An antenna isolation structure and a transceiving antenna device

Abstract

The present application relates to the technical field of wireless communication, and particularly relates to an antenna isolation structure and a transceiving antenna device. The antenna isolation structure of the present application is characterized in that: an electromagnetic bandgap structure is arranged on a surface layer of a printed circuit board substrate; a dielectric choke groove is formed by hollowing out a ground layer in a corresponding area inside the printed circuit board substrate; and the electromagnetic bandgap structure and the dielectric choke groove are arranged between a transmitting antenna array and a receiving antenna array, and are used for improving the isolation degree between the transmitting antenna array and the receiving antenna array. In the transceiving antenna device of the present application, the electromagnetic bandgap structure and the dielectric choke groove respectively suppress electromagnetic coupling from different dimensions, and cooperate with each other from two dimensions of the surface layer and the inside, so as to form a multi-dimensional electromagnetic blocking barrier between the transceiving antennas, thereby significantly improving the isolation effect.

Description

Technical Field

[0001] This invention relates to the field of wireless communication technology, and in particular to an antenna isolation structure and a transceiver antenna device. Background Technology

[0002] With the rapid development of wireless communication technology, phased array antenna systems are evolving towards higher integration, miniaturization, and multifunctionality. In typical application scenarios such as low-Earth orbit satellite communication terminals, 5G / 6G millimeter-wave base stations, and radar detection systems, it is often necessary to integrate both transmitting and receiving antenna arrays on the same printed circuit board or closely adjacent boards. However, excessively small physical spacing between the transmitting and receiving antennas can lead to severe electromagnetic coupling, thereby reducing the system's receiving sensitivity and even causing receiver saturation or transmitted signal distortion.

[0003] Existing technologies struggle to achieve high isolation within limited spaces. Therefore, effectively improving the isolation between transmitting and receiving antennas within a limited space has become a critical technical issue that urgently needs to be addressed in the design of high-density integrated phased array systems. Summary of the Invention

[0004] The purpose of this invention is to provide an antenna isolation structure and a transceiver antenna device to effectively improve the isolation between transceiver antennas within a limited space.

[0005] To solve the above-mentioned technical problems, the present invention provides an antenna isolation structure and a transceiver antenna device.

[0006] The antenna isolation structure of the present invention includes: Printed circuit board substrate; An electromagnetic bandgap structure is disposed on the surface layer of the printed circuit board substrate to suppress surface waves propagating along the dielectric surface and block the coupling path of electromagnetic waves in the horizontal direction. The dielectric choke groove forms a resonant cavity by hollowing out the ground layer in a corresponding area inside the printed circuit board substrate. It utilizes the 180° phase cancellation characteristic generated by its deep resonance to block the path of electromagnetic waves coupled through the dielectric layer in the vertical direction. The electromagnetic bandgap structure and the dielectric choke are disposed between the transmitting antenna array and the receiving antenna array, and are used to cooperate with each other from both the surface and internal dimensions to form a multi-dimensional electromagnetic blocking barrier between the transmitting antenna array and the receiving antenna array, thereby improving the isolation between the transmitting antenna array and the receiving antenna array.

[0007] Furthermore, the printed circuit board substrate includes a first printed circuit board and a second printed circuit board that are independent of each other; The antenna isolation structure also includes a plurality of spaced structural shielding grilles, which are disposed between the first printed circuit board and the second printed circuit board. The first printed circuit board has a transmitting area for arranging the transmitting antenna array, and the second printed circuit board has a receiving area for arranging the receiving antenna array.

[0008] Furthermore, the electromagnetic bandgap structure includes a transmitting electromagnetic bandgap unit disposed in the transmitting region and a receiving electromagnetic bandgap unit disposed in the receiving region; the structural shielding grid is located between the transmitting electromagnetic bandgap unit and the receiving electromagnetic bandgap unit. The dielectric choke includes a transmitting array dielectric choke disposed in the transmitting region and a receiving array dielectric choke disposed in the receiving region; the electromagnetic bandgap structure is located between the transmitting array dielectric choke and the receiving array dielectric choke. The operating frequency bands of the transmitting array electromagnetic bandgap element and the transmitting array dielectric choke slot are configured to match the operating frequency band of the transmitting antenna array, and the operating frequency bands of the receiving array electromagnetic bandgap element and the receiving array dielectric choke slot are configured to match the operating frequency band of the receiving antenna array.

[0009] Furthermore, each of the structural shielding grids includes a structural base and structural grids arranged sequentially at intervals on the structural base, with a cut-out area between two adjacent structural grids to form a structural shielding groove.

