Circuit board assembling jig

By designing the connection method between the flip plate and the slide, the processing positions of the flip plate overlap, solving the problem of large space occupancy of circuit board assembly fixtures in the prior art, and achieving more efficient circuit board processing and production line layout.

CN222582673UActive Publication Date: 2025-03-07XIAMEN TENGYINGJIE ELECTRONICS CO LTD
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Patent Information

Application Number
CN202421263840.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-04
Publication Date
2025-03-07
Estimated Expiration
2034-06-04

AI Technical Summary

Technical Problem

The existing circuit board assembly fixture takes up a lot of space when flipping the circuit board, which affects the efficiency of the production line.

Method used

A circuit board assembly fixture is designed, and its flip plate is connected to the slide base. Through the sliding track of the slide base and the flip position design of the flip plate, the first processing position and the second processing position of the flip plate overlap, reducing the height and length of the fixture.

Benefits of technology

It effectively reduces the space occupied by circuit board assembly fixtures, ensures the stability of circuit board processing process, and improves the efficiency of the production line.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of circuit board assembly production, and discloses a circuit board assembly jig, which comprises a bottom plate, a sliding seat and an overturning plate, the sliding seat is slidably arranged on the bottom plate, and the sliding track of the sliding seat comprises a first position and a second position; one side of the turnover plate is rotationally connected with the sliding seat, the turnover plate is supported on the bottom plate and is provided with a containing cavity used for containing and positioning the circuit board, and the inner wall of the containing cavity is provided with a receding opening used for exposing the to-be-machined positions of the front face and the back face of the circuit board; the turnover plate comprises a first processing position and a second processing position, when the turnover plate is at the first processing position, the front surface of the circuit board faces upwards, and the sliding seat is at the first position; and when the overturning plate is overturned to a second processing position around the sliding seat, the back surface of the circuit board faces upwards, the sliding seat slides to the second position, and the first processing position and the second processing position are overlapped. The circuit board assembling jig provided by the utility model can solve the problem of how to reduce the occupied space of the jig on the premise of not influencing the stability of the circuit board processing process.
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Description

Technical Field

[0001] The utility model relates to the field of printed circuit board assembly production, and particularly relates to a printed circuit board assembly jig. Background Art

[0002] A printed circuit board is a carrier for electronic components. During the assembly production process of a printed circuit board, it is generally necessary to flip the printed circuit board to perform processing operations on the front and back of the printed circuit board in sequence. Currently, during the assembly production of printed circuit boards, printed circuit board assembly jigs are often used to flip the printed circuit boards, effectively reducing the risk of damage to the printed circuit boards during the flipping process.

[0003] In the prior art, a printed circuit board assembly jig includes a base, two sliding plates, and two flipping components. The flipping component includes a rotating rod, a U-shaped block, and a positioning plate. The sliding plate is slidably disposed on the base, the rotating rod is rotatably connected to the sliding plate, the U-shaped blocks of the two flipping components are respectively fixedly connected to one end of the two rotating rods facing each other, and the positioning plate is detachably connected to the U-shaped block. When using this printed circuit board production jig, first slide the sliding plate, place both sides of the printed circuit board into the two U-shaped blocks respectively, then use the positioning plate to clamp and fix the printed circuit board and the U-shaped block. Then, rotate the rotating rod to flip the printed circuit board by 180° so as to perform processing operations on the front and back of the printed circuit board.

[0004] In order to ensure the stability of the printed circuit board processing process, the U-shaped block is fixedly connected to the middle position of the side of the printed circuit board. Therefore, during the flipping process of the printed circuit board around the sliding plate, one side of it flips towards the direction close to the base, and the other side flips towards the direction away from the base. In order to avoid interference between the printed circuit board and the base, a flipping space needs to be provided between the flipping component (U-shaped block) and the base for one side of the printed circuit board to flip towards the base, resulting in a relatively large overall occupied space of this printed circuit board production jig. Summary of the Utility Model

[0005] (1) Technical Problems to be Solved

[0006] The utility model provides a printed circuit board assembly jig, which can at least solve the technical problem of how to reduce the occupied space of the jig without affecting the stability of the printed circuit board processing process.

