Vertical probe card with anti-drop structure

Abstract

The utility model discloses a vertical probe card with an anti-drop structure, which relates to the technical field of probe cards, and comprises a mounting body connected with a mounting seat in a matching manner, a fixing assembly arranged between the mounting seat and the mounting body in a matching manner, and a probe card mechanism used for testing a semiconductor wafer, a moving cavity is formed in the mounting body, the probe card mechanism comprises a fixing piece which is in sliding fit with the interior of the moving cavity, the bottom surface of the fixing piece is fixedly connected with a detection needle head, a through hole which is in sliding fit with the detection needle head is formed in the lower end of the moving cavity, and the detection needle head extends to the position below the mounting body through the through hole. When the device is used, the detection needle head is in contact with the wafer under the action of gravity, so that the abrasion of the wafer to the detection needle head is reduced to the greatest extent, no elastic component is arranged in the whole process, elastic fatigue is avoided, and the service life of the device is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of probe cards, in particular to a vertical probe card with an anti-drop structure. Background Art

[0002] A probe card is a key component used in semiconductor wafer testing, primarily responsible for performing preliminary electrical performance measurements and screening defective chips before chip packaging. A special type of probe card is a vertical probe card, in which the probe needles are perpendicular to the substrate. The short needle structure makes vertical contact with the device, making it particularly suitable for testing fine-pitch, high-frequency chips. It is primarily used for multi-die testing, especially for testing logic products.

[0003] A Chinese patent with announcement number CN221572654U discloses a vertical probe card with an anti-slip structure. The working principle of this structure is: the needle is driven to contact the wafer product, and the pressure generated pushes the needle up and compresses the second spring. At the same time, the needle pushes the connection part to move horizontally through the inclined surface and compresses the first spring, thereby buffering the needle, reducing the pressure when the needle contacts the product, and preventing the probe from falling off due to pressure. When the needle is separated from the wafer, under the action of the first spring and the second spring, the connection part and the needle are reset to proceed with the detection of the next wafer.

[0004] The shortcomings of the existing technical solution are that: all probes are provided with a first spring and a second spring. When each group of probes is in use, the first spring and the second spring are used to squeeze the probes. After long-term use, the first spring and the second spring are prone to elastic fatigue, which will cause some probes to be unable to accurately reach and contact the wafer when trying to contact the wafer surface due to insufficient spring restoring force, thereby affecting the use effect. Utility Model Content

[0005] The purpose of the utility model is to provide a vertical probe card with an anti-drop structure to solve the technical problem in the prior art that when the probe is in use, its elastic component is prone to elastic fatigue, thereby affecting the detection effect.

[0006] The technical problem to be solved by the present invention can be achieved through the following technical solutions:

[0007] A vertical probe card with an anti-slip structure includes a mounting body connected to a mounting seat, a fixing component is provided between the mounting seat and the mounting body, and the device also includes a probe card mechanism for testing semiconductor wafers, a movable cavity is provided inside the mounting body, the probe card mechanism includes a fixing plate that slides inside the movable cavity, a detection needle is fixedly connected to the bottom surface of the fixing plate, a through hole that slides with the detection needle is provided at the lower end of the movable cavity, and the detection needle extends to the bottom of the mounting body through the through hole, and a monitoring component for detecting the position of the fixing plate is provided at the bottom of the movable cavity.

[0008] As a further solution of the present invention: the monitoring component includes a voltage sensor fixedly arranged at the bottom of the moving cavity.

[0009] As a further solution of the present invention: the height of the movable cavity is not less than the height of the entire probe card mechanism.

[0010] As a further solution of the present invention: the fixing assembly includes a connecting plate fixedly connected to the mounting body, a card interface is provided on the connecting plate, and a card connector that matches the card interface is fixedly connected to the mounting seat.

[0011] As a further solution of the present invention: a limiting piece is fixedly connected to the mounting body, and a limiting groove cooperating with the limiting piece is provided on the mounting seat.

[0012] As a further solution of the present invention: the inner wall of the movable cavity is coated with an insulating layer that matches the fixed sheet.

[0013] Beneficial effects of the utility model:

[0014] 1. When the present invention is in use, when the wafer is placed in the specified position below the detection needle, the mounting seat will drive the mounting body to descend, and then drive the fixed plate and the detection needle to descend until the lower end of the detection needle contacts the surface of the wafer. At this time, the mounting seat will continue to drive the mounting body to descend. Due to the support of the detection needle, the fixed plate leaves the bottom surface of the movable cavity. At this time, the voltage sensor cannot detect the voltage on the fixed plate, and the downward movement of the mounting seat can be paused to maintain the position of the detection needle and the mounting body. The current on the fixed plate will flow to the inside of the wafer under the action of the detection needle, thereby realizing the detection of the wafer. During the whole process, the detection needle contacts the wafer under the action of gravity, thereby minimizing the wear of the wafer on the detection needle itself, and no elastic component is provided during the whole process, and elastic fatigue will not occur, thereby improving the service life of the device.