[0010] Furthermore, the depth of the structural shielding groove is 0.4 to 0.6 times the free space wavelength, and the grid spacing of the structural shielding groove is 1 / 60 to 1 / 8 times the free space wavelength.

[0011] Furthermore, the printed circuit board substrate is a single printed circuit board; the single printed circuit board has a transmitting area and a receiving area arranged at intervals; the transmitting area is used to deploy the transmitting antenna array, and the receiving area is used to deploy the receiving antenna array. The electromagnetic bandgap structure includes a transmitting array electromagnetic bandgap unit disposed in the transmitting region and a receiving array electromagnetic bandgap unit disposed in the receiving region. The medium choke slot includes a transmitting array medium choke slot disposed in the transmitting area and a receiving array medium choke slot disposed in the receiving area; The operating frequency bands of the transmitting array electromagnetic bandgap element and the transmitting array dielectric choke slot are configured to match the operating frequency band of the transmitting antenna array, and the operating frequency bands of the receiving array electromagnetic bandgap element and the receiving array dielectric choke slot are configured to match the operating frequency band of the receiving antenna array.

[0012] Furthermore, the electromagnetic bandgap structure includes a plurality of periodically arranged electromagnetic bandgap units, each of which includes a patch disposed on the surface of a printed circuit board substrate, a metallized via, and a reference ground layer, wherein the patch is electrically connected to the reference ground layer through the metallized via.

[0013] Furthermore, multiple grounding holes are provided around the dielectric choke groove, and the center-to-center distance between adjacent grounding holes should be less than a set multiple of the dielectric wavelength.

[0014] Furthermore, the depth of the dielectric choke groove is 0.4 to 0.6 times the dielectric wavelength, and the spacing between adjacent grounding holes is less than 0.25 times the dielectric wavelength.

[0015] The present invention also provides a transceiver antenna device, including a transmitting antenna array, a receiving antenna array, and an antenna isolation structure as described in any one of the above technical solutions; The printed circuit board substrate has a transmitting area and a receiving area, the transmitting antenna array is disposed in the transmitting area, and the receiving antenna array is disposed in the receiving area.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects: In the transceiver antenna device of this invention, the electromagnetic bandgap structure and the dielectric choke suppress electromagnetic coupling from different dimensions. The electromagnetic bandgap structure is disposed on the surface of the printed circuit board substrate, utilizing the bandgap characteristics of its periodic structure to suppress surface waves propagating along the dielectric surface, thus blocking the coupling path of electromagnetic waves in the horizontal direction. The dielectric choke forms a resonant cavity by hollowing out the ground layer inside the printed circuit board, utilizing the 180° phase cancellation characteristic generated by its deep resonance to block the coupling path of electromagnetic waves through the dielectric layer in the vertical direction. The two structures work together from both the surface and internal dimensions to form a multi-dimensional electromagnetic blocking barrier between the transceiver antennas, thereby significantly improving the isolation effect. Furthermore, this solution does not require increasing the physical distance between the transceiver antennas or introducing additional independent shielding components; high isolation is achieved simply by integrating the electromagnetic bandgap structure and the dielectric choke on the printed circuit board, which is beneficial for maintaining the miniaturization of the device.

[0017] Therefore, the transceiver antenna device of the present invention can effectively suppress electromagnetic coupling between the transceiver antenna arrays, reduce interference of the transmitted signal to the receiving channel, thereby ensuring the receiving sensitivity of the system, avoiding receiver saturation and transmitted signal distortion, and ensuring the normal operation of the communication system. This solution is particularly suitable for high-density integrated phased array communication systems with limited space and high isolation requirements, such as satellite communication terminals, 5G / 6G millimeter-wave base stations, radar detection systems, etc., and is especially suitable for miniaturized devices where transceiver antennas coexist and space is limited. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a first embodiment of the transceiver antenna device of the present invention; Figure 2 This is a structural block diagram of a first embodiment of the transceiver antenna device of the present invention; Figure 3 This is a schematic diagram of the structure of the shielding grid of the transceiver antenna device of the present invention; Figure 4 This is a schematic diagram of the electromagnetic bandgap unit of the transceiver antenna device of the present invention; Figure 5 This is a schematic diagram of the electromagnetic bandgap structure of the transceiver antenna device of the present invention; Figure 6 This is a schematic diagram of the dielectric choke and transmitting antenna array of the transceiver antenna device of the present invention; Figure 7 This is a schematic diagram of the dielectric choke groove of the transceiver antenna device of the present invention; Figure 8 This is a schematic diagram of the structure of a second embodiment of the transceiver antenna device of the present invention; Figure 9 This is a structural block diagram of a second embodiment of the transceiver antenna device of the present invention; Figure 10 A comparison of full-wave simulations when different shielding structures are used for the transceiver antenna device.

