Cold and warm air blower

Abstract

The utility model discloses a cold and warm air blower which comprises a shell frame body, a semiconductor refrigeration module, a flow increasing device, a first fan, a second fan, a main control integrated circuit board and a power supply assembly. The semiconductor refrigeration module comprises a semiconductor refrigeration piece, a heat dissipation piece and a cold conduction piece, the refrigeration face of the semiconductor refrigeration piece is attached to the cold conduction piece, and the heating face of the semiconductor refrigeration piece is attached to the heat dissipation piece. The structure design is reasonable, the semiconductor refrigeration module is adopted for refrigeration, the positions of the semiconductor refrigeration piece, the heat dissipation piece and the cold conduction piece are ingeniously arranged in the shell frame body to correspondingly form a heating cavity and a refrigeration cavity which are independent of each other, the heat dissipation effect is effectively improved, and then the cold air effect is improved; in addition, the flow increasing device is additionally arranged and used for further improving the cooling effect of the heating cavity instead of directly acting on the refrigerating cavity, and health problems cannot be caused on the basis that the refrigerating effect is improved. An electric heating assembly can be additionally arranged, the hot air blowing function is added, and different use requirements are met.

Description

Technical Field

[0001] The utility model relates to the technical field of fans, in particular to a cooling and heating fan. Background Art

[0002] An electric fan, also known as a fan, uses electricity to drive blades and accelerate air circulation. It's primarily used for cooling and ventilation. In the scorching summer heat, in kitchens, hot workshops, outdoor workstations, outdoor work and camping, and in vehicles without air conditioning, the air blown by a fan becomes hot air, rendering it ineffective in cooling the air and failing to provide the desired cooling effect. Utility Model Content

[0003] In view of the above shortcomings, the purpose of the present invention is to provide a cooling and heating fan with a reasonable structural design, which can accelerate heat dissipation and improve the cooling effect.

[0004] In order to achieve the above purpose, the technical solution provided by the present utility model is:

[0005] A cooling and heating fan, comprising a housing, a semiconductor refrigeration module, a flow increasing device, a first fan, a second fan, a main control integrated circuit board and a power supply assembly; the semiconductor refrigeration module, the flow increasing device, the first fan, the second fan and the main control integrated circuit board are arranged on the housing and electrically connected to the power supply assembly; the semiconductor refrigeration module comprises a semiconductor refrigeration sheet, a heat sink and a cooling conductor, the cooling surface of the semiconductor refrigeration sheet is in contact with the cooling conductor, and a ventilated cavity formed between the cooling conductor and the inner wall of the housing on this side is called a refrigeration cavity, the heating surface of the semiconductor refrigeration sheet is in contact with the heat sink, and a ventilated cavity formed between the heat sink and the inner wall of the housing on this side is called a heating cavity; or

[0006] The heat dissipating element or cooling element is a through structure with a self-ventilated cavity, the internal space of the ventilation cavity of the heat dissipating element is a heating cavity, and the internal space of the ventilation cavity of the cooling element is a cooling cavity; or

[0007] Two or more cooling components are joined together to form a common ventilated cavity called a cooling cavity.

[0008] The first fan is arranged on the side frame body of the cooling element, and a first air inlet is arranged on the frame body near the first fan in a direction of the first air inlet, and a first air outlet is arranged on the far frame body near the cooling chamber relative to the first air inlet, and the second fan is arranged on the far frame body near the second fan in a direction of the heating chamber, and a second air outlet is arranged on the far frame body near the second fan in a direction of the heating chamber relative to the second air inlet, and a second air outlet is arranged on the far frame body near the heating chamber. The first air inlet, the first fan, the cooling chamber and the first air outlet form a through cold air channel in the frame body; the second air inlet, the second fan, the heating chamber and the second air outlet form a through hot air channel in the frame body, and the cold air channel and the hot air channel are isolated from each other in the frame body; the fluid output end of the flow increasing device is arranged towards the hot air channel.

[0009] As a preferred solution of the present invention, the flow-increasing device is a vortex cooler; the air inlet nozzle of the vortex cooler can be connected to an external pressure air source, the hot air end outlet of the vortex cooler is arranged outside the shell body, and the cold air end outlet of the vortex cooler is arranged toward the hot air channel, or the cold air end outlet of the vortex cooler is arranged toward the hot air channel after passing through a connecting pipe or a nozzle nozzle.

[0010] As a preferred embodiment of the present invention, the flow-increasing device includes a water source, an ultrasonic microporous atomizing sheet, and an ultrasonic atomizing control circuit. The ultrasonic atomizing control circuit is electrically connected to the main control integrated circuit board. The water source is arranged on the housing body near the heat dissipation cavity. A water permeable hole is provided at the bottom of the water source. The water absorption surface of the ultrasonic microporous atomizing sheet is arranged toward the water permeable hole, and the atomizing emission surface of the ultrasonic microporous atomizing sheet is arranged toward the inner side of the hot air channel. Or

[0011] A water permeable pipe connecting the water source body and the hot air channel is provided on the frame body. The ultrasonic microporous atomizer is arranged at one end of the water permeable pipe leading to the hot air channel. The water absorption surface of the ultrasonic microporous atomizer faces the water permeable pipe, and the atomization emission surface of the ultrasonic microporous atomizer is arranged toward the inner side of the hot air channel. The other end of the water permeable pipe is connected to the water permeable hole on the water source body.