[0007] (2) Technical Solutions

[0008] To solve the above technical problems, the utility model provides the following technical solutions: A printed circuit board assembly jig includes:

[0009] A bottom plate;

[0010] A sliding seat, slidably disposed on the bottom plate, and the sliding track of the sliding seat includes a first position and a second position;

[0011] A flip plate, one side of which is rotatably connected to the slide seat, and the flip plate is supported on the bottom plate, and is provided with a receiving cavity for receiving and positioning the circuit board, and a clearance opening is provided on the inner wall of the receiving cavity, and the clearance opening is used to expose the positions to be processed on the front and back sides of the circuit board;

[0012] Among them, the flip plate includes a first processing position and a second processing position. When the flip plate is in the first processing position, the front side of the circuit board faces upward and the slide is in the first position. When the flip plate flips from the first processing position to the second processing position around the slide, the back side of the circuit board faces upward, and the slide slides from the first position to the second position, and the first processing position and the second processing position overlap.

[0013] It is further provided that the aforementioned flip plate includes a shielding portion, and the shielding portion is used to cover the outside of the electronic components of the circuit board.

[0014] Further, the aforementioned flip plate includes:

[0015] A carrier plate, one side of which is rotatably connected to the slide seat, and the carrier plate is supported on the bottom plate and is provided with a receiving groove;

[0016] The baffle is rotatably connected to the carrier plate and connected to the carrier plate through a detachable structure. The baffle and the receiving groove of the carrier plate are combined to form a receiving cavity. The baffle and the bottom of the receiving groove are both provided with a yielding opening, and the shielding part is located on the baffle.

[0017] It is further configured that the aforementioned detachable structure includes a rotating part and an abutting part that are integrally connected. The rotating part is rotatably connected to the carrier plate and is used to link the abutting part to rotate toward or away from the baffle. The abutting part rotates toward the baffle and abuts against the baffle to fix the baffle and the carrier plate.

[0018] It is further provided that the aforementioned baffle includes a positioning portion, and when the baffle is connected to the carrier through a detachable structure, the positioning portion is tightly abutted against the circuit board to fix the circuit board in the accommodating cavity and keep the electronic components away from the shielding portion.

[0019] It is further provided that the aforementioned flip plate also includes a positioning plate, which is screwed into the receiving groove to fix the circuit board between the positioning plate and the groove bottom of the receiving groove and keep the electronic components away from the shielding portion.

[0020] It is further arranged that a first support block and a second support block are respectively provided on both sides of the top of the aforementioned base plate; wherein, when the flip plate is in the first processing position, the flip plate is supported on the first support block and is horizontally arranged, and when the flip plate is in the second processing position, the flip plate is supported on the second support block and is horizontally arranged.

[0021] It is further provided that the aforementioned flip plate is provided with a handle for driving the flip plate to flip and slide.

[0022] (III) Beneficial effects

[0023] Compared with the prior art, the circuit board assembly jig provided by the utility model has the following beneficial effects:

[0024] 1. Before the circuit board assembly jig provided by the utility model is used, the flip plate is in the first processing position and the slide is in the first position. When in use, the circuit board to be processed is first positioned in the accommodating cavity of the flip plate. At this time, the front side of the circuit board faces upward, and the processing operation is performed on the exposed position to be processed on the front side of the circuit board through the clearance opening. After the front side of the circuit board is processed, the flip plate is flipped around the slide from the first processing position to the second processing position, and the slide slides from the first position to the second position. At this time, the back side of the circuit board faces upward, and the processing operation is performed on the exposed position to be processed on the back side of the circuit board through the clearance opening. Finally, the flip plate is flipped in the opposite direction around the slide, and flipped back from the second processing position to the first processing position, and the slide slides back from the second position to the first position. Finally, the processed circuit board is removed from the flip plate. In this way, one side of the flip plate of the circuit board assembly jig is rotatably connected to the slide, and the other side can be flipped around the slide in a direction away from the base plate to the first processing position or the second processing position. There is no need to set a flipping space between the rotating connection of the flip plate and the base plate, thereby ensuring that the flip plate does not interfere with the base plate during the flipping process. Compared with the existing circuit board assembly jig, the height of the circuit board assembly jig is effectively reduced, and the slide slides while the flip plate flips, so that the first processing position and the second processing position of the flip plate overlap, and there is no need to extend the length or width of the circuit board assembly jig, thereby reducing the overall occupied space of the circuit board assembly jig.

