Semiconductor refrigeration type brake disc device

Abstract

The utility model provides a semiconductor refrigeration type brake disc device which comprises a clamping cover and an inner connecting disc, the inner side of the clamping cover is provided with brake pads which are in friction with brake disc bodies and play a role in braking, the inner sides of the two brake pads are provided with the brake disc bodies used for reducing the speed of an automobile tire, and the inner side of each brake pad is provided with an inner connecting disc. A plurality of groups of ventilation holes for ventilation and heat dissipation are formed in the brake disc main body, and an inner connecting disc for connection is arranged on the inner side of the brake disc main body. The brake pad and the semiconductor chilling plate are supported and connected by using the inner frame, the temperature of the semiconductor chilling plate is conducted by using the temperature conducting plate, the external wire is connected by using the connector, and the refrigeration temperature of the semiconductor chilling plate is reduced by using the temperature conducting plate, so that the brake pad is cooled.

Description

Technical Field

[0001] The utility model belongs to the technical field of brake discs and relates to a semiconductor refrigeration type brake disc device. Background Art

[0002] The brake disc is an important component in the car's braking system. It is a disc-shaped metal part that is fixed to the wheel and in contact with the brake pad. When the driver steps on the brake pedal, the brake pad clamps the brake disc and generates braking force through friction to slow down or stop the car. The material of the brake disc is usually cast iron or alloy steel, which has good wear resistance and thermal stability. The quality and performance of the brake disc have a vital impact on the braking effect and safety of the car. If the brake disc is severely worn or has other problems, it will lead to safety hazards such as increased braking distance and brake failure. The high temperature generated by the brake pad during frequent use is a problem worthy of attention and may lead to a series of adverse consequences.

[0003] The main function of brake pads is to slow down the vehicle through friction with the brake disc. The friction coefficient directly determines the braking force. When the temperature of the brake pads is too high, its material properties will change, the friction coefficient will decrease, resulting in reduced braking force and longer braking distance. In emergency braking situations, this may cause serious safety hazards.

[0004] Thermal decay refers to the significant decrease in performance of brake pads after working at high temperatures for a long time. This will cause the brake pads to gradually lose their effectiveness during continuous braking, and may even lead to critical brake failure.

[0005] Brake pads are usually made of a variety of materials. High temperatures may weaken the bonding between the materials, or even cause delamination. This will not only affect the braking performance of the brake pads, but may also cause problems such as abnormal noise. Therefore, a semiconductor cooling brake disc device is urgently needed to solve the above problems. Utility Model Content

[0006] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a semiconductor cooling brake disc device to solve the problems raised in the above background technology.

[0007] The utility model is realized by the following technical scheme: a semiconductor cooling type brake disc device, comprising: a card cover, a brake disc body and an inner connecting disc, wherein a brake pad is provided inside the card cover for rubbing against the brake disc body and achieving a braking effect;

[0008] The inner sides of the two groups of brake pads are provided with a brake disc body for decelerating the tires of the vehicle, and the inside of the brake disc body is provided with a plurality of ventilation holes for ventilation and heat dissipation;

[0009] An inner connecting plate for connection is provided on the inner side of the brake disc body. The inner connecting plate and the brake disc body are an integrated structure. The front and rear sides of the brake disc body respectively correspond to a group of brake pads for corresponding contact. The brake disc body can be braked by using two groups of brake pads.

[0010] As a preferred embodiment, the card cover includes a side shell, a semiconductor cooling plate and a connecting head, and a group of buckles for improving the connection effect are provided on the left and right sides of the side shell.

[0011] As a preferred embodiment, a group of connecting shells are provided on the rear side of the buckle, and several groups of fixing holes are provided at the lower end inside the connecting shell for connection and fixation. A group of connecting seats for connecting and fixing with the inner frame are provided at the lower ends of the left and right sides of the connecting shell, so that the brake pads and semiconductor refrigeration plates can be supported and connected by using the inner frame.

[0012] As a preferred embodiment, a group of inner frames for supporting and connecting the brake pad body are provided on the inner side of the two groups of connecting seats, and a group of thermal conductive plates for conducting temperature are provided on the front and rear sides of the inner frames, so that the temperature of the semiconductor refrigeration plate can be conducted by using the thermal conductive plates.

[0013] As a preferred embodiment, a group of rear mounting seats for installing brake pads are provided on the inner side of the thermal conductive plate, and a semiconductor refrigeration plate for cooling the brake pads is provided on the inner side of the side shell. A group of connectors are provided in the middle of the left and right ends of the semiconductor refrigeration plate, and external wires can be connected by using the connectors.