[0015] 2. When the utility model is in use, after the mounting body is removed from the mounting base, the mounting body can be rotated so that the through hole faces upward, and the fixing plate falls to the other end of the movable cavity under the action of gravity, thereby driving the detection needle into the movable cavity, completing the storage of the detection needle and avoiding damage to the detection needle caused by external force impact. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings.

[0017] Figure 1 This is a schematic diagram of the structure of the mounting body and mounting base of the utility model;

[0018] Figure 2 This is a schematic diagram of the overall structure of the installation body of the utility model;

[0019] Figure 3 This is a schematic diagram of the longitudinal section structure of the installation body of the utility model;

[0020] Figure 4 This is a schematic diagram of the probe card mechanism structure of the utility model.

[0021] In the figure: 1. Mounting seat; 2. Probe card mechanism; 201. Fixing plate; 202. Detection needle; 3. Card connector; 4. Mounting body; 5. Connecting plate; 6. Card interface; 7. Limiting plate; 8. Limiting groove; 9. Moving cavity; 10. Voltage sensor; 11. Through hole. DETAILED DESCRIPTION

[0022] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] like Figures 1-4As shown, a vertical probe card with an anti-slip structure includes a mounting body 4 that is connected to a mounting base 1, a fixing assembly is provided between the mounting base 1 and the mounting body 4, and a lifting assembly is provided on the mounting base 1 to drive the mounting base 1 to move up and down. The fixing assembly includes a connecting plate 5 fixedly connected to the mounting body 4, a card interface 6 is provided on the connecting plate 5, and a card connector 3 that cooperates with the card interface 6 is fixedly connected to the mounting base 1. When connecting the mounting base 1 and the mounting body 4, the card connector 3 on the mounting base 1 can be plugged into the card interface 6 on the mounting body 4, thereby realizing the connection between the mounting base 1 and the mounting body 4. A limiting plate 7 is fixedly connected to the mounting body 4, and a limiting groove 8 that cooperates with the limiting plate 7 is provided on the mounting base 1. After the mounting body 4 is connected to the mounting base 1, the limiting plate 7 on the mounting body 4 will slide into the limiting groove 8 on the mounting base 1, thereby improving the stability of the mounting body 4 after installation.

[0024] The device also includes a probe card mechanism 2 for testing semiconductor wafers. A movable cavity 9 is provided inside the mounting body 4. The probe card mechanism 2 includes a fixed plate 201 that slides in the movable cavity 9. The fixed plate 201 is electrically connected to a power supply. An insulating layer that matches the fixed plate 201 is coated on the inner wall of the movable cavity 9. A plurality of detection needles 202 arranged in a matrix are fixedly connected to the bottom surface of the fixed plate 201. A through hole 11 that slides in cooperation with the detection needle 202 is provided at the lower end of the movable cavity 9. The detection needle 202 extends to the bottom of the mounting body 4 through the through hole 11. Initially, the fixed plate 201 is directly below the movable cavity 9 under the action of gravity. At this time, the detection needle 202 extends to the bottom of the mounting body 4 through the through hole 11. When the wafer is placed under the detection needle 202 When the wafer is in the specified position, the mounting seat 1 will drive the mounting body 4 to descend, and then drive the fixing plate 201 and the detection needle 202 to descend until the lower end of the detection needle 202 contacts the surface of the wafer. At this time, the mounting seat 1 will continue to drive the mounting body 4 to descend. Due to the support of the detection needle 202, the fixing plate 201 leaves the bottom surface of the movable cavity 9. A monitoring component for detecting the position of the fixing plate 201 is provided at the bottom of the movable cavity 9. The monitoring component is electrically connected to the lifting component on the mounting seat 1. When the monitoring component detects that the fixing plate 201 is away from the bottom surface of the movable cavity 9, it will drive the lifting component to stop extending, thereby maintaining the position of the detection needle 202 and the mounting body 4. The current on the fixing plate 201 will flow to the inside of the wafer under the action of the detection needle 202, thereby realizing the detection of the wafer.

[0025] In order to monitor the position of the fixed plate 201, the monitoring component includes a voltage sensor 10 fixedly arranged at the bottom of the movable cavity 9. When the voltage sensor 10 can detect the voltage on the fixed plate 201, it indicates that the fixed plate 201 is located at the bottom of the movable cavity 9. When the voltage sensor 10 cannot detect the voltage on the fixed plate 201, it indicates that the fixed plate 201 has left the bottom of the movable cavity 9 and the extension of the lifting component needs to be suspended.