[0025] 2. When the flip board is in the first processing position or the second processing position, support is provided by the bottom plate and the slide seat slidably connected to the bottom plate, thereby ensuring the stability of the circuit board processing process.

[0026] In summary, compared with the existing circuit board assembly jig, the circuit board assembly jig can reduce the space occupied by the jig without affecting the stability of the circuit board processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional diagram of the circuit board assembly jig in the embodiment in the first processing position;

[0028] Figure 2 A three-dimensional diagram of the circuit board assembly jig in the embodiment with the baffle open;

[0029] Figure 3 A three-dimensional diagram of the circuit board assembly jig in the embodiment in a flipping and sliding state;

[0030] Figure 4 It is a three-dimensional diagram of the circuit board assembly jig in the embodiment in the second processing position.

[0031] Figure Number:

[0032] 1. Bottom plate; 11. First support block; 12. Second support block;

[0033] 2. Sliding seat;

[0034] 3. flip plate; 31. carrier plate; 311. receiving groove; 32. baffle plate; 321. shielding portion; 33. receiving cavity; 34. clearance opening; 35. positioning plate; 36. first side; 37. second side; 38. support column; 39. handle;

[0035] 4. Removable structure; 41. Rotating portion; 42. Abutting portion. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by conventional technicians in this field without creative work are within the scope of protection of the utility model.

[0037] The utility model provides a circuit board assembly jig, which is used to solve the problem of how to reduce the occupied space of the jig without affecting the stability of the circuit board processing process.

[0038] See also Figure 1 and Figure 4 As shown, Figure 1 This is a three-dimensional diagram of the circuit board assembly jig in the embodiment in the first processing position. Figure 4 1 is a three-dimensional diagram of a circuit board assembly jig in an embodiment in a second processing position. The circuit board assembly jig further includes a base plate 1 , a slide seat 2 and a flip plate 3 .

[0039] The slide seat 2 is slidably connected to the base plate 1 via a guide rail or a slide groove, and a sliding track of the slide seat 2 includes a first position and a second position.

[0040] One side of the flip plate 3 is rotatably connected to the slide 2 by a rotating shaft or hinge, and the flip plate 3 is supported on the bottom plate 1. The flip plate 3 has a receiving cavity 33 for receiving and positioning the circuit board, and the inner wall of the receiving cavity 33 has a clearance opening 34, which is used to expose the positions to be processed on the front and back sides of the circuit board.

[0041] Among them, the flip plate 3 includes a first processing position and a second processing position. When the flip plate 3 is in the first processing position, the front side of the circuit board faces upward and the slide 2 is in the first position. When the flip plate 3 flips around the slide 2 from the first processing position to the second processing position, the back side of the circuit board faces upward, and the slide 2 slides from the first position to the second position, and the first processing position and the second processing position overlap.

