A cutting assembly for integrated circuit chips

Abstract

The utility model discloses a cutting assembly of integrated circuit chip, including base and fixedly connected in the cutting table of base top, the position of base and corresponding cutting table is equipped with cutting device for integrated circuit chip cutting. The utility model drives drive seat to go down with vertical electric jar, and then makes cutting mechanism go down, in this process, the pressing fixed structure of cutting frame both sides can accurate pressing fixed to the integrated circuit chip of cutting, effectively avoid the chip displacement when cutting, guarantee cutting accuracy and chip quality, the spacing between two cutting structures can be adjusted flexibly on the adjusting structure of cutting frame, realize the free adjustment of integrated circuit chip cutting width, satisfy the production demand of different specifications chip, improve equipment applicability, simultaneously, the automation operation of cutting is realized to the collaborative work of vertical electric jar with cutting mechanism movement, reduces the labor intensity, promotes production efficiency and product quality stability.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit chip cutting technology, and in particular to a cutting assembly for integrated circuit chips. Background Technology

[0002] In the integrated circuit chip manufacturing process, the dicing step is crucial, directly impacting the chip's quality and subsequent performance. Publication number CN210125809U describes an integrated circuit chip dicing apparatus, a common piece of equipment in chip manufacturing technology, which to some extent achieves the chip dicing function. This apparatus includes a mounting base, and power components, support components, and pushing components mounted on the top surface of the mounting base. Through the coordinated work of these components, the process of moving the chip from the conveyor belt to the worktable, to dicing, and then back to the conveyor belt is completed.

[0003] However, in practical applications, the above-mentioned technical solution has significant shortcomings. Firstly, it is inconvenient to clamp and fix the integrated circuit chips to be cut. During chip cutting, if the chip cannot be stably fixed, it is prone to displacement under the cutting force, leading to decreased cutting accuracy, cutting deviations, affecting chip quality and performance, and potentially even causing chip scrap, increasing production costs. Secondly, this technical solution is not convenient for adjusting the cutting width of integrated circuit chips. With the diversification of market demand, integrated circuit chips of different specifications and applications have different requirements for cutting width. The inability to flexibly adjust the cutting width greatly limits the applicability of the cutting device, making it difficult to meet diverse production needs and reducing production efficiency and equipment utilization. Utility Model Content

[0004] The purpose of this invention is to provide a cutting assembly for integrated circuit chips. A vertical electric cylinder drives the drive base downward, which in turn moves the cutting mechanism downward. During this process, the clamping and fixing structures on both sides of the cutting frame can accurately clamp and fix the integrated circuit chip to be cut, effectively preventing chip displacement during cutting and ensuring cutting accuracy and chip quality. The adjustment structure on the cutting frame can flexibly adjust the distance between the two cutting structures, realizing free adjustment of the cutting width of the integrated circuit chip, meeting the production needs of chips of different specifications, and improving the applicability of the equipment. At the same time, the horizontal electric cylinder driving the cutting mechanism to move and the coordinated work of the vertical electric cylinder realize the automated cutting operation, reduce labor intensity, and improve production efficiency and product quality stability.

[0005] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0006] A dicing assembly for an integrated circuit chip, comprising:

[0007] A base and a cutting table fixedly connected to the top of the base, wherein a cutting device for cutting integrated circuit chips is installed on the base and at a position corresponding to the cutting table;

[0008] The cutting device includes a gantry frame fixedly connected to the top of the base, a vertical electric cylinder is installed on the gantry frame, a drive seat is fixedly connected to the output end of the vertical electric cylinder, a horizontal electric cylinder is installed on the side of the drive seat, and a cutting mechanism is installed on the output end of the horizontal electric cylinder.

[0009] The aforementioned integrated circuit chip cutting assembly includes a cutting mechanism comprising a cutting frame fixedly connected to the output end of the transverse electric cylinder, two symmetrically arranged cutting structures mounted on the cutting frame, and an adjustment structure for adjusting the cutting structures mounted on the cutting frame at a position corresponding to the cutting structures.

