Bidirectional AC / DC conversion module based on IGBT discrete device

Abstract

A bidirectional AC / DC conversion module based on an IGBT discrete device comprises a capacitor filter plate, an IGBT plate and a bottom plate which are arranged in parallel and fixedly connected, distances are reserved between the capacitor filter plate and the IGBT plate and between the IGBT plate and the bottom plate, the capacitor filter plate is provided with a capacitor assembly, and the IGBT plate is provided with an IGBT module. Two groups of first filter capacitors in the capacitor assembly are respectively arranged at two opposite edges of the capacitor filter plate, so that the distance between the two groups of first filter capacitors is reduced, and heat dissipation is facilitated; all the electrolytic capacitors in the capacitor assembly are located in the middle of the capacitor filtering plate, the electrolytic capacitors are arranged at equal intervals, and heat dissipation air channels are reserved, so that heat dissipation is smooth, and normal operation of all devices is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of bidirectional AC / DC conversion, and particularly relates to a bidirectional AC / DC conversion module based on IGBT discrete devices. Background Art

[0002] With the popularization and development of electric vehicles, the demand for electric vehicle chargers is also increasing continuously. Since a power conversion system (PCS) can convert direct current (DC) in an energy storage device into alternating current (AC), or convert alternating current (AC) into direct current (DC), the power conversion system is increasingly applied in the field of chargers. At present, a multi-IGBT integrated module, as a key component of the power conversion system, is very popular because of its advantages such as being suitable for high-power scenarios and having a more compact package form. However, considering the actual production cost, the manufacturing cost of the multi-IGBT integrated module is relatively high. An IGBT discrete device is formed by packaging a single IGBT chip, which has a simple structure and a low cost, although it is often used in scenarios with lower power. Combining multiple IGBT discrete devices can also meet the requirements of high-power scenarios, and the cost is lower than that of the multi-IGBT integrated module. However, when multiple IGBT discrete devices are combined and applied, there are problems of poor heat dissipation and a large space occupied by the devices. Summary of the Utility Model

[0003] In order to solve the problems of poor heat dissipation and a large space occupied by the devices when multiple IGBT discrete devices are combined in the prior art, the utility model provides a bidirectional AC / DC conversion module based on IGBT discrete devices, so that the heat dissipation is smooth and the normal operation of each device is ensured.

[0004] The technical solution adopted by the utility model to solve the above technical problems is: a bidirectional AC / DC conversion module based on IGBT discrete devices, which includes a capacitor filter board, an IGBT board and a bottom board that are arranged in parallel and fixedly connected. There is a distance between the capacitor filter board and the IGBT board, and between the IGBT board and the bottom board. A capacitor component is arranged on the capacitor filter board, an IGBT discrete device module group and a plurality of drive boards are arranged on the IGBT board, the IGBT discrete device module group is connected to the capacitor component and all the drive boards, and a heat dissipation component in contact with the IGBT discrete device module group is arranged on the bottom board.

[0005] As a further optimization of a bidirectional AC / DC conversion module based on IGBT discrete devices of the utility model: the capacitor component includes multiple groups of first filter capacitors and multiple groups of electrolytic capacitors. At least one group of first filter capacitors is distributed along a straight line and along the edge of the capacitor filter board, and all the electrolytic capacitors are located in the middle of the capacitor filter board.

[0006] As a further optimization of a bidirectional AC / DC conversion module based on IGBT discrete devices in the utility model: The first filter capacitor is set in two groups, and the two groups of first filter capacitors are respectively arranged at two opposite edges of the capacitor filter board.

[0007] As a further optimization of a bidirectional AC / DC conversion module based on IGBT discrete devices in the utility model: On the surface of the IGBT board facing the capacitor filter board, there are at least one current-carrying copper bar, multiple groups of current-carrying copper posts and multiple groups of first connectors. All the current-carrying copper bars are distributed along the width direction of the IGBT board, and the current-carrying copper bars extend along the length direction of the IGBT board. Each group of current-carrying copper posts and each group of first connectors are both distributed along the length direction of the IGBT board.

[0008] As a further optimization of a bidirectional AC / DC conversion module based on IGBT discrete devices in the utility model: The capacitor filter board includes three substrates spliced in sequence along a straight line, and the three substrates are coplanar.

[0009] As a further optimization of a bidirectional AC / DC conversion module based on IGBT discrete devices in the utility model: The IGBT discrete device module includes several single modules, each single module includes multiple IGBT single tubes, and all the single modules and all the drive boards are plugged on the surface of the IGBT board facing the bottom board.

