

[0020] Furthermore, the method for calculating the current change includes: the absolute value of the difference between the first current value and the second current value, and the formula for calculating the current change includes: current change value = |first current value - second current value|.

[0021] Furthermore, the voltage change is the parallel voltage drop of the sampling resistor, and the calculation method of the parallel voltage drop includes: voltage change = current change × sampling resistor value.

[0022] Furthermore, the method for calculating the sampled value includes: the ratio between the voltage change of the pin of the reconfigurable reflective unit and the minimum voltage resolution of the monitoring chip is used as the sampled value, and the formula for calculating the sampled value includes: sampled value = voltage change / minimum voltage resolution.

[0023] Furthermore, the method for outputting the test results of the pins based on the inclusion relationship between the sampled values ​​and the preset interval includes: When the sampled value belongs to the first interval, the pin test result of the reconfigurable reflection array unit is normal. When the sampled value belongs to the second interval, the pin test result of the reconfigurable reflection array unit is short-circuited. When the sampled value belongs to the third interval, the pin test result of the reconfigurable reflection array unit is open circuit; Furthermore, the preset interval includes a first interval corresponding to the normal state, a second interval corresponding to the short-circuit state, and a third interval corresponding to the open-circuit state.

[0024] Furthermore, the method for obtaining the first interval includes: after collecting current values ​​of the standard normal pin before and after control through the acquisition path multiple times, calculating the sampled value based on the current value collected before and after each control, and the interval generated based on the calculation result is recorded as the first interval.

[0025] Furthermore, the method for obtaining the second interval includes: after collecting current values ​​multiple times from the standard short-circuit pins before and after control through the acquisition path, calculating the sampled value based on the current values ​​collected before and after each control, and recording the interval generated based on the calculation results as the preset second interval.

[0026] Furthermore, the method for obtaining the third interval includes: after collecting current values ​​multiple times from the standard open-circuit pins before and after control through the acquisition path, calculating the sampled value based on the current values ​​collected before and after each control, and recording the interval generated based on the calculation results as the third interval.

[0027] The beneficial effects of this invention are: (i) This invention uses a microcontroller to automate the fault detection of reconfigurable reflective array units. After the test command is input by the computer host computer, non-destructive testing of the entire array of multiple large-scale reconfigurable reflective arrays can be performed, and the specific fault information of each pin in the entire array can be returned. The detection method is more efficient than the manual method of testing one by one.

[0028] (ii) This invention sends instructions from a computer to a microcontroller. After the microcontroller compiles the instructions, it controls the test circuit to collect the values ​​of the reflective units in the large-scale reconfigurable reflective array, which can determine the fault status of the reflective unit pins. Only one main control IC and voltage and current monitoring chip are needed to detect the working status of the large-scale reconfigurable reflective array units and return the actual fault type of the pins. The structure is simple.

[0029] (III) The detection method for reconfigurable reflective array elements provided by the present invention can filter out most negligible element abnormalities, avoid the evaluation delay and evaluation result interference caused by the computer facing a large number of invalid fault information on the working status of a large-scale reconfigurable reflective array, achieve a significant acceleration of the detection process, and greatly improve the detection efficiency and real-time accuracy. Attached Figure Description

[0030] Figure 1 The diagram shows the internal structure of a detection device for a reconfigurable reflective array element. Figure 2 The diagram shows a flowchart of a detection method for reconfigurable reflective array elements; Figure 3 The diagram shows the external connection of a detection device for a reconfigurable reflective array element; Figure 4 The diagram shown is a circuit diagram of the first path in a detection device for a reconfigurable reflective array element. Figure 5 The diagram shown is a circuit diagram of the second path in a detection device for a reconfigurable reflective array element. Detailed Implementation