[0012] As a preferred embodiment of the present invention, the flow increasing device includes an air pump, a water pipe, an air tube, a two-fluid nozzle and a water source. The air pump is electrically connected to the main control integrated circuit board. The gas input interface of the two-fluid nozzle is connected to the air outlet of the air pump through the air tube. The liquid input interface of the two-fluid nozzle is connected to the water source through the water pipe. The nozzle of the two-fluid nozzle is arranged toward the hot air channel; or

[0013] The water source body is provided with a water hole and two air holes. The liquid input interface of the two-fluid nozzle is connected to the water hole of the water source body through a water pipe. The gas input interface of the two-fluid nozzle is connected to one air hole of the water source body through an air pipe. The other air hole of the water source body is connected to the air outlet of the air pump through another air pipe; or

[0014] The flow-increasing device includes an air pump, an air pipe, a mixed fluid nozzle, a three-way sleeve and a water source. The air pump is electrically connected to the main control integrated circuit board. The air outlet of the air pump is connected to the mixed fluid nozzle through the air pipe. The middle position of the air pipe is connected to the two passage openings of the three-way sleeve. The third passage opening of the three-way sleeve is connected to the water permeable hole set on the water source.

[0015] As a preferred solution of the present invention, the first fan is a cross-flow fan, the impeller of the cross-flow fan is arranged in the refrigeration chamber, and a wind-gathering buckle tile structure is arranged in the refrigeration chamber around the impeller of the cross-flow fan. The wind-gathering buckle tile structure is coaxially arranged with the cross-flow fan impeller and has a similar length. The upper and lower coaxial arc lines of the inner wall of the wind-gathering buckle tile structure are close to the arc line of the outer diameter of the cross-flow fan impeller and maintain a uniform gap; the wind-gathering buckle tile structure is respectively provided with a first ventilation gap and a second ventilation gap at the position facing the first air inlet and the first air outlet, and a part of the cold guide member extends to the first ventilation gap or the second ventilation gap of the wind-gathering buckle tile structure, and the first ventilation gap and the second ventilation gap still maintain smooth ventilation in the cold air channel.

[0016] As a preferred solution of the present invention, the frame body also includes a detachably connected rotating base, which includes a fixed base body, a rotating drive motor and a rotating split body connected to the rotor of the rotating drive motor. The rotating drive motor is electrically connected to the main control integrated circuit board through a male and female socket, or through contact terminals, or through a wireless charging transmitter and receiver module, or through a flexible cable connection.

[0017] As a preferred solution of the present invention, the flow-increasing device is arranged on the rotating split of the rotating base, the flow-increasing device is electrically connected to the rotating drive motor, and the rotating split is also provided with an exposed docking portion. When the main body of the air conditioner and heater is placed on the rotating base, the exposed docking portion of the rotating split is close to the second air inlet or to a docking window additionally provided on the side wall of the heating chamber. The fluid emitting end of the flow-increasing device is arranged on the exposed docking portion and supplies fluid toward the hot air channel.

[0018] As a preferred solution of the present invention, the water source body of the flow-increasing device is a built-in water storage chamber or an external bottle cap structure. The side of the external bottle cap structure containing the internal thread is arranged outside the shell body, and the external bottle cap structure can be connected to an external water bottle or an external water pipe.

[0019] A cooling and heating fan, comprising a housing, a semiconductor refrigeration module, an electric heating component, a high-speed fan, an air induction and air conditioning structure, a main control integrated circuit board and a power supply component; the semiconductor refrigeration module, the electric heating component, the high-speed fan and the main control integrated circuit board are arranged on the housing and electrically connected to the power supply component; the semiconductor refrigeration module comprises a semiconductor refrigeration sheet, a heat sink and a cooling conductor; the cooling surface of the semiconductor refrigeration sheet is fitted with the cooling conductor, and a ventilated cavity formed between the cooling conductor and the inner wall of the housing on this side is called a refrigeration cavity; the heating surface of the semiconductor refrigeration sheet is fitted with the heat sink, and a ventilated cavity formed between the heat sink and the inner wall of the housing on this side is called a heating cavity; or

[0020] The heat dissipating element or cooling element is a through structure with a self-ventilated cavity, the internal space of the ventilation cavity of the heat dissipating element is a heating cavity, and the internal space of the ventilation cavity of the cooling element is a cooling cavity; or

[0021] Two or more cooling components are joined together to form a common ventilated cavity called a cooling cavity.

[0022] The high-speed fan is arranged in the extension direction of the hot and cold parting surface of the semiconductor refrigeration module, and an induced draft air regulating structure is arranged between the high-speed fan and the semiconductor refrigeration module. The air blown by the high-speed fan passes through the cavity of the induced draft air regulating structure and then blows toward the heating cavity or the cooling cavity. An air inlet is arranged on the frame body close to the high-speed fan and away from the induced draft air regulating structure, a first air outlet is arranged on the frame body on one side close to the cooling cavity and away from the induced draft air regulating structure, and a second air outlet is arranged on the frame body on the other side close to the heating cavity and away from the induced draft air regulating structure. The first air outlet and the second air outlet are arranged in different directions; the electric heating component is arranged on the frame body close to the heating cavity and not in direct contact with the heat sink.

[0023] In a preferred embodiment of the present invention, the electric heating component is an electric heating wire component, a PTC thermistor heating component, an NTC thermistor heating component, or a PTCR thermistor heating component.