[0010] As a further optimization of a bidirectional AC / DC conversion module based on IGBT discrete devices in the utility model: The heat dissipation component includes multiple radiators, and the radiators correspond to the single modules one by one.

[0011] As a further optimization of a bidirectional AC / DC conversion module based on IGBT discrete devices in the utility model: An insulating board is arranged on the bottom board, and multiple heat pipes are arranged on the insulating board. The heat pipes can contact with all the radiators.

[0012] As a further optimization of a bidirectional AC / DC conversion module based on IGBT discrete devices in the utility model: A ceramic insulating board is laid on the IGBT discrete device module, and thermal conductive silicone grease is arranged between the IGBT discrete device module and the ceramic insulating board and between the ceramic sheet and the radiator.

[0013] As a further optimization of a bidirectional AC / DC conversion module based on IGBT discrete devices in the utility model: The edges of the IGBT board and the bottom board are connected by mounting brackets.

[0014] Beneficial effects: The capacitor filter board, IGBT board, and bottom board of the present utility model are arranged in parallel and fixedly connected. There are distances between the capacitor filter board and the IGBT board, and between the IGBT board and the bottom board. The capacitor filter board is provided with a capacitor assembly, which includes multiple groups of first filter capacitors and multiple groups of electrolytic capacitors. At least one group of first filter capacitors is distributed in a straight line and along the edge of the capacitor filter board. The first filter capacitors are set to two groups, and the two groups of first filter capacitors are respectively arranged at two opposite edges of the capacitor filter board, reducing the distance between the two groups of first filter capacitors, which is beneficial to heat dissipation. All electrolytic capacitors are located in the middle of the capacitor filter board, and the electrolytic capacitors are arranged at equal intervals, reserving a heat dissipation air duct, making the heat dissipation smooth and ensuring the normal operation of each device. Description of the Drawings

[0015] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0016] Figure 2 is an exploded view of the overall structure of the present utility model;

[0017] Figure 3 is a schematic diagram of the distribution of the first filter capacitors and electrolytic capacitors on the capacitor filter board;

[0018] Figure 4 is a schematic diagram of the position of the present utility model in the energy storage converter (PCS);

[0019] Reference numerals in the figures: 1. Capacitor filter board, 101. First filter capacitor, 102. Substrate, 103. Electrolytic capacitor, 2. IGBT board, 201. Current-carrying copper busbar, 202. Current-carrying copper column, 203. First connector, 204. IGBT discrete device module, 205. Driver board, 3. Bottom board, 301. Heat sink plate, 302. Insulating board, 303. Spacer, 304. Heat dissipation component, 305. Mounting bracket, 4. Heat dissipation fan, 5. Lower box body. Detailed Embodiments

[0020] The following further elaborates on the technical solutions of the present utility model in combination with specific embodiments. For parts that are not detailedly described and disclosed in the following embodiments of the present utility model, they should all be understood as the prior art known or should be known to those skilled in the art, such as the structure and model of the energy storage converter (PCS), the model of the capacitor filter board 1, the model of the first filter capacitor 101, the model of the second filter capacitor, the model of the electrolytic capacitor 103, the models of the current-carrying copper busbar 201 and the current-carrying copper column 202, the model of the IGBT single tube, the model of the heat sink plate 301, the model of the insulating board 302, the model and specific structure of the radiator, the model of the heat dissipation fan 4, etc.

[0021] A bidirectional AC / DC conversion module based on IGBT discrete devices, such asFigures 1-3 As shown in the figure, it includes a capacitor filter board 1, an IGBT board 2 and a bottom board 3 which are arranged in parallel and fixedly connected. There are distances between the capacitor filter board 1 and the IGBT board 2, and between the IGBT board 2 and the bottom board 3. A capacitor assembly is arranged on the capacitor filter board 1. The capacitor assembly includes multiple groups of first filter capacitors 101 and multiple groups of electrolytic capacitors 103. At least one group of first filter capacitors 101 is distributed along a straight line and along the edge of the capacitor filter board 1. The first filter capacitors 101 are set to two groups, and the two groups of first filter capacitors 101 are respectively arranged at two opposite edges of the capacitor filter board 1. Reducing the distance between the two groups of first filter capacitors 101 is beneficial to heat dissipation. Since the withstand voltage of the electrolytic capacitors 103 is insufficient, a series voltage equalization design is adopted, and multiple capacitors are selected in parallel to meet the design requirements considering the comprehensive volume and capacity; all the electrolytic capacitors 103 are located in the middle of the capacitor filter board 1, and the electrolytic capacitors 103 are arranged at equal intervals. The capacitor filter board 1 includes three substrates 102 spliced in sequence along a straight line, and the three substrates 102 are coplanar.

