Semiconductor laser optical fiber coupling module and semiconductor laser

Abstract

The utility model discloses a semiconductor laser optical fiber coupling module. The semiconductor laser optical fiber coupling module comprises a semiconductor laser chipset, a first collimating lens array, a first reflecting mirror, a wedge-shaped mirror, a polarization splitting prism, a first reflecting prism, a second reflecting prism, a second collimating lens and an optical fiber, the light beam emitted by the first reflector is not parallel to the base any more, is integrally deflected through the wedge-shaped mirror and then is parallel to the base again, and then enters the optical fiber after being reflected and deflected for several times. According to the semiconductor laser optical fiber coupling module, the step height is converted into the wedge-shaped lens angle through the wedge-shaped lens, no step height design exists between adjacent chips, two paths of light beams enter the optical fiber after being subjected to a series of light beam shaping, the overall height of the device is reduced, the size of the semiconductor laser is reduced, more chip sets can be arranged, and the device reliability is improved. And the output power of the semiconductor laser is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor lasers, and in particular to a semiconductor laser fiber coupling module. Background Art

[0002] As a high-tech product, semiconductor lasers are increasingly used in the fields of medical treatment, communication, and military, and the demand for high-power and high-brightness semiconductor lasers is also increasing. The common method is to increase the output power of a single semiconductor laser, encapsulate a single piece into a COS, and then sinter the COS in series or in parallel on a heat sink. In the design of the optical path, adjacent COS are often arranged in steps. The more COS there are, the greater the power. However, as the number of COS increases, the number of steps will also increase, and the height of the semiconductor laser will also increase, and it will also be limited by the overall space. Utility Model Content

[0003] The embodiment of the present application provides a semiconductor laser fiber coupling module, which converts the step height into the wedge mirror angle through a wedge mirror, and has no step height design between adjacent chips. Two light beams enter the optical fiber after a series of beam shaping, which reduces the overall height of the device, thereby reducing the volume of the semiconductor laser, so that more chip groups can be arranged, and the output power of the semiconductor laser is improved.

[0004] The semiconductor laser fiber coupling module comprises: a semiconductor laser chip group, which is used to emit two groups of light beams;

[0005] A collimation module, used for collimating the two groups of light beams emitted by the semiconductor laser chip group and then emitting them, and for deflecting the two groups of light beams emitted after collimation and then emitting them;

[0006] A wedge-shaped mirror, wherein the two groups of light beams emitted by the collimation module are a first light beam and a second light beam, and the wedge-shaped mirror is used to deflect the first light beam emitted by the collimation module and then enter the first reflecting prism, and to deflect the second light beam emitted by the collimation module and then enter the polarization beam splitting prism;

[0007] A polarization beam splitter prism, used to make the second light beam emitted by the wedge-shaped mirror reflect and then enter the first reflecting prism;

[0008] A first reflecting prism is used to combine the first light beam emitted from the wedge mirror and the second light beam emitted from the polarizing beam splitter prism into a third combined light beam at the first reflecting prism, and the first reflecting prism is also used to deflect the third combined light beam and then cause it to enter the polarizing beam splitter prism;

[0009] The polarization beam splitter prism is also used to allow the third combined light beam emitted from the first reflecting prism to be transmitted and then incident on the coupling module;

[0010] The coupling module is used to deflect the third combined light beam emitted from the polarization beam splitter and then emit it, and to collimate the deflected third combined light beam and then couple it into the optical fiber.

[0011] In one embodiment, the semiconductor laser chip set includes a plurality of chips, and there is no height difference between any two adjacent chips of the semiconductor laser chip set.

[0012] In one embodiment, the collimation module comprises:

[0013] A first collimating lens array, used for collimating two groups of light beams emitted by the semiconductor laser chip group before emitting them;

[0014] a first reflector, used for deflecting two groups of light beams emitted from the first collimating lens array and then emitting them, the two groups of light beams emitted from the first reflector comprising a first light beam and a second light beam;

[0015] The wedge-shaped mirror is located at the light-emitting side of the first reflector, and is used to deflect the first light beam emitted by the first reflector and then enter the first reflecting prism, and to deflect the second light beam emitted by the first reflector and then enter the polarization splitting prism.