[0014] As a preferred embodiment, the side shell is made of a metal material, the side shell and the two sets of buckles are an integrated structure, and the front and rear ends and left and right sides of the inner frame are each provided with a set of embedding grooves for interlocking with the buckles.

[0015] As a preferred embodiment, the inner side of the semiconductor refrigeration plate is in contact with the thermal conductive plate, and the thermal conductive plate is made of a metal copper material. The middle position of the thermal conductive plate is interlocked with the middle position inside the rear mounting seat, and the inner side of the middle position of the thermal conductive plate is in contact with the brake pad. The thermal conductive plate can be used to reduce the cooling temperature of the semiconductor refrigeration plate and thus cool the brake pad.

[0016] After adopting the above technical scheme, the beneficial effects of the utility model are: by using two sets of brake pads to fit the brake disc body, by using an internal frame to support and connect the brake pads and the semiconductor refrigeration plate, by using a thermal conductive plate to conduct the temperature of the semiconductor refrigeration plate, by using a connector to connect the external wires, and by using a thermal conductive plate to reduce the cooling temperature of the semiconductor refrigeration plate to cool the brake pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 This is a front view structural diagram of a semiconductor cooling brake disc device of the utility model;

[0019] Figure 2 It is a front view structural schematic diagram of a card cover in a semiconductor cooling type brake disc device of the utility model;

[0020] Figure 3 This is a front side top view of the inner frame of a semiconductor cooling brake disc device of the utility model;

[0021] Figure 4 This is a front view structural diagram of a semiconductor cooling plate in a semiconductor cooling type brake disc device of the utility model;

[0022] In the figure: 100 - card cover, 110 - brake pad, 120 - brake disc body, 130 - ventilation hole, 140 - inner connecting disc;

[0023] 10a-side shell, 10b-clip, 10c-fixing hole, 10d-connecting seat, 10e-thermal conductive plate, 10f-rear mounting seat, 10g-semiconductor cooling plate, 10h-connecting head. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-Figure 4 A semiconductor cooling type brake disc device comprises: a card cover 100, a brake disc body 120 and an inner connecting disc 140, wherein a brake pad 110 is provided inside the card cover 100 for rubbing against the brake disc body 120 and achieving a braking effect;

[0026] A brake disc body 120 for decelerating the tires of the vehicle is disposed inside the two sets of brake pads 110, and a plurality of ventilation holes 130 for ventilation and heat dissipation are disposed inside the brake disc body 120;

[0027] An inner connecting plate 140 for connection is provided on the inner side of the brake disc body 120. The inner connecting plate 140 and the brake disc body 120 are an integrated structure. The front and rear sides of the brake disc body 120 correspond to a group of brake pads 110 respectively in contact with each other. The brake disc body 120 can be braked by using two groups of brake pads 110.

[0028] The card cover 100 includes a side shell 10a, a semiconductor cooling sheet 10g and a connector 10h. A group of buckles 10b for improving the connection effect are provided on both sides of the side shell 10a.

[0029] A group of connecting shells are provided on the rear side of the buckle 10b, and several groups of fixing holes 10c for connection and fixation are provided at the lower end of the inside of the connecting shell. A group of connecting seats 10d for connecting and fixing with the inner frame are provided at the lower ends of the left and right sides of the connecting shell. The brake pad 110 and the semiconductor refrigeration plate 10g can be supported and connected by using the inner frame.

[0030] An inner frame for supporting and connecting the brake pad 110 body is provided inside the two groups of connecting seats 10d, and a group of thermal conductive plates 10e for conducting temperature are provided on both the front and rear sides of the inner frame. The temperature of the semiconductor refrigeration plate 10g can be conducted by using the thermal conductive plates 10e.

[0031] A group of rear mounting seats 10f for mounting the brake pad 110 are provided on the inner side of the thermal conductive plate 10e, and a semiconductor refrigeration plate 10g for cooling the brake pad 110 is provided on the inner side of the side shell 10a. A group of connectors 10h are provided in the middle of the left and right ends of the semiconductor refrigeration plate 10g, and external wires can be connected by using the connectors 10h.

[0032] The side shell 10a is made of a metal material. The side shell 10a and the two groups of buckles 10b are an integrated structure. A group of embedding grooves for interlocking with the buckles 10b are provided on both the front and rear ends and the left and right sides of the inner frame.