[0019] Figure label: 110. Transmitting antenna array; 120. Receiving antenna array; 210. First printed circuit board; 220. Second printed circuit board; 230. Single printed circuit board; 300. Structural shielding grid; 310. Structural substrate; 320. Structural grid; 330. Structural shielding groove; 401. Patch; 402. Metallized via; 403. Ground plane; 410. Transmitting array electromagnetic bandgap element; 420. Receiving array electromagnetic bandgap element; 501. Grounding hole; 502. Grounding layer; 503. Ground plane cutout area; 504. Insulating dielectric filling area; 510. Transmitting array dielectric choke groove; 520. Receiving array dielectric choke groove. Detailed Implementation

[0020] The antenna isolation structure and transceiver antenna device of the present invention will now be described with reference to the schematic diagrams, which illustrate preferred embodiments of the invention. It should be understood that those skilled in the art can modify the invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the invention.

[0021] The serial numbers assigned to components in this document, such as "first," "second," etc., are merely used to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). In the description of this invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0023] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "electrical connection" can be a direct electrical connection or an indirect electrical connection through an intermediate medium.

[0024] The invention is described more specifically by way of example in the following paragraphs with reference to the accompanying drawings. The advantages and features of the invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the invention.

[0025] The following is in conjunction with the instruction manual appendix. Figure 1 To be continued Figure 10The antenna isolation structure and transceiver antenna device of the present invention will be described. It should be noted that... Figure 1 , Figure 4 , Figure 5 and Figure 8 The background grid in the image is a drawing grid and does not participate in the actual structure.

[0026] like Figure 1 and Figure 8 As shown, in some embodiments, the transceiver antenna device includes a transmitting antenna array 110, a receiving antenna array 120, and an antenna isolation structure.

[0027] The antenna isolation structure includes a printed circuit board substrate, an electromagnetic bandgap structure, and a dielectric choke. The printed circuit board substrate has a transmitting region and a receiving region. The transmitting antenna array 110 is disposed in the transmitting region, and the receiving antenna array 120 is disposed in the receiving region.

[0028] The electromagnetic bandgap structure is disposed on the surface layer of the printed circuit board substrate to suppress surface waves propagating along the dielectric surface and block the coupling path of electromagnetic waves in the horizontal direction.

[0029] The dielectric choke groove forms a resonant cavity by hollowing out the ground layer in a corresponding area inside the printed circuit board substrate. Utilizing the 180° phase cancellation characteristic generated by its deep resonance, it blocks the path of electromagnetic waves coupled through the dielectric layer in the vertical direction. The electromagnetic bandgap structure and the dielectric choke groove are disposed between the transmitting antenna array 110 and the receiving antenna array 120, working together from both surface and internal dimensions to form a multi-dimensional electromagnetic blocking barrier between the transmitting antenna array 110 and the receiving antenna array 120, thereby improving the isolation between them.

[0030] In the transceiver antenna device of this invention, the electromagnetic bandgap structure and the dielectric choke suppress electromagnetic coupling from different dimensions. The electromagnetic bandgap structure is disposed on the surface of the printed circuit board substrate, utilizing the bandgap characteristics of its periodic structure to suppress surface waves propagating along the dielectric surface, thus blocking the coupling path of electromagnetic waves in the horizontal direction. The dielectric choke forms a resonant cavity by hollowing out the ground layer inside the printed circuit board, utilizing the 180° phase cancellation characteristic generated by its deep resonance to block the coupling path of electromagnetic waves through the dielectric layer in the vertical direction. The two structures work together from both the surface and internal dimensions to form a multi-dimensional electromagnetic blocking barrier between the transceiver antennas, thereby significantly improving the isolation effect. Furthermore, this solution does not require increasing the physical distance between the transceiver antennas or introducing additional independent shielding components; high isolation is achieved simply by integrating the electromagnetic bandgap structure and the dielectric choke on the printed circuit board, which is beneficial for maintaining the miniaturization of the device.