[0022] The first group of filter capacitors is arranged at the edge of the first substrate 102 far from the second substrate 102. The electrolytic capacitors 103 are evenly divided into three groups. The first group of electrolytic capacitors 103 is placed at the edge of the first substrate 102 close to the second substrate 102. The second group of electrolytic capacitors 103 is placed on the second substrate 102. The third group of electrolytic capacitors 103 is placed at the edge of the third substrate 102 close to the second substrate 102. The second group of electrolytic capacitors 103 is placed at the edge of the third substrate 102 far from the second substrate 102. This distribution method reserves a heat dissipation air duct, making the heat dissipation smooth and ensuring the normal operation of each device.

[0023] An IGBT discrete device module 204 and multiple drive boards 205 are arranged on the IGBT board 2. The IGBT discrete device module 204 is connected to the capacitor assembly and all the drive boards 205. The IGBT discrete device module 204 includes several single modules, and each single module includes multiple IGBT single tubes. In this solution, it can be set to six IGBT single tubes. All the single modules and all the drive boards 205 are plugged on the surface of the IGBT board 2 facing the bottom board 3, and the pin insertion method can be adopted, which is convenient for replacement.

[0024] On the surface of the IGBT board 2 facing the capacitor filter board 1, there are at least one current-carrying copper bar 201, multiple groups of current-carrying copper posts 202, and multiple groups of first connectors 203. All the current-carrying copper bars 201 are distributed along the width direction of the IGBT board 2 and extend along the length direction of the IGBT board 2. Each group of current-carrying copper posts 202 and each group of first connectors 203 are both distributed along the length direction of the IGBT board 2. On the surface of the filter capacitor board facing the IGBT board 2, there is a second connector, which is convenient for mating installation with the first connector 203. The capacitor filter board 1 and the devices arranged on the capacitor filter board 1 constitute the first-layer PCB board, and the IGBT board 2 and the devices arranged on the IGBT board 2 constitute the second-layer PCB board. Considering that this module is for high-power applications and the input and output currents are very large, due to the limited copper-clad thickness and current-carrying capacity of the PCB board, the overall space layout is compact and the PCB Layout design is difficult. Considering various factors and cost processes, the PCB board is nested with current-carrying copper posts 202, and the current-carrying capacity is increased and the heat generation of the PCB is reduced by bridging the current-carrying copper bars 201. The current-carrying copper bars 201 are convenient to assemble and have good practicability. Through the cooperation of the current-carrying copper bars 201, current-carrying copper posts 202, first connectors 203 and second connectors, the circuits and communications of the two-layer PCB board are realized.

[0025] On two opposite sides of the surface of the IGBT board 2 far from the filter capacitor board, there are multiple second filter capacitors, and all the second filter capacitors correspond one by one to the first filter capacitor 101. The second filter capacitors generate little heat and are distributed on both sides, while the IGBT single tubes with large heat generation are distributed in the middle of the IGBT board 2.

[0026] On the bottom plate 3, there is a heat dissipation component 304 in contact with the IGBT discrete device module 204. The heat dissipation component 304 includes multiple radiators, and the radiators correspond one by one to the single modules. The IGBT discrete device module 204 is divided into three parts according to the three-phase electricity of UVW, and each part processes one-phase circuit respectively. Six IGBT single tubes are combined in parallel on one radiator to form a single module, and one circuit consists of three single modules. There are three circuits in total, and the UVW phases are arranged in sequence. There are three IGBT drive boards 205, and the three IGBT drive boards 205 respectively correspond to one of the UVW, and are dispersedly arranged between the radiator and the second filter capacitor. On the bottom plate 3, there is an insulating plate. This module works in a bidirectional AC-DC or DC-AC mode, and the heat generation of the three single modules in each circuit is not balanced. There are multiple heat pipes 301 on the insulating plate 302, and the heat pipes 301 can contact all the radiators, increasing the heat dissipation area and ensuring the temperature consistency of the IGBT monomers in each circuit.

