Jig for grinding concave platform surface of sapphire wafer

Abstract

The utility model relates to a jig for grinding a concave platform surface of a sapphire wafer, which is characterized in that a circular groove (11) is arranged in the center of the top surface of a jig body (1), a first annular groove (12) is arranged at the edge of the circular groove (11), a first strip-shaped groove (13) and a second strip-shaped groove (14) are arranged on the surface of the circular groove (11), the first strip-shaped groove (13) and the second strip-shaped groove (14) are vertically intersected, and the first annular groove (12) is arranged at the edge of the circular groove (11). The intersection point is positioned at the circle center of the circular groove (11); a connecting piece (15) is fixedly mounted on the lower surface of the jig body (1); the sapphire machining tool can be suitable for sapphire products of special structures, and the machining efficiency and the machining yield can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of sapphire wafer processing, in particular to a fixture for grinding a concave platform surface of a sapphire wafer. Background Art

[0002] With the continuous development of society and the advancement of science and technology, all walks of life have higher and higher requirements for the uniqueness of product design. For example: a sapphire wafer with a shape similar to a "pot lid". The biggest feature of the design of this special sapphire wafer is that a concave platform is set in the center of the upper surface and an R angle is set between the concave platform surface and the top surface. Due to the setting of the concave platform, this type of product cannot be ground with a traditional large grinding disc, and can only be ground with a grinding head smaller than the size of the concave platform surface. In addition, the grinding jig on the existing grinding equipment has a low matching degree with this type of special-shaped sapphire wafer, which leads to low grinding efficiency, low product yield, and high production cost. Summary of the invention

[0003] In view of the problems existing in the above-mentioned prior art, the utility model provides a jig for grinding the concave platform surface of a sapphire wafer, which can be suitable for sapphire products with special structures and can effectively improve the processing efficiency and processing yield.

[0004] In order to achieve the above-mentioned purpose, the utility model provides a jig for grinding the inner concave platform surface of a sapphire wafer, comprising a jig body, a circular groove, a first annular groove, a first strip groove, a second strip groove, a connecting piece, a second annular groove, a telescopic mechanism and an auxiliary hole, wherein a circular groove is centrally arranged on the top surface of the jig body, the first annular groove is arranged at the edge of the circular groove, a first strip groove and a second strip groove are arranged on the surface of the circular groove, the first strip groove and the second strip groove intersect vertically, and the intersection point is located at the center of the circular groove; a connecting piece is fixedly installed on the lower surface of the jig body; the connecting piece is a cylinder, and a thread is arranged on the surface.

[0005] In addition, the jig for grinding the concave platform surface of a sapphire wafer according to the above embodiment of the utility model may also have the following additional technical features:

[0006] As a further improvement of the present invention, a second annular groove is provided on the side wall of the fixture body, and the telescopic mechanism clamps the second annular groove.

[0007] As a further improvement of the present invention, an auxiliary hole is provided on the side wall of the fixture body.

[0008] As a further improvement of the present invention, the depth of the first strip-shaped groove is greater than the depth of the second annular groove.

[0009] As a further improvement of the present invention, the first strip-shaped groove and the second strip-shaped groove have the same depth and width.

[0010] Through the above scheme, the utility model has at least the following advantages: compared with conventional grinding jigs, a circular groove is set on the top surface of the jig body, a first annular groove is set at the edge of the circular groove, and two vertically intersecting strip grooves are set along the center of the jig body. With the above arrangement, the grinding jig provided by the utility model has a good matching degree with the sapphire wafer with a concave platform surface, which can improve the processing efficiency, and the arrangement of the first annular groove and the two vertically intersecting strip grooves can timely remove the tiny particles generated during the grinding process to prevent them from scratching the sapphire wafer and improve the product yield; in addition, the arrangement of the two vertically intersecting strip grooves can also make the removal operation of the ground sapphire wafer more convenient, further improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a top view schematic diagram of a jig used for grinding the concave platform surface of a sapphire wafer;

[0012] Figure 2 It is a side view of a jig used for grinding the concave platform surface of a sapphire wafer;

[0013] In the figure: 1. fixture body, 11. circular groove, 12. first annular groove, 13. first strip groove, 14. second strip groove, 15. connecting piece, 16. second annular groove, 17. telescopic mechanism, 18. auxiliary hole. DETAILED DESCRIPTION

[0014] The following describes the jig for grinding the concave platform surface of a sapphire wafer according to the present invention in conjunction with the accompanying drawings.