[0031] Therefore, the transceiver antenna device of the present invention can effectively suppress electromagnetic coupling between the transceiver antenna arrays, reduce interference of the transmitted signal to the receiving channel, thereby ensuring the receiving sensitivity of the system, avoiding receiver saturation and transmitted signal distortion, and ensuring the normal operation of the communication system. This solution is particularly suitable for high-density integrated phased array communication systems with limited space and high isolation requirements, such as satellite communication terminals, 5G / 6G millimeter-wave base stations, radar detection systems, etc., and is especially suitable for miniaturized devices where transceiver antennas coexist and space is limited.

[0032] Depending on the different structural forms of the printed circuit board substrate, the transceiver antenna device can be divided into two categories: split-board type and single-board type. In the split-board type transceiver antenna device, the printed circuit board substrate includes a first printed circuit board 210 and a second printed circuit board 220 that are independent of each other. The transmitting antenna array 110 and the receiving antenna array 120 are respectively arranged on different printed circuit boards. On this basis, a structural shielding grid 300 can be further introduced to form a triple isolation structure. In the single-board type transceiver antenna device, the printed circuit board substrate is a single printed circuit board 230. The transmitting antenna array 110 and the receiving antenna array 120 are arranged at intervals in different areas of the same printed circuit board. In this case, a dual combination of electromagnetic bandgap structure and dielectric choke slot is used to achieve isolation. The specific implementation methods of the above two types of transceiver antenna devices are described in detail below.

[0033] Example 1: Split-type transceiver antenna device like Figure 1 and Figure 2 As shown, in the split-board transceiver antenna device, the printed circuit board substrate includes a first printed circuit board 210 and a second printed circuit board 220 that are independent of each other. The two printed circuit boards are physically separated from each other and can be fixed in the overall structure and maintain a preset relative position by mechanical connectors such as screws, clips, or brackets. This split-board design allows for the selection of different substrate materials, thicknesses, or stacked structures for the different operating frequencies, power levels, and performance requirements of the transmitting antenna array 110 and the receiving antenna array 120, thereby optimizing the performance of their respective antenna arrays.

[0034] The first printed circuit board 210 has a dedicated transmission area for laying out the transmitting antenna array 110. The design parameters of this area, such as dielectric constant and loss tangent, are independently optimized according to the operating frequency and performance requirements of the transmitting antenna. The second printed circuit board 220 has a dedicated receiving area for laying out the receiving antenna array 120. Its design parameters are also independently optimized according to the performance requirements of the receiving antenna.

[0035] The antenna isolation structure includes three types of isolation structures: structural shielding grid 300, electromagnetic bandgap structure, and dielectric choke groove.

[0036] Among them, such as Figure 1 and Figure 2 As shown, there are multiple structural shielding grilles 300, spaced apart between the first printed circuit board 210 and the second printed circuit board 220. They are made of conductive material, such as metal plates or metal structures with specific geometries, and their main function is to provide additional electromagnetic shielding. The structural shielding grilles 300 are positioned between the first printed circuit board 210 and the second printed circuit board 220, forming a physical isolation zone and an electromagnetic shielding layer between the transmitting and receiving areas. The structural shielding grilles 300 can be placed perpendicular to the plane of the printed circuit board substrate and tightly connected to the edges or specific areas of the two printed circuit boards, thereby establishing an effective electromagnetic barrier between the two independent printed circuit boards, further suppressing direct coupling of electromagnetic waves and the propagation of surface waves.

[0037] Specifically, such as Figure 3 As shown, each of the structural shielding grids 300 includes a structural base 310 and structural grids 320 arranged sequentially at intervals on the structural base 310. A cutout area is provided between two adjacent structural grids 320 to form a structural shielding groove 330. The structural base 310 is the supporting and load-bearing part of the structural shielding grid 300, providing mechanical strength and stability for the entire shielding structure. Its material can be selected from metal plates, conductive plastics, or other materials with certain rigidity and conductivity. The selection should take into account electromagnetic shielding performance, machinability, and compatibility with the printed circuit board substrate.

[0038] The structural grid 320 is a periodically or quasi-periodically arranged conductive structure disposed on the structural substrate 310. Its design can take various forms, such as stripes, grids, or aperture arrays. The specific shape and size affect its operating frequency band and shielding effect. Preferably, the grid spacing is 1 / 60 to 1 / 8 of the free space wavelength, for example, 1 / 50, 1 / 40, or 1 / 10 of the free space wavelength, which can meet most of the isolation bandwidth and impedance characteristic requirements.