[0024] As a preferred solution of the present invention, the air induction and air adjustment structure is a split shell body with a double-channel inner cavity extending from the cavity wall of the heating cavity and the cooling cavity toward the high-speed fan, one channel of which guides the air blown by the high-speed fan to the cooling cavity, and the other channel of which guides the air blown by the high-speed fan to the heating cavity, or,

[0025] The air induction and air regulation structure is a retaining wall on the housing body of the fixed high-speed blower, extending toward the hot and cold parting surface of the semiconductor refrigeration module. The retaining wall divides the cavity between the high-speed blower and the semiconductor refrigeration module into two, which are connected to the cooling cavity and the heating cavity respectively.

[0026] The air induction and air adjustment structure is a herringbone or conical diversion structure frame body provided at the bifurcation of the heating cavity and the cooling cavity in the frame body, the small end of the herringbone or conical diversion structure frame body is directed toward the high-speed fan, and the large end of the herringbone or conical structure frame body is directed toward the direction where the heating cavity and the cooling cavity are located, or,

[0027] The air induction and air regulation structure is a hollow shell frame with a rotatable diverter baffle in the middle. The amount of air flowing into the refrigeration chamber and the heating chamber can be adjusted by rotating the diverter baffle in the middle.

[0028] As a preferred solution of the present invention, the frame body also includes a sleeve; the sleeve is detachably connected to the second air outlet of the frame body through a splicing mechanism, and the splicing mechanism is a bolt and nut correspondingly arranged at the second air outlet and the sleeve frame body, or a magnet, or a magnet and an iron piece, or a tightening thread with matching inner and outer spirals, or a spring-loaded buckle and a slot.

[0029] As a preferred solution of the present invention, the electric heating component is arranged on the sleeve, and the electric heating component is electrically connected to the main control integrated circuit board through a male and female socket, or through contact terminals, or through a wireless charging transmitter and receiver module, or through a flexible cable connection.

[0030] As a preferred solution of the present invention, the shell frame can be detachably connected to other devices through a zipper, a button, or a Velcro; the part of the structure where the zipper, the button, or the Velcro is located on the shell frame is fixed to the shell frame by nailing, sewing, or pressing with a plastic plate.

[0031] As a preferred solution of the present invention, the heat dissipating member and the cooling conducting member are respectively metal heat sinks, or are respectively non-metallic structural members; or

[0032] The heat dissipation element and the cooling conduction element are respectively a combination of a metal heat sink and a condenser; or

[0033] The heat dissipation component and the cooling conduction component are respectively assemblies of a non-metallic structural component and a condenser.

[0034] A negative ion generator component is provided on the side frame of the heating chamber, and the negative ion generator component is electrically connected to the main control integrated circuit board.

[0035] A humidifying device is provided on the side frame of the refrigeration chamber. The humidifying device includes a water storage chamber, an ultrasonic microporous atomizing sheet and an ultrasonic circuit. A water permeable hole is provided at the bottom of the water storage chamber. The water absorption surface of the ultrasonic microporous atomizing sheet is connected to the water permeable hole of the water storage chamber. The water spraying surface of the ultrasonic microporous atomizing sheet is arranged toward the air inlet or the refrigeration chamber.

[0036] The beneficial effects of the present invention are as follows: the present invention has a reasonable structural design, adopts a semiconductor refrigeration module for cooling, and cleverly arranges the positions of the semiconductor refrigeration fins, heat dissipation components, and cold conduction components in the shell body to form independent heating and cooling chambers, effectively improving the heat dissipation effect and thus improving the cooling effect; in addition, a flow-increasing device is added to further accelerate the cooling effect of the heating chamber, rather than directly acting on the cooling chamber. On the basis of ensuring the improvement of the cooling effect, it will not cause health problems. An electric heating component can also be added to increase the hot air blowing function to meet different usage needs.

[0037] The present invention will be further described below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic diagram of the three-dimensional structure of Example 1 of the present utility model.

[0039] Figure 2 This is a schematic diagram of the decomposition structure of Example 1 of the present utility model Figure 1 .

[0040] Figure 3 This is a schematic diagram of the decomposition structure of Example 1 of the present utility model Figure 2 .

[0041] Figure 4 It is a schematic diagram of the three-dimensional structure of Example 2 of the present utility model.

[0042] Figure 5 This is a schematic diagram of the decomposition structure of Example 2 of the present utility model Figure 1 .

[0043] Figure 6 This is a schematic diagram of the decomposition structure of Example 2 of the present utility model Figure 2 .

[0044] Figure 7 It is a schematic diagram of the three-dimensional structure of Example 3 of the present utility model.

[0045] Figure 8 This is a schematic diagram of the decomposition structure of Example 3 of the present utility model Figure 1 .

[0046] Figure 9 This is a schematic diagram of the decomposition structure of Example 3 of the present utility model Figure 2 .

[0047] Figure 10 It is a schematic diagram of the three-dimensional structure of Example 4 of the present utility model.

[0048] Figure 11 This is a schematic diagram of the decomposition structure of Example 4 of the present utility model Figure 1 .

[0049] Figure 12 This is a schematic diagram of the decomposition structure of Example 4 of the present utility model Figure 2 .

[0050] Figure 13 It is a schematic diagram of the three-dimensional structure of Example 5 of the present utility model.

[0051] Figure 14 It is a schematic diagram of the three-dimensional structure of Example 6 of the present utility model.

[0052] Figure 15 It is a schematic cross-sectional structural diagram of Example 6 of the present utility model.

[0053] Figure 16 It is a schematic diagram of the decomposition structure of Example 6 of the present utility model.

