A follow-up resonant grinding and foreign matter cleaning device and process for power cables

Abstract

This invention belongs to the field of grinding and surface finishing technology, and relates to a follow-up resonant grinding and foreign matter removal device and process for power supply cables. The device includes a precision resonant actuation mechanism, a contour grinding head, a grinding impedance detection unit, and a frequency conversion grinding control center. Based on the electromechanical coupling impedance signal, the control center tracks the mechanical resonant point through phase-locked logic and adjusts the drive signal frequency, so that the contour grinding head with its segmented, clamping structure is in a resonant grinding state with the foreign matter on the surface of the power supply cable. The high-frequency vibration of the inner abrasive layer performs micro-cutting and shearing peeling of the foreign matter; and adaptive mode switching is achieved based on the dynamic characteristics of the impedance spectrum. This invention achieves non-destructive precision micro-grinding, efficiently removes ice buildup and improves the surface finish of the workpiece, avoiding damage from traditional rigid scraping, and is suitable for cleaning the surface of power supply cables such as cables.

Description

Technical Field

[0001] This invention belongs to the field of grinding and surface finishing technology, specifically relating to a device and process for precision follow-up grinding and surface finishing of surface deposits (such as ice) on power cables using the principle of resonant grinding. Background Technology

[0002] In industrial production and infrastructure maintenance, power cables (such as contact wires, transmission cables, precision guide rails, and pipes) often develop hard, difficult-to-remove foreign objects on their surfaces due to environmental factors. Existing cleaning techniques mostly involve simple mechanical tapping or heat melting, which presents the following problems: 1) Poor machining accuracy: Traditional mechanical scrapers are rigid cutters, which are very easy to scratch the surface of the workpiece substrate and damage the hardened or anti-corrosion layer of the metal surface.

[0003] 2) Incomplete cleaning: For interface layers that are tightly bonded to the substrate, conventional methods are difficult to completely remove them without damaging the substrate, similar to the problem of "removal of allowance" in grinding.

[0004] 3) Lack of finishing effect: Existing technologies only focus on removing deposits, neglecting the protection and repair of the workpiece surface. Grinding or polishing devices encompass technologies that use abrasive tools to grind, polish, or grind the workpiece surface. Introducing the concept of "resonance grinding," which uses high-frequency micro-amplitude vibration to replace large-feed cutting, is key to solving the aforementioned challenges of high-precision, low-damage surface cleaning. Therefore, this invention aims to provide a surface grinding and cleaning device and process based on the principle of follow-up resonance. Summary of the Invention

[0005] The purpose of this invention is to provide a follower resonant grinding and foreign matter removal device and process that combines high-efficiency cutting and surface protection functions. This is achieved through the following technical solution: A follow-up resonant grinding and foreign matter removal device for power supply cables, comprising: A precision resonant actuator, serving as a power source for grinding feed, is used to receive AC drive signals and convert them into high-frequency mechanical vibrations. The contour grinding head 3 is physically connected to the output end of the precision resonant actuation mechanism. The contour grinding head 3 adopts a split-type clamping structure. Its inner side is provided with an abrasive layer 4 with solidified hard particles, which is used to clamp the surface of the power supply cable 1 to be processed for micro-cutting. The surface of the abrasive layer 4 is provided with chip removal grooves. The grinding impedance detection unit 10 is used to acquire the electromechanical coupling impedance signal of the device in real time during the grinding process; and The variable frequency grinding control center 9 is electrically connected to the grinding impedance detection unit 10, and the signal output terminal of the variable frequency grinding control center 9 is electrically connected to the precision resonant actuation mechanism. The variable frequency grinding control center 9 has a built-in phase-locked logic, which is used to track the mechanical resonance point of the electromechanical coupling impedance signal through the phase-locked logic, and dynamically adjust the frequency of the AC drive signal according to the tracking result, so that the contour grinding head 3 is kept at the frequency state of resonant grinding with the foreign object 2 on the surface of the power supply cable 1.

[0006] Furthermore, the hard particles are one of diamond, cubic boron nitride, or silicon carbide hard particles, which are solidified on the metal substrate surface of the profile grinding head 3 by electroplating or brazing processes, and the particle size of the abrasive layer 4 is 80 mesh to 300 mesh.