[0039] Preferably, the depth of the structural shielding groove 330 is 0.4 to 0.6 times the free space wavelength, for example, 0.4, 0.5, or 0.6 times the free space wavelength. This depth can be optimized through full-wave simulation. After passing through the groove, the electromagnetic wave can generate a 180° phase difference with the electromagnetic wave on the surface, thus canceling each other out and improving isolation. Through full-wave simulation, the structural shielding grille 300 can be optimized into a sawtooth or stepped shape to further improve isolation. Furthermore, through full-wave simulation, the structural shielding grille 300 can also protrude above the printed circuit board substrate, but this must not affect the large-angle scanning of the antenna array and must not protrude beyond the scanning range required by the antenna array specifications.

[0040] like Figure 4 and Figure 5 As shown, the electromagnetic bandgap structure includes a transmitting array electromagnetic bandgap unit 410 disposed in the transmitting region and a receiving array electromagnetic bandgap unit 420 disposed in the receiving region. The electromagnetic bandgap structure is composed of a series of metal patches 401 or etched patterns, which can be arranged periodically or non-periodically, such as a mushroom-shaped electromagnetic bandgap structure, a through-hole electromagnetic bandgap structure, or a planar electromagnetic bandgap structure. Preferably, in this embodiment, a mushroom-shaped electromagnetic bandgap structure is used. Each electromagnetic bandgap unit includes a patch 401 disposed on the surface of the printed circuit board substrate, a metallized via 402, and a reference ground layer 403. The patch 401 is electrically connected to the reference ground layer 403 through the metallized via 402, and the whole is mushroom-shaped.

[0041] The operating frequency bands of the transmitting array electromagnetic bandgap element 410 and the transmitting array dielectric choke slot 510 are matched with the operating frequency band of the transmitting antenna array 110, and the operating frequency bands of the receiving array electromagnetic bandgap element 420 and the receiving array dielectric choke slot 520 are matched with the operating frequency band of the receiving antenna array 120. By precisely designing parameters such as element size, shape, period, and choke slot depth and width, their resonant frequencies or bandgap characteristics are made to match the operating frequency bands of their respective antenna arrays, thereby achieving targeted suppression of surface wave coupling in specific frequency bands.

[0042] In this structure, the electromagnetic bandgap elements are arranged in a periodic repeating pattern. Electromagnetic waves are scattered at the boundaries of the periodic structure, and destructive interference occurs between the scattered waves, preventing electromagnetic waves of a specific frequency band from propagating within the structure. Simultaneously, the electromagnetic bandgap element acts as a resonant circuit, with the surface reactance tending towards infinity at a specific frequency band, thus blocking the propagation of electromagnetic waves near that frequency. Preferably, the size of the electromagnetic bandgap element is defined as p, then 0.1λg ≤ p ≤ 0.25λg, where λg is the wavelength of the dielectric, and p can be 0.1λg, 0.15λg, 0.2λg, or 0.25λg, with the appropriate size determined based on the results of full-wave simulation optimization. This structure, through its unique bandgap characteristics, can suppress surface waves propagating on the substrate surface, thereby reducing coupling between antennas.

[0043] like Figure 1 and Figure 2 As shown, the dielectric choke includes a transmitting array dielectric choke 510 disposed in the transmitting area and a receiving array dielectric choke 520 disposed in the receiving area. An electromagnetic bandgap structure is located between the transmitting array dielectric choke 510 and the receiving array dielectric choke 520. Figure 6 and Figure 7The diagram shows a longitudinal cross-sectional view of a printed circuit board. The dielectric choke structure includes a grounding hole 501, a ground layer 502, a ground plane cutout area 503, and an insulating dielectric filling area 504. The dielectric choke is formed by cutting out a corresponding area of ​​the ground layer within the printed circuit board. Here, "cutting out" specifically refers to the removal of the grounding copper foil layer on a specific inner layer within a designated area during manufacturing through chemical etching, thereby forming the ground plane cutout area 503. The insulating dielectric substrate (such as FR4 or high-frequency board material) within this area is completely retained, forming the insulating dielectric filling area 504, which serves as the electromagnetic wave transmission medium.

[0044] The depth of the dielectric choke structure can be selected within the range of 0.4 to 0.6 times the corresponding dielectric wavelength based on simulation optimization results. It should be noted that the depth of the dielectric choke is 0.4 to 0.6 times the corresponding dielectric wavelength. In practical engineering, since the stacked structure of multilayer printed circuit boards is pre-designed, the positions of each ground layer 205 in the thickness direction are discrete and fixed, and cannot be continuously and arbitrarily adjusted. Therefore, the bottom ground layer 502 of the choke is generally selected from the existing ground layer in the printed circuit board stacked structure with a depth closest to 0.5 times the dielectric wavelength to ensure that the reflected wave and the incident wave meet a phase difference condition of approximately 180°, canceling each other out and effectively suppressing surface wave coupling. For different printed circuit board stacked designs, if the depth of this ground layer is within the range of 0.4 to 0.6 times the dielectric wavelength, for example, 0.4, 0.45, 0.5, 0.55, or 0.6 times, the phase cancellation effect that meets engineering requirements can be obtained, thereby effectively improving the isolation between the transmitting and receiving antennas. When the phase difference deviates too much from 180°, the cancellation effect drops sharply, so it is not considered a preferred option.

