Etching device for TVS (Transient Voltage Suppressor) chip processing

Abstract

The utility model discloses an etching device for TVS (Transient Voltage Suppressor) chip processing, which comprises a shell, an etching tank is arranged on one side in the shell, a drying tank is arranged on one side, far away from the etching tank, in the shell, a first support frame is arranged above one side, close to the etching tank, of the shell, a horizontal transmission assembly is arranged above the first support frame, and a second support frame is arranged above the horizontal transmission assembly. A horizontal transmission assembly is arranged in the etching tank, a vertical transmission assembly is arranged on the horizontal transmission assembly, two connecting rods are arranged on the side, away from the horizontal transmission assembly, of the vertical transmission assembly, a screen frame is arranged below the two connecting rods, a first partition plate is arranged at the lower end in the etching tank, and an ultrasonic generator is arranged below the first partition plate. The etching device is simple in structure, convenient to operate and good in etching effect, the etched TVS chip can be quickly cleaned, meanwhile, the etched TVS chip can be dried, and the processing efficiency of the TVS chip is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of TVS chip processing, in particular to an etching device for TVS chip processing. Background Art

[0002] TVS is a high-efficiency protection device in the form of a diode. When the two poles of a TVS diode are subjected to a reverse transient high-energy impact, it can change the high impedance between the two poles to a low impedance at a speed of 10 to the negative 12th power of seconds, absorbing surge power of up to several kilowatts, and clamping the voltage between the two poles to a predetermined value, effectively protecting the precision components in the electronic circuit from damage by various surge pulses. TVS chips are generally designed to be very small, so they cannot be manually processed like other products. They are generally processed by etching. The existing TVS diodes are not thoroughly cleaned during the post-etching cleaning process. After cleaning, impurities mixed in the cleaning liquid will still adhere to the surface of the semiconductor chip, affecting the cleaning effect of the semiconductor chip cleaning device, and even affecting the quality of semiconductor chip manufacturing. For this reason, we propose an etching device for TVS chip processing. Utility Model Content

[0003] In order to solve the above problems, the utility model provides an etching device for TVS chip processing. The utility model solves the problem that the existing TVS diode is not thoroughly cleaned during the cleaning process after etching, and the impurities mixed in the cleaning liquid after cleaning will still adhere to the surface of the semiconductor chip, affecting the cleaning effect of the semiconductor chip cleaning device and even affecting the quality of semiconductor chip manufacturing.

[0004] An etching device for TVS chip processing in the utility model comprises a shell, an etching groove is provided on one side of the shell, a drying groove is provided on the side of the shell away from the etching groove, a first support frame is provided above the side of the shell close to the etching groove, a horizontal transmission component is provided above the first support frame, a vertical transmission component is provided on the horizontal transmission component, two connecting rods are provided on the side of the vertical transmission component away from the horizontal transmission component, a mesh frame is provided below the two connecting rods, a first partition is provided at the lower end of the etching groove, an ultrasonic generator is provided below the first partition, a second partition is provided at the lower end of the drying groove, two air inlets are provided on the shell below the second partition, a fan is provided on the side of the air inlet in the drying groove, and a plurality of vents arranged in a matrix are provided on the second partition.

[0005] In the above solution, the drying tank is provided with an electric heating pipe below the second partition.

[0006] In the above solution, a filter screen is provided in the air inlet.

[0007] In the above scheme, the horizontal transmission component includes a first mounting frame, which is fixedly connected to the first supporting frame. A first motor is provided on one side of the first mounting frame. The rotating shaft of the first motor passes through the first mounting frame and is fixedly connected to the first threaded rod. A first movable block is provided on the first threaded rod, and the top of the first movable block is fixedly connected to the supporting plate.

[0008] In the above scheme, the vertical transmission component includes a second mounting frame, the second mounting frame is fixedly connected to the support plate, a second motor is provided above the second mounting frame, the second motor rotating shaft passes through the second mounting frame and is fixedly connected to the second threaded rod, a second movable block is provided on the second threaded rod, the second movable block is fixedly connected to the connecting plate, the connecting plate is fixedly connected to the fixed plate on the side away from the second movable block, and the fixed plate is fixedly connected to the connecting rod.

[0009] In the above solution, a second support frame is provided on the upper side of the shell away from the first support frame, a guide rail is provided on the upper side of the second support frame, and a sliding block matching the guide rail is provided on the support plate.

[0010] In the above solution, the etching tank is provided with a drain pipe located above the first partition plate, and a valve is provided on the drain pipe.