[0007] Furthermore, a power amplification drive module is electrically connected between the frequency conversion grinding control center 9 and the precision resonant actuation mechanism. The power amplification drive module is used to amplify the AC drive signal output by the frequency conversion grinding control center 9 and then send it to the precision resonant actuation mechanism.

[0008] Furthermore, the precision resonant actuation mechanism adopts a multi-stage series hybrid excitation structure: the first stage is a magnetostrictive exciter with a response frequency of 200Hz-2000Hz low-frequency large-amplitude signal, used to generate the impact crushing force required for rough grinding; the second stage is a piezoelectric ceramic stacked transducer 6 with a response frequency of 20kHz-50kHz ultrasonic frequency band signal, used to generate the high-frequency micro-vibration required for fine grinding; the variable frequency grinding control center 9 controls the independent or superimposed operation of the above two stages of exciters according to the change of foreign object thickness load.

[0009] Furthermore, it also includes a flexible constant force feed mechanism 7, through which the precision resonant actuation mechanism is floatingly mounted on the moving carrier; the flexible constant force feed mechanism 7 includes a pneumatic spring or damping shock absorption assembly, used to compensate for the geometric deformation of the power supply cable 1 and maintain a constant normal grinding pressure of the contour grinding head 3 on the workpiece surface.

[0010] Furthermore, the variable frequency grinding control center 9 is internally equipped with a nonlinear waveform shaping module based on direct digital frequency synthesis technology, which is used to generate an asymmetric sawtooth wave drive signal through phase accumulation and waveform lookup table; the ratio of the rise time to the fall time of the sawtooth wave is less than 1:4, so that the contour grinding head 3 generates a cutting motion with directional impact acceleration.

[0011] Furthermore, the segmented enclosing structure of the contour grinding head 3 includes at least two opposing arc-shaped grinding pads, and the chip removal groove is a spiral or grid-shaped chip removal groove opened on the inner surface of the grinding pad, used to discharge grinding chips or foreign debris generated during grinding.

[0012] Furthermore, the variable frequency grinding control center 9 is equipped with a surface finishing mode; when the grinding impedance detection unit 10 detects that the system impedance phase angle returns to zero and the quality factor Q value suddenly increases beyond the set threshold, it determines that the foreign matter has been removed, and the variable frequency grinding control center 9 automatically reduces the drive amplitude and switches to the high-frequency ultrasonic band, using the contour grinding head 3 to perform vibration polishing on the workpiece metal substrate.

[0013] Furthermore, the grinding impedance detection unit 10 includes a current sampling circuit and a voltage sampling circuit. The variable frequency grinding control center 9 obtains the dynamic mechanical impedance spectrum of the system by calculating the phase difference and amplitude ratio of the voltage and current.

[0014] This invention also provides a follow-up resonant grinding and foreign matter removal process for removing foreign matter adhering to the surface of power cables, comprising the following steps: S1: Workpiece clamping: Hold the profile grinding head against the surface of the power cable to be processed; S2: Frequency sweep modeling: The frequency conversion grinding control center outputs a low-power frequency sweep signal to establish the mechanical impedance spectrum under the current working condition and identify the main resonant frequency of the system; S3: Resonance Cutting: Lock the main resonance frequency and output a high-power drive signal to drive the precision resonant actuation mechanism to drive the contour grinding head to perform resonant micro-cutting on the foreign object; S4: Adaptive control: During the grinding process, the drift of the resonant frequency is tracked in real time, and the remaining thickness of the foreign object is judged based on the drift characteristics of the electromechanical coupling impedance signal or the quality factor Q value. When the impedance change is detected to reach the preset threshold, the drive waveform is automatically switched to the surface finishing mode or the excitation is stopped. S5: Axial feed: The drive unit moves along the axial direction of the power supply cable to complete the continuous grinding operation.

[0015] Compared with the prior art, the present invention has significant technological progress and beneficial effects, specifically reflected in the following four aspects: 1) This invention achieves non-destructive precision micro-grinding, significantly improving workpiece surface quality. Existing cleaning techniques often employ rigid scraping or low-frequency impact, which easily causes scratches or peeling of the hardened layer on the power cable surface, affecting surface quality and operational performance. This invention introduces the concept of "micro-cutting" from the grinding process, utilizing high-frequency resonance to drive the grinding head to generate micron-level amplitude cutting motion. By controlling the abrasive particle size and vibration parameters of the grinding head, the device only breaks down hard and brittle foreign objects, while producing an "ultrasonic polishing" effect on tough metal substrates. Experiments show that the surface roughness Ra value of the workpiece after surface cleaning can be significantly reduced, effectively delaying the re-adhesion of subsequent icing.