[0054] Figure 17 It is a schematic diagram of the three-dimensional structure of Example 7 of the present utility model. DETAILED DESCRIPTION

[0055] Example 1, see Figure 1 、 Figure 2 and Figure 3 This embodiment provides a cooling and heating fan, comprising a housing 1, a semiconductor cooling module 3, a flow increasing device 4, a first fan 5, a second fan 6, a main control integrated circuit board 7, and a power supply assembly 8. The power supply assembly 8 is a battery. The heat sink 32 and the cooling conductor 33 may each be a metal heat sink, or a non-metallic structural component; or the heat sink 32 and the cooling conductor 33 may each be a combination of a metal heat sink and a condenser; or the heat sink 32 and the cooling conductor 33 may each be a combination of a non-metallic structural component and a condenser.

[0056] The semiconductor refrigeration module 3 , the flow increasing device 4 , the first fan 5 , the second fan 6 and the main control integrated circuit board 7 are arranged on the housing 1 and electrically connected to the power supply assembly 8 .

[0057] The semiconductor refrigeration module 3 includes a semiconductor refrigeration plate 31, a heat sink 32 and a cooling conductor 33. The cooling surface of the semiconductor refrigeration plate 31 is in contact with the cooling conductor 33, and a ventilated cavity formed between the cooling conductor 33 and the inner wall of the shell frame on this side is called a refrigeration cavity. The heating surface of the semiconductor refrigeration plate 31 is in contact with the heat sink 32, and a ventilated cavity formed between the heat sink 32 and the inner wall of the shell frame on this side is called a heating cavity. In other embodiments, the heat sink 32 or the cooling conductor 33 can also be a through structure with a ventilated cavity. The internal space of the ventilation cavity of the heat sink 32 is the heating cavity, and the internal space of the ventilation cavity of the cooling conductor 33 is the refrigeration cavity. Or two or more cooling conductors 33 can be spliced together to form a common ventilated cavity called a refrigeration cavity.

[0058] The first fan 5 is disposed on a housing body lateral to the cooling element 33. A first air inlet 11 is disposed on the housing body near the first fan 5. A first air outlet 12 is disposed on the housing body distal to the first air inlet 11, spaced from the first fan 5 and the cooling element 33 and close to the refrigeration chamber. Preferably, the first fan 5 is a cross-flow fan, the impeller of which is disposed within the refrigeration chamber.

[0059] The second fan 6 is arranged on the housing body on the heating chamber side, and a second air inlet 13 is provided on the housing body near the second fan 6. A second air outlet 14 is provided on the far end of the housing body, which is separated from the second fan 6 and the heating chamber and close to the heating chamber relative to the second air inlet 13. The first air inlet 11, the first fan 5, the cooling chamber and the first air outlet 12 form a continuous cold air channel in the housing body 1;

[0060] The second air inlet 13, the second fan 6, the heating chamber and the second air outlet 14 form a continuous hot air channel in the housing 1, and the cold air channel and the hot air channel are isolated from each other in the housing;

[0061] The fluid output end of the flow-increasing device 4 is positioned toward the hot air passage. In this embodiment, the flow-increasing device 4 includes an air pump 41, a water pipe 42, an air tube 43, a two-fluid nozzle 44, and a water source 45. The air pump is electrically connected to the main control integrated circuit board 7. The gas input interface of the two-fluid nozzle is connected to the air outlet of the air pump via the air tube, and the liquid input interface of the two-fluid nozzle is connected to the water source via the water pipe. The nozzle of the two-fluid nozzle is positioned toward the hot air passage, forming the fluid output end. The water vapor ejected from the fluid output end of the flow-increasing device 4 accelerates the cooling effect of the heating chamber, rather than directly affecting the cooling chamber. This ensures improved cooling effect without causing health problems.

[0062] Alternatively, the water source body is provided with a water-permeable hole and two air-permeable holes, the liquid input interface of the two-fluid nozzle is connected to the water-permeable hole of the water source body via a water pipe, the gas input interface of the two-fluid nozzle is connected to one air-permeable hole of the water source body via an air pipe, and the other air-permeable hole of the water source body is connected to the air outlet of the air pump via another air pipe. In other embodiments, the flow-increasing device 4 may also include an air pump, an air pipe, a mixed fluid nozzle, a three-way sleeve, and a water source body, the air pump being electrically connected to the main control integrated circuit board 7, the air outlet of the air pump being connected to the mixed fluid nozzle via an air pipe, the middle position of the air pipe being connected to the two access ports of the three-way sleeve, and the third access port of the three-way sleeve being connected to the water-permeable hole provided on the water source body.

[0063] The water source body can be a built-in water storage cavity or an external bottle cap structure. The side of the external bottle cap structure containing the internal thread is arranged outside the shell frame, and the external bottle cap structure can be connected to an external water bottle or an external water pipe.

[0064] Alternatively, a negative ion generator assembly is provided on the side frame of the heating chamber, and the negative ion generator assembly is electrically connected to the main control integrated circuit board.

[0065] Alternatively, a humidifying device is provided on the side frame of the refrigeration chamber, and the humidifying device includes a water storage chamber, an ultrasonic microporous atomizing sheet and an ultrasonic circuit thereof. A water permeable hole is provided at the bottom of the water storage chamber, the water absorption surface of the ultrasonic microporous atomizing sheet is connected to the water permeable hole of the water storage chamber, and the water spraying surface of the ultrasonic microporous atomizing sheet is arranged toward the air inlet or the refrigeration chamber.