[0031] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0032] Figure 1 The diagram shows the internal structure of a detection device for a reconfigurable reflective array element. Figure 2 The diagram shown illustrates the principle of a forged image detection method. Please refer to it. Figure 1 As shown, the present invention provides a detection device for a reconfigurable reflective array element, the device comprising: an isolation chip, a driver chip, a main control chip, and a test circuit; Isolation chip, driver chip, main control chip, and test circuit; The isolation chip receives test commands from the computer and converts them into drive signals; The driver chip, connected to the isolation chip, converts the drive signal into a level signal. The main control chip is connected to the driver chip, receives the level signal sent by the driver chip, and generates pin control signals based on the level signal; The test circuit is connected to the main control chip, receives the pin control signals of the main control chip, acquires the pin current values ​​of the reconfigurable reflective array unit based on the pin control signals, and transmits the pin current values ​​back to the main control chip. Furthermore, the isolation chip and the driver chip are connected via a communication bus.

[0033] Furthermore, the driver chip and the main control chip are connected via a communication bus.

[0034] Furthermore, the main control chip and the test circuit are connected via a communication bus.

[0035] Furthermore, the communication bus is used to transmit signals and data.

[0036] The device also includes a power supply circuit, which provides power to the isolation chip, the driver chip, the main control chip, and the test circuit.

[0037] Furthermore, the power supply circuit is a DC power supply circuit, including: a voltage regulator and an external DC power supply, and the power supply circuit achieves power supply by outputting a target level.

[0038] Furthermore, the main control chip also transmits the pin current values ​​returned by the test circuit back to the computer via the driver chip and the isolation chip.

[0039] Furthermore, the device is connected to a computer via a serial cable to obtain test commands issued by the computer and pin current values ​​reported by the test circuit.

[0040] In this embodiment, the RS232 communication protocol is implemented using a MAX3232CSE RS232 transceiver during serial communication, and the stability of system data is ensured by two digital isolators, ADuM1402 and ADuM1250.

[0041] Furthermore, the main control chip generates a level signal based on the pin current value and sends it back to the driver chip, the driver chip generates a drive signal and sends it back to the isolation chip, and the isolation chip generates a return signal and sends it back to the computer.

[0042] Furthermore, the level signal is a transistor-to-transistor logic level signal.

[0043] Furthermore, the acquisition path is used to acquire the pin current value of the reconfigurable reflective array unit. Different acquisition paths include different sampling resistors and current monitoring chips with different voltage resolutions, and the acquired pin current value is transmitted back to the main control chip through the output circuit.

[0044] In this embodiment, the driver chip is a 232 driver chip, and the main control chip is an STM32F103R8T6 microcontroller. After the computer sends the test command, the microcontroller compiles and generates the control signals of the pins to realize the issuance of subarray control commands, including powering on the entire array and controlling different pins of the antenna units. The microcontroller program can realize automatic switching of the control of the reconfigurable reflective array unit pins (i.e., scanning the entire array) and stop when the test ends (excluding power-off), and read and transmit the monitored voltage and current data.

[0045] Figure 4 The diagram shown is a circuit diagram of the first path in a detection device for a reconfigurable reflective array element. Figure 5 The diagram shown is a circuit diagram of the second path in a detection device for a reconfigurable reflective array element; please refer to... Figure 4 and Figure 5 As shown, the present invention also provides a data acquisition path: In this embodiment, the acquisition path includes an INA226 voltage and current monitoring chip and a sampling resistor. The monitoring chip acquires the current value on the pin of the reconfigurable reflection unit and transmits the acquired current value back to the STM32F103R8T6 microcontroller through the SCL pin.

[0046] In this embodiment, the reconfigurable reflective array unit contains four diodes, and each reconfigurable reflective array unit contains four acquisition pins. The acquisition path can be directly connected to the acquisition pins to acquire the corresponding pin current values.

[0047] Figure 2 The diagram shown is a flowchart of a detection method for reconfigurable reflective array elements; please refer to... Figure 2 As shown, the present invention also provides a method for detecting reconfigurable reflective array elements, the method comprising: The computer issues test commands and generates drive signals through the isolation chip; The driver chip generates a level signal based on the drive signal; The main control chip generates pin control signals based on level signals; The main control chip controls the pins of the reconfigurable reflective array unit based on pin control signals; The test circuit acquires the pin current values ​​of the reconfigurable reflective array unit based on the pin control signals; The computer calculates the sampled value based on the pin current value and outputs the pin test result based on the inclusion relationship between the sampled value and the preset interval.