[0016] 2) Intelligent adaptive grinding based on impedance spectrum solves the uncertainty problem of "excess material removal". To address the load variation problem caused by uneven icing thickness, this invention constructs a dynamic mechanical impedance feedback closed loop. By monitoring the equivalent impedance change of the resonant system in real time, the system can accurately identify abrupt changes in the physical properties of the "foreign object-metal" interface. When the foreign object is completely removed and the grinding head contacts the metal substrate, the control algorithm automatically switches from "coarse grinding and crushing mode" to "fine grinding and finishing mode" or automatically stops the machine. This mechanism completely avoids the "over-cutting" or fatigue damage caused by traditional equipment continuing to grind dry after the foreign object has been removed.

[0017] 3) The composite modulation waveform improves energy transfer efficiency and ice-breaking capability. This invention innovatively designs an asymmetric composite modulation grinding waveform. A low-frequency carrier wave generates a macroscopic stress wave to destroy the foreign object skeleton, while high-frequency ultrasonic waves are superimposed to generate local cavitation and shearing effects. Due to the use of a composite modulation waveform combining low-frequency carrier wave destruction of the foreign object skeleton and high-frequency ultrasonic micro-grinding, this invention effectively improves the material removal rate (MRR) per unit energy consumption, enabling efficient processing of difficult-to-process icing materials such as high-density frost.

[0018] 4) The flexible floating structure ensures process stability under complex working conditions. To address geometric errors in the workpiece, such as sag, torsion, and wind-induced sway, this invention designs a flexible constant-force feed mechanism. This mechanism endows the grinding head with multi-degree-of-freedom floating following capability, ensuring that the grinding head always maintains a constant normal grinding force against the workpiece surface. This not only guarantees the consistency of grinding removal but also effectively suppresses chatter caused by rigid collisions, extending the service life of the core components of the equipment.

[0019] It is important to note that the follow-up resonant grinding and foreign matter removal device for power cables described in this invention differs fundamentally in mechanism from traditional vibration impact de-icing devices (such as impact devices based on eccentric wheels). Traditional impact relies on macroscopic rigid impact to cause brittle cracking of foreign matter, easily leading to chatter and fatigue damage to the workpiece itself. This invention, however, introduces the concept of precision machine tool grinding, implementing micro-cutting and shearing at the interface layer by controlling the abrasive particle size and high-frequency follow-up micro-amplitude vibration. Therefore, simply replacing the traditional low-frequency impact frame and ultrasonic transducer with a single module not only fails to achieve the follow-up flexible grinding effect of this invention but also causes instantaneous overload damage to the ultrasonic transducer due to rigid collisions. The organic combination of the components of this invention produces an unexpected synergistic precision cleaning effect. Attached Figure Description

[0020] Figure 1 This is a closed-loop logic block diagram of the system principle of the follow-up resonant grinding and foreign matter cleaning device provided in the embodiment of the present invention.

[0021] Figure 2 This is a cross-sectional structural diagram of the contour grinding head and precision resonant actuation mechanism provided in an embodiment of the present invention.

[0022] Figure 3 This is a schematic diagram of the micro-cutting mechanism of the grinding head working surface provided in an embodiment of the present invention.

[0023] Figure 4 This is a flowchart of the adaptive control process for "coarse grinding-fine grinding" based on impedance spectrum feedback provided in an embodiment of the present invention.

[0024] The attached diagram is labeled as follows: 1. Power supply cable; 2. Foreign object; 3. Contouring grinding head; 4. Abrasive layer; 5. Amplitude rod; 6. Piezoelectric ceramic stack (or piezoelectric ceramic stack transducer); 7. Flexible constant force feed mechanism (components include floating constant force spring); 8. Fixed base; 9. Variable frequency grinding control center; 10. Grinding impedance detection unit. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] Example 1: A follower-type resonant grinding and foreign matter removal device based on ultrasonic micro-cutting mechanism

[0027] This embodiment provides a specific hardware structure and core control module for a follow-up resonant grinding and foreign matter removal device.

