Circuit board and terminal

Abstract

A circuit board and a terminal, the circuit board comprising: a surface layer structure comprising a first surface layer and a second surface layer opposite to each other; the inner layer structure is arranged between the first surface layer and the second surface layer, and the inner layer structure comprises one or more first radio frequency line layers; the first device and the second device are arranged on the first surface layer in a penetrating mode, and signals of the first device and signals of the second device are transmitted in the same first radio frequency line layer. According to the invention, the attenuation and reflection of the radio frequency signal caused by the via hole can be avoided, and the transmission quality of the radio frequency signal is improved.

Description

Technical Field

[0001] The present application relates to the field of radio frequency communication technology, and more specifically to a circuit board and a terminal. Background Art

[0002] With the development of smart cars and electronic devices, the functions of electrical products are becoming more and more complex, the transmission and reception rates of RF signals are getting higher and higher, and the rising edge of the signal is getting shorter and shorter. It is more and more important to design interconnection routing transmission with less crosstalk. The anti-interference setting of RF signals during transmission on printed circuit boards has become a crucial link in electronic equipment.

[0003] Related technology summary: When radio frequency signals are transmitted on a printed circuit board, there are two forms: one is a microstrip line transmitted on the surface of the printed circuit board, and the other is a stripline transmitted on the inner layer of the printed circuit board.

[0004] For the microstrip line transmitted on the surface of the printed circuit board, the microstrip line is located on the top layer of the printed circuit board. Since there is air above the top layer and PP (glass fiber cloth) below, this asymmetric reference medium will cause the relative capacitive coupling to change greatly when the RF signal propagates on the top layer. The RF signal will be affected by serious inductive coupling noise during transmission, which will cause far-end crosstalk. The far-end crosstalk has a serious impact on the transmission quality of the RF signal and will also cause systemic working problems in the product.

[0005] For the strip lines transmitted on the inner layer of the printed circuit board, since the chip is soldered on the surface of the printed circuit board, the pins of the chip are fanned out and connected to the inner layer through vias, and the RF signal is transmitted on the inner layer and then transmitted to other chip pins through vias; or the RF signal is transmitted to other connector pins through vias, and the RF signal on the chip can only be transmitted on the inner layer of the printed circuit board through vias. In this process, the RF signal is attenuated and reflected at the vias, which in turn affects the quality of the RF signal.

[0006] In view of the above technical problems, the present application provides a new circuit board and terminal. Utility Model Content

[0007] The present application is proposed to solve at least one of the above problems. According to one aspect of the present application, a circuit board is provided, comprising: a surface structure, the surface structure comprising a first surface layer and a second surface layer relative to each other; an inner layer structure, arranged between the first surface layer and the second surface layer, the inner layer structure comprising one or more first radio frequency line layers; a first device and a second device, the first device and the second device being arranged through the first surface layer, and the signals of the first device and the second device being transmitted on the same first radio frequency line layer.

[0008] In some embodiments of the present application, a first empty area and a second empty area are provided on the circuit board, penetrating at least the first surface layer, the first device is provided in the first empty area, and the second device is provided in the second empty area.

[0009] In some embodiments of the present application, the pins of the first device and the pins of the second device are arranged on the same first radio frequency line layer.

[0010] In some embodiments of the present application, the same first radio frequency line layer where the pins of the first device and the pins of the second device are located has opposite first and second surfaces, and the first and second surfaces are provided with reference dielectric layers of the same material.

[0011] In some embodiments of the present application, the reference medium layer located on the first surface is evenly distributed on the first surface, and / or the reference medium layer located on the second surface is evenly distributed on the second surface.

[0012] In some embodiments of the present application, a second radio frequency line layer is disposed in both the first surface layer and the second surface layer, and the second radio frequency line layer in the first surface layer is grounded.

[0013] In some embodiments of the present application, a plurality of the first radio frequency line layers are stacked up and down, and there is a gap between two adjacent first radio frequency line layers.

[0014] In some embodiments of the present application, the same first radio frequency line layer where the pins of the first device and the pins of the second device are located is the first radio frequency line layer closest to the first surface layer among multiple first radio frequency line layers.