[0016] In one embodiment, the fiber coupling module further includes a base, the plane where the first reflector is located is not perpendicular to the plane where the base is located, and the first reflector is used to deflect the two groups of light beams emitted from the first collimating lens array so as to be non-parallel to the base.

[0017] In one embodiment, the wedge-shaped mirror is further used to deflect the first light beam and the second light beam emitted from the first reflector so that the first light beam and the second light beam are emitted parallel to the base.

[0018] In one embodiment, the first collimating lens array includes a fast-axis collimating lens and a slow-axis collimating lens;

[0019] The plane where the fast axis collimating lens is located is perpendicular to the front surface of the semiconductor laser chipset. The fast axis collimating lens is placed opposite to the semiconductor laser chipset. The fast axis collimating lens is used to collimate the two groups of light beams emitted by the semiconductor laser chipset in the fast axis direction before emitting them.

[0020] In one embodiment, the plane where the slow axis collimating lens is located is parallel to the front surface of the semiconductor laser chipset, and the slow axis collimating lens is located on the light output side of the fast axis collimating lens. The slow axis collimating lens is used to collimate the two groups of light beams emitted by the fast axis collimating lens in the slow axis direction before emitting them.

[0021] In one embodiment, the coupling module comprises:

[0022] A second reflecting prism is used to deflect the third combined light beam emitted from the polarization beam splitting prism and then emit it;

[0023] The second collimating lens is used to collimate the third combined light beam emitted from the second reflecting prism and then couple it into the optical fiber.

[0024] In one embodiment, the semiconductor laser chipset is also used to emit a test beam;

[0025] The position of the wedge mirror coincides with the position of the light spot of the test light beam emitted by the semiconductor laser chipset.

[0026] In a second aspect, the present application further provides a semiconductor laser, wherein the semiconductor laser comprises the semiconductor laser fiber coupling module as described in the first aspect.

[0027] In the embodiment of the present application, the step height is converted into a wedge mirror angle through a wedge mirror, and there is no step height design between adjacent chips. The two light beams enter the optical fiber after a series of beam shaping, which reduces the overall height of the device and thus reduces the volume of the semiconductor laser, so that more chipsets can be arranged and the output power of the semiconductor laser is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a schematic diagram of the structure of a semiconductor laser fiber coupling module provided in an embodiment of the present application;

[0030] Figure 2 is a light path diagram of a wedge mirror provided in an embodiment of the present application; BRIEF DESCRIPTION OF THE DRAWINGS

[0032] 1. Semiconductor laser chipset; 2. Fast axis collimating lens; 3. Slow axis collimating lens; 4. First reflecting mirror; 5. Wedge mirror; 61. First reflecting prism; 7. Polarization beam splitting prism; 62. Second reflecting prism; 8. Second collimating lens; 9. Optical fiber; 10. Base. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0035] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0037] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0038] See also Figure 1 to Figure 2 An embodiment of the present application provides a semiconductor laser fiber coupling module, including a semiconductor laser chipset, for emitting two groups of light beams.

[0039] Specifically, the semiconductor laser chip set may include multiple groups of chips, and may also include multiple groups of chip packages. The semiconductor laser chip may be packaged in COS, that is, the semiconductor laser chip is mounted on a heat sink with high thermal conductivity.

[0040] The collimation module is used for collimating the two groups of light beams emitted by the semiconductor laser chip group (1) before emitting them, and for deflecting the two groups of light beams emitted after collimation before emitting them.

[0041] Specifically, the collimation module includes a lens and a reflector, which are used to collimate and deflect the two groups of light beams emitted by the semiconductor laser, and then emit them to the wedge mirror after deflection. Optionally, the two groups of light beams are the first light beam and the second light beam.

[0042] The wedge-shaped mirror is used to deflect the first light beam emitted by the collimating module and then make it incident on the first reflecting prism.

[0043] Specifically, the wedge mirror is a wedge-shaped optical lens, which is placed opposite to the polarization beam splitter prism. When the non-parallel light emitted by the collimation module reaches the wedge mirror, the wedge mirror can deflect the light beam by a certain angle. Figure 2 As shown, Figure 2 It is a schematic diagram of the optical path of the wedge mirror. When the first light beam enters the wedge mirror, the refraction effect of the wedge mirror causes the originally non-parallel light beam to be refracted by the wedge mirror and then emerge as parallel light and enter the first reflecting prism.