[0048] Furthermore, the method by which the main control chip controls the reconfigurable reflective array unit based on the pin control signal includes: the main control chip powering on the reconfigurable reflective array unit based on the pin control signal, and controlling the corresponding pin voltage of the reconfigurable reflective array unit to be a first voltage or a second voltage.

[0049] In an embodiment of the present invention, after the computer issues a test command, the driver chip generates a drive level and sends it to the STM32F103R8T6 microcontroller. The microcontroller compiles the computer's test command based on the drive level to generate pin control signals and sends the pin control signals to the adapter board. The adapter board controls the secondary power supply to power on and apply power to the reconfigurable reflective array unit based on the pin control signals, so that the corresponding pin voltage of the reconfigurable reflective array unit is a first voltage or a second voltage.

[0050] Furthermore, the adapter board is unidirectionally connected to the main control chip via a serial cable, and unidirectionally connected to the reconfigurable reflection unit.

[0051] Furthermore, the input terminal of the adapter board is communicatively connected to one output terminal of the main control chip, and the output terminal of the adapter board is communicatively connected to the input terminal of the reconfigurable reflection unit.

[0052] Furthermore, the method for the test circuit to acquire the pin current value of the reconfigurable reflective unit based on the pin control signal includes: the test circuit selects different acquisition paths based on different pin output voltages to acquire the first current value and the second current value of the corresponding pin of the reconfigurable reflective unit.

[0053] Furthermore, the method by which the test circuit selects different acquisition paths based on different pin output voltages to acquire the first current value or the second current value of the corresponding pin of the reconfigurable reflective array element includes: When the pin voltage of the reconfigurable reflective array unit is the first voltage, the first path is selected to collect the first current value; When the pin voltage of the reconfigurable reflective array element is the second voltage, the second path is selected to collect the second current value; The pin current values ​​collected by each acquisition channel are sent back to the main control chip.

[0054] In this embodiment, after the adapter board receives the power-on signal, it powers on the reconfigurable reflection unit through the power supply circuit and connects one output of the secondary power supply to the reconfigurable reflection array. At this time, the output voltage of each of the four pins of the reconfigurable reflection unit is -5V. Since there is a constant current source inside the reconfigurable reflection unit, the output current of the four pins after power-on is always 5mA. After the adapter board receives the pin control signal, the reconfigurable reflection units other than the test unit control pin 0 by default. The Securret software issues control commands, and the pins of the reconfigurable reflection units are powered on according to the control commands. The power supply circuit applies -5V and +2V voltages to the pins of the reconfigurable reflection units to complete the power-on. Before power-on, the pin voltage of the reconfigurable reflection unit is -5V, which is the first voltage. After power-on, the pin voltage of the reconfigurable reflection unit is +2V, which is the second voltage. The test circuit supplies external +3.3V and -5V power to the INA226 voltage and current monitoring chip in the test path through a secondary power supply. When the pin voltage of the reconfigurable reflector is -5V, the current collected through the first path is the first current value. When the pin voltage of the same reconfigurable reflector is +2V, the current collected through the second path is the second current value.

[0055] After returning the first and second current values ​​to the computer, the sampled values ​​of the pins of the reconfigurable reflective unit are calculated.

[0056] Furthermore, the method for calculating the sampled values ​​of the pins of the reconfigurable reflection unit includes: Calculate the current change based on the first current value and the second current value; Calculate voltage changes based on current changes and sampling resistors in the acquisition path; The sampled value is calculated based on the voltage change and the minimum voltage resolution of the monitoring chip in the acquisition path.

[0057] Furthermore, the method for calculating the current change includes: the absolute value of the difference between the first current value and the second current value, and the formula for calculating the current change includes: current change value = |first current value - second current value|.

