Plane machining process device for silicon material cutting

Abstract

The utility model discloses a silicon material cutting plane processing technology device which comprises a supporting platform and a recycling and filtering device, the recycling and filtering device comprises a first filtering tank, a second filtering tank and a third filtering tank, a second filtering net is fixedly installed in the first filtering tank, and a third filtering net is fixedly installed in the third filtering tank. A first filter screen is fixedly mounted on one side of the top end of the first filter tank, the second filter tank is fixedly connected to one side of the first filter tank, and an activated carbon filter plate is movably inserted into the inner side of the second filter tank. By means of the multi-stage filtering system, cutting fluid can be efficiently recycled, waste of the cutting fluid is reduced, the use cost is reduced, impurities and chippings in the cutting fluid can be effectively removed through the two layers of filtering nets and the activated carbon filtering plate, the cleanliness of the cutting fluid is kept, and waste liquid discharge is reduced by recycling the cutting fluid.

Description

Technical Field

[0001] The utility model relates to the technical field of water cooling for silicon material cutting, in particular to a plane processing device for silicon material cutting. Background Art

[0002] Silicon material cutting technology mainly includes traditional mechanical cutting methods and laser cutting methods. Traditional mechanical cutting methods such as mortar wire cutting and diamond wire cutting are widely used in the field of silicon material processing. Mechanical cutting requires the use of cutting fluid to rinse and cool the cutting part. However, the cutting fluid will carry a large amount of cutting residue after use, making it difficult to recover the cutting fluid. Therefore, a planar processing process device for silicon material cutting is urgently needed to solve the above problems. Utility Model Content

[0003] The purpose of the present invention is to provide a planar processing device for cutting silicon materials to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a plane processing device for cutting silicon materials, comprising a supporting platform and a recovery and filtration device, the recovery and filtration device comprising a first filter tank, a second filter tank and a third filter tank, the interior of the first filter tank being fixedly installed with a second filter screen, the top side of the first filter tank being fixedly installed with a first filter screen, the second filter tank being fixedly connected to one side of the first filter tank, an activated carbon filter plate being movably inserted into the inner side of the second filter tank, three first guide pipes being fixedly installed on the side of the second filter tank close to the first filter tank, and the top end of the first guide pipe passes through the side wall of the first filter tank close to the second filter tank.

[0005] Preferably, the third filter tank is fixedly connected to the side of the second filter tank away from the first filter tank, and a compressed activated carbon filter plate is movably inserted into the inner side of the third filter tank. Three second guide pipes are fixedly installed inside the side of the third filter tank close to the second filter tank, and the top end of the second guide pipe passes through the side wall of the second filter tank close to the third filter tank. The inner bottom end of the third filter tank is located on the side of the compressed activated carbon filter plate away from the second guide pipe and a water pump is fixedly installed thereon. A delivery branch pipe is fixedly installed at the output end of the water pump. The outer top end of the third filter tank is located on the side of the compressed activated carbon filter plate close to the water pump and is fixedly connected to a water injection tank.

[0006] Preferably, a cutting table is fixedly installed in the middle of the top of the support platform, four connecting pipes are symmetrically fixedly installed at both ends of the cutting table, a universal nozzle is fixedly installed on the top of the connecting pipe, and a reflux discharge groove is provided on one side of the support platform.

[0007] Preferably, the delivery branch pipe passes through the top end of the support platform, and the branch end of the delivery branch pipe is fixedly installed on the bottom end of the connecting pipe.

[0008] Preferably, drainage holes are evenly distributed throughout the top of the cutting table.

[0009] Preferably, the first filter tank, the second filter tank and the third filter tank in the recovery and filtration device are all made of transparent materials, and the first filter tank, the second filter tank and the third filter tank are all fixedly installed at the bottom end of the support platform, and the water injection tank is located on the outside of the support platform.

[0010] Preferably, one end of the reflux discharge trough away from the support platform is located inside the top end of the first filter screen.

[0011] Preferably, the first flow guide pipe is located on one side of the second filter screen, and the first filter screen is located on the other side of the second filter screen.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] The utility model uses a multi-stage filtration system to efficiently recycle cutting fluid, thereby reducing waste of cutting fluid and lowering the cost of use. The two-layer filter screen and activated carbon filter plate can effectively remove impurities and debris in the cutting fluid, maintain the cleanliness of the cutting fluid, and reduce waste liquid discharge and environmental pollution by recycling the cutting fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the main three-dimensional structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the rear structure of the main body in the utility model;

[0016] Figure 3 This is a schematic structural diagram of the recovery and filtration device in the present utility model;

[0017] Figure 4 This is a schematic diagram of the disassembled structure of the recovery and filtration device in the present utility model.

