Circuit board with gold edge

Abstract

The utility model relates to the technical field of circuit board design, and discloses a circuit board with a gold edge, which comprises a circuit board, a hard metal object is arranged on the circuit board, and the gold edge is arranged at a part to be attached to the hard metal object on the circuit board. The application has the advantages of reducing scratch damage to the circuit board and protecting the circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board design, and in particular to a circuit board with a gold edge. Background Art

[0002] Circuit boards are an indispensable part of modern electronic devices. There are many ways to assemble circuit boards in various electronic devices. When assembling some circuit boards, some shielding covers, panel brackets and other hard metal objects need to be attached to the circuit boards. When installing and removing shielding covers and panel brackets many times, it is inevitable that the fitting positions with the circuit boards will be worn and scratched. If the degree of wear is too high, it may cause circuit connection problems or transmission abnormalities. Utility Model Content

[0003] In order to reduce scratch damage to the circuit board and protect the circuit board, the present application provides a circuit board with a gold edge.

[0004] The present application provides a circuit board with a gold edge, which adopts the following technical solution:

[0005] A circuit board with gold edges comprises a circuit board, a hard metal object is arranged on the circuit board, and a gold edge is arranged at a portion of the circuit board to be bonded with the hard metal object.

[0006] By adopting the above technical solution, when installing and disassembling hard metal objects multiple times, the gold edge can be added to play an isolation role, enhance the wear resistance of the circuit board, reduce the wear and scratches on the circuit board to be bonded, thereby protecting the circuit board and reducing the occurrence of circuit connection problems or transmission anomalies; in addition, the gold edge can also effectively control electromagnetic radiation.

[0007] Optionally, the hard metal object includes a panel bracket and a shielding cover; the panel bracket is arranged on one side of the circuit board, and the shielding cover is arranged on the other side of the circuit board; the gold edge is arranged at a position on the circuit board to be attached to the shielding cover or the panel bracket.

[0008] By adopting the above technical solution, when the shielding cover and the panel bracket are installed and disassembled multiple times, the gold edge is added to play an isolation role, enhance the wear resistance of the circuit board, reduce the wear and scratches on the circuit board to be bonded, thereby protecting the circuit board and reducing the occurrence of circuit connection problems or transmission abnormalities.

[0009] Optionally, a gold edge is also provided on the side of the circuit board close to the hard metal object.

[0010] By adopting the above technical solution, other areas of the circuit board are also protected, thereby improving the wear resistance of the circuit board.

[0011] Optionally, the gold edge wraps around the side edge and edges of both side surfaces of the circuit board.

[0012] By adopting the above technical solution, the gold edge can protect the part of the circuit board to be bonded and the side position, thereby improving the structural strength of the circuit board and preventing it from being easily worn by extrusion force and the like during repeated disassembly and assembly.

[0013] Optionally, a plurality of mounting holes are provided on the edge of the circuit board near the side, and an extension portion for covering the circumference of the mounting hole is provided at a position of the gold edge corresponding to the mounting hole, and a fixing hole corresponding to the mounting hole is provided on the extension portion, and fixing parts are provided in the fixing hole and the mounting hole for fixing the gold edge and the circuit board.

[0014] By adopting the above technical solution, an extension portion is provided at the installation hole to ensure the coverage area of ​​the installation part, which is beneficial to ensure the stability of the structure after installation.

[0015] Optionally, a window area is provided on the circuit board at a position corresponding to the gold edge, and the window area is paved with copper.

[0016] By adopting the above technical solution, the copper sheet laid in the window area can be used as a part of the circuit to connect the ground holes on the circuit board to play a role in grounding protection; at the same time, it can also improve the heat dissipation performance. In addition, it also improves the structural strength of the circuit board, can withstand a certain degree of mechanical stress and vibration, and improves the rigidity of the circuit board.

[0017] Optionally, a buffer layer is provided on the surface of the gold edge, and the buffer layer is placed between the gold edge and the panel bracket, and between the gold edge and the shielding cover.

[0018] By adopting the above technical solution, the buffer layer can alleviate impact and wear, further extending the service life of the circuit board.

[0019] Optionally, a plurality of limiting protrusions for limiting the positions of the shielding cover and the panel bracket are arranged on the gold edge.

[0020] By adopting the above technical solution, the shielding cover and the panel bracket can be quickly positioned during installation, which is beneficial to improving the efficiency and quality of installation.

[0021] Optionally, magnetic parts are provided on the gold edge at positions corresponding to the shielding cover and the panel bracket.

[0022] By adopting the above technical solution, the stability of fixing the shielding cover and the panel bracket on the circuit board is improved by means of magnetic attraction.