[0044] The wedge mirror is also used to deflect the second light beam emitted from the first reflector and then cause the second light beam to enter the polarization beam splitter prism.

[0045] Similarly, when the second light beam enters the wedge-shaped mirror, since the incident angle of the second light beam is different from that of the first light beam, the second light beam is refracted by the wedge-shaped mirror and also emerges as parallel light and enters the polarization beam splitter prism.

[0046] The polarization beam splitter prism is used to make the second light beam emitted from the wedge mirror to be incident on the first reflecting prism after being reflected.

[0047] Specifically, the polarization beam splitter prism also includes a half-wave plate. The wave plate, i.e., a phase delay plate, can rotate the polarization of the incident laser beam by 90°. In the embodiment of the present application, the second light beam emitted from the wedge mirror passes through the half-wave plate of the polarization beam splitter prism, so that the transmission amount of the second light beam is 0, and is reflected perpendicular to the incident surface of the polarization beam splitter prism, that is, the second light beam is polarized and rotated by 90° through the wave plate and then enters the first reflecting prism located on the left side of the polarization beam splitter prism.

[0048] The first reflecting prism is used to combine the first light beam emitted from the wedge mirror and the second light beam emitted from the polarization beam splitter prism into a third combined light beam at the first reflecting prism.

[0049] Specifically, the second light beam is reflected 90° by the wave plate of the polarization beam splitter prism and then enters the first reflecting prism located on the left side of the polarization beam splitter prism. The first light beam is directly incident on the first reflecting prism under the deflection of the wedge mirror. The two light beams converge at the first reflecting prism to form a third combined light beam.

[0050] Furthermore, the first reflecting prism is also used to deflect the third combined light beam and then make it incident on the polarization beam splitter prism; the polarization beam splitter prism is also used to make the third combined light beam emitted from the first reflecting prism be transmitted and then make it incident on the second reflecting prism.

[0051] The third combined light beam is reflected and emitted by the first reflecting prism, and will continue to be incident on the polarization beam splitter prism located on the right side of the first reflecting prism along the original light path. Under the transmission effect of the polarization beam splitter prism, the third combined light beam is transmitted through the polarization beam splitter prism and then is incident on the coupling module located on the right side of the polarization beam splitter prism.

[0052] The coupling module is used to deflect the third combined light beam emitted from the polarization beam splitter and then emit it, and to collimate the deflected third combined light beam and then couple it into the optical fiber.

[0053] In the embodiment of the present application, the step height is converted into a wedge mirror angle through a wedge mirror, and there is no step height design between adjacent chips. The two light beams enter the optical fiber after a series of beam shaping, which reduces the overall height of the device and thus reduces the volume of the semiconductor laser, so that more chipsets can be arranged and the output power of the semiconductor laser is improved.

[0054] In one embodiment, the semiconductor laser chipset includes a plurality of chips, and there is no height difference between any two adjacent chips in the semiconductor laser chipset. Specifically, the semiconductor laser chip may be in a packaged form, such as a COS packaged chip, and the semiconductor laser chipset may alternately sinter two rows of COS, and there is no height difference between any two adjacent COS in the semiconductor laser chipset, that is, the chips in the chipset adopt a step-free coupling method.

[0055] The embodiment of the present application can reduce the height of the entire semiconductor laser and the device volume of the semiconductor laser by designing the height of adjacent COS without steps.

[0056] In one embodiment, the collimation module includes: a first collimating lens array, which is used to collimate two groups of light beams emitted by the semiconductor laser chip group before emitting them.

[0057] Specifically, the first collimating lens array includes a fast-axis collimating lens and a slow-axis collimating lens. The collimating lens is a curved optical lens. Since the divergence angle of the light beam emitted by the semiconductor laser chip is large, in order to couple the light beam into other optical devices with lower loss, the collimating lens is mainly used to convert the light beam into a light beam with a smaller divergence angle, and at the same time, through refraction, refract the two groups of light beams into parallel light beams.

[0058] The collimation module also includes: a first reflector, which is used to deflect the two groups of light beams emitted from the first collimating lens array and then emit them, and the two groups of light beams emitted from the first reflector include a first light beam and a second light beam.