[0027] All the radiators are reasonably arranged to form a smooth air duct, and wind deflectors are arranged at appropriate positions to make the air duct between the radiators relatively closed, so that more air passes through the tooth surfaces of the radiators. A ceramic insulating plate is laid on the IGBT discrete device module 204, and openings are made in the middle part. Thermal conductive silicone grease is provided between the IGBT discrete device module 204 and the ceramic insulating plate, and between the ceramic sheet and the radiator. The thermal conductive silicone grease is a prior art and will not be elaborated here.

[0028] Considering the inversion of the IGBT board 2 assembly, a capacitor backing plate 303 is added under the inverted second filter capacitor to reduce the stress on the pins of the second filter capacitor on the IGBT board 2. The edges of the IGBT board 2 and the bottom board 3 are connected by a mounting bracket 305 to increase the overall firmness between the IGBT board 2 and the devices arranged on the IGBT board 2.

[0029] As Figure 4 shown, in the lower box body 5 of the energy storage converter (PCS) of the present utility model, the cooling fan 4 in the energy storage inverter can dissipate heat from the present utility model.

[0030] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bidirectional AC / DC conversion module based on IGBT discrete devices, characterized in that: It includes a capacitor filter board (1), an IGBT board (2) and a bottom board (3) which are arranged in parallel and fixedly connected. There are distances between the capacitor filter board (1) and the IGBT board (2), and between the IGBT board (2) and the bottom board (3). A capacitor assembly is arranged on the capacitor filter board (1), and an IGBT discrete device module (204) and multiple driver boards (205) are arranged on the IGBT board (2). The IGBT discrete device module (204) is connected to the capacitor assembly and all the driver boards (205). A heat dissipation component (304) which contacts the IGBT discrete device module (204) is arranged on the bottom board (3).

2. The bidirectional AC / DC conversion module based on IGBT discrete devices according to claim 1, characterized in that: The capacitor assembly includes multiple groups of first filter capacitors (101) and multiple groups of electrolytic capacitors (103). At least one group of first filter capacitors (101) is distributed along a straight line and along the edge of the capacitor filter board (1), and all the electrolytic capacitors (103) are located in the middle of the capacitor filter board (1).

3. The bidirectional AC / DC conversion module based on IGBT discrete devices according to claim 2, wherein: Two groups of first filter capacitors (101) are provided, and the two groups of first filter capacitors (101) are respectively arranged at two opposite edges of the capacitor filter board (1).

4. The bidirectional AC / DC conversion module based on IGBT discrete devices according to claim 1, wherein: On the surface of the IGBT board (2) facing the capacitor filter board (1), there is at least one current-carrying copper bar (201), multiple groups of current-carrying copper posts (202) and multiple groups of first connectors (203). All the current-carrying copper bars (201) are distributed along the width direction of the IGBT board (2), and the current-carrying copper bars (201) extend along the length direction of the IGBT board (2). Each group of current-carrying copper posts (202) and each group of first connectors (203) are both distributed along the length direction of the IGBT board (2).

5. The bidirectional AC / DC conversion module based on IGBT discrete devices according to claim 1, wherein: The capacitor filter board (1) includes three substrates (102) spliced in sequence along a straight line, and the three substrates (102) are coplanar.

6. The bidirectional AC / DC conversion module based on IGBT discrete devices according to claim 1, wherein: The IGBT discrete device module (204) includes several single modules, each single module includes multiple IGBT single tubes, and all the single modules and all the driver boards (205) are plugged on the surface of the IGBT board (2) facing the bottom board (3).

7. The bidirectional AC / DC conversion module based on IGBT discrete devices according to claim 6, characterized in that: The heat dissipation component (304) includes multiple radiators, and the radiators correspond to the single modules one by one.

8. The bidirectional AC / DC conversion module based on IGBT discrete devices according to claim 7, wherein: An insulating board (302) is arranged on the bottom board (3), and multiple heat pipes (301) are arranged on the insulating board (302), and the heat pipes (301) can contact all the radiators.

9. The bidirectional AC / DC conversion module based on IGBT discrete devices according to claim 1, wherein: A ceramic insulating board is laid on the IGBT discrete device module (204), and thermal conductive silicone grease is provided between the IGBT discrete device module (204) and the ceramic insulating board, and between the ceramic sheet and the radiator.

10. The bidirectional AC / DC conversion module based on IGBT discrete devices according to claim 1, wherein: The edges of the IGBT board (2) and the bottom board (3) are connected by a mounting bracket (305).

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