[0042] Before the circuit board assembly jig provided by the above technical solution is used, the flip plate 3 is in the first processing position, and the slide seat 2 is in the first position. Figure 1 As shown, when in use, the circuit board to be processed is first fixed in the accommodating cavity 33 of the flip plate 3. At this time, the front side of the circuit board to be processed faces upward, and the processing operation can be performed on the exposed position of the front side of the circuit board to be processed through the clearance opening 34. Figure 3 As shown, Figure 3 : is a three-dimensional diagram of the circuit board assembly jig in the embodiment in a flipping and sliding state (the solid arrow in the figure is the rotation direction of the flip plate 3, and the dotted arrow is the sliding direction of the slide 2). The flip plate 3 flips 180° counterclockwise around the slide 2, flipping from the first processing position to the second processing position, and the slide 2 slides from the first position to the second position. At this time, the back of the circuit board to be processed faces upward, as shown in FIG. Figure 4 As shown, the exposed processing position on the back of the circuit board to be processed can be processed through the clearance opening 34. After the back of the circuit board is processed, the flip plate 3 flips 180° clockwise around the slide 2, flips from the second processing position to the first processing position, and the slide 2 slides back from the second position to the first position. Finally, the processed circuit board is removed from the flip plate 3. In this way, one side of the flip plate 3 of the circuit board assembly jig is rotatably connected to the slide 2, and the other side can be flipped around the slide 2 in a direction away from the bottom plate 1 to the first processing position or the second processing position. There is no need to set a flipping space between the rotating connection of the flip plate 3 and the bottom plate 1, which can ensure that the flip plate 3 does not interfere with the bottom plate 1 during the flipping process. Compared with the existing circuit board assembly jig, the height of the circuit board assembly jig is effectively reduced, and the slide 2 slides while the flip plate 3 flips, so that the first processing position and the second processing position of the flip plate 3 overlap, and there is no need to extend the length or width of the circuit board assembly jig, thereby reducing the overall occupied space of the circuit board assembly jig. When the flip plate 3 of the circuit board assembly jig is in the first processing position or the second processing position, support is provided by the base plate 1 and the slide seat 2 slidably connected to the base plate 1, thereby ensuring the stability of the circuit board processing process. In summary, compared with the existing circuit board assembly jig, the circuit board assembly jig can reduce the occupied space of the jig without affecting the stability of the circuit board processing process.

[0043] The above-mentioned flip plate 3 can be marked with information such as the operation sequence and operation requirements of each process of processing the circuit board, and the marked information of each process can be located at the operation position corresponding to each process, so as to conveniently instruct and guide the staff to process the circuit boards in a standardized sequence and requirements, thereby improving the processing efficiency and processing quality of the circuit boards.

[0044] See also Figure 2 As shown, Figure 2 This is a three-dimensional diagram of the circuit board assembly jig in the embodiment in the state where the baffle is opened. In one embodiment of the flip plate 3, the flip plate 3 includes a shielding portion 321, and the shielding portion 321 is used to cover the outside of the electronic components of the circuit board. In this way, when the staff processes the front and back of the circuit board through the clearance opening 34, they may accidentally touch the surrounding electronic components due to unskilled operation, fatigue, etc., resulting in problems such as damage to the electronic components or loose connections. The circuit board assembly jig can protect the electronic components on the circuit board from being touched during the assembly process through the shielding portion 321.

[0045] See also Figure 1 and Figure 2 As shown, in one embodiment of the flip plate 3, the flip plate 3 includes a carrier plate 31 and a baffle plate 32, one side of the carrier plate 31 is rotatably connected to the slide 2 by a rotating shaft or hinge, and the carrier plate 31 is supported on the bottom plate 1. The carrier plate 31 has a receiving groove 311. The baffle plate 32 is rotatably connected to the carrier plate 31 by a rotating shaft or hinge, and is connected to the carrier plate 31 by a detachable structure 4. The baffle plate 32 and the receiving groove 311 of the carrier plate 31 are combined to form a receiving cavity 33. The baffle plate 32 and the bottom of the receiving groove 311 both have a clearance opening 34, and the shielding portion 321 is located on the baffle plate 32. In this way, the flip plate 3 can carry the circuit board through the carrier plate 31, and the receiving groove 311 can be rotated to close or open through the baffle plate 32, so that the circuit board to be processed is enclosed in the receiving groove 311 for processing, or the processed circuit board is taken out of the receiving groove 311 and replaced with the next circuit board to be processed.

[0046] See also Figure 1 and Figure 2 As shown, in one embodiment of the detachable structure 4, the detachable structure 4 includes an integrally connected rotating portion 41 and abutting portion 42, the rotating portion 41 is rotatably connected to the carrier plate 31, and is used to link the abutting portion 42 to rotate toward or away from the baffle 32, the abutting portion 42 rotates toward the baffle 32 and abuts against the baffle 32, pressing the baffle 32 against the carrier plate 31, thereby fixing the baffle 32 and the carrier plate 31. In this way, the detachable structure 4 can quickly disassemble one side of the carrier plate 31 and the baffle 32 by rotating the abutting portion 42 toward or away from the baffle 32, which is simple to operate, saves time, and improves work efficiency.