[0045] It should be understood that the aforementioned depth range of 0.4 to 0.6 times the dielectric wavelength is an engineering preferred range based on the actual discreteness of printed circuit board stacking, and not a strict limitation on the scope of protection of this invention. Those skilled in the art, after reading this specification, can select the optimal ground layer position within this range to achieve the resonant depth of the dielectric choke groove according to the specific printed circuit board stacking conditions.

[0046] Taking a depth of 0.5 times the dielectric wavelength as an example, to achieve this depth, a complete ground layer 502 (such as layer L9) is retained at a depth of approximately 0.5 times the dielectric wavelength in the thickness direction of the printed circuit board as the bottom reflective surface of the slot, forming the ground layer 502. All intermediate ground layers 502 above this depth are removed in the corresponding area of ​​the choke slot. Dense metallized grounding holes 501 are arranged around the slot, and the center-to-center distance between adjacent grounding holes 501 should be less than a set multiple of the dielectric wavelength, such as 0.25 times. Other values ​​can also be set according to requirements, thereby forming an equivalent electric wall. Together with the ground layer 502 retained at the bottom, they constitute a closed electromagnetic resonant cavity, with only the top opening in contact with the antenna surface, forcing surface waves to enter the slot and be reflected and canceled before they can pass through.

[0047] Furthermore, the depth and width of the choke slot can be optimized through parametric scanning using full-wave simulation. Even better, the bottom of the choke slot can be designed as a continuous stepped channel—with the bottom reflective layer segmented on different inner ground layers 502 along the extension direction of the same continuous slot, forming multiple stepped depths. Different step depths correspond to different phase cancellation frequencies, and the superposition of multiple adjacent resonant frequencies can significantly extend the bandwidth range with high isolation. Signal traces, power lines, or components are strictly prohibited within the hollowed-out floor area to ensure the purity of the electromagnetic boundary of the resonant cavity.

[0048] This invention is not limited to a triple structure combination. In actual engineering layouts, pairwise combinations can be flexibly selected based on the spatial constraints, stack-up structure, and processing conditions of the printed circuit board, including: combinations of electromagnetic bandgap structures and structural shielding grids 300, combinations of electromagnetic bandgap structures and dielectric chokes, and combinations of structural shielding grids 300 and dielectric chokes. For example, when the board thickness is insufficient to form the depth required for a complete choke, a combination of electromagnetic bandgap structures and structural shielding grids 300 can be used; when space is insufficient to arrange periodic electromagnetic bandgap units, a combination of structural shielding grids 300 and dielectric chokes can be used. All combinations follow the independent design rules for each structure and can be flexibly configured according to the actual frequency band and spatial constraints.

[0049] To verify the technical effectiveness of this invention, the applicant conducted full-wave simulation comparisons of different shielding structures. For example... Figure 10 As shown, the isolation is lowest (smallest absolute value) when the electromagnetic bandgap structure is used alone (curve 1), while the isolation is optimal across the entire frequency band when the triple structure (structural shielding grid 300 + electromagnetic bandgap structure + dielectric choke groove, corresponding to curve 3) is combined, proving the effectiveness of the synergistic effect of the three structures. The combination of structural shielding grid 300 and dielectric choke groove (curve 2) or the combination of electromagnetic bandgap structure and structural shielding grid 300 (curve 4) can also effectively improve the isolation.

[0050] The added dielectric choke structure of this invention has the core advantage of achieving phase cancellation characteristics inside the printed circuit board substrate and achieving high isolation in areas without metal shielding structure coverage, extending the isolation capability from the surface to the inside of the printed circuit board, and significantly improving the isolation performance in a limited lateral space.

[0051] Furthermore, the three structures can be deployed differently based on the characteristics of the printed circuit board layout: structural shielding grilles 300 are preferentially deployed in the physical boundary areas between antenna arrays to block spatial radiation coupling; dielectric chokes are preferentially deployed in areas with large printed circuit board layer thickness to achieve internal phase cancellation using deep resonance; and electromagnetic bandgap structures are preferentially deployed in thin areas with only the surface layer and one or two adjacent substrate layers to suppress surface wave propagation. This differentiated layout strategy balances optimal isolation performance with engineering feasibility and process compatibility.