[0010] The aforementioned integrated circuit chip cutting assembly includes a cutting structure comprising a mounting plate, on which a cutting motor is mounted, and a cutting disc is fixedly connected to the output shaft of the cutting motor.

[0011] The aforementioned integrated circuit chip cutting assembly includes an adjustment structure comprising a bidirectional screw rotatably mounted on the cutting frame, the bidirectional screw having reverse threads, and two symmetrically arranged threaded sleeves threadedly connected to the bidirectional screw, with the side of the threaded sleeves fixedly connected to the side of the mounting plate.

[0012] In the aforementioned integrated circuit chip cutting assembly, a limiting slider is fixedly connected to the side of the threaded sleeve, and a limiting groove matching the limiting slider is provided on the inner wall of the cutting frame.

[0013] In the aforementioned integrated circuit chip cutting assembly, both sides of the bottom of the cutting frame are equipped with clamping and fixing structures for clamping and fixing the integrated circuit chip to be cut. The clamping and fixing structure includes a mounting base fixedly connected to the cutting frame, a connecting spring fixedly connected to the bottom of the mounting base, and a pressure plate fixedly connected to the bottom of the connecting spring.

[0014] In the aforementioned integrated circuit chip cutting assembly, positioning slide rods are fixedly connected to both sides of the top of the pressure plate, and the positioning slide rods are slidably connected to the mounting base.

[0015] In the aforementioned integrated circuit chip cutting assembly, limit telescopic rods are fixedly connected to both sides of the top of the drive seat, and the other end of the limit telescopic rods is fixedly connected to the gantry frame.

[0016] This utility model has at least the following beneficial effects:

[0017] 1. This utility model realizes a cutting component for integrated circuit chips. A vertical electric cylinder drives the drive seat to move downward, thereby causing the cutting mechanism to move downward. During this process, the clamping and fixing structures on both sides of the cutting frame can accurately clamp and fix the integrated circuit chip to be cut, effectively avoiding chip displacement during cutting and ensuring cutting accuracy and chip quality. The adjustment structure on the cutting frame can flexibly adjust the distance between the two cutting structures, realizing free adjustment of the cutting width of the integrated circuit chip, meeting the production needs of chips of different specifications, and improving the applicability of the equipment. At the same time, the horizontal electric cylinder driving the cutting mechanism to move and the coordinated work of the vertical electric cylinder realize the automated cutting operation, reduce labor intensity, and improve production efficiency and product quality stability.

[0018] 2. Precise clamping and fixing to ensure cutting quality: This invention, while the cutting mechanism moves downwards, uses clamping and fixing structures on both sides of the cutting frame to clamp and fix the integrated circuit chip to be cut. This design ensures that the chip remains stable throughout the cutting process, effectively preventing displacement due to cutting force. This significantly improves cutting precision, guarantees the quality and performance of the integrated circuit chip, reduces chip scrap rates caused by cutting deviations, and saves production costs.

[0019] 3. Flexible adjustment of cutting width to meet diverse needs: This invention features an adjustable structure that allows for adjustment of the distance between the two cutting structures, thereby enabling flexible adjustment of the cutting width of integrated circuit chips. This feature allows the cutting assembly to adapt to the cutting requirements of integrated circuit chips of different specifications and applications, greatly improving the applicability and versatility of the equipment. Enterprises no longer need to purchase multiple cutting machines for producing chips with different cutting widths, reducing equipment procurement costs while also improving production efficiency and enabling rapid response to diverse market demands.