[0015] In some embodiments of the present application, the second radio frequency line layer is a microstrip line layer, and the first radio frequency line layer is a stripline layer.

[0016] In some embodiments of the present application, the first device is a first chip, and the second device is a second chip; or, the first device is a chip, and the second device is a connector.

[0017] According to another aspect of the present application, a terminal is provided, and the terminal includes any one of the circuit boards described above.

[0018] In some embodiments of the present application, the terminal includes a vehicle.

[0019] According to the circuit board and terminal of the embodiment of the present application, by transmitting the signals of the first device and the second device on the same first RF line layer, the RF signal does not need to pass through a via when being transmitted between the first device and the second device, thereby avoiding attenuation and reflection of the RF signal caused by the via, thereby improving the transmission quality of the RF signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0021] Figure 1 A schematic structural diagram of a circuit board provided in the related art is shown.

[0022] Figure 2 A schematic structural diagram of another circuit board provided in the related art is shown.

[0023] Figure 3 A schematic structural diagram of a circuit board provided according to an embodiment of the present application is shown.

[0024] Figure 4 A top view of a circuit board provided according to an embodiment of the present application is shown.

[0025] In the attached figure:

[0026] 100 circuit boards;

[0027] 111 second radio frequency line layer;

[0028] 121 first RF line layer;

[0029] 131 reference dielectric layer;

[0030] 141 First Chip;

[0031] 142 second chip;

[0032] 143 connector;

[0033] 151 Copper clad laminate. DETAILED DESCRIPTION

[0034] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0035] It should be understood that the present application can be implemented in different forms and should not be construed as being limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present application to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0036] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part.

[0037] Spatially relative terms such as "under," "below," "below," "under," "above," "above," etc., may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatially relative terms are intended to include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "on" the other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0038] Related technologies summarize that when RF signals are transmitted on a printed circuit board, there are two forms: one is that the RF signal is transmitted in the microstrip line on the surface of the printed circuit board, and the other is that the RF signal is transmitted in the strip line on the inner layer of the printed circuit board.

[0039] like Figure 1 As shown, a printed circuit board is provided, which includes L1 layer, L2 layer, L3 layer, L4 layer, L5 layer, L6 layer, L7 layer and L8 layer, wherein L1 layer is the upper surface layer (also referred to as the top layer or top layer) of the printed circuit board, L1 layer is a microstrip line layer, L8 layer is the lower surface layer (also referred to as the bottom layer or bottom layer) of the printed circuit board, L2 layer, L3 layer, L4 layer, L5 layer, L6 layer and L7 layer are the inner layer structure of the printed circuit board, and each inner layer is a strip line layer. In the printed circuit board, devices (such as chips, connectors, etc.) are soldered on the top layer of the printed circuit board, and the pins of the devices are directly connected to the microstrip lines of the top layer. Since there is air above the top layer and a PP layer (i.e., glass fiber cloth) below the top layer, the asymmetric reference dielectric material will cause a large change in the relative capacitive coupling when the RF signal propagates in the top layer. The RF signal will be severely affected by inductive coupling noise during transmission, which will cause far-end crosstalk. The far-end crosstalk has a serious impact on the transmission quality of the RF signal and will also cause systemic working problems in the product.

[0040] like Figure 2 As shown, a printed circuit board is provided, which includes L1 layer, L2 layer, L3 layer, L4 layer, L5 layer, L6 layer, L7 layer and L8 layer, wherein L1 layer is the upper surface layer (also referred to as the top layer or top layer) of the printed circuit board, L1 layer is a microstrip line layer, L8 layer is the lower surface layer (also referred to as the bottom layer or bottom layer) of the printed circuit board, L2 layer, L3 layer, L4 layer, L5 layer, L6 layer and L7 layer are the inner layer structure of the printed circuit board, and each inner layer is a stripline layer. In the printed circuit board, two devices (such as chips, connectors, etc.) are soldered on the top layer of the printed circuit board, and the pins of the two devices are respectively connected to the stripline of one of the inner layers (such as the L3 layer shown in the figure) through vias. When the radio frequency signal is transmitted between the two devices, the pin of one device is first transmitted to the inner layer through the via, and the radio frequency signal is transmitted in the inner layer, and then transmitted to the pin of the other device through the via. During this process, the RF signal is attenuated and reflected at the via, which in turn affects the quality of the RF signal.