[0047] In one embodiment of fixing the circuit board and the flip plate 3, the baffle 32 includes a positioning portion (not shown in the figure). When the baffle 32 is connected to the carrier 31 through the detachable structure 4, the positioning portion is in close contact with the circuit board to fix the circuit board in the accommodating cavity 33 and keep the electronic components on the front of the circuit board away from the shielding portion 321. In this way, while the baffle 32 and the carrier 31 are fixed by the detachable structure 4, the positioning portion can fix the position of the circuit board in the accommodating cavity 33. This method of fixing the circuit board and the flip plate 3 does not require additional operations and can improve work efficiency. In addition, while the positioning portion fixes the circuit board in the accommodating cavity 33, the electronic components on the front of the circuit board are prevented from contacting the shielding portion 321, so as to prevent the circuit board from moving during the process of flipping the flip plate 3 to the back side facing up, causing the electronic components to collide with the shielding portion 321, thereby affecting the quality of the electronic components.

[0048] The positioning portion may be made of elastic material, which can further protect the circuit board from damage.

[0049] See also Figure 2 As shown, in one embodiment of fixing the circuit board and the flip plate 3, the flip plate 3 further includes a positioning plate 35, which is screwed into the receiving groove 311 to fix the circuit board between the positioning plate 35 and the bottom of the receiving groove 311, and to keep the electronic components on the front of the circuit board away from the shielding portion 321. In this way, the screwing member for screwing the positioning plate 35 can penetrate the existing connection hole on the circuit board to fix the positioning plate 35 in the receiving groove 311 of the carrier 31, and then fix the circuit board between the positioning plate 35 and the bottom of the receiving groove 311. This method of fixing the circuit board and the flip plate 3 has a better reinforcement effect than the previous one, and can also prevent the baffle 32 from being installed incorrectly, resulting in the circuit board falling off. In addition, when the positioning plate 35 fixes the circuit board in the receiving groove 311, the electronic components on the front of the circuit board can be prevented from contacting the shielding portion 321, so as to prevent the circuit board from moving during the process of flipping the flip plate 3 to the back side facing up, causing the electronic components to collide with the shielding portion 321, thereby affecting the quality of the electronic components.

[0050] The positioning plate 35 can be made of elastic material, metal, plastic or other materials.

[0051] See also Figure 1 and Figure 4As shown, in one embodiment of the bottom plate 1, the top of the bottom plate 1 is fixedly connected with a first support block 11 and a second support block 12 by welding or bonding, and the first support block 11 and the second support block 12 are respectively located on both sides of the top of the bottom plate 1. Among them, when the flip plate 3 is in the first processing position, the flip plate 3 is supported on the first support block 11, and the flip plate 3 is horizontally distributed. When the flip plate 3 is in the second processing position, the flip plate 3 is supported on the second support block 12, and the flip plate 3 is horizontally distributed. In this way, no matter whether the flip plate 3 is flipped to the first processing position or the second processing position, the flip plate 3 can be supported on the bottom plate 1, and the first support block 11 and the second support block 12 can make the flip plate 3 and the circuit board thereon distributed horizontally, so as to process the front and back sides of the circuit board.

[0052] There are at least two first supporting blocks 11 and second supporting blocks 12 , two of which support two ends of the flip plate 3 respectively, thereby ensuring the stability of the circuit board processing process.

[0053] In this embodiment, the carrier plate 31 includes a first side 36 and a second side 37, and the first side 36 is hinged to the slide 2; when the flip plate 3 is in the first processing position, the second side 37 is supported on the first support block 11; when the second side 37 of the flip plate 3 is turned 180° counterclockwise around the slide 2 toward the first side 36 to the second processing position, the first side 36 slides together with the slide 2 toward the second side 37, so that the second side 37 is supported on the second support block 12. One side of the baffle plate 32 is hinged to the second side 37 of the carrier plate 31, and the other side of the baffle plate 32 is connected to the first side 36 of the carrier plate 31 through a detachable structure 4.