[0059] Optionally, the semiconductor laser further includes a base, the plane where the first reflector is located is perpendicular to the plane where the base is located, and the first reflector is used to deflect two groups of light beams emitted from the first collimating lens array before emitting them.

[0060] In the embodiment of the present application, the light beam emitted from the chip is collimated by a collimation module and then deflected to be incident on a wedge-shaped mirror.

[0061] In one embodiment, the first collimating lens array includes a fast-axis collimating lens and a slow-axis collimating lens. The plane where the fast-axis collimating lens is located is perpendicular to the front surface of the semiconductor laser chipset, and the fast-axis collimating lens is placed opposite to the semiconductor laser chipset. The fast-axis collimating lens is used to collimate the two groups of light beams emitted by the semiconductor laser chipset in the fast-axis direction before emitting. Specifically, the fast axis is a direction perpendicular to the entire surface of the laser chip. Generally, the divergence angle of the fast axis is greater than that of the slow axis. The fast-axis collimating lens is used to collimate and focus the fast-axis direction spot of the laser emitted by the chip. Optionally, the fast-axis collimating lens is a spherical or aspherical mirror.

[0062] The embodiment of the present application can focus the light beam emitted from the chip by collimating the light beam and then emitting it, so that the light beam can be coupled into other optical devices with lower loss.

[0063] In one embodiment, the plane where the slow axis collimating lens is located is parallel to the front surface of the semiconductor laser chip group, the slow axis collimating lens is located on the light-emitting side of the fast axis collimating lens, and the slow axis collimating lens is used to collimate the two groups of light beams emitted by the fast axis collimating lens in the slow axis direction before emitting. Specifically, the slow axis is parallel to the direction of the surface of the laser chip, and the slow axis collimating lens is used to collimate and focus the laser light spot in the slow axis direction emitted by the fast axis collimating lens. Optionally, the slow axis collimating lens is a spherical or aspherical mirror.

[0064] The embodiment of the present application can further focus the light beam by re-collimating the light beam in the slow axis direction, so that the light beam can be coupled into other optical devices with lower loss.

[0065] In one embodiment, the fiber coupling module further includes a base, the plane where the first reflector is located is not perpendicular to the plane where the base is located, and the first reflector is used to deflect the two groups of light beams emitted from the first collimating lens array so as to be non-parallel to the base.

[0066] Specifically, the semiconductor laser also includes a base, and the first reflector, that is, the small reflector, is set at a certain angle to the base. The first reflector deflects the two groups of light beams emitted by the slow-axis collimating lens and then emits them. At this time, the light beams are not parallel to the base after being deflected 90° by the small reflector, that is, the two groups of light beams are no longer parallel light parallel to the base after being reflected by the small reflector.

[0067] In the embodiment of the present application, the position of the small first reflector is determined so that the two groups of light beams can be emitted as parallel light after being reflected by the first reflector and refracted by the wedge-shaped mirror.

[0068] In one embodiment, the wedge-shaped mirror is further used to deflect the first light beam and the second light beam emitted by the first reflector so that they are emitted parallel to the base. Figure 2 , Figure 2 It is a schematic diagram of the optical path of the wedge mirror. When the first light beam and the second light beam emitted from the first reflector enter the wedge mirror as non-parallel light, due to the refraction effect of the wedge mirror, the first light beam and the second light beam can be emitted as parallel light.

[0069] In the embodiment of the present application, the light beam is re-emitted as parallel light through the refraction effect of the wedge mirror.

[0070] In one embodiment, the coupling module includes: a second reflecting prism, used to deflect the third combined light beam emitted from the polarization beam splitter prism and then emit it.

[0071] Specifically, the second collimating lens is arranged opposite to the second reflecting prism, and the second collimating lens is located at the light-emitting side of the second reflecting prism. The second reflecting prism reflects and deflects the third combined light beam by 90 degrees and then the beam enters the second collimating lens.

[0072] The coupling module also includes: a second collimating lens, which is used to collimate the third combined light beam emitted from the second reflecting prism and then couple it into the optical fiber.

[0073] Specifically, the second collimating lens is used to re-collimate the third combined light beam emitted from the second reflecting prism, so that the third combined light beam is coupled into the optical fiber as parallel light.