[0028] For information on mechanical construction (see appendix) Figure 2 ): like Figure 2As shown, the follow-up resonant grinding and foreign matter removal device provided by the present invention is mainly installed on a fixed base 8 (e.g., the end of the robotic arm of a work vehicle) to perform surface treatment on the contact wire cable 1, which serves as the power supply cable, so as to precisely remove foreign matter 2 (specifically ice layer) attached to the surface of the workpiece and perform surface finishing.

[0029] In this embodiment, the "power supply cable 1" targeted by the follow-up resonant grinding and foreign matter removal device has broad industrial applicability. Specifically, the power supply cable 1 includes not only contact wire cables in electrified railways or power transmission cables in power systems, but also various pipes, precision guide rails, and slender cylindrical workpieces exposed to low-temperature environments in the field of industrial machinery. By adjusting the inner curvature radius of the contour grinding head 3, this invention can precisely follow and fit the surface contour of the aforementioned different workpieces, thereby achieving efficient and non-destructive resonant grinding and surface cleaning.

[0030] The core mechanical structure of the device includes: 1) Precision resonant actuation mechanism: Composed of a piezoelectric ceramic stack 6 and an amplitude transformer 5. The piezoelectric ceramic stack 6 serves as the excitation source, converting the input AC electrical energy into high-frequency mechanical vibration; the amplitude transformer 5 is connected to the front end of the piezoelectric ceramic stack 6, amplifying the amplitude and transmitting energy. If a greater impact force is required in extremely hard conditions, a magnetostrictive exciter (not shown in the figure) can be connected in series behind the piezoelectric ceramic stack 6 to form a magnetic-piezoelectric hybrid excitation structure, thereby achieving the superposition of low-frequency large-amplitude impact and high-frequency ultrasonic micro-grinding energy.

[0031] 2) Contouring Grinding Head 3: Physically connected to the output end of the amplitude transformer 5. To achieve high-precision grinding, the contouring grinding head 3 is designed as a segmented, clamping structure that matches the curvature of the power supply cable 1, specifically including at least two opposing arc-shaped grinding pads. On the inner surface of the grinding pads that contacts the foreign object 2, an abrasive layer 4 composed of diamond, cubic boron nitride, or silicon carbide particles (abrasive grit size configured from 80 mesh to 300 mesh) is cured by electroplating or brazing. In addition, the inner surface of the grinding pads is provided with spiral or grid-like chip removal grooves for discharging grinding chips / foreign object debris generated during grinding.

[0032] 3) Flexible Constant Force Feed Mechanism: To address geometric errors such as sag changes, torsion, or wind-induced swaying of the power supply cable 1 under actual working conditions, the precision resonant actuation mechanism is not rigidly fixed. Instead, it is floatingly mounted on the fixed base 8 via a floating constant force spring 7 (or a pneumatic spring and damping shock absorption assembly) as a component of the flexible constant force feed mechanism. The floating constant force spring 7 provides the grinding assembly with multi-degree-of-freedom flexible follow-up capability and provides a constant normal preload, ensuring that the normal grinding pressure of the profile grinding head 3 on the workpiece surface remains constant.

[0033] During operation, the frequency conversion control signal drives the piezoelectric ceramic stack 6 to generate high-frequency vibration. After being amplified by the amplitude transformer 5, it drives the contour grinding head 3 and its surface abrasive layer 4 to perform high-frequency micro-cutting on the foreign object 2. In order to further improve the chip removal efficiency and prevent frictional heat from causing the foreign object to remelt and adhere to the grinding wheel, this device can also be equipped with a pneumatic auxiliary chip removal system. This system includes compressed air nozzles (not shown in the figure) aligned with the grinding area, which use compressed air flow to blow away the grinding products and force-cool the contour grinding head 3.

[0034] Regarding the control module (see appendix) Figure 1 ): like Figure 1 As shown, the variable frequency grinding control center 9 described in this embodiment is implemented using FPGA-based direct digital frequency synthesis (DDS) technology. The variable frequency grinding control center 9 is internally equipped with a nonlinear waveform shaping module based on DDS technology. This module generates a digital sequence containing the fundamental frequency and specific harmonics through phase accumulation and waveform lookup, which is then converted to an AC drive signal via D / A conversion. The DDS waveform synthesis module can dynamically adjust the phase accumulation step size of the output frequency within microseconds based on the feedback signal, thereby achieving rapid, overshoot-free locking of the mechanical resonance point.