[0066] Example 2, see Figure 4 、 Figure 5 and Figure 6 The present embodiment provides a cooling and heating fan, which is basically similar in structure to that of the first embodiment, except that: the number of the semiconductor cooling fins 31 is six, which are divided into two groups. The number of the heat sinks 32 is two. There are two first fans 6, which are symmetrically arranged on the housing body 1. The cooling member 33 is a through structure with a self-ventilated cavity, and the internal space of the ventilation cavity of the cooling member 33 is a cooling cavity. The cooling surfaces of the two groups of semiconductor cooling fins 31 are in contact with the opposite sides of the cooling member 33. The flow increasing device 4 is a vortex cooler; the air inlet nozzle of the vortex cooler can be connected to an external pressure air source, the hot air outlet of the vortex cooler is arranged toward the outside of the housing body, and the cold air outlet of the vortex cooler is arranged toward the hot air channel, or the cold air outlet of the vortex cooler is arranged toward the hot air channel after passing through a connecting pipe or a nozzle. The air blown into the heating cavity is pre-cooled by the vortex cooler to improve the heat exchange effect, so as to obtain better temperature difference cooling.

[0067] Example 3, see Figure 7 、 Figure 8 and Figure 9 This embodiment provides a cooling and heating fan, which is basically similar in structure to that of embodiment 2, with the difference that the power supply component 8 is an external power supply. The number of the semiconductor refrigeration fins 31 is twelve, divided into four groups. The number of heat sinks 32 is four, and the number of the first fans 6 is four accordingly. The cooling member 33 is located at the center of the housing 1. The cooling member 33 is a through structure with a self-ventilated cavity. The four outer wall surfaces of the cooling member 33 are in contact with the cooling surfaces of the four groups of semiconductor refrigeration fins 31. The four heat sinks 32 are in contact with the heating surfaces of the four groups of semiconductor refrigeration fins 31, and the positions of the four first fans 6 corresponding to the four heat sinks 32 are arranged on the housing 1. The flow increasing device 4 in this embodiment is consistent with the structural principle of the flow increasing device 4 in embodiment 1.

[0068] Example 4, see Figure 10 、 Figure 11 and Figure 12The present embodiment provides a cooling and heating fan, which is basically similar in structure to that of the first embodiment, except that: a wind-gathering tile structure 51 is provided in the refrigeration chamber surrounding the impeller of the cross-flow fan, the wind-gathering tile structure 51 is coaxially arranged with the cross-flow fan impeller and has a similar length, the coaxial arc lines of the upper and lower inner walls of the wind-gathering tile structure 51 are close to the arc lines of the outer diameter of the cross-flow fan impeller and the gap is kept uniform; a first ventilation gap and a second ventilation gap are respectively provided on the wind-gathering tile structure 51 facing the first air inlet 11 and the first air outlet 12, a portion of the cooling member 33 extends to the first ventilation gap or the second ventilation gap of the wind-gathering tile structure 51, and the first ventilation gap and the second ventilation gap still maintain smooth ventilation in the cold air channel. The flow-increasing device 4 includes a water source body 45, an ultrasonic microporous atomizing sheet 46 and an ultrasonic atomizing control circuit. The ultrasonic atomizing control circuit 46 is electrically connected to the main control integrated circuit board 7. The water source body is arranged on the shell body near the heat dissipation cavity. A water permeable hole is provided at the bottom of the water source body. The water absorption surface of the ultrasonic microporous atomizing sheet is arranged toward the water permeable hole, and the atomizing emission surface of the ultrasonic microporous atomizing sheet is arranged toward the inner side of the hot air channel; or a water permeable pipeline connecting the water source body and the hot air channel is provided on the shell body, the ultrasonic microporous atomizing sheet is arranged at one end of the water permeable pipeline leading to the hot air channel, the water absorption surface of the ultrasonic microporous atomizing sheet is facing the water permeable pipeline, the atomizing emission surface of the ultrasonic microporous atomizing sheet is arranged toward the inner side of the hot air channel, and the other end of the water permeable pipeline is connected to the water permeable hole on the water source body.

[0069] Example 5, see Figure 13 This embodiment provides a flow-increasing heat dissipation cooling device, which has a structure substantially similar to that of Embodiment 3, differing in that the housing 1 further includes a detachably connectable rotating base 15. The rotating base 15 includes a fixed base, a rotating drive motor, and a rotating split connected to the rotor of the rotating drive motor. The rotating drive motor is electrically connected to the main control integrated circuit board 7 via a male and female socket, contact terminals, a wireless charging transmitter and receiver module, or a flexible flat cable connection. Furthermore, the flow-increasing device 4 can be disposed on the rotating split of the rotating base. The flow-increasing device 4 is electrically connected to the rotating drive motor. The rotating split also includes an exposed docking portion. When the main body of the cooling / heating fan is placed on the rotating base, the exposed docking portion of the rotating split is in close proximity to the second air inlet 13 or to a docking window provided on the side wall of the heating chamber. The fluid-emitting end of the flow-increasing device 4 is disposed on the exposed docking portion and supplies fluid into the hot air channel. In other embodiments, the shell frame may not adopt a rotating base structure, but may be detachably connected to other devices through a zipper, button, or Velcro; the part of the structure where the zipper, button, or Velcro is located on the shell frame is fixed to the shell frame by nailing, sewing, or pressing with plastic plates to meet different usage requirements.

[0070] Example 6, see Figure 14 、 Figure 15 and Figure 16 The present embodiment provides a cooling and heating fan, comprising a housing 1, a semiconductor refrigeration module 3, an electric heating component 9, a high-speed fan 10, an air induction and adjustment structure 20, a main control integrated circuit board 7 and a power supply component 8; the semiconductor refrigeration module 3, the electric heating component 9, the high-speed fan 10 and the main control integrated circuit board 7 are arranged on the housing 1 and electrically connected to the power supply component 8.