[0041] In order to solve at least one of the above problems, the present application provides a circuit board, which includes: a surface structure, the surface structure includes a first surface layer and a second surface layer relative to each other; an inner layer structure, arranged between the first surface layer and the second surface layer, the inner layer structure includes one or more first radio frequency line layers; a first device and a second device, the first device and the second device are penetrated through the first surface layer, and the signals of the first device and the second device are transmitted on the same first radio frequency line layer.

[0042] According to the circuit board of the present application, by transmitting the signals of the first device and the second device on the same first RF line layer, the RF signal does not need to pass through a via when being transmitted between the first device and the second device, thereby avoiding attenuation and reflection of the RF signal caused by the via, thereby improving the transmission quality of the RF signal.

[0043] In order to thoroughly understand the present application, a detailed structure will be presented in the following description to illustrate the technical solution proposed by the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0044] Reference below Figure 3 and Figure 4 A circuit board 100 according to an embodiment of the present application is described. The circuit board 100 provided in the embodiment of the present application includes: a surface structure, the surface structure includes a first surface layer and a second surface layer relative to each other, and the first surface layer and the second surface layer are both provided with a first radio frequency line layer 111; an inner layer structure, arranged between the first surface layer and the second surface layer, and the inner layer structure includes one or more first radio frequency line layers 121; a first device and a second device, the first device and the second device are penetrated through the first surface layer, and the signals of the first device and the second device are transmitted in the same first radio frequency line layer 121.

[0045] Among them, the first surface layer can be called the upper surface layer of the circuit board 100 (also called the top layer or top layer), and the first surface layer can be called the lower surface layer of the circuit board 100 (also called the bottom layer or bottom layer).

[0046] Taking a first RF line layer 121 provided between the first surface layer and the second surface layer as an example, the first device and the second device are provided through the first surface layer, and the pins of the first device and the pins of the second device are both provided in the first RF line layer 121, so as to realize the transmission of the signals of the first device and the second device in the same first RF line layer 121. Of course, the transmission of the signals of the first device and the second device in the same first RF line layer 121 can also be realized by other methods, which are not limited to this. When the RF signal is transmitted between the first device and the second device, the RF signal is directly transmitted from the pin of one device to the first RF line layer 121, the RF signal is transmitted in the first RF line layer 121, and then directly transmitted from the first RF line layer 121 to the pin of another device. The RF signal does not need to pass through the via during the transmission process, thereby avoiding the attenuation and reflection of the RF signal caused by the via, thereby improving the transmission quality of the RF signal.

[0047] Taking the case where a plurality of first RF line layers 121 are provided between the first surface layer and the second surface layer as an example, the first device and the second device are provided through the first surface layer, and the pin of the first device and the pin of the second device are provided on the same first RF line layer 121 among the plurality of first RF line layers 121, so as to realize the transmission of the signals of the first device and the second device on the same first RF line layer 121. Of course, the transmission of the signals of the first device and the second device on the same first RF line layer 121 can also be realized by other methods, which are not limited to this. When the RF signal is transmitted between the first device and the second device, the RF signal is directly transmitted from the pin of one device to the first RF line layer 121, the RF signal is transmitted within the first RF line layer 121, and then directly transmitted from the first RF line layer 121 to the pin of another device. The RF signal does not need to pass through a via during the transmission process, thereby avoiding the attenuation and reflection of the RF signal caused by the via, thereby improving the transmission quality of the RF signal.