[0026] In order to accommodate the detection needle 202, the height of the movable cavity 9 is not less than the overall height of the probe card mechanism 2, so that the detection needle 202 can be accommodated inside the movable cavity 9. When the mounting body 4 is removed from the mounting base 1, the mounting body 4 can be rotated so that the through hole 11 faces upward, and the fixing plate 201 falls to the other end of the movable cavity 9 under the action of gravity, thereby driving the detection needle 202 into the movable cavity 9, completing the accommodation of the detection needle 202 and avoiding damage to the detection needle 202 caused by external force impact.

[0027] To facilitate understanding of the embodiments of this solution by those skilled in the art, the working principle of the embodiments of this solution will now be described in conjunction with specific application scenarios:

[0028] When in use, the card connector 3 on the mounting base 1 can be plugged into the card interface 6 on the mounting body 4, thereby realizing the connection between the mounting base 1 and the mounting body 4, which is convenient for installation. The limiting piece 7 is fixedly connected to the mounting body 4, and the mounting base 1 is provided with a limiting groove 8 that matches the limiting piece 7. After the mounting body 4 is connected to the mounting base 1, the limiting piece 7 on the mounting body 4 will slide into the limiting groove 8 on the mounting base 1, thereby improving the stability of the mounting body 4 after installation;

[0029] Initially, the fixing piece 201 is located directly below the movable cavity 9 under the action of gravity. At this time, the detection needle 202 extends to the bottom of the mounting body 4 through the through hole 11. When the wafer is placed at a specified position below the detection needle 202, the mounting seat 1 drives the mounting body 4 to descend, thereby driving the fixing piece 201 and the detection needle 202 to descend until the lower end of the detection needle 202 contacts the wafer surface. At this time, the mounting seat 1 continues to drive the mounting body 4 to descend. Due to the support of the detection needle 202, the fixing piece 201 leaves the bottom surface of the movable cavity 9. A voltage sensor for detecting the position of the fixing piece 201 is provided at the bottom of the movable cavity 9. Sensor 10, when the voltage sensor 10 cannot detect the voltage on the fixed plate 201, it means that the fixed plate 201 is away from the bottom of the movable cavity 9, and the downward movement of the mounting base 1 can be suspended, thereby maintaining the position of the detection needle 202 and the mounting body 4. The current on the fixed plate 201 will flow into the interior of the wafer under the action of the detection needle 202, thereby realizing the detection of the wafer. During the whole process, the detection needle 202 is in contact with the wafer under the action of gravity, thereby minimizing the wear of the detection needle 202 itself. No elastic component is provided during the whole process, and elastic fatigue will not occur, thereby ensuring the service life of the device;

[0030] After the mounting body 4 is removed from the mounting base 1, the mounting body 4 can be rotated so that the through hole 11 faces upward, and the fixing plate 201 falls to the other end of the movable cavity 9 under the action of gravity, thereby driving the detection needle 202 into the movable cavity 9, completing the storage of the detection needle 202 and preventing the detection needle 202 from being damaged by external force impact.

[0031] The above describes an embodiment of the present invention in detail. However, the above content is only a preferred embodiment of the present invention and should not be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent application of the present invention.

Claims

1. A vertical probe card with an anti-drop structure, comprising a mounting body (4) connected to a mounting seat (1), wherein a fixing component is provided between the mounting seat (1) and the mounting body (4), characterized in that , also includes: A probe card mechanism (2) for testing semiconductor wafers, wherein a movable cavity (9) is provided inside the mounting body (4), the probe card mechanism (2) comprises a fixing plate (201) that is slidably fitted inside the movable cavity (9), a detection needle (202) is fixedly connected to the bottom surface of the fixing plate (201), a through hole (11) that is slidably fitted with the detection needle (202) is provided at the lower end of the movable cavity (9), the detection needle (202) extends to the bottom of the mounting body (4) through the through hole (11), and a monitoring component for detecting the position of the fixing plate (201) is provided at the bottom of the movable cavity (9).

2. The vertical probe card with an anti-drop structure according to claim 1, wherein: The monitoring component comprises a voltage sensor (10) fixedly arranged at the bottom of the moving cavity (9).

3. The vertical probe card with an anti-drop structure according to claim 1, wherein: The height of the movable cavity (9) is not less than the overall height of the probe card mechanism (2).

4. The vertical probe card with an anti-drop structure according to claim 1, wherein: The fixing assembly comprises a connecting plate (5) fixedly connected to the mounting body (4); a card interface (6) is provided on the connecting plate (5); and a card connector (3) matched with the card interface (6) is fixedly connected to the mounting seat (1).

5. The vertical probe card with an anti-drop structure according to claim 1, wherein: A limiting piece (7) is fixedly connected to the mounting body (4), and a limiting groove (8) matching the limiting piece (7) is provided on the mounting seat (1).

6. The vertical probe card with an anti-drop structure according to claim 1, wherein: The inner wall of the movable cavity (9) is coated with an insulating layer that matches the fixed sheet (201).

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