[0071] The semiconductor refrigeration module 3 includes a semiconductor refrigeration plate, a heat sink and a cooling conductor; the cooling surface of the semiconductor refrigeration plate is in contact with the cooling conductor, and the ventilated cavity formed between the cooling conductor and the inner wall of the shell frame on this side is called a refrigeration cavity; the heating surface of the semiconductor refrigeration plate is in contact with the heat sink, and the ventilated cavity formed between the heat sink and the inner wall of the shell frame on this side is called a heating cavity.

[0072] Alternatively, the heat sink 32 or the cooling conductor 33 is a through structure with a self-ventilated cavity, the internal space of the ventilation cavity of the heat sink 32 is a heating cavity, and the internal space of the ventilation cavity of the cooling conductor 33 is a cooling cavity; two or more cooling conductors 33 are spliced together to form a common ventilated cavity called a cooling cavity.

[0073] The heat dissipation component and the cooling conduction component are respectively metal heat sinks, or respectively non-metal structural components; or the heat dissipation component and the cooling conduction component are respectively a combination of a metal heat sink and a condenser; or the heat dissipation component and the cooling conduction component are respectively a combination of a non-metal structural component and a condenser.

[0074] The high-speed fan 10 is arranged in the extension direction of the hot and cold parting surface of the semiconductor refrigeration module 3. An air-inducing and air-regulating structure 20 is arranged between the high-speed fan 10 and the semiconductor refrigeration module 3. The air blown by the high-speed fan 10 passes through the cavity of the air-inducing and air-regulating structure 20 and then blows toward the heating cavity or the cooling cavity. Specifically, the air-inducing and air-regulating structure 20 is a diverter housing body with a double-channel inner cavity extending from the cavity wall of the heating cavity and the cooling cavity toward the high-speed fan 10. One channel guides the air blown by the high-speed fan 10 toward the cooling cavity, and the other channel guides the air blown by the high-speed fan 10 toward the heating cavity. Alternatively, the air-inducing and air-regulating structure 20 is a retaining wall extending toward the hot and cold parting surface of the semiconductor refrigeration module on the housing body on which the high-speed fan 10 is fixed. The retaining wall divides the cavity between the high-speed blower and the semiconductor refrigeration module into two, which are respectively connected to the cooling cavity and the heating cavity. The draft-inducing and air-regulating structure 20 is a "human"-shaped or conical diversion structure frame body arranged at the bifurcation of the heating chamber and the cooling chamber in the frame body, the small end of the "human"-shaped or conical diversion structure frame body faces the high-speed fan 10, and the large end of the "human"-shaped or conical structure frame body is arranged in the direction where the heating chamber and the cooling chamber are located. Alternatively, the draft-inducing and air-regulating structure 20 is a hollow frame body with a rotatable diversion baffle in the middle, and the amount of air flowing to the cooling chamber and the heating chamber can be adjusted by rotating the diversion baffle in the middle.

[0075] An air inlet 16 is provided on the frame body close to the high-speed fan 10 and away from the induced draft and air regulating structure 20, a first air outlet 12 is provided on one side of the frame body close to the refrigeration chamber and away from the induced draft and air regulating structure 20, and a second air outlet 14 is provided on the other side of the frame body close to the heating chamber and away from the induced draft and air regulating structure 20. The first air outlet 12 and the second air outlet 14 are provided in different directions.

[0076] The electric heating component 9 is disposed on the housing body near the heating chamber and is not in direct contact with the heat sink 32. In this embodiment, the electric heating component 9 is an electric heating wire component. In other embodiments, the electric heating component 9 may also be a PTC thermistor heating component, an NTC thermistor heating component, or a PTCR thermistor heating component.

[0077] Example 7, see Figure 17This embodiment provides a cooling and heating fan, which is basically similar in structure to that of embodiment 6, with the difference that: the frame body 1 also includes a sleeve 17; the sleeve 17 is detachably connected to the second air outlet of the frame body through a splicing mechanism. In this embodiment, the splicing mechanism is a magnet 18 correspondingly arranged at the second air outlet 12 and the sleeve 17 frame body. In other embodiments, the splicing mechanism can also be a bolt and a nut, or a magnet and an iron piece, or a tightening thread with matching inner and outer spirals, or a spring-loaded buckle and a slot. The electric heating component 9 can also be arranged on the sleeve 17, and the electric heating component 9 can be electrically connected to the main control integrated circuit board 7 through a male and female socket, or through contact terminals, or through a wireless charging transmitter and receiver module, or through a flexible cable connection. In addition, the frame body can also be installed on other devices. For example, the shell frame can be detachably connected to other devices through a zipper, button, or Velcro; the part of the structure where the zipper, button, or Velcro is located on the shell frame is fixed to the shell frame by nailing, sewing, or pressing with plastic plates to meet different usage requirements.

[0078] The above embodiments are only preferred implementation methods of the present invention. The present invention cannot list all implementation methods one by one. Any technical solution that adopts one of the above embodiments, or equivalent changes made based on the above embodiments, are within the protection scope of the present invention.

[0079] Based on the disclosure and teachings of the above description, those skilled in the art to which the present invention belongs can also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although some specific terms are used in this specification, these terms are only for convenience of description and do not constitute any limitation to the present invention. As described in the above embodiments of the present invention, other fans obtained by using the same or similar structures are all within the scope of protection of the present invention.