[0023] To summarize, the present application includes at least one of the following beneficial technical effects: adding a gold edge to the window area where various hard objects such as panel brackets and shielding covers fit the circuit board, so that the shielding cover and panel bracket will only wear on the gold edge during installation and removal, thereby reducing scratches and damage to the circuit board and protecting the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of the circuit board with gold edges.

[0025] Figure 2 This is a front view of the circuit board with a gold edge.

[0026] Figure 3 This is a side view of the circuit board with gold edges.

[0027] Figure 4 This is the back structure of the circuit board with gold edges.

[0028] Figure 5 This is the front layout design of the circuit board with a gold border.

[0029] Figure 6 Layout design for the back side of the circuit board with gold edges.

[0030] Figure 7 The schematic diagram of the structure of a circuit board with a gold edge and a buffer layer is shown.

[0031] Figure 8 A schematic diagram of a structure in which a limited position protrusion is provided for a circuit board with a gold edge.

[0032] Fig. 9 The schematic diagram of the structure of a circuit board with a gold edge and a magnetic component is provided.

[0033] Figure numerals: 1. gold edge; 2. circuit board; 3. panel bracket; 4. shielding cover; 5. mounting hole; 6. fixing hole; 7. fixing piece; 8. window area; 9. copper sheet; 10. buffer layer; 11. limiting protrusion; 12. magnetic piece; 13. extension part. DETAILED DESCRIPTION

[0034] The present application is further described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0035] The embodiment of the present application discloses a circuit board with a gold edge.

[0036] Reference Figures 1 to 4A circuit board with a gold edge includes a circuit board 2 which is in a rectangular shape as a whole. A hard metal object is installed on the side of the circuit board 2. A gold edge 1 is provided on the part of the circuit board 2 to be bonded with the hard metal object to reduce the wear of the circuit board 2 by the hard metal object, which is beneficial to protecting the circuit board 2, thereby ensuring the working stability of the circuit board 2.

[0037] In this embodiment, the hard metal object includes a panel bracket 3 and a shielding cover 4; the panel bracket 3 is installed on one side of the circuit board 2, and the shielding cover 4 is installed on the other side of the circuit board 2. A gold edge 1 is provided at the position on the circuit board 2 where the shielding cover 4 or the panel bracket 3 is to be attached. When the shielding cover 4 and the panel bracket 3 are installed and removed multiple times, the gold edge 1 can play an isolating role, improve the wear resistance of the circuit board 2, reduce the wear and scratches on the position where the circuit board 2 is to be attached, thereby protecting the circuit board 2 and reducing the occurrence of circuit connection problems or transmission abnormalities.

[0038] The side of the circuit board 2 close to the hard metal object is also provided with a gold edge 1. This protects other areas of the circuit board 2 and improves the overall wear resistance of the circuit board 2. The gold edge 1 wraps the side of the circuit board 2 and the edges of the two side surfaces close to the side. The gold edge 1 protects the part to be bonded and the side of the circuit board 2, thereby improving the overall structural strength of the circuit board 2; during repeated disassembly and assembly, the circuit board 2 is not easily worn by extrusion force, friction force, etc.

[0039] A plurality of mounting holes 5 are provided at the edge of the circuit board 2 near the side, for fixing the panel bracket 3 and the shielding cover 4 to the circuit board 2, or for fixing the circuit board 2 to the external structure. An extension 13 for covering the periphery of the mounting hole 5 is provided at the position corresponding to the mounting hole 5 on the gold edge 1, and a fixing hole 6 corresponding to the mounting hole 5 is provided on the extension 13. Fixing parts 7 are installed in the fixing holes 6 and the mounting holes 5, for fixing the panel bracket 3, the shielding cover 4, the gold edge 1 and the circuit board 2. The extension 13 is provided at the mounting hole 5 to ensure the coverage area of ​​the mounting part, which is conducive to ensuring the stability of the structure after installation.

[0040] Reference Figure 5 and Figure 6 , a window area 8 is provided on the circuit board 2 at a position corresponding to the gold edge 1, and the window area 8 is paved with copper foil 9. A window area 8 solder mask is added during the PCB layout stage, and the corresponding layer of copper foil 9 is paved. Figures 5-6, the window area 8 designed for PCB layout will be reflected as a golden ring edge on the circuit board 2 after board making. The golden edge 1 can reduce the wear and scratch of the contact part between other hard objects and the circuit board 2, and protect the circuit of the circuit board 2. The copper sheet 9 laid in the window area 8 can be used as a part of the circuit to connect the ground hole on the circuit board 2 to play a role in grounding protection; at the same time, it can also improve the heat dissipation performance. In addition, it also improves the structural strength of the circuit board 2, can withstand a certain degree of mechanical stress and vibration, and improves the overall rigidity of the circuit board 2.