[0048] Based on this, the present application provides a circuit board 100 capable of improving the transmission quality of radio frequency signals. According to the circuit board 100 of the present application, by transmitting the signals of the first device and the second device on the same first radio frequency line layer 121, the radio frequency signal does not need to pass through a via when being transmitted between the first device and the second device, thereby avoiding the attenuation and reflection of the radio frequency signal caused by the via, thereby improving the transmission quality of the radio frequency signal.

[0049] In some embodiments, a first empty area and a second empty area that at least penetrate the first surface layer are disposed on the circuit board 100 , the first device is disposed in the first empty area, and the second device is disposed in the second empty area.

[0050] The first empty area and the second empty area can be obtained by hollowing out the circuit board 100. Specifically, since the pins of the first device and the pins of the second device are arranged in the same first RF line layer 121 between the first surface layer and the second surface layer, in addition to hollowing out the first surface layer so that the first empty area and the second empty area penetrate the first surface layer, it is also necessary to hollow out the reference dielectric layer 131 above the first RF line layer 121 where the pins of the first device and the pins of the second device are located so that the first empty area and the second empty area penetrate the reference dielectric layer 131 above the first RF line layer 121 where the pins of the first device and the pins of the second device are located. If there are other first RF line layers 121 above the first RF line layer 121 where the pins of the first device and the pins of the second device are located, it is also necessary to hollow out the other first RF line layers 121 above the first RF line layer 121 where the pins of the first device and the pins of the second device are located so that the first empty area and the second empty area also penetrate the other first RF line layers 121 above the first RF line layer 121 where the pins of the first device and the pins of the second device are located. Therefore, after the first device and the second device are respectively arranged in the first empty area and the second empty area, the pins of the first device and the second device can be directly arranged on the same first radio frequency line layer 121 exposed from the first empty area and the second empty area.

[0051] In some embodiments, the same first RF line layer 121 where the pins of the first device and the pins of the second device are located has a first surface and a second surface opposite to each other, and the first surface and the second surface are provided with reference dielectric layers 131 of the same material.

[0052] The first surface may be referred to as the upper surface of the same first RF line layer 121 where the pins of the first device and the pins of the second device are located, and the second surface may be referred to as the lower surface of the same first RF line layer 121 where the pins of the first device and the pins of the second device are located. In this embodiment, by setting a reference dielectric layer 131 of the same material on the upper surface and the lower surface of the same first RF line layer 121 where the pins of the first device and the pins of the second device are located, a symmetrical reference dielectric material is provided above and below the first RF line layer 121, the impedance of the RF signal on the first RF line layer 121 is controllable, the electromagnetic wave passes through the same effective dielectric constant during propagation, the relative capacitive coupling and the relative inductive coupling are exactly the same, so that when the RF signal is transmitted in the first RF line layer 121, no far-end crosstalk occurs, thereby reducing far-end crosstalk noise, ensuring the quality of the RF signal, and avoiding systemic working problems of the product.

[0053] like Figure 1 As shown, the top layer of the printed circuit board provided is air, and the bottom layer is a PP layer. The asymmetric reference dielectric material makes the electromagnetic wave propagate through an asymmetric effective dielectric constant and capacitance C.l The capacitance will decrease as the dielectric constant decreases (the decrease is relatively small), C ml At the same time, it will also decrease (the amount of decrease is relatively large), which will lead to C ml / C l The resulting value will be much smaller.

[0054] According to the far-end crosstalk noise formula:

[0055] Far-end crosstalk noise Fext = (1 / 2) × {(C ml / C l )-(L ml / L l )}

[0056] Among them, C ml is the mutual capacitance per unit length, C l is the self-capacitance per unit length, L ml is the mutual inductance per unit length, L l is the self-inductance per unit length.

[0057] Due to L ml / L l The value of will not change due to the change of effective dielectric constant, so Figure 1 The printed circuit board in C ml / C l When the far-end crosstalk noise Fext is reduced a lot, the noise amplitude is not zero, and there is noise interference; and the circuit board provided in this embodiment has the same reference dielectric layer 131 of the same material as the upper surface and the lower surface of the same first RF line layer 121 where the pins of the first device and the pins of the second device are located, and the electromagnetic wave passes through the same effective dielectric constant εr during propagation. At this time, the capacitive coupling C ml The increase is proportional to the effective dielectric constant εr, and the capacitance C between the signal path and the return path l It is also proportional to the increase of the effective dielectric constant, so C ml / C l Remains unchanged, so there is no far-end crosstalk.