[0058] Furthermore, the voltage change is the parallel voltage drop of the sampling resistor, and the calculation method of the parallel voltage drop includes: voltage change = current change × sampling resistor value.

[0059] Furthermore, the method for calculating the sampled value includes: the ratio between the voltage change of the pin of the reconfigurable reflective unit and the minimum voltage resolution of the monitoring chip is used as the sampled value, and the formula for calculating the sampled value includes: sampled value = voltage change / minimum voltage resolution.

[0060] In an embodiment of the present invention, the INA226 chip is used as the monitoring chip for the acquisition path. Since the minimum voltage resolution (LSB) of the voltage measurement of the INA226 chip is fixed, the LSB of the shunt voltage is 2.5μV, and its configuration register is 16 bits (16-bit signed number, ranging from -32768 to +32767), its full scale = 2.5μV × 2^15 = 81.92mV.

[0061] by Figure 4 Taking the sampling resistor used in the acquisition path as an example, the resistance of this sampling resistor is R=10mΩ, and the current flowing through this sampling resistor is I, which is the current of the pin when the large-scale reconfigurable reflection array is powered on. Therefore, the calculation of the sampled value can be expressed as: X = I * R / 2.5 The asterisk (*) represents the multiplication operator.

[0062] In one possible implementation, taking the current of a pin sampled after powering on a large-scale reflective array as an example: the sampled current is 1.00A, and the sampling resistor in the sampling path has a resistance of 10mΩ. Therefore, the calculation of the sampled value can be expressed as: X = (1*10*10^-3) / (2.5*10^-6) = 4000 Therefore, when the pins of the controlled unit are open-circuited (2V) or short-circuited (-5V), the change in the sampled value can be obtained based on the corresponding current change, thereby determining whether the pins of the controlled unit are open-circuited or short-circuited. The calculation of the change in the sampled value can be expressed as:

[0063] Furthermore, the method for outputting the test results of the pins based on the inclusion relationship between the sampled values ​​and the preset interval includes: When the sampled value belongs to the first interval, the pin test result of the reconfigurable reflection array unit is normal. When the sampled value belongs to the second interval, the pin test result of the reconfigurable reflection array element is short circuit; When the sampled value belongs to the third interval, the pin test result of the reconfigurable reflection array unit is open circuit; Furthermore, the preset interval includes a first interval corresponding to the normal state, a second interval corresponding to the short-circuit state, and a third interval corresponding to the open-circuit state.

[0064] Furthermore, the method for obtaining the first interval includes: after collecting current values ​​of the standard normal pin before and after control through the acquisition path multiple times, calculating the sampled value based on the current value collected before and after each control, and the interval generated based on the calculation result is recorded as the first interval.

[0065] Furthermore, the method for obtaining the second interval includes: after collecting current values ​​multiple times for the standard short-circuit pins before and after control through the acquisition path, calculating the sampled value based on the current values ​​collected before and after each control, and recording the interval generated based on the calculation results as the second interval.

[0066] Furthermore, the method for obtaining the third interval includes: after collecting current values ​​multiple times from the standard open-circuit pins before and after control through the acquisition path, calculating the sampled value based on the current values ​​collected before and after each control, and recording the interval generated based on the calculation results as the third interval.

[0067] Please refer to Figure 4 and Figure 5 As shown, in this embodiment of the invention, the sampling resistance of the acquisition path is 10mΩ, and there are four possible pin faults in the reconfigurable reflection unit: (1) When +2V is applied, it is short-circuited; when -5V is applied, it is normal. Due to the forward bias characteristic of the diode, the current flowing through the sampling resistor is still 5mA when +2V is applied and short-circuited. At this time, it will not affect the operation of the controlled unit, so no judgment is needed. At this time, the returned sample value does not change. (2) The +2V pin is open when powered on, but the -5V pin is normal when powered on. When the +2V pin is open, no current flows through it, and the sampled value changes, thus indicating that the pin is open. (3) +2V power-on is normal, -5V power-on is open circuit. Due to the reverse bias characteristic of the diode, the current flowing through the diode is 0 when -5V power-on is applied, and it will not affect the operation of the controlled unit at this time. No judgment is required, and the sampled value does not change at this time.