[0052] Example 2: Plate-mounted transceiver antenna device In this embodiment, as Figure 8 and Figure 9 As shown, the printed circuit board substrate is a single printed circuit board 230. A single printed circuit board 230 means that all necessary circuitry and antenna structures are integrated onto a single continuous substrate, rather than using multiple separate substrates spliced ​​or stacked. This design simplifies the substrate manufacturing process, reduces the number of components, and helps achieve a more compact physical size.

[0053] The single printed circuit board 230 has spaced-apart transmitting and receiving areas. The transmitting area is specifically designed for housing the transmitting antenna array 110, and the receiving area is specifically designed for housing the receiving antenna array 120. The transmitting and receiving areas are physically separated and spaced apart; this spacing is intended to provide sufficient physical isolation for the transmitting and receiving antenna arrays, reducing direct coupling and providing space for the deployment of isolation structures. The transmitting antenna array 110 and the receiving antenna array 120 are integrated into their respective dedicated areas, ensuring functional zoning and electromagnetic compatibility of the antennas.

[0054] Unlike Embodiment 1, this embodiment does not rely on the metal structure shielding grid 300, but instead uses a combination of dielectric choke groove and electromagnetic bandgap structure to improve isolation.

[0055] Specifically, the electromagnetic bandgap structure includes a transmitting array electromagnetic bandgap element 410 disposed in the transmitting region and a receiving array electromagnetic bandgap element 420 disposed in the receiving region. The dielectric choke includes a transmitting array dielectric choke 510 disposed in the transmitting region and a receiving array dielectric choke 520 disposed in the receiving region. In this embodiment, the specific construction of the electromagnetic bandgap structure and the dielectric choke is the same as the corresponding structure in Embodiment 1. For structural details and preferred parameters, please refer to the relevant description in Embodiment 1, which will not be repeated here.

[0056] To ensure optimal isolation, the operating frequency bands of the transmitting array electromagnetic bandgap element 410 and the transmitting array dielectric choke slot 510 are precisely configured to match the operating frequency band of the transmitting antenna array 110; the operating frequency bands of the receiving array electromagnetic bandgap element 420 and the receiving array dielectric choke slot 520 are configured to match the operating frequency band of the receiving antenna array 120. By precisely designing parameters such as element size, shape, period, and choke slot depth and width, their resonant frequencies or bandgap characteristics are matched with the operating frequency bands of their respective antenna arrays, thereby achieving targeted suppression of surface wave coupling in specific frequency bands.

[0057] Embodiment 2 of the present invention provides an implementation of a plate-type transceiver antenna device. In the scenario where the transceiver antenna is on the same plate and a physical metal grid cannot be installed, this solution configures a dielectric choke and an electromagnetic bandgap structure independently optimized for their respective frequency bands on the transmitting array side and the receiving array side, respectively. The choke achieves phase cancellation inside the printed circuit board substrate, and the electromagnetic bandgap structure suppresses surface waves on the surface. The two work together to block the electromagnetic coupling path from different physical dimensions.

[0058] Simulation results demonstrate that the combination of the dielectric choke and the electromagnetic bandgap structure significantly improves isolation compared to solutions using only a single isolation method. Especially when the distance between the transmitting and receiving antennas is minimized, this solution effectively suppresses electromagnetic coupling, ensuring that the system's receiving sensitivity remains unaffected.

[0059] Another significant advantage of this embodiment is its simple design and manufacturing process—no additional metal components or changes to the assembly process are required. The entire isolation structure can be achieved simply by etching out the designated area of ​​the ground layer 502, arranging periodic grounding vias 501, and fabricating periodic patch units 401 on the surface during the printed circuit board substrate manufacturing process. This solution offers engineering advantages such as low cost, good consistency, and ease of mass production, making it suitable for various high-density integrated phased array communication devices.

[0060] In addition, the present invention also provides an antenna isolation structure, which is the same as the antenna isolation structure in Embodiment 1 and Embodiment 2 described above, and will not be described again here.