[0058] Further, the reference medium layer 131 located on the first surface is evenly distributed on the first surface, and / or the reference medium layer 131 located on the second surface is evenly distributed on the second surface.

[0059] In this embodiment, by evenly distributing the reference dielectric layer 131 on the first surface and / or the second surface, far-end crosstalk can be further avoided when the RF signal is transmitted in the same first RF line layer 121 where the pins of the first device and the pins of the second device are located.

[0060] For example, Figure 1As shown, the same first RF line layer 121 where the pins of the two devices in communication connection are located can be the L2 layer, and the upper and lower surfaces of the L2 layer are provided with PP layers (i.e., glass fiber cloth) of the same material and evenly distributed. It can be understood that in addition to being a PP layer, the reference medium layer 131 can also be made of other suitable materials, which is not limited.

[0061] In some embodiments, the second RF line layer 111 in the first surface layer is grounded. By grounding the second RF line layer 111 in the first surface layer, an effective shielding layer can be formed to protect the pins of the first device and the same first RF line layer 121 where the pins of the second device are located from interference from external electromagnetic waves.

[0062] In some embodiments, a plurality of first radio frequency line layers 121 are stacked one above the other, and a gap exists between two adjacent first radio frequency line layers 121 .

[0063] Generally speaking, a reference dielectric layer 131 may be disposed between two adjacent first radio frequency line layers 121. Figure 3 As shown, the circuit board 100 may further include a copper clad laminate 151 (Copper Clad Laminate, referred to as CCL for short), and the copper clad laminate 151 may be disposed between two adjacent first radio frequency line layers 121 .

[0064] It can be understood that the pins of the first device and the pins of the second device can be jointly arranged in any first RF line layer 121 of a plurality of first RF line layers 121 stacked up and down. Preferably, the pins of the first device and the pins of the second device are jointly arranged in the first first RF line layer 121 below the first surface layer, that is, the same first RF line layer 121 where the pins of the first device and the pins of the second device are located is the first RF line layer 121 closest to the first surface layer among the plurality of first RF line layers 121. In this case, it can be ensured that the RF signal is directly transmitted in the first first RF line layer 121 below the first surface layer without passing through a via, and at the same time, compared with the case where the pins of the first device and the pins of the second device are jointly arranged in the first RF line layer 121 below, the workload of hollowing out the circuit board 100 to obtain the first empty area and the second empty area can also be reduced.

[0065] In some embodiments, the second RF line layer 111 is a microstrip line layer, and the first RF line layer 121 is a stripline layer. A microstrip line is a transmission line with only one reference plane, and a stripline is a transmission line with two reference planes. A microstrip line is usually a surface routing line, and a stripline is usually an inner routing line.

[0066] Exemplarily, the microstrip line layer may be implemented as a copper foil layer.

[0067] In some embodiments, Figure 3 As shown, the first device is a first chip 141 , and the second device is a second chip 142 .

[0068] Specifically, the pins of the first chip 141 and the pins of the second chip 142 are set on the same first RF line layer 121. Taking the transmission of RF signals from the first chip 141 to the second chip 142 as an example, the RF signal is directly transmitted from the pins of the first chip 141 to the same first RF line layer 121 where the pins of the first chip 141 and the pins of the second chip 142 are located. The RF signal is transmitted within the first RF line layer 121, and then directly transmitted from the first RF line layer 121 to the pins of the second chip 142, so that the first chip 141 and the second chip 142 are communicated with each other.

[0069] In some embodiments, Figure 4 As shown, the first device is a chip, and the second device is a connector 143 .