Claims

1. A cooling and heating fan, characterized in that: It includes a housing, a semiconductor refrigeration module, a flow increasing device, a first fan, a second fan, a main control integrated circuit board and a power supply component; The semiconductor refrigeration module, the flow increasing device, the first fan, the second fan and the main control integrated circuit board are arranged on the housing and electrically connected to the power supply assembly; The semiconductor refrigeration module includes a semiconductor refrigeration plate, a heat sink and a cooling conductor. The cooling surface of the semiconductor refrigeration plate is in contact with the cooling conductor, and a ventilated cavity formed between the cooling conductor and the inner wall of the shell frame on this side is called a refrigeration cavity. The heating surface of the semiconductor refrigeration plate is in contact with the heat sink, and a ventilated cavity formed between the heat sink and the inner wall of the shell frame on this side is called a heating cavity. The heat dissipating element or cooling element is a through structure with a self-ventilated cavity, the internal space of the ventilation cavity of the heat dissipating element is a heating cavity, and the internal space of the ventilation cavity of the cooling element is a cooling cavity; or Two or more cooling components are joined together to form a common ventilated cavity called a cooling cavity. The first fan is provided on the housing body at the side of the cooling member, a first air inlet is provided on the housing body near the first fan, a first air outlet is provided on the distal housing body which is spaced apart from the first fan and the cooling member and close to the refrigeration chamber relative to the first air inlet, a second fan is provided on the housing body at the side of the heating chamber, a second air inlet is provided on the housing body near the second fan, a second air outlet is provided on the distal housing body which is spaced apart from the second fan and the heating chamber relative to the second air inlet and close to the heating chamber, the first air inlet, the first fan, the refrigeration chamber and the first air outlet forming a continuous cold air channel in the housing body; The second air inlet, the second fan, the heating chamber and the second air outlet form a continuous hot air channel in the housing body, and the cold air channel and the hot air channel are isolated from each other in the housing body; The fluid output end of the flow increasing device is arranged toward the hot air channel.

2. The cooling and heating fan according to claim 1, characterized in that: The flow-increasing device is a vortex cooler; the air inlet nozzle of the vortex cooler can be connected to an external pressure air source, the hot air outlet of the vortex cooler is arranged outside the shell body, and the cold air outlet of the vortex cooler is arranged toward the hot air channel, or the cold air outlet of the vortex cooler is arranged toward the hot air channel after passing through a connecting pipe or a nozzle.

3. The cooling and heating fan according to claim 1, characterized in that: The flow-increasing device includes a water source, an ultrasonic microporous atomizing sheet, and an ultrasonic atomizing control circuit. The ultrasonic atomizing control circuit is electrically connected to the main control integrated circuit board. The water source is arranged on the housing body near the heat dissipation cavity. A water permeable hole is provided at the bottom of the water source. The water absorption surface of the ultrasonic microporous atomizing sheet is arranged toward the water permeable hole. The atomizing emission surface of the ultrasonic microporous atomizing sheet is arranged toward the inner side of the hot air channel. A water permeable pipe connecting the water source body and the hot air channel is provided on the frame body. The ultrasonic microporous atomizer is arranged at one end of the water permeable pipe leading to the hot air channel. The water absorption surface of the ultrasonic microporous atomizer faces the water permeable pipe, and the atomization emission surface of the ultrasonic microporous atomizer is arranged toward the inner side of the hot air channel. The other end of the water permeable pipe is connected to the water permeable hole on the water source body.

4. The cooling and heating fan according to claim 1, characterized in that: The flow-increasing device includes an air pump, a water pipe, an air tube, a two-fluid nozzle and a water source, the air pump is electrically connected to the main control integrated circuit board, the gas input interface of the two-fluid nozzle is connected to the air outlet of the air pump through the air tube, the liquid input interface of the two-fluid nozzle is connected to the water source through the water pipe, and the nozzle of the two-fluid nozzle is arranged toward the hot air channel; or The water source body is provided with a water hole and two air holes. The liquid input interface of the two-fluid nozzle is connected to the water hole of the water source body through a water pipe. The gas input interface of the two-fluid nozzle is connected to one air hole of the water source body through an air pipe. The other air hole of the water source body is connected to the air outlet of the air pump through another air pipe; or The flow-increasing device includes an air pump, an air pipe, a mixed fluid nozzle, a three-way sleeve and a water source. The air pump is electrically connected to the main control integrated circuit board. The air outlet of the air pump is connected to the mixed fluid nozzle through the air pipe. The middle position of the air pipe is connected to the two passage openings of the three-way sleeve. The third passage opening of the three-way sleeve is connected to the water permeable hole set on the water source.

5. The cooling and heating fan according to claim 1, characterized in that: The first fan is a cross-flow fan, the impeller of the cross-flow fan is arranged in the refrigeration chamber, and a wind-gathering tile structure is arranged in the refrigeration chamber around the impeller of the cross-flow fan. The wind-gathering tile structure is coaxially arranged with the cross-flow fan impeller and has a similar length. The coaxial arc line of the inner wall of the wind-gathering tile structure is close to the arc line of the outer diameter of the cross-flow fan impeller, and the gap is kept uniform. A first ventilation gap and a second ventilation gap are respectively provided on the wind-gathering buckle tile structure at positions facing the first air inlet and the first air outlet. A portion of the cooling member extends to the first ventilation gap or the second ventilation gap of the wind-gathering buckle tile structure. The first ventilation gap and the second ventilation gap still maintain smooth ventilation in the cold air channel.

6. The cooling and heating fan according to claim 1, characterized in that: The housing also includes a detachably connected rotating base, which includes a fixed base, a rotating drive motor, and a rotating split connected to the rotor of the rotating drive motor. The rotating drive motor is electrically connected to the main control integrated circuit board through a male and female socket, or through contact terminals, or through a wireless charging transmitter and receiver module, or through a flexible cable connection.