[0035] The grinding impedance detection unit 10 is electrically connected to the frequency conversion grinding control center 9, specifically connected in series in the electrical circuit or installed on the actuation mechanism. The grinding impedance detection unit 10 includes a current sampling circuit and a voltage sampling circuit. The frequency conversion grinding control center 9 obtains the dynamic electromechanical coupling impedance signal of the system by calculating the phase difference and amplitude ratio of the voltage and current, thereby constructing a dynamic mechanical impedance spectrum in real time.

[0036] In this embodiment, the follow-up resonant grinding and foreign matter removal device also includes a power amplification drive module (not shown in the figure) electrically connected between the frequency conversion grinding control center 9 and the precision resonant actuation mechanism (piezoelectric ceramic stack 6). The power amplification drive module is used to receive the weak AC drive signal generated by the frequency conversion grinding control center 9, and perform linear power amplification or voltage / current level topology amplification inside it to generate an excitation source signal sufficient to drive the excitation source to perform high-frequency high-power vibration, thereby ensuring that the entire closed loop has sufficient energy output feedback response capability when facing high-density, thick-film hard ice loads.

[0037] In this embodiment, the follow-up resonant grinding and foreign matter removal device is mainly used for the daily maintenance and emergency cleaning of power supply cables 1 in power supply systems (such as electrified railway contact networks and high-voltage transmission lines). It should be noted that the foreign matter 2 adhering to the surface of the power supply cable 1 broadly refers to any residue that affects power supply safety or the surface quality of the cable. Specifically, the foreign matter 2 includes not only hard ice layers frozen in cold climates (such as rime and hoarfrost), but also metal oxide layers formed by long-term exposure of the cable surface, air pollution deposits, and mechanical obstructions such as bird nest residue or tree branches. This invention utilizes the micro-cutting force generated by high-frequency resonant grinding to non-destructively and adaptively cut and peel off all types of foreign matter 2, and performs ultrasonic polishing on the copper substrate of the cable.

[0038] Example 2: Nonlinear Asymmetric Waveform Driven "Roughing and Finishing Composite" Grinding Process

[0039] This embodiment describes the control strategy of the present invention (please refer to the attached diagram for a schematic diagram of the micro-cutting mechanism of its working surface). Figure 3 (This demonstrates how waveform shaping can achieve a "roughing-finishing" cycle similar to CNC machining.)

[0040] The variable frequency grinding control center 9 has two preset waveform drive working modes: 1) Asymmetric rough grinding mode: The nonlinear waveform shaping module inside the variable frequency grinding control center 9 synthesizes a special "sawtooth wave" drive signal. The rise time of this sawtooth wave is extremely short (e.g., rise time t). f <50μs), while the fall time is relatively long (e.g., fall time t). f >200μs), making the ratio of the rise time to the fall time of the sawtooth wave less than 1:4. This asymmetric waveform gives the profile grinding head 3 a large instantaneous directional impact acceleration when it advances forward to press in the foreign object, generating a strong shearing and impact crushing force. It takes advantage of the weakness of the low tensile strength of the foreign object to perform rapid rough grinding and efficiently remove the outer thick ice residue.

[0041] 2) Sine wave fine grinding mode: When the grinding impedance detection unit 10 detects that the load has become lighter and the foreign matter has become significantly thinner, the control center automatically switches to output a pure standard sine wave signal and precisely locks the frequency at the high-order ultrasonic resonance point of the system (such as the 20kHz-50kHz frequency band). At this time, the contour grinding head 3 generates a high-frequency, micro-amplitude, gentle and uniform vibration, mainly using the frictional heat effect and local cavitation shearing effect of ultrasonic waves to clean the residual foreign matter at the interface, and to perform vibration micro-polishing on the metal substrate surface of the power supply cable 1 to remove the surface oxide film and improve the surface finish.

[0042] This nonlinear control strategy of "first rough grinding and impact with sawtooth wave, then fine grinding and polishing with sine wave" effectively coordinates the relationship between cutting efficiency and substrate surface processing quality.

[0043] Example 3: Intelligent Closed-Loop Control System Based on Electromechanical Impedance Spectroscopy (EMIS)

[0044] This embodiment focuses on how to accurately characterize the mechanical grinding process using electrical parameters to achieve intelligent closed-loop control of servo grinding (for the adaptive control process based on impedance spectrum feedback, please refer to the appendix). Figure 4 ).