[0015] In the first embodiment of the present application, Figure 1 and Figure 2As shown, the jig for grinding the concave platform surface of the sapphire wafer (hereinafter referred to as "this patent") includes a jig body 1, a circular groove 11, a first annular groove 12, a first strip groove 13, a second strip groove 14, a connecting piece 15, a second annular groove 16, a telescopic mechanism 17 and an auxiliary hole 18. The circular groove 11 is centrally arranged on the top surface of the jig body 1, the first annular groove 12 is arranged at the edge of the circular groove 11, the first strip groove 13 and the second strip groove 14 are arranged on the surface of the circular groove 11, the first strip groove 13 and the second strip groove 14 intersect vertically, and the intersection is located at the center of the circular groove 11 The circular groove 11 is centrally arranged on the top surface of the fixture body 1, and is used to place a sapphire wafer with a concave platform surface. The depth of the circular groove 11 matches the size of the sapphire wafer with a concave platform surface. The first annular groove 12 is arranged at the edge of the circular groove 11. Through this arrangement, tiny particles generated during the grinding of the sapphire wafer can be discharged from the circular groove 11 to the first annular groove 12, which can prevent the tiny particles generated during the grinding of the sapphire wafer from accumulating on the edge of the circular groove 11, avoid the sapphire wafer from being scratched by the tiny particles generated during the grinding of the sapphire wafer, and improve the product yield.

[0016] In addition, the first strip groove 13 is centrally arranged on the top surface of the jig body 1, and the second strip groove 14 is centrally arranged on the top surface of the jig body 1, and the second strip groove 14 intersects the first strip groove 13 vertically. Through this arrangement, not only can the tiny particles generated during the grinding process of the sapphire wafer be discharged to the outside of the grinding jig through the first strip groove 13 and the second strip groove 14, thereby avoiding the above-mentioned tiny particles from scratching the sapphire wafer and improving the product yield, but also the removal operation of the sapphire wafer after grinding can be made more convenient, thereby improving the processing efficiency.

[0017] During specific use, after the sapphire wafer is ground, a sheet with a thickness smaller than the width of the first strip groove 13 and the second strip groove 14 and a hardness smaller than the hardness of sapphire is inserted into the first strip groove 13 or the first strip groove 14, and the sapphire wafer can be easily taken out by using the lever principle.

[0018] A connector 15 is fixedly installed on the lower surface of the jig body 1; the connector 15 is a cylinder with threads on the surface. The connector 15 is centrally arranged at the bottom of the jig body 1 and is used to connect the jig body 1 with the grinding equipment. The connector 15 can be a cylinder with threads on the surface, and the jig body 1 and the grinding equipment are threadedly connected through the connector 15. It should be understood that the connector 15 is not limited to the above-mentioned implementation method, and the connector 15 can also be a cylinder without threads on the surface, and the jig body 1 and the grinding equipment are connected through the connector 15 clamp, as long as a stable connection between the jig body 1 and the grinding equipment can be achieved.

[0019] The structure of the second embodiment is basically the same as that of the first embodiment, except that the side wall of the jig body 1 is provided with a second annular groove 16, and the telescopic mechanism 17 clamps the second annular groove 16. The telescopic mechanism 17 is sleeved on the side wall of the jig body 1 through the second annular groove 16, which means that there is no connection between the telescopic mechanism 17 and the second annular groove 16 and the side wall of the jig body 1, and the telescopic mechanism 17 is placed flat in the groove of the second annular groove 16. In addition, the telescopic mechanism 17 can be a clamp, which can adjust the tightness of the side wall of the jig body 1 at the location of the first strip groove 13 and the second strip groove 14 through its own structure. This arrangement can ensure that the sapphire wafer is firmly fixed in the circular groove 11 of the jig body 1, and the sapphire wafer can be prevented from sliding and falling off during the grinding process, thereby improving the product yield and processing efficiency.