[0020] 4. Automated operation, improved production efficiency: A horizontal electric cylinder moves the cutting mechanism directly above the integrated circuit chip to be cut, and then a vertical electric cylinder moves the drive seat downwards, thereby moving the cutting mechanism downwards for cutting. The entire process is automated. This automated operation not only reduces manual intervention and labor intensity but also improves the stability and consistency of cutting, further enhancing the production efficiency and quality stability of integrated circuit chips. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0022] Figure 1 This is a schematic diagram of the structure of the integrated circuit chip cutting assembly of this utility model;

[0023] Figure 2 This is a schematic diagram of the cutting device in the integrated circuit chip cutting assembly of this utility model;

[0024] Figure 3 This is a schematic diagram of the cutting mechanism in the integrated circuit chip cutting assembly of this utility model;

[0025] Figure 4 This is a schematic diagram of the cutting structure in the integrated circuit chip cutting assembly of this utility model;

[0026] Figure 5 This is a schematic diagram of the clamping and fixing structure in the cutting assembly of the integrated circuit chip of this utility model.

[0027] Explanation of icon numbers:

[0028] 1. Base; 2. Cutting table; 3. Cutting device;

[0029] 301. Gantry frame; 302. Vertical electric cylinder; 303. Drive base; 304. Horizontal electric cylinder; 305. Cutting mechanism;

[0030] 3031. Limiting telescopic rod;

[0031] 3051. Cutting frame; 3052. Cutting structure; 3053. Adjustment structure; 3054. Pressing and fixing structure;

[0032] 30521, Mounting plate; 30522, Cutting motor; 30523, Cutting disc;

[0033] 30531, double-acting screw; 30532, threaded sleeve;

[0034] 30533, Limiting slider; 30534, Limiting groove;

[0035] 30541, Mounting base; 30542, Connecting spring; 30543, Pressure plate; 30544, Positioning slide rod. Detailed Implementation

[0036] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0037] Please refer to Figures 1 to 5 As shown, an embodiment of the present invention provides a cutting assembly for an integrated circuit chip, comprising: a base 1 and a cutting table 2 fixedly connected to the top of the base 1, characterized in that a cutting device 3 for cutting integrated circuit chips is installed on the base 1 at a position corresponding to the cutting table 2.

[0038] The cutting device 3 includes a gantry 301 fixedly connected to the top of the base 1. A vertical electric cylinder 302 is installed on the gantry 301. A drive base 303 is fixedly connected to the output end of the vertical electric cylinder 302. A horizontal electric cylinder 304 is installed on the side of the drive base 303. A cutting mechanism 305 is installed on the output end of the horizontal electric cylinder 304.

[0039] By adopting the above technical solution, the vertical electric cylinder 302 drives the drive seat 303 to move downward, thereby causing the cutting mechanism 305 to move downward. During this process, the clamping and fixing structures 3054 on both sides of the cutting frame 3051 can accurately clamp and fix the integrated circuit chip to be cut, effectively avoiding chip displacement during cutting and ensuring cutting accuracy and chip quality. The adjustment structure 3053 on the cutting frame 3051 can flexibly adjust the distance between the two cutting structures 3052, realizing free adjustment of the cutting width of the integrated circuit chip, meeting the production needs of chips of different specifications, and improving the applicability of the equipment. At the same time, the horizontal electric cylinder 304 drives the cutting mechanism 305 to move, and the coordinated work of the vertical electric cylinder 302 realizes the automated operation of cutting, reduces labor intensity, and improves production efficiency and product quality stability.

[0040] To achieve flexible adjustment of the cutting width of integrated circuit chips, in this embodiment: the cutting mechanism 305 includes a cutting frame 3051 fixedly connected to the output end of the transverse electric cylinder 304. Two symmetrically arranged cutting structures 3052 are installed on the cutting frame 3051. An adjustment structure 3053 for adjusting the cutting structure 3052 is installed on the cutting frame 3051 at the position corresponding to the cutting structure 3052. The spacing between the two cutting structures 3052 can be easily adjusted by adjusting the adjustment structure 3053, thereby meeting the diverse cutting width requirements of integrated circuit chips of different specifications and improving the versatility and applicability of the equipment.

[0041] In order to perform efficient and stable cutting of integrated circuit chips, in this embodiment: the cutting structure 3052 includes a mounting plate 30521, on which a cutting motor 30522 is mounted, and a cutting disk 30523 is fixedly connected to the output shaft of the cutting motor 30522. The cutting motor 30522 provides power to drive the cutting disk 30523 to rotate at high speed, thereby achieving precise cutting of integrated circuit chips and ensuring the efficiency and quality of the cutting process.