[0070] Specifically, the pins of the chip and the pins of the connector 143 are set on the same first RF line layer 121. Taking the transmission of RF signals from the chip to the connector 143 as an example, the RF signals are directly transmitted from the pins of the chip to the same first RF line layer 121 where the pins of the chip and the pins of the connector 143 are located. The RF signals are transmitted within the first RF line layer 121, and then directly transmitted from the first RF line layer 121 to the pins of the connector 143, so that the chip and the connector 143 can achieve communication connection.

[0071] It can be understood that the circuit board 100 can also include a larger number of devices. For example, the circuit board 100 can include three devices, namely two chips and a connector 143. The pins of the two chips and the pins of the connector 143 are arranged on the same first RF line layer 121. Through the first RF line layer 121, the RF signal can be transmitted from one chip to another chip, and then from another chip to the connector 143, or the RF signal can be transmitted from the connector 143 to a chip, and then from one chip to another chip.

[0072] like Figure 3 and Figure 4 As shown, a circuit board 100 according to an embodiment of the present application is shown. The circuit board 100 includes L1 layer, L2 layer, L3 layer, L4 layer, L5 layer, L6 layer, L7 layer and L8 layer, wherein L1 layer is the upper surface layer of the printed circuit board (also referred to as the top layer or top layer), L1 layer is a microstrip line layer, L8 layer is the lower surface layer of the printed circuit board (also referred to as the bottom layer or bottom layer), L2 layer, L3 layer, L4 layer, L5 layer, L6 layer and L7 layer are the inner layer structures of the printed circuit board, and each inner layer is a stripline layer.

[0073] The circuit board 100 further includes a first chip 141, a second chip 142 and a connector 143. The first chip 141 and the second chip 142 are in communication connection, and the second chip 142 is also in communication connection with the connector 143. Empty areas corresponding to the first chip 141, the second chip 142 and the connector 143 are provided on the L1 layer, and the first chip 141, the second chip 142 and the connector 143 are provided in the empty areas, and the pins of the first chip 141, the second chip 142 and the connector 143 are directly connected to the stripline layer of the L2 layer. When the RF signal is transmitted between the first chip 141 and the second chip 142, the RF signal is directly transmitted from the pin of the first chip 141 to the stripline layer of the L2 layer, the RF signal is transmitted in the stripline layer of the L2 layer, and then directly transmitted from the stripline layer of the L2 layer to the pin of the second device; when the RF signal is transmitted between the second chip 142 and the connector 143, the RF signal is directly transmitted from the pin of the second chip 142 to the stripline layer of the L2 layer, the RF signal is transmitted in the stripline layer of the L2 layer, and then directly transmitted from the stripline layer of the L2 layer to the pin of the connector 143. The RF signal does not need to pass through the via in the above transmission process, thereby avoiding the attenuation and reflection of the RF signal caused by the via, and improving the transmission quality of the RF signal.

[0074] In the circuit board 100, the upper and lower surfaces of the stripline layer of the L2 layer are respectively provided with PP layers (i.e., glass fiber cloth) of the same material and evenly distributed, so that the upper and lower surfaces of the stripline layer of the L2 layer have symmetrical reference dielectric materials, and the capacitance C between the signal path and the return path of the stripline layer of the L2 layer is l As the dielectric constant increases, C ml / C l It remains unchanged, avoiding far-end crosstalk noise in the RF signal and ensuring the quality of the RF signal.

[0075] In addition, the microstrip line layer of the L1 layer can be grounded to form an effective shielding layer to protect the strip line layer of the L2 layer from interference from external electromagnetic waves.

[0076] The circuit board 100 of this embodiment can be implemented according to a conventional printed circuit board stacking architecture. In the specific preparation process, the L1 layer and the PP layer between the L1 layer and the L2 layer can be hollowed out according to the position and size of the first chip 141, the second chip 142 and the connector 143 to form a void area, and then the hollowed L1 layer, the PP layer between the L1 layer and the L2 layer, and other layers are pressed according to the general circuit board manufacturing process flow, and the process is simple and does not require additional processes.