[0033] See also Figure 1-Figure 4As the first embodiment of the utility model: In order to solve the problem that when the temperature of the brake pad 110 is too high, its material properties will change, the friction coefficient will decrease, resulting in weakened braking force and extended braking distance, which may cause serious safety hazards in emergency braking. First, when the car uses the brake pad 110 to clamp the brake disc body 120 during braking, the brake pad 110 and the outer surface of the brake disc body 120 slow down the vehicle by increasing the friction. When the brake pad 110 and the brake disc body 120 are frequently used, the brake pad 110 will generate high temperature and cause thermal attenuation of the braking effect. Since the inner side of the semiconductor refrigeration plate 10g is in contact with the thermal conductive plate 10e, the middle position of the thermal conductive plate 10e is embedded with the middle position inside the rear mounting seat 10f, and the inner side of the middle position of the thermal conductive plate 10e is in contact with the brake pad 110, the thermal conductive plate 10e is used to cool the brake pad 110 by the cooling temperature of the semiconductor refrigeration plate 10g, thereby maintaining the stable use of the brake pad 110.

[0034] See also Figure 1-Figure 4 , as the second embodiment of the utility model: based on the description in the above embodiment, further, since a group of connecting shells are provided on the rear side of the buckle 10b, a plurality of fixing holes 10c for connection and fixation are provided at the lower end of the inner part of the connecting shell, and a group of connecting seats 10d for connection and fixation with the inner frame are provided at the lower ends of the left and right sides of the connecting shell. When the maintenance personnel need to replace the semiconductor refrigeration plate 10g, the side shell 10a can effectively protect the semiconductor refrigeration plate 10g while facilitating the maintenance personnel to disassemble and repair it.

[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor cooling brake disc device, comprising: A card cover (100), a brake disc body (120) and an inner connecting disc (140), characterized in that a brake pad (110) is provided inside the card cover (100) for rubbing against the brake disc body (120) and achieving a braking effect; A brake disc body (120) for decelerating the tire of the vehicle is provided inside the two groups of brake pads (110), and a plurality of ventilation holes (130) for ventilation and heat dissipation are provided inside the brake disc body (120); An inner connection plate (140) for connection is provided on the inner side of the brake disc body (120); the inner connection plate (140) and the brake disc body (120) are an integrated structure; the front and rear sides of the brake disc body (120) respectively contact with a group of brake pads (110).

2. A semiconductor cooling brake disc device according to claim 1, characterized in that: The card cover (100) comprises a side shell (10a), a semiconductor cooling sheet (10g) and a connector (10h), and a group of buckles (10b) for improving the connection effect are provided on both left and right sides of the side shell (10a).

3. A semiconductor cooling brake disc device according to claim 2, characterized in that: A group of connection shells are provided at the rear side of the buckle (10b), a plurality of groups of fixing holes (10c) for connection and fixing are provided at the lower end inside the connection shells, and a group of connection seats (10d) for connection and fixing with the inner frame are provided at the lower ends of the left and right sides of the connection shells.

4. A semiconductor cooling brake disc device according to claim 3, characterized in that: A group of inner frames for supporting and connecting the main body of the brake pad (110) are provided inside the two groups of connecting seats (10d), and a group of thermal conductive plates (10e) for conducting temperature are provided on both the front and rear sides of the inner frame.

5. The semiconductor cooling brake disc device according to claim 4, characterized in that: A group of rear mounting seats (10f) for mounting the brake pad (110) are provided on the inner side of the thermal conductive plate (10e), a semiconductor cooling plate (10g) for cooling the brake pad (110) is provided on the inner side of the side shell (10a), and a group of connectors (10h) are provided at the middle position of the left and right ends of the semiconductor cooling plate (10g).

6. The semiconductor cooling type brake disc device according to claim 2, characterized in that: The side shell (10a) is made of a metal material. The side shell (10a) and the two groups of buckles (10b) are an integrated structure. The front and rear ends and the left and right sides of the inner frame are each provided with a group of embedding grooves for interlocking with the buckles (10b).

7. The semiconductor cooling type brake disc device according to claim 5, characterized in that: The inner side of the semiconductor refrigeration plate (10g) contacts the thermal conductive plate (10e), which is made of a metal copper material. The middle position of the thermal conductive plate (10e) is interlocked with the middle position inside the rear mounting seat (10f), and the inner side of the middle position of the thermal conductive plate (10e) contacts the brake pad (110).

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