[0042] To achieve precise and stable adjustment of the spacing between the two cutting structures 3052, in this embodiment, the adjustment structure 3053 includes a bidirectional screw 30531 rotatably mounted on the cutting frame 3051. The bidirectional screw 30531 has reverse threads, and two symmetrically arranged threaded sleeves 30532 are threadedly connected to it. The sides of the threaded sleeves 30532 are fixedly connected to the sides of the mounting plate 30521. Rotating the bidirectional screw 30531, utilizing the characteristics of its reverse threads, allows the two threaded sleeves 30532 to move synchronously in opposite directions, thereby driving the mounting plate 30521 and the cutting structures 3052 to move, achieving precise adjustment of the spacing between the cutting structures 3052. This method is simple to operate and offers high adjustment accuracy.

[0043] To ensure the stability of the threaded sleeve 30532's movement and prevent it from shifting during movement, in this embodiment: a limiting slider 30533 is fixedly connected to the side of the threaded sleeve 30532, and a limiting groove 30534 matching the limiting slider 30533 is provided on the inner wall of the cutting frame 3051. The limiting slider 30533 slides within the limiting groove 30534, limiting and guiding the threaded sleeve 30532, ensuring that the threaded sleeve 30532 can only move along the axial direction of the bidirectional screw 30531, thus improving the stability and reliability of the adjustment process.

[0044] To reliably clamp and fix the integrated circuit chip to be cut during the cutting process and prevent chip displacement from affecting cutting accuracy, in this embodiment: clamping and fixing structures 3054 for clamping and fixing the integrated circuit chip to be cut are installed on both sides of the bottom of the cutting frame 3051. The clamping and fixing structure 3054 includes a mounting base 30541 fixedly connected to the cutting frame 3051, a connecting spring 30542 fixedly connected to the bottom of the mounting base 30541, and a pressure plate 30543 fixedly connected to the bottom of the connecting spring 30542. During the downward movement of the cutting mechanism 305, the pressure plate 30543 first contacts the chip. As the cutting mechanism 305 continues to move downward, the connecting spring 30542 is compressed, generating elastic force to clamp and fix the chip, ensuring the stability of the chip during the cutting process.

[0045] To ensure the stability of the pressure plate 30543 during the clamping process and prevent it from shaking, in this embodiment, positioning slide rods 30544 are fixedly connected to both sides of the top of the pressure plate 30543, and the positioning slide rods 30544 are slidably connected to the mounting base 30541. The positioning slide rods 30544 slide within the mounting base 30541, guiding the pressure plate 30543 so that it can only move in the vertical direction, thus improving the stability and reliability of the clamping and fixing process.

[0046] To ensure the stability of the drive seat 303 under the action of the vertical electric cylinder 302 and prevent it from shaking, in this embodiment, limiting telescopic rods 3031 are fixedly connected to both sides of the top of the drive seat 303, and the other end of the limiting telescopic rods 3031 is fixedly connected to the gantry frame 301. The limiting telescopic rods 3031 extend and retract with the movement of the drive seat 303, playing a limiting and guiding role for the drive seat 303, ensuring that the drive seat 303 can only move in the vertical direction, improving the stability of the movement of the cutting mechanism 305, and thus ensuring the cutting quality.