[0077] The PP layers on the upper and lower surfaces of the L2 layer can be produced by a one-time lamination process according to the general conventional circuit board processing process. The PP materials on the upper and lower surfaces of the L2 layer are subjected to the same environment such as temperature and pressure during the lamination process, thereby ensuring that the reference dielectric materials above and below the L2 layer are homogeneous and evenly distributed, so that the impedance of the RF signal in the L2 layer can be controlled, ensuring the quality of the RF signal.

[0078] The solder paste can be brushed onto the circuit board 100 by SMT technology (surface mounting technology) to realize patch welding of the first chip 141, the second chip 142 and the connector 143. The welded product is debugged and powered on to realize the required communication function.

[0079] According to yet another aspect of the present application, a terminal is provided. The terminal includes a circuit board.

[0080] Among them, the circuit board can be implemented as the circuit board 100 mentioned above, and reference can be made to the introduction above, which will not be repeated here.

[0081] It should be noted that the terminals mentioned above may include mobile phones, smart watches, tablet computers, smart TVs, vehicles, etc., without limitation.

[0082] To summarize, according to the circuit board and terminal of the embodiments of the present application, by allowing the signals of the first device and the second device to be transmitted on the same first RF line layer, the RF signal does not need to pass through a via when being transmitted between the first device and the second device, thereby avoiding the attenuation and reflection of the RF signal caused by the via, thereby improving the transmission quality of the RF signal.

[0083] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application to this. Those of ordinary skill in the art may make various changes and modifications therein without departing from the scope and spirit of the present application. All these changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0084] Similarly, it should be understood that in order to streamline the present application and help understand one or more of the various application aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present application should not be interpreted as reflecting the following intention: the claimed application requires more features than the features clearly stated in each claim. More specifically, as reflected in the corresponding claims, the application point is that the corresponding technical problem can be solved with less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present application.

[0085] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0086] It should be noted that the above embodiments illustrate rather than limit the present application, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets should not be construed as a limitation to the claims. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names.

Claims

1. A circuit board, characterized in that: The circuit board comprises: A surface structure, the surface structure comprising a first surface layer and a second surface layer opposite to each other, an inner layer structure, disposed between the first surface layer and the second surface layer, the inner layer structure comprising one or more first radio frequency line layers; A first device and a second device, wherein the first device and the second device are arranged through the first surface layer, and signals of the first device and the second device are transmitted in the same first radio frequency line layer.

2. The circuit board according to claim 1, characterized in that The circuit board is provided with a first empty area and a second empty area which at least penetrate the first surface layer. The first device is provided in the first empty area, and the second device is provided in the second empty area.

3. The circuit board according to claim 1, characterized in that: The pins of the first device and the pins of the second device are arranged on the same first radio frequency line layer.

4. The circuit board according to claim 3, characterized in that: The same first radio frequency line layer where the pins of the first device and the pins of the second device are located has a first surface and a second surface opposite to each other, and the first surface and the second surface are provided with reference dielectric layers made of the same material.

5. The circuit board according to claim 4, characterized in that: The reference medium layer located on the first surface is evenly distributed on the first surface, and / or the reference medium layer located on the second surface is evenly distributed on the second surface.

6. The circuit board according to claim 1, wherein: A second radio frequency line layer is disposed in both the first surface layer and the second surface layer, and the second radio frequency line layer in the first surface layer is grounded.

7. The circuit board according to claim 1, characterized in that: A plurality of the first radio frequency line layers are stacked up and down, and there is a gap between two adjacent first radio frequency line layers.

8. The circuit board according to claim 7, characterized in that: The same first radio frequency line layer where the pins of the first device and the pins of the second device are located is the first radio frequency line layer closest to the first surface layer among the plurality of first radio frequency line layers.

9. The circuit board according to claim 6, characterized in that: The second radio frequency line layer is a microstrip line layer, and the first radio frequency line layer is a strip line layer.

10. The circuit board according to claim 1, wherein: The first device is a first chip, and the second device is a second chip; or, The first device is a chip, and the second device is a connector.

11. A terminal, characterized in that: The terminal comprises the circuit board according to any one of claims 1 to 10.

12. The terminal according to claim 11, characterized in that The terminal includes a vehicle.

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