7. The cooling and heating fan according to claim 6, characterized in that: The flow-increasing device is arranged on the rotating split of the rotating base, and the flow-increasing device is electrically connected to the rotating drive motor. The rotating split is also provided with an exposed docking portion. When the main body of the air conditioner and heater is placed on the rotating base, the exposed docking portion of the rotating split is close to the second air inlet or to a docking window additionally provided on the side wall of the heating chamber. The fluid emission end of the flow-increasing device is arranged on the exposed docking portion and supplies fluid toward the hot air channel.

8. The cooling and heating fan according to any one of claims 3, 4, and 7, characterized in that: The water source of the flow-increasing device is a built-in water storage chamber or an external bottle cap structure. The side of the external bottle cap structure containing the internal thread is arranged outside the shell frame. The external bottle cap structure can be connected to an external water bottle or an external water pipe.

9. A cooling and heating fan, characterized in that: It includes a shell frame, semiconductor refrigeration module, electric heating component, high-speed fan, air induction and air adjustment structure, main control integrated circuit board and power supply component; The semiconductor refrigeration module, electric heating component, high-speed fan and main control integrated circuit board are arranged on the housing and electrically connected to the power supply component; The semiconductor refrigeration module includes a semiconductor refrigeration sheet, a heat dissipation element and a cooling element; The cooling surface of the semiconductor refrigeration plate is in contact with the cooling element, and the ventilated cavity formed between the cooling element and the inner wall of the housing is called a cooling cavity. The heating surface of the semiconductor refrigeration plate is in contact with the heat sink, and the ventilated cavity formed between the heat sink and the inner wall of the shell frame on this side is called a heating cavity; or The heat dissipating element or cooling element is a through structure with a self-ventilated cavity, the internal space of the ventilation cavity of the heat dissipating element is a heating cavity, and the internal space of the ventilation cavity of the cooling element is a cooling cavity; or Two or more cooling components are joined together to form a common ventilated cavity called a cooling cavity. The high-speed fan is arranged in the extension direction of the hot and cold parting surface of the semiconductor refrigeration module, an induced air flow regulating structure is arranged between the high-speed fan and the semiconductor refrigeration module, an air inlet is arranged on the housing body close to the high-speed fan and away from the induced air flow regulating structure, a first air outlet is arranged on the housing body on one side close to the refrigeration cavity and away from the induced air flow regulating structure, and a second air outlet is arranged on the other side close to the heating cavity and away from the induced air flow regulating structure, and the first air outlet and the second air outlet are arranged in different directions; The electric heating component is arranged on the housing body close to the heating cavity and is not in direct contact with the heat dissipation element.

10. The cooling and heating fan according to claim 9, characterized in that: The electric heating component may be an electric heating wire component, a PTC thermistor heating component, an NTC thermistor heating component, or a PTCR thermistor heating component.

11. The cooling and heating fan according to claim 9, characterized in that: The air induction and air adjustment structure is a split shell body with a double-channel inner cavity extending from the cavity wall of the heating cavity and the cooling cavity toward the high-speed fan, one channel of which guides the air blown by the high-speed fan to the cooling cavity, and the other channel of which guides the air blown by the high-speed fan to the heating cavity, or, The air induction and air regulation structure is a retaining wall on the housing body of the fixed high-speed blower, extending toward the hot and cold parting surface of the semiconductor refrigeration module. The retaining wall divides the cavity between the high-speed blower and the semiconductor refrigeration module into two, which are connected to the cooling cavity and the heating cavity respectively. The air induction and air adjustment structure is a "human" shaped or conical diversion structure frame body provided at the bifurcation of the heating cavity and the cooling cavity in the frame body, the small end of the "human" shaped or conical diversion structure frame body is directed toward the high-speed fan, and the large end of the "human" shaped or conical structure frame body is directed toward the direction where the heating cavity and the cooling cavity are located, or, The air induction and air regulation structure is a hollow shell frame with a rotatable diverter baffle in the middle. The amount of air flowing into the refrigeration chamber and the heating chamber can be adjusted by rotating the diverter baffle in the middle.

12. The cooling and heating fan according to claim 9, characterized in that: The housing body also includes a sleeve; the sleeve is detachably connected to the second air outlet of the housing body through a splicing mechanism, and the splicing mechanism is a bolt and a nut correspondingly arranged at the second air outlet and the sleeve housing body, or a magnet, or a magnet and an iron piece, or a tightening thread with matching inner and outer spirals, or a spring-loaded buckle and a slot; The electric heating component is arranged on the sleeve, and the electric heating component is electrically connected to the main control integrated circuit board through a male and female socket, or through contact terminals, or through a wireless charging transmitting and receiving module, or through a flexible cable connection.

13. The cooling and heating fan according to claim 9, characterized in that: A negative ion generator component is provided on the side frame of the heating chamber, and the negative ion generator component is electrically connected to the main control integrated circuit board.

14. The cooling and heating fan according to claim 9, characterized in that: A humidifying device is provided on the side frame of the refrigeration chamber. The humidifying device includes a water storage chamber, an ultrasonic microporous atomizing sheet and an ultrasonic circuit. A water permeable hole is provided at the bottom of the water storage chamber. The water absorption surface of the ultrasonic microporous atomizing sheet is connected to the water permeable hole of the water storage chamber. The water spraying surface of the ultrasonic microporous atomizing sheet is arranged toward the air inlet or the refrigeration chamber.

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