[0011] The advantages and beneficial effects of the utility model are as follows: the utility model provides an etching device for TVS chip processing, through the mutual cooperation between the horizontal transmission component and the vertical transmission component, the position of the mesh frame can be adjusted, when the mesh frame with the TVS chip placed inside is located inside the etching tank, the etching liquid inside the etching tank etches the TVS chip, the etched TVS chip can be cleaned by the ultrasonic generator, the airflow enters the drying tank through the air inlet, and the electric heating tube heats the airflow when the airflow passes through the electric heating tube, and the heated airflow can effectively speed up the drying speed of the TVS chip. This etching device has a simple structure, is easy to operate, and has a good etching effect. The etched TVS chip can be quickly cleaned, and the etched TVS chip can be dried at the same time, which effectively improves the processing efficiency of the TVS chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0013] Figure 1 It is a schematic diagram of the structure of the utility model;

[0014] Figure 2 It is a cross-sectional view of the utility model;

[0015] Figure 3 This is a schematic structural diagram of part A of the utility model;

[0016] Figure 4 This is a schematic structural diagram of part B of the utility model.

[0017] In the figure: 1, shell 2, etching tank 3, drying tank 4, first support frame 5, horizontal transmission component 51, first mounting frame 52, first motor 53, first threaded rod 54, first movable block 55, support plate 6, vertical transmission component 61, second mounting frame 62, second motor 63, second threaded rod 64, second movable block 65, connecting plate 66, fixing plate 7, connecting rod 8, mesh frame 9, first partition 10, ultrasonic generator 11, second partition 12, air inlet 13, fan 14, electric heating pipe 15, vent 16, filter 17, second support frame 18, guide rail 19, slider 20, drain pipe 21, valve. DETAILED DESCRIPTION

[0018] The following is a further description of the specific implementation of the present invention in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0019] like Figure 1-4As shown, the utility model is an etching device for TVS chip processing, comprising a shell 1, an etching groove 2 is provided on one side of the shell 1, a drying groove 3 is provided on the side of the shell 1 away from the etching groove 2, a first support frame 4 is provided above the side of the shell 1 close to the etching groove 2, a horizontal transmission component 5 is provided above the first support frame 4, the horizontal transmission component 5 enables the etching device to have a horizontal transmission function, a vertical transmission component 6 is provided on the horizontal transmission component 5, the vertical transmission component 6 enables the etching device to have a vertical transmission function, two connecting rods 7 are provided on the side of the vertical transmission component 6 away from the horizontal transmission component 5, a mesh frame 8 is provided below the two connecting rods 7, the mesh frame 8 can store the TVS chip to be etched, a first baffle 9 is provided at the lower end of the etching groove 2, the An ultrasonic generator 10 is provided under the first partition 9. When the TVS chip is etched in the etching tank 2, the ultrasonic generator 10 works to clean the TVS chip above the first partition 9. A second partition 11 is provided at the lower end of the drying tank 3. The shell 1 is provided with two air inlets 12 below the second partition 11. A fan 13 is provided on one side of the air inlet 12 in the drying tank 3. A plurality of matrix-arranged vents 15 are provided on the second partition 11. Airflow can enter the drying tank 3 through the air inlet 12. When the fan 13 is working, the fan 13 can speed up the flow speed of the airflow inside the air inlet 12. The airflow can be directly blown onto the TVS chip through the vents 15, thereby speeding up the drying speed of the TVS chip through the flow speed of the airflow.

[0020] The drying tank 3 is provided with an electric heating pipe 14 below the second partition plate 11. When the electric heating pipe 14 is working, the electric heating pipe 14 can heat the flowing airflow, thereby effectively accelerating the drying speed of the TVS chip through the flowing hot airflow.

[0021] The air inlet 12 is provided with a filter 16 , and the filter 16 can filter the airflow entering the drying tank 3 .

[0022] The horizontal transmission component 5 includes a first mounting frame 51, which is fixedly connected to the first support frame 4. A first motor 52 is provided on one side of the first mounting frame 51. The rotating shaft of the first motor 52 passes through the first mounting frame 51 and is fixedly connected to the first threaded rod 53. Both ends of the first threaded rod 53 are movably connected to the first mounting frame 51. A first movable block 54 is provided on the first threaded rod 53. The first threaded rod 53 and the first movable block 54 are threadedly connected. The top of the first movable block 54 is fixedly connected to the support plate 55. When the first motor 52 is working, the first motor 52 drives the first threaded rod 53 to rotate, and the first movable block 54 on the first threaded rod 53 can move horizontally on the first threaded rod 53, and the transmission support plate 55 through the first movable block 54 also moves accordingly.

[0023] The vertical transmission component 6 includes a second mounting frame 61, which is fixedly connected to the support plate 55. A second motor 62 is provided above the second mounting frame 61. The rotating shaft of the second motor 62 passes through the second mounting frame 61 and is fixedly connected to the second threaded rod 63. Both ends of the second threaded rod 63 are movably connected to the second mounting frame 61. A second movable block 64 is provided on the second threaded rod 63. The second threaded rod 63 and the second movable block 64 are threadedly connected. The second movable block 64 is fixedly connected to a connecting plate 65. The connecting plate 65 is fixedly connected to a fixed plate 66 on a side away from the second movable block 64. The fixed plate 66 is fixedly connected to a connecting rod 7. When the second motor 62 is working, the second motor 62 drives the second threaded rod 63 to rotate. The second movable block 64 on the second threaded rod 63 can move in the vertical direction on the second threaded rod 63. Through the transmission of the connecting plate 65, the fixed plate 66 and the connecting rod 7, the screen frame 8 can move in the vertical direction.