[0041] Reference Figure 7 In other embodiments, a buffer layer 10 is provided on the surface of the gold edge 1. The buffer layer 10 is made of a high temperature resistant material and is an elastic film. The buffer layer 10 is placed between the gold edge 1 and the panel bracket 3, and between the gold edge 1 and the shielding cover 4, so that the panel bracket 3 and the shielding cover 4 are further buffered by the buffer layer 10 to reduce the impact and wear on the circuit board 2, and further extend the service life of the circuit board 2.

[0042] Reference Figure 8 In other embodiments, the gold edge 1 is provided with a plurality of limiting protrusions 11 for limiting the positions of the shielding cover 4 and the panel bracket 3. The limiting protrusions 11 are hemispherical protrusions and are placed on the sides of the shielding cover 4 and the panel bracket 3. In this embodiment, the limiting protrusions 11 are located on the sides of the shielding cover 4 and the panel bracket 3 along the length direction of the circuit board 2, so that during installation, the shielding cover 4 and the panel bracket 3 are quickly positioned during installation, which is conducive to improving the efficiency and quality of installation.

[0043] Reference Fig. 9 In other embodiments, a magnetic member 12 is provided on the gold edge 1 at a position corresponding to the shielding cover 4 and the panel bracket 3. The magnetic member 12 is configured as a magnetic strip or a magnetic sheet, and does not protrude too high from the surface of the circuit board 2, so that the gap between the circuit board 2 and the hard metal object is not too high. By means of magnetic attraction, it is not necessary to manually hold the hard metal object during installation, which helps to quickly achieve installation and helps to improve the stability of fixing the shielding cover 4 and the panel bracket 3 on the circuit board 2.

[0044] The implementation principle of the circuit board with gold edges in the embodiment of the present application is: when installing and removing hard metal objects such as the shielding cover 4 and the panel bracket 3 for many times, the overall structural strength of the circuit board 2 is improved by adding the gold edge 1. The gold edge 1 plays an isolating role, enhances the wear resistance of the circuit board 2, reduces the wear and scratches on the position to be bonded to the circuit board 2, thereby protecting the circuit board 2 and reducing the occurrence of circuit connection problems or transmission anomalies. In addition, the gold edge 1 can also effectively control electromagnetic radiation and improve the working stability of the circuit board 2.

[0045] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A circuit board with a gold edge, characterized in that: It comprises a circuit board (2), a hard metal object is arranged on the circuit board (2), and a gold edge (1) is arranged at a portion of the circuit board (2) to be bonded with the hard metal object.

2. The circuit board with gold edges according to claim 1, characterized in that: The hard metal object comprises a panel bracket (3) and a shielding cover (4); the panel bracket (3) is arranged on one side of the circuit board (2), and the shielding cover (4) is arranged on the other side of the circuit board (2); and the gold edge (1) is arranged at a position on the circuit board (2) to be bonded to the shielding cover (4) or the panel bracket (3).

3. The circuit board with gold edges according to claim 2, characterized in that: A gold edge (1) is also provided on the side of the circuit board (2) close to the hard metal object.

4. The circuit board with gold edges according to claim 3, characterized in that: The gold edge (1) wraps around the side edge and the edges of both side surfaces of the circuit board (2).

5. The circuit board with gold edges according to claim 4, characterized in that: A plurality of mounting holes (5) are arranged on the edge of the circuit board (2) near the side edge; an extension portion (13) for covering the periphery of the mounting hole (5) is arranged on the position of the gold edge (1) corresponding to the mounting hole (5); a fixing hole (6) corresponding to the mounting hole (5) is opened on the extension portion (13); and fixing members (7) are arranged in the fixing hole (6) and the mounting hole (5) for fixing the gold edge (1) and the circuit board (2).

6. The circuit board with gold edges according to claim 4, characterized in that: A window area (8) is provided on the circuit board (2) at a position corresponding to the gold edge (1), and the window area (8) is paved with copper foil (9).

7. The circuit board with gold edges according to claim 2, characterized in that: A buffer layer (10) is provided on the surface of the gold edge (1), and the buffer layer (10) is placed between the gold edge (1) and the panel bracket (3), and between the gold edge (1) and the shielding cover (4).

8. The circuit board with gold edges according to claim 3, characterized in that: The gold edge (1) is provided with a plurality of limiting protrusions (11) for limiting the positions of the shielding cover (4) and the panel bracket (3).

9. The circuit board with gold edges according to claim 2, characterized in that: A magnetic piece (12) is provided on the gold edge (1) at a position corresponding to the shielding cover (4) and the panel bracket (3).

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