[0074] In the embodiment of the present application, the polarized light beam is collimated again through a second collimating lens and coupled into the optical fiber.

[0075] In one embodiment, the semiconductor laser chipset is also used to emit a test beam, and the position of the wedge mirror coincides with the position of the light spot of the second test beam emitted by the semiconductor laser chipset.

[0076] Optionally, in order to allow the light beam to pass along a preset optical path, the positions of the various reflectors and lenses may be fine-tuned through testing.

[0077] Specifically, the semiconductor laser chip can be packaged in COS, and the semiconductor laser chipset can include multiple COS packaged chips. Optionally, two rows of COS head and tail paths are coupled respectively, the position of the wedge mirror is adjusted, and the chipset emits a test beam. When the spot of the test beam is on the wedge mirror and the power of the semiconductor laser is coupled to the maximum, the position of the wedge mirror is determined as the standard position of the wedge mirror.

[0078] Similarly, the optical fiber is fixed on the collimator block, and the tail end of the optical fiber is reversely transmitted, that is, the second test beam is emitted from the direction of the optical fiber. Optionally, the spot position of the test beam is observed using a beam analyzer. When the second test beam is collimated by the collimating lens along the preset optical path and enters the beam analyzer, the position of the collimating lens is adjusted so that the centroid coordinates of the collimating lens coincide with the beam spot position. At this time, the position of the collimating lens is the standard position, and this place is positioned as the position of the collimating lens.

[0079] Correspondingly, when the position coupling of the collimating lens is determined, the test light beam is collimated by the collimating lens and then incident on the second reflecting prism located on the light-emitting side of the collimating lens. The light spot of the test light beam is determined to be at the center of the second reflecting prism using a beam analyzer, and the position of the second reflecting prism at this time is determined to be the standard position, and this place is positioned as the position of the second reflecting prism. Similarly, when the position of the second reflecting prism is determined, the test light beam is reflected by the second reflecting prism to the polarizing beam splitter prism, and the polarizing beam splitter prism transmits the test light beam and then incident on the first reflecting prism. Optionally, using a light spot card to observe that the first and last light spots of the test light beam are both at the position of the center axis of the light path of the first reflector, then the position of the first reflecting prism at this time is the standard position, and this place is positioned as the position of the first reflecting prism.

[0080] Optionally, according to the preset design, a polarization beam splitter prism and a second reflecting prism are placed along the alignment line on the ceramic sheet on the semiconductor laser, and the second reflecting prism is fine-tuned so that the spot of the test beam is at the center of the second reflecting prism. At this time, the position of the second reflecting prism is the standard position. Similarly, the spot card can also be used to observe whether the first and last spots of the test beam are both at the position of the center axis of the first reflecting mirror light path. If the first and last spots of the test beam are both at the position of the center axis of the first reflecting mirror light path, then the position of the first reflecting prism at this time is the standard position.

[0081] Similarly, the slow-axis collimating lens can be placed at the coarse positioning position according to the preset position, and the fast-axis collimating lens is used to collimate the test beam in the fast-axis direction. At this time, the fast-axis collimating lens is coupled to make the centroid Y and Y width of the test beam spot consistent with the position of the existing standard parts. At this time, the position of the fast-axis collimating lens is determined as the standard position of the fast-axis collimating lens. At this time, the power of the first reflector is coupled to the maximum, and the position of the slow-axis collimating lens continues to be fine-tuned. The power of the first reflector is coupled to the maximum again. The position of the slow-axis collimating lens is found at the peak power of the first reflector by fine-tuning the slow-axis collimating lens multiple times. At this time, the position of the slow-axis collimating lens is the standard position. Optionally, there can be multiple slow-axis collimating lenses, and the positions of the remaining multiple slow-axis collimating lenses are determined according to the standard position.

[0082] The embodiment of the present application ensures the accuracy of the position of each lens and reflector by testing the light beam and passing the light in the forward and reverse directions, thereby ensuring that the light beam emitted by the chip enters the optical fiber along a preset light path, thereby reducing the loss of the light beam.