[0054] See also Figure 4 As shown, on the basis of the above-mentioned embodiment, a support column 38 is fixedly connected to the carrier board 31 by welding, bonding or screwing, and the support column 38 is installed near the position where the carrier board 31 needs to be screwed to the positioning plate 35 and / or the central position of the carrier board 31. Since at least two connection holes are required for the carrier board 31 to be screwed to the positioning plate 35, and the positions of the connection holes are relatively concentrated, the structural strength of this position of the carrier board 31 is relatively low, and it is easy to be deformed by force during the screwing process of the positioning plate 35, which may affect the quality of the circuit board. The central position of the carrier board 31 is also more likely to be deformed by force than other positions, which may also affect the quality of the circuit board. Therefore, the support column 38 can improve the structural strength near the position where the carrier board 31 needs to be screwed to the positioning plate 35 and / or the central position of the carrier board 31, thereby reducing the risk of the carrier board 31 being deformed by force during the screwing process of the positioning plate 35, which affects the quality of the circuit board.

[0055] See also Figure 1 and Figure 4As shown, in one embodiment of the flip plate 3, a handle 39 is installed on the flip plate 3 by screwing, bonding or welding, etc., for driving the flip plate 3 to flip and slide. In this way, the handle 39 can facilitate the staff to manually flip and slide the flip plate 3 quickly, so that the front or back of the circuit board faces upward for processing.

[0056] In this embodiment, the handle 39 is located on the second side 37 of the carrier 31 .

[0057] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board assembly jig, characterized in that: include: Base plate; A slide seat, slidably disposed on the bottom plate, wherein a sliding track of the slide seat includes a first position and a second position; A flip plate, one side of which is rotatably connected to the slide seat, and the flip plate is supported on the bottom plate, and is provided with a receiving cavity for receiving and positioning the circuit board, and a clearance opening is provided on the inner wall of the receiving cavity, and the clearance opening is used to expose the positions to be processed on the front and back sides of the circuit board; Wherein, the flip plate includes a first processing position and a second processing position. When the flip plate is in the first processing position, the front side of the circuit board faces upward, and the slide is in the first position. When the flip plate flips from the first processing position to the second processing position around the slide, the back side of the circuit board faces upward, and the slide slides from the first position to the second position, and the first processing position and the second processing position overlap.

2. A circuit board assembly jig according to claim 1, characterized in that: The flip plate includes a shielding portion, and the shielding portion is used to cover the outside of the electronic components of the circuit board.

3. A circuit board assembly jig according to claim 2, characterized in that: The flip plate comprises: A carrier plate, one side of which is rotatably connected to the slide seat, and the carrier plate is supported on the bottom plate and is provided with a receiving groove; The baffle is rotatably connected to the carrier plate and connected to the carrier plate through a detachable structure. The baffle and the receiving groove of the carrier plate are combined to form the receiving cavity. The baffle and the bottom of the receiving groove are both provided with the yielding opening, and the shielding portion is located on the baffle.

4. A circuit board assembly jig according to claim 3, characterized in that: The detachable structure includes a rotating part and an abutting part which are integrally connected. The rotating part is rotatably connected to the carrier plate and is used to link the abutting part to rotate toward or away from the baffle. The abutting part rotates toward the baffle and abuts against the baffle to fix the baffle and the carrier plate.

5. The circuit board assembly jig according to claim 3, characterized in that: The baffle includes a positioning portion. When the baffle is connected to the carrier through the detachable structure, the positioning portion is in close contact with the circuit board to fix the circuit board in the accommodating cavity and keep the electronic component away from the shielding portion.

6. The circuit board assembly jig according to claim 3, characterized in that: The flip plate also includes a positioning plate, which is screwed into the receiving groove to fix the circuit board between the positioning plate and the groove bottom of the receiving groove and keep the electronic component away from the shielding part.

7. The circuit board assembly jig according to claim 1, characterized in that: A first support block and a second support block are respectively provided on both sides of the top of the base plate; wherein, when the flip plate is in the first processing position, the flip plate is supported on the first support block and is horizontally arranged, and when the flip plate is in the second processing position, the flip plate is supported on the second support block and is horizontally arranged.

8. The circuit board assembly jig according to claim 1, characterized in that: The flip plate is provided with a handle for driving the flip plate to flip and slide.