[0020] During specific use, the extension amount of the telescopic mechanism 17 is adjusted to the maximum state, the sapphire wafer is placed with the concave platform surface facing upward in the circular groove 11 of the jig body 1, and the contraction amount of the telescopic mechanism 17 is adjusted to firmly fix the sapphire wafer in the circular groove 11 of the jig body 1 to prevent the sapphire wafer from sliding in the circular groove 11 of the jig body 1 during the grinding process, thereby scratching the sapphire wafer; after the grinding is completed, the contraction amount of the telescopic mechanism 17 is adjusted again to take out the sapphire wafer.

[0021] In order to further optimize the working efficiency of the present application, prevent the grinding liquid flowing out of the first strip groove 13 from excessively invading the telescopic mechanism 17 located in the second annular groove 16, and avoid the failure of the telescopic mechanism 17 caused by excessive invading of the grinding liquid, thereby affecting the processing efficiency, the depth of the first strip groove 13 is greater than the depth of the second annular groove 16. The depth of the first strip groove 13 is greater than the depth of the second annular groove 16, which means that the bottom end of the first strip groove 13 is located below the second annular groove 16. The depth and width of the first strip groove 13 and the second strip groove 14 are the same. Through this arrangement, the second strip groove 14 is symmetrical with the first strip groove 13 along the center of the jig body, ensuring the balance of the jig body structure and avoiding the problem of unsmooth operation of the grinding jig due to its own structural imbalance. An auxiliary hole 18 is opened on the side wall of the jig body 1, and the auxiliary hole 18 can be a circular hole.

[0022] During specific use, when the jig body 1 is threadedly connected to the grinding equipment, after the jig body 1 is installed on the grinding equipment, a long rod that matches the appearance and size of the auxiliary hole 18 is used to reinforce the connection between the jig body 1 and the grinding equipment thread by using the lever principle; similarly, the auxiliary hole 18 can also be used for the disassembly of the jig body 1. Through the above arrangement, the installation and disassembly operations of the jig body 1 can be made more convenient, saving time and effort in operation and improving processing efficiency. It should be understood that the auxiliary hole 18 is not limited to the above implementation method, and the auxiliary hole 18 can also be a square hole or a hexagonal hole, as long as the installation and disassembly of the auxiliary jig body 1 can be achieved.

[0023] In summary, the jig for grinding the concave platform surface of a sapphire wafer in the embodiment of the utility model is provided with a circular groove 11 on the top surface of the jig body 1, a first annular groove 12 is provided at the edge of the circular groove 11, and two vertically intersecting strip grooves are provided along the center of the jig body 11. With the above arrangement, the grinding jig provided by the utility model has a good matching degree with the sapphire wafer with a concave platform surface, which can improve the processing efficiency, and the arrangement of the first annular groove 12 and the two vertically intersecting strip grooves can timely remove the tiny particles generated during the grinding process to prevent them from scratching the sapphire wafer and improve the product yield; in addition, the arrangement of the two vertically intersecting strip grooves can also make the removal operation of the ground sapphire wafer more convenient, further improving the processing efficiency.

[0024] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A jig for grinding a concave platform surface of a sapphire wafer, comprising a jig body (1), characterized in that: A circular groove (11) is centrally arranged on the top surface of the jig body (1), a first annular groove (12) is arranged at the edge of the circular groove (11), a first strip groove (13) and a second strip groove (14) are arranged on the surface of the circular groove (11), the first strip groove (13) and the second strip groove (14) intersect vertically, and the intersection point is located at the center of the circular groove (11); a connecting piece (15) is fixedly installed on the lower surface of the jig body (1); the connecting piece (15) is a cylinder, and a thread is arranged on the surface.

2. The jig for grinding the concave terrace surface of a sapphire wafer according to claim 1, characterized in that: A second annular groove (16) is provided on the side wall of the jig body (1), and the telescopic mechanism (17) clamps the second annular groove (16).

3. The jig for grinding the concave terrace surface of a sapphire wafer according to claim 2, characterized in that: The side wall of the jig body (1) is provided with an auxiliary hole (18).

4. The jig for grinding the concave terrace surface of a sapphire wafer according to claim 1, characterized in that: The depth of the first strip-shaped groove (13) is greater than the depth of the second annular groove (16).

5. The jig for grinding the concave terrace surface of a sapphire wafer according to claim 4, characterized in that: The first strip-shaped groove (13) and the second strip-shaped groove (14) have the same depth and width.

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