[0045] In the de-icing grinding process, the system performs the following closed-loop adaptive control steps based on electromechanical impedance spectral feedback: 1) S1: Workpiece clamping: Before the operation begins, the floating constant force spring 7 of the flexible constant force feed mechanism stably clamps the segmented contour grinding head 3 onto the surface of the power supply cable 1 to be processed.

[0046] 2) S2: Frequency Sweep Modeling: The variable frequency grinding control center outputs a low-power frequency sweep signal (the frequency sweep range is preset to 1kHz-50kHz) from the 9-drive system. The control center collects voltage and current feedback in real time to establish the dynamic mechanical impedance spectrum of the system under the current operating conditions. Under ice load conditions, the impedance characteristic curve exhibits overdamped characteristics with low quality factor and multiple peak values.

[0047] 3) S3: Resonance cutting: Lock the main resonant frequency point in the impedance characteristic curve, output a high-power drive signal, drive the precision resonant actuation mechanism to drive the contour grinding head 3 to perform stable resonant micro-cutting on the foreign object 2.

[0048] 4) S4: Adaptive Control: During continuous grinding feed, as the foreign object 2 is continuously thinned by cutting, the equivalent mass and damping of the system continuously decrease, causing the resonant frequency to drift towards higher frequencies. Simultaneously, the phase angle of the dynamic impedance spectrum also drifts. The variable frequency grinding control center 9 tracks this resonant frequency drift in real time and synchronously adjusts the frequency of the AC drive signal. When the foreign object 2 completely detaches and the abrasive layer 4 contacts the surface of the workpiece's metal substrate, the phase angle of the electromechanical coupling impedance will rapidly return to zero, and the sharpness of the resonant peak (quality factor Q value) will suddenly increase. When the variable frequency grinding control center 9 detects that the sudden increase in the quality factor Q value exceeds the set characteristic threshold, the detachment criterion is triggered.

[0049] Those skilled in the art should understand that the threshold for sudden increase in the quality factor Q (e.g., set to 500 under specific working conditions) is not fixed. Its specific value needs to be determined in advance by laboratory calibration or on-site testing based on the material, stiffness, damping characteristics, and initial icing thickness of the power supply cable 1 to be processed.

[0050] 5) S5: Axial feed: Once the foreign matter removal is determined by the triggering detachment criterion, the system automatically switches the drive waveform to the surface finishing mode, reduces the drive amplitude for safe ultrasonic vibration polishing, or automatically stops the excitation to prevent the grinding wheel from overheating due to idling; at the same time, the walking drive device controls the fixed base 8 to move along the axial direction of the power supply cable 1 to the next icing area to complete the continuous grinding operation.

[0051] The specific embodiments described above further illustrate the inventive purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the invention. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A follower-type resonant grinding and foreign matter removal device for power supply cables, characterized in that, include: A precision resonant actuator, serving as a power source for grinding feed, is used to receive AC drive signals and convert them into high-frequency mechanical vibrations. The contour grinding head (3) is physically connected to the output end of the precision resonant actuation mechanism. The contour grinding head (3) adopts a split-type clamping structure. Its inner side is provided with an abrasive layer (4) with solidified hard particles, which is used to clamp the surface of the power supply cable (1) to be processed for micro-cutting. The surface of the abrasive layer (4) is provided with chip removal grooves. A grinding impedance detection unit (10) is used to acquire the electromechanical coupling impedance signal of the device in real time during the grinding process; and The variable frequency grinding control center (9) is electrically connected to the grinding impedance detection unit (10), and the signal output terminal of the variable frequency grinding control center (9) is electrically connected to the precision resonant actuation mechanism; the variable frequency grinding control center (9) has a built-in phase-locked logic, which is used to track the mechanical resonance point of the electromechanical coupling impedance signal through the phase-locked logic, and dynamically adjust the frequency of the AC drive signal according to the tracking result, so that the contour grinding head (3) is kept in the frequency state of resonant grinding with the foreign object (2) on the surface of the power supply cable (1).

2. The follow-up resonant grinding and foreign matter removal device for power supply cables according to claim 1, characterized in that: The hard particles are one of diamond, cubic boron nitride or silicon carbide hard particles, which are solidified on the metal substrate surface of the profile grinding head (3) by electroplating or brazing process, and the particle size of the abrasive layer (4) is 80 mesh to 300 mesh.