[0061] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. An antenna isolation structure, characterized in that, include: Printed circuit board substrate; An electromagnetic bandgap structure is disposed on the surface layer of the printed circuit board substrate to suppress surface waves propagating along the dielectric surface and block the coupling path of electromagnetic waves in the horizontal direction. The dielectric choke groove forms a resonant cavity by hollowing out the ground layer in a corresponding area inside the printed circuit board substrate. It utilizes the 180° phase cancellation characteristic generated by its deep resonance to block the path of electromagnetic waves coupled through the dielectric layer in the vertical direction. The electromagnetic bandgap structure and the dielectric choke are disposed between the transmitting antenna array and the receiving antenna array, and are used to cooperate with each other from both the surface and internal dimensions to form a multi-dimensional electromagnetic blocking barrier between the transmitting antenna array and the receiving antenna array, thereby improving the isolation between the transmitting antenna array and the receiving antenna array.

2. The antenna isolation structure according to claim 1, characterized in that, The printed circuit board substrate includes a first printed circuit board and a second printed circuit board that are independent of each other; The antenna isolation structure also includes a plurality of spaced structural shielding grilles, which are disposed between the first printed circuit board and the second printed circuit board; The first printed circuit board has a transmitting area for arranging the transmitting antenna array, and the second printed circuit board has a receiving area for arranging the receiving antenna array.

3. The antenna isolation structure according to claim 2, characterized in that, The electromagnetic bandgap structure includes a transmitting electromagnetic bandgap unit disposed in the transmitting region and a receiving electromagnetic bandgap unit disposed in the receiving region; the structural shielding grid is located between the transmitting electromagnetic bandgap unit and the receiving electromagnetic bandgap unit. The dielectric choke includes a transmitting array dielectric choke disposed in the transmitting region and a receiving array dielectric choke disposed in the receiving region; the electromagnetic bandgap structure is located between the transmitting array dielectric choke and the receiving array dielectric choke. The operating frequency bands of the transmitting array electromagnetic bandgap element and the transmitting array dielectric choke slot are configured to match the operating frequency band of the transmitting antenna array, and the operating frequency bands of the receiving array electromagnetic bandgap element and the receiving array dielectric choke slot are configured to match the operating frequency band of the receiving antenna array.

4. The antenna isolation structure according to claim 2, characterized in that, Each of the structural shielding grids includes a structural base and structural grids arranged sequentially at intervals on the structural base, with a cut-out area between two adjacent structural grids to form a structural shielding groove.

5. The antenna isolation structure according to claim 4, characterized in that, The depth of the structural shielding groove is 0.4 to 0.6 times the free space wavelength, and the grid spacing of the structural shielding groove is 1 / 60 to 1 / 8 times the free space wavelength.

6. The antenna isolation structure according to claim 1, characterized in that, The printed circuit board substrate is a single printed circuit board; the single printed circuit board has a transmitting area and a receiving area arranged at intervals; the transmitting area is used to deploy the transmitting antenna array, and the receiving area is used to deploy the receiving antenna array. The electromagnetic bandgap structure includes a transmitting array electromagnetic bandgap unit disposed in the transmitting region and a receiving array electromagnetic bandgap unit disposed in the receiving region. The medium choke slot includes a transmitting array medium choke slot disposed in the transmitting area and a receiving array medium choke slot disposed in the receiving area; The operating frequency bands of the transmitting array electromagnetic bandgap element and the transmitting array dielectric choke slot are configured to match the operating frequency band of the transmitting antenna array, and the operating frequency bands of the receiving array electromagnetic bandgap element and the receiving array dielectric choke slot are configured to match the operating frequency band of the receiving antenna array.

7. The antenna isolation structure according to claim 1, characterized in that, The electromagnetic bandgap structure includes a plurality of periodically arranged electromagnetic bandgap units. Each electromagnetic bandgap unit includes a patch disposed on the surface of a printed circuit board substrate, a metallized via, and a reference ground layer. The patch is electrically connected to the reference ground layer through the metallized via.

8. The antenna isolation structure according to claim 1, characterized in that, The dielectric choke groove is surrounded by multiple grounding holes, and the center-to-center distance between adjacent grounding holes should be less than a set multiple of the dielectric wavelength.

9. The antenna isolation structure according to claim 8, characterized in that, The depth of the dielectric choke groove is 0.4 to 0.6 times the dielectric wavelength, and the spacing between adjacent grounding holes is less than 0.25 times the dielectric wavelength.

10. A transceiver antenna device, characterized in that, Includes a transmitting antenna array, a receiving antenna array, and an antenna isolation structure as described in any one of claims 1 to 9; The printed circuit board substrate has a transmitting area and a receiving area, the transmitting antenna array is disposed in the transmitting area, and the receiving antenna array is disposed in the receiving area.

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