[0024] A second support frame 17 is provided above the shell 1 on a side away from the first support frame 4, a guide rail 18 is provided above the second support frame 17, a slider 19 matching the guide rail 18 is provided on the support plate 55, and the slider 19 can slide on the guide rail 18. When the support plate 55 moves, the movement stability of the support plate 55 is effectively improved through the mutual cooperation between the slider 19 and the guide rail 18.

[0025] The etching tank 2 is provided with a drain pipe 20 above the first partition plate 9 , and the drain pipe 20 is provided with a valve 21 . The etching liquid in the etching tank 2 can be discharged through the drain pipe 20 , and the valve 21 can control the on-off of the drain pipe 20 .

[0026] Specifically, in the utility model, the horizontal transmission component 5 enables the etching device to have the function of horizontal transmission, and the vertical transmission component 6 enables the etching device to have the function of vertical transmission. Through the mutual cooperation between the horizontal transmission component 5 and the vertical transmission component 6, the position of the mesh frame 8 can be adjusted. When the mesh frame 8 with the TVS chip placed therein is located inside the etching tank 2, the etching liquid inside the etching tank 2 etches the TVS chip. After the etching of the TVS chip is completed, the ultrasonic generator 10 starts to work, so that the etched TVS chip can be cleaned by the ultrasonic generator 10. When the etched TVS chip is located inside the drying tank 3, the fan 13 drives the airflow to flow, and the airflow enters the drying tank 3 through the air inlet 12. When the airflow passes through the electric heating tube 14, the electric heating tube 14 heats the airflow. The heated airflow can effectively accelerate the drying speed of the TVS chip.

[0027] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An etching device for TVS chip processing, comprising a housing (1), characterized in that: An etching tank (2) is provided on one side of the shell (1), a drying tank (3) is provided on the side of the shell (1) away from the etching tank (2), a first support frame (4) is provided above the side of the shell (1) close to the etching tank (2), a horizontal transmission component (5) is provided above the first support frame (4), a vertical transmission component (6) is provided on the horizontal transmission component (5), two connecting rods (7) are provided on the side of the vertical transmission component (6) away from the horizontal transmission component (5), a mesh frame (8) is provided below the two connecting rods (7), a first partition (9) is provided at the lower end of the etching tank (2), an ultrasonic generator (10) is provided below the first partition (9), a second partition (11) is provided at the lower end of the drying tank (3), two air inlets (12) are provided on the shell (1) below the second partition (11), a fan (13) is provided on the side of the air inlet (12) in the drying tank (3), and a plurality of ventilating openings (15) arranged in a matrix are provided on the second partition (11).

2. The etching device for TVS chip processing according to claim 1, characterized in that: The drying tank (3) is provided with an electric heating pipe (14) below the second partition plate (11).

3. The etching device for TVS chip processing according to claim 1, characterized in that: A filter screen (16) is provided in the air inlet (12).

4. The etching device for TVS chip processing according to claim 1, characterized in that: The horizontal transmission assembly (5) comprises a first mounting frame (51), the first mounting frame (51) being fixedly connected to a first support frame (4), a first motor (52) being provided on one side of the first mounting frame (51), a rotating shaft of the first motor (52) passing through the first mounting frame (51) and being fixedly connected to a first threaded rod (53), a first movable block (54) being provided on the first threaded rod (53), and an upper portion of the first movable block (54) being fixedly connected to a support plate (55).

5. The etching device for TVS chip processing according to claim 4, characterized in that: The vertical transmission component (6) comprises a second mounting frame (61), the second mounting frame (61) is fixedly connected to the support plate (55), a second motor (62) is arranged above the second mounting frame (61), a rotating shaft of the second motor (62) passes through the second mounting frame (61) and is fixedly connected to the second threaded rod (63), a second movable block (64) is arranged on the second threaded rod (63), the second movable block (64) is fixedly connected to the connecting plate (65), the connecting plate (65) is fixedly connected to the fixed plate (66) at a side away from the second movable block (64), and the fixed plate (66) is fixedly connected to the connecting rod (7).

6. The etching device for TVS chip processing according to claim 4, characterized in that: A second support frame (17) is provided above the shell (1) and away from the first support frame (4); a guide rail (18) is provided above the second support frame (17); and a sliding block (19) matching the guide rail (18) is provided on the support plate (55).

7. The etching device for TVS chip processing according to claim 1, characterized in that: The etching tank (2) is provided with a drain pipe (20) located above the first partition plate (9), and a valve (21) is provided on the drain pipe (20).

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