[0047] The working principle of this utility model is as follows: First, the integrated circuit chip to be cut is placed on the cutting table 2. Then, the horizontal electric cylinder 304 is activated, and its output end drives the cutting mechanism 305 to move, so that the cutting mechanism 305 is precisely moved above the integrated circuit chip to be cut. Next, the vertical electric cylinder 302 operates, driving the drive seat 303 to move down, and then driving the cutting mechanism 305 down together. During the downward movement of the cutting mechanism 305, the clamping and fixing structures 3054 on both sides of the cutting frame 3051 play their role first. Under the elastic force of the connecting spring 30542, the pressure plate 30543 firmly clamps and fixes the integrated circuit chip to be cut, preventing the chip from shifting during the cutting process. After that, the cutting structure 3052 on the cutting frame 3051 starts to work. The cutting motor 30522 drives the cutting disk 30523 to rotate at high speed to cut the integrated circuit chip. At the same time, if it is necessary to adjust the cutting width of the integrated circuit chip, it can be achieved by adjusting the structure 3053. Rotating the bidirectional screw 30531 utilizes its reverse thread characteristic to cause the two threaded sleeves 30532 to move synchronously in opposite directions, thereby driving the mounting plate 30521 and the cutting structure 3052 to move. This adjusts the spacing between the two cutting structures 3052 to meet the cutting requirements of chips of different specifications. The entire cutting process achieves automated and precise operation, effectively improving cutting quality and production efficiency.

[0048] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the present invention's conception through the foregoing teachings or related technical or knowledge. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A dicing assembly for an integrated circuit chip, comprising a base (1) and a dicing table (2) fixedly connected to the top of the base (1), characterized in that, A cutting device (3) for cutting integrated circuit chips is installed on the base (1) at a position corresponding to the cutting table (2). The cutting device (3) includes a gantry frame (301) fixedly connected to the top of the base (1), a vertical electric cylinder (302) is installed on the gantry frame (301), a drive seat (303) is fixedly connected to the output end of the vertical electric cylinder (302), a horizontal electric cylinder (304) is installed on the side of the drive seat (303), and a cutting mechanism (305) is installed on the output end of the horizontal electric cylinder (304).

2. The dicing assembly for an integrated circuit chip according to claim 1, characterized in that: The cutting mechanism (305) includes a cutting frame (3051) fixedly connected to the output end of the transverse electric cylinder (304). Two symmetrically arranged cutting structures (3052) are installed on the cutting frame (3051). An adjustment structure (3053) for adjusting the cutting structure (3052) is installed on the cutting frame (3051) at a position corresponding to the cutting structure (3052).

3. The dicing assembly for an integrated circuit chip according to claim 2, characterized in that: The cutting structure (3052) includes a mounting plate (30521), on which a cutting motor (30522) is mounted, and a cutting disc (30523) is fixedly connected to the output shaft of the cutting motor (30522).

4. The dicing assembly for an integrated circuit chip according to claim 3, characterized in that: The adjustment structure (3053) includes a bidirectional screw (30531) rotatably mounted on the cutting frame (3051). The bidirectional screw (30531) has reverse threads, and two symmetrically arranged threaded sleeves (30532) are threadedly connected to the bidirectional screw (30531). The side of the threaded sleeve (30532) is fixedly connected to the side of the mounting plate (30521).

5. The dicing assembly for an integrated circuit chip according to claim 4, characterized in that: The threaded sleeve (30532) is fixedly connected to a limiting slider (30533) on its side, and a limiting groove (30534) matching the limiting slider (30533) is provided on the inner wall of the cutting frame (3051).

6. The dicing assembly for an integrated circuit chip according to claim 5, characterized in that: Both sides of the bottom of the cutting frame (3051) are equipped with a clamping and fixing structure (3054) for clamping and fixing the integrated circuit chip to be cut. The clamping and fixing structure (3054) includes a mounting base (30541) fixedly connected to the cutting frame (3051). A connecting spring (30542) is fixedly connected to the bottom of the mounting base (30541), and a pressure plate (30543) is fixedly connected to the bottom of the connecting spring (30542).

7. The dicing assembly for an integrated circuit chip according to claim 6, characterized in that: Positioning slide rods (30544) are fixedly connected to both sides of the top of the pressure plate (30543), and the positioning slide rods (30544) are slidably connected to the mounting base (30541).

8. The dicing assembly for an integrated circuit chip according to claim 7, characterized in that: Limiting telescopic rods (3031) are fixedly connected to both sides of the top of the drive seat (303), and the other end of the limiting telescopic rods (3031) is fixedly connected to the gantry frame (301).

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