[0068] (4) +2V power-on is normal, -5V power-on is short-circuited. When -5V power-on is short-circuited, the current flowing through the sampling resistor increases. The short circuit is determined based on the change in the sampled value.

[0069] In one possible implementation, when the current value corresponding to the diode forward voltage 2V decreases by 5mA, the sampling resistor connected to the 2V voltage on the test channel is 4mΩ, and the change in the sampled value is as follows:

[0070] A difference of approximately 8 in the sampled value indicates that the pin is open-circuited to 2V. In another possible embodiment, when the current value corresponding to the diode reverse cutoff power supply -5V increases by 18.8mA, the sampling resistor connected to the -5V voltage on the test channel is 40mΩ, and the change in the sampled value is as follows:

[0071] When the sampled value has a difference of about 300, it means that the pin is short-circuited to -5V.

[0072] The beneficial effects of the above steps are as follows: By measuring the change in current value of the reconfigurable reflective unit pins before and after control through the test path, the fault condition of the reconfigurable reflective unit pins can be determined. Since the controlled unit consists of four diodes, based on the forward and reverse bias characteristics of the diodes, the detection time for unnecessary fault detection is reduced. That is, in the two pin fault conditions of short circuit when +2V is applied and normal when -5V is applied, and normal when +2V is applied and open circuit when -5V is applied, due to the characteristics of the diodes, even if the pin is faulty, it will not affect the operation of the reconfigurable reflective unit. The above method can quickly detect necessary pin fault conditions by detecting the change in the returned sample value, reducing the time of manually checking each pin one by one. At the same time, it is more efficient and accurate than the existing infrared detection method for solder joints.

[0073] Figure 3 The diagram shown is an external connection diagram of a detection device for a reconfigurable reflective array element. Please refer to [the diagram / reference]. Figure 3 As shown: The external power supply has two output terminals. One terminal outputs +5V for wave control power supply, and the other terminal outputs +60V for secondary power supply, where the secondary power supply is part of the power supply circuit. This embodiment includes a secondary power supply with four output terminals. Each output terminal can power on and power on one large-scale reconfigurable reflective array, and can simultaneously power on and power on four large-scale reconfigurable reflective arrays. Figure 3 An example of simultaneously powering two large-scale reconfigurable reflective arrays is given in the text; Meanwhile, the secondary power supply in this embodiment also supplies power to the device of the present invention. Specifically, by connecting the secondary power supply to the +3.3V and -5V input terminals of the device of the present invention, the power supply operation of the device of the present invention can be realized. After powering the device of the present invention, the +2V OUT and -5V OUT output terminals of the device are connected to the input terminals of each large-scale reconfigurable reflective array to power each large-scale reconfigurable reflective array.

[0074] The device included in this embodiment has eight channels for powering on and testing, and can simultaneously test eight large-scale reconfigurable reflective arrays.

[0075] Although the invention has been described in considerable detail and particularly with regard to several of the described embodiments, it is not intended to limit itself to any of these details or embodiments or any particular embodiment, thereby effectively covering the intended scope of the invention. Furthermore, the invention has been described above with respect to embodiments foreseeable by the inventors in order to provide a useful description, and non-substantial modifications to the invention that have not yet been foreseen may still represent equivalent modifications.

Claims

1. A detection device for reconfigurable reflective array elements, characterized in that, The device includes: an isolation chip, a driver chip, a main control chip, and a test circuit; The isolation chip receives test commands from the computer and converts them into drive signals; The driver chip, connected to the isolation chip, converts the drive signal into a level signal. The main control chip is connected to the driver chip, receives the level signal sent by the driver chip, and generates pin control signals based on the level signal; The test circuit is connected to the main control chip, receives the pin control signals of the main control chip, acquires the pin current values ​​of the reconfigurable reflective array unit based on the pin control signals, and transmits the pin current values ​​back to the main control chip. The device further includes a power supply circuit, which provides power to the isolation chip, the driver chip, the main control chip, and the test circuit respectively; The main control chip also transmits the pin current values ​​returned by the test circuit back to the computer via the driver chip and the isolation chip.