[0083] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0084] The above is a detailed introduction to an electronic device provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor laser fiber coupling module, characterized in that: The modules include: A semiconductor laser chip set (1) for emitting two groups of light beams; A collimation module, used for collimating the two groups of light beams emitted by the semiconductor laser chip group (1) before emitting them, and for deflecting the two groups of light beams emitted after collimation before emitting them; a wedge-shaped mirror (5), wherein the two groups of light beams emitted by the collimating module are a first light beam and a second light beam, and the wedge-shaped mirror is used to deflect the first light beam emitted by the collimating module and then cause it to enter a first reflecting prism (61), and to deflect the second light beam emitted by the collimating module and then cause it to enter a polarizing beam splitting prism (7); A polarization beam splitter prism (7) used to make the second light beam emitted by the wedge mirror (5) reflect and then enter the first reflection prism (61); a first reflecting prism (61) used for combining the first light beam emitted by the wedge mirror (5) and the second light beam emitted by the polarizing beam splitter prism (7) into a third combined light beam at the first reflecting prism (61); the first reflecting prism (61) is also used for causing the third combined light beam to be incident on the polarizing beam splitter prism (7) after being deflected; The polarization beam splitting prism (7) is also used to allow the third combined light beam emitted by the first reflecting prism (61) to be transmitted and then incident on the coupling module; A coupling module, used for deflecting the third combined light beam emitted from the polarization beam splitter (7) and then emitting it, and for collimating the deflected third combined light beam and then coupling it into the optical fiber (9); The semiconductor laser chip group (1) comprises a plurality of chips, and there is no height difference between any two adjacent chips in the semiconductor laser chip group (1).

2. The optical fiber coupling module according to claim 1, characterized in that: The collimation module comprises: A first collimating lens array, used for collimating two groups of light beams emitted by the semiconductor laser chip group (1) before emitting them; A first reflector (4) is used to deflect two groups of light beams emitted from the first collimating lens array and then emit them, the two groups of light beams emitted from the first reflector (4) comprising a first light beam and a second light beam; The wedge-shaped mirror (5) is located on the light-emitting side of the first reflector (4), and is used to deflect a first light beam emitted by the first reflector (4) so ​​that it enters a first reflecting prism (61), and to deflect a second light beam emitted by the first reflector (4) so ​​that it enters a polarization beam splitting prism (7).

3. The optical fiber coupling module according to claim 2, characterized in that: The optical fiber coupling module also includes a base (10), the plane where the first reflector (4) is located is not perpendicular to the plane where the base (10) is located, and the first reflector (4) is used to deflect two groups of light beams emitted from the first collimating lens array so that they are not parallel to the base (10).

4. The optical fiber coupling module according to claim 3, characterized in that: The wedge-shaped mirror (5) is also used to deflect the first light beam and the second light beam emitted by the first reflector (4) so ​​that they are emitted parallel to the base (10).

5. The optical fiber coupling module according to claim 2, characterized in that: The first collimating lens array comprises a fast-axis collimating lens (2) and a slow-axis collimating lens (3); The plane where the fast axis collimating lens (2) is located is perpendicular to the front surface of the semiconductor laser chip group (1); the fast axis collimating lens (2) is placed opposite to the semiconductor laser chip group (1); the fast axis collimating lens (2) is used to collimate two groups of light beams emitted by the semiconductor laser chip group (1) in the fast axis direction before emitting them.

6. The optical fiber coupling module according to claim 5, characterized in that: The plane where the slow axis collimating lens (3) is located is parallel to the front surface of the semiconductor laser chip group (1); the slow axis collimating lens (3) is located on the light-emitting side of the fast axis collimating lens (2); the slow axis collimating lens (3) is used to collimate the two groups of light beams emitted by the fast axis collimating lens (2) in the slow axis direction before emitting them.

7. The optical fiber coupling module according to claim 1, characterized in that: The coupling module comprises: A second reflecting prism (62) is used to deflect the third combined light beam emitted from the polarization beam splitting prism (7) and then emit it; The second collimating lens (8) is used to collimate the third combined light beam emitted by the second reflecting prism (62) and then couple it into the optical fiber (9).

8. The optical fiber coupling module according to claim 1, characterized in that: The semiconductor laser chipset (1) is also used to emit a test light beam; The position of the wedge mirror (5) coincides with the position of the light spot of the test light beam emitted by the semiconductor laser chip group (1).

9. A semiconductor laser, characterized in that: The invention comprises a semiconductor laser fiber coupling module as claimed in any one of claims 1 to 8.

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