3. The follow-up resonant grinding and foreign matter removal device for power supply cables according to claim 1, characterized in that: A power amplification drive module is electrically connected between the frequency conversion grinding control center (9) and the precision resonant actuation mechanism. The power amplification drive module is used to amplify the AC drive signal output by the frequency conversion grinding control center (9) and then send it to the precision resonant actuation mechanism.

4. The follow-up resonant grinding and foreign matter removal device for power supply cables according to claim 1, characterized in that: The precision resonant actuation mechanism adopts a multi-stage series hybrid excitation structure: the first stage is a magnetostrictive exciter with a response frequency of 200Hz-2000Hz low-frequency large-amplitude signal, which is used to generate the impact crushing force required for rough grinding; the second stage is a piezoelectric ceramic stacked transducer (6) with a response frequency of 20kHz-50kHz ultrasonic frequency band signal, which is used to generate the high-frequency micro-vibration required for fine grinding; the variable frequency grinding control center (9) controls the independent or superimposed operation of the above two stages of exciters according to the change of foreign object thickness load.

5. The follow-up resonant grinding and foreign matter removal device for power supply cables according to claim 1, characterized in that: It also includes a flexible constant force feed mechanism (7), through which the precision resonant actuation mechanism is floatingly mounted on the moving carrier; the flexible constant force feed mechanism (7) includes a pneumatic spring or damping shock absorption assembly, used to compensate for the geometric deformation of the power supply cable (1) and maintain the normal grinding pressure of the contour grinding head (3) on the workpiece surface constant.

6. The follow-up resonant grinding and foreign matter removal device for power supply cables according to claim 1, characterized in that: The variable frequency grinding control center (9) is equipped with a nonlinear waveform shaping module based on direct digital frequency synthesis technology, which is used to generate an asymmetric sawtooth wave drive signal by phase accumulation and waveform lookup. The ratio of the rising edge time to the falling edge time of the sawtooth wave is less than 1:4, so that the contour grinding head (3) generates a cutting motion with directional impact acceleration.

7. The follow-up resonant grinding and foreign matter removal device for power supply cables according to claim 1, characterized in that: The profile grinding head (3) has a split-type cohesive structure including at least two opposing arc-shaped grinding tiles. The chip removal groove is a spiral or grid-shaped chip removal groove opened on the inner surface of the grinding tile, used to discharge grinding chips or foreign matter debris generated during grinding.

8. The follow-up resonant grinding and foreign matter removal device for power supply cables according to claim 1, characterized in that: The variable frequency grinding control center (9) is equipped with a surface finishing mode. When the grinding impedance detection unit (10) detects that the system impedance phase angle returns to zero and the quality factor Q value suddenly increases beyond the set threshold, it determines that the foreign matter has been removed. The variable frequency grinding control center (9) automatically reduces the driving amplitude and switches to the high frequency ultrasonic band, and uses the contour grinding head (3) to vibrate polish the metal substrate of the workpiece.

9. The follow-up resonant grinding and foreign matter removal device for power supply cables according to claim 1, characterized in that: The grinding impedance detection unit (10) includes a current sampling circuit and a voltage sampling circuit. The variable frequency grinding control center (9) obtains the dynamic mechanical impedance spectrum of the system by calculating the phase difference and amplitude ratio of voltage and current.

10. A follow-up resonant grinding and foreign matter removal process for removing foreign matter adhering to the surface of power supply cables, characterized in that, Includes the following steps: S1: Workpiece clamping: Hold the profile grinding head against the surface of the power cable to be processed; S2: Frequency sweep modeling: The frequency conversion grinding control center outputs a low-power frequency sweep signal to establish the mechanical impedance spectrum under the current working condition and identify the main resonant frequency of the system; S3: Resonance Cutting: Lock the main resonance frequency and output a high-power drive signal to drive the precision resonant actuation mechanism to drive the contour grinding head to perform resonant micro-cutting on the foreign object; S4: Adaptive control: During the grinding process, the drift of the resonant frequency is tracked in real time, and the remaining thickness of the foreign object is judged based on the drift characteristics of the electromechanical coupling impedance signal or the quality factor Q value. When the impedance change is detected to reach the preset threshold, the drive waveform is automatically switched to the surface finishing mode or the excitation is stopped. S5: Axial feed: The drive unit moves along the axial direction of the power supply cable to complete the continuous grinding operation.

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