2. The detection device for a reconfigurable reflective array element according to claim 1, characterized in that, The test circuit includes at least two acquisition paths, which are used to acquire the pin current values ​​of the reconfigurable reflective array elements.

3. The detection device for a reconfigurable reflective array element according to claim 2, characterized in that, The different acquisition paths include different sampling resistors and current monitoring chips with different voltage resolutions.

4. A method for detecting reconfigurable reflective array elements, characterized in that, The method is based on a detection device for reconfigurable reflective array elements as described in any one of claims 1 to 3, and the method includes: The computer issues test commands and generates drive signals through the isolation chip; The driver chip generates a level signal based on the drive signal; The main control chip generates pin control signals based on level signals; The main control chip controls the pins of the reconfigurable reflective array unit based on pin control signals; The test circuit acquires the pin current values ​​of the reconfigurable reflective array unit based on the pin control signals; The computer calculates the sampled value based on the pin current value and outputs the pin test result based on the inclusion relationship between the sampled value and the preset interval.

5. The detection method for reconfigurable reflective array elements according to claim 4, characterized in that, The method by which the main control chip controls the pins of the reconfigurable reflective array unit based on the pin control signal includes: the main control chip powering on the reconfigurable reflective array unit based on the pin control signal, and controlling the corresponding pin voltage of the reconfigurable reflective array unit to be a first voltage or a second voltage.

6. The detection method for reconfigurable reflective array elements according to claim 5, characterized in that, The method for the test circuit to acquire the pin current value of the reconfigurable reflective unit based on the pin control signal includes: the test circuit selects different acquisition paths based on different pin voltages to acquire the first current value or the second current value of the corresponding pin of the reconfigurable reflective unit.

7. The detection method for reconfigurable reflective array elements according to claim 6, characterized in that, The method for controlling the pin voltage of the reconfigurable reflective array unit to be a first voltage or a second voltage includes: the main control chip performs a power-on operation on the pin of the reconfigurable reflective array unit based on the pin control signal, records the pin voltage of the reconfigurable reflective array unit after power-on as the second voltage, and records the pin voltage of the reconfigurable reflective array unit before power-on as the first voltage.

8. The detection method for reconfigurable reflective array elements according to claim 7, characterized in that, The method by which the test circuit selects different acquisition paths based on different pin output voltages to acquire the first or second current value of the corresponding pin of the reconfigurable reflective array element includes: When the pin voltage of the reconfigurable reflective array unit is the first voltage, the first path is selected to collect the first current value; When the pin voltage of the reconfigurable reflective array element is the second voltage, the second path is selected to collect the second current value; The pin current values ​​collected by each acquisition channel are sent back to the main control chip.

9. The detection method for reconfigurable reflective array elements according to claim 8, characterized in that, The method for calculating sampled values ​​based on pin current values ​​by the computer includes: Calculate the current change based on the first current value and the second current value; Calculate voltage changes based on current changes and sampling resistors in the acquisition path; The sampled value is calculated based on the voltage change and the voltage resolution of the monitoring chip in the acquisition path.

10. The detection method for reconfigurable reflective array elements according to claim 9, characterized in that, The method for outputting the test results of the pins based on the inclusion relationship between the sampled values ​​and the preset interval includes: When the sampled value belongs to the first interval, the pin test result of the reconfigurable reflection array unit is normal. When the sampled value belongs to the second interval, the pin test result of the reconfigurable reflection array unit is short-circuited. When the sampled value belongs to the third interval, the pin test result of the reconfigurable reflection array unit is open circuit; The preset intervals include a first interval corresponding to the normal state, a second interval corresponding to the short-circuit state, and a third interval corresponding to the open-circuit state.

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