[0018] In the figure: 1-support platform, 2-recovery and filtration device, 3-reflux discharge tank, 4-cutting table, 5-delivery branch pipe, 6-connecting pipe, 7-universal nozzle, 8-first filter tank, 9-second filter tank, 10-third filter tank, 11-first filter screen, 12-second filter screen, 13-first guide pipe, 14-activated carbon filter plate, 15-second guide pipe, 16-compressed activated carbon filter plate, 17-water pump, 18-water injection tank. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] See also Figure 1-4 , the utility model provides an embodiment: a plane processing device for cutting silicon materials, including a supporting platform 1 and a recovery and filtering device 2, the recovery and filtering device 2 includes a first filter tank 8, a second filter tank 9 and a third filter tank 10, the first filter tank 8 is fixedly installed with a second filter screen 12, the top side of the first filter tank 8 is fixedly installed with a first filter screen 11, the second filter tank 9 is fixedly connected to one side of the first filter tank 8, and the inner side of the second filter tank 9 is movably plugged with an activated carbon filter plate 14, and three first guide pipes 13 are fixedly installed on the side of the second filter tank 9 close to the first filter tank 8, and the top end of the first guide pipe 13 passes through the side wall of the first filter tank 8 close to the second filter tank 9, the first guide pipe 13 is located on one side of the second filter screen 12, and the first filter screen 11 is located on the other side of the second filter screen 12.

[0021] The third filter tank 10 is fixedly connected to the side of the second filter tank 9 away from the first filter tank 8, and a compressed activated carbon filter plate 16 is movably inserted into the inner side of the third filter tank 10. Three second guide pipes 15 are fixedly installed inside the side of the third filter tank 10 close to the second filter tank 9, and the top of the second guide pipe 15 passes through the side wall of the second filter tank 9 close to the third filter tank 10. The design of the first guide pipe 13 and the second guide pipe 15 allows the cutting liquid to flow into the next filter tank after sedimentation. A water pump 17 is fixedly installed at the inner bottom end of the third filter tank 10 on the side of the compressed activated carbon filter plate 16 away from the second guide pipe 15, and a delivery branch pipe 5 is fixedly installed at the output end of the water pump 17. The outer top end of the third filter tank 10 is fixedly connected to the water injection tank 18 on the side of the compressed activated carbon filter plate 16 close to the water pump 17.

[0022] A cutting table 4 is fixedly installed in the middle of the top of the support platform 1. Drain holes are evenly opened on the top of the cutting table 4, so that the cutting liquid can be discharged to the top of the support platform 1 in time. Four connecting pipes 6 are symmetrically fixedly installed at both ends of the cutting table 4. A universal nozzle 7 is fixedly installed on the top of the connecting pipe 6, and its spraying direction can be conveniently adjusted through the universal nozzle 7. A reflux discharge groove 3 is provided on one side of the support platform 1. The end of the reflux discharge groove 3 away from the support platform 1 is located on the inner side of the top of the first filter screen 11. The cutting liquid on the inner side of the top of the support platform 1 is discharged to the inner side of the first filter screen 11 for filtration through the reflux discharge groove 3. The delivery branch pipe 5 passes through the top of the support platform 1, and the branch end of the delivery branch pipe 5 is fixedly installed at the bottom end of the connecting pipe 6. The water pump 17 delivers the cutting liquid inside the third filter tank 10 to the connecting pipe 6 through the delivery branch pipe 5, and sprays it on the silicon cutting area through the universal nozzle 7.

[0023] The first filter tank 8, the second filter tank 9 and the third filter tank 10 in the recovery and filtration device 2 are all made of transparent materials. The transparent design makes it easy to observe the internal water level and filtration conditions, and it is possible to promptly detect whether the filter is blocked. The first filter tank 8, the second filter tank 9 and the third filter tank 10 are all fixedly installed at the bottom end of the support platform 1, and the water injection tank 18 is located on the outside of the support platform 1, which is convenient for injecting cutting fluid through the water injection tank 18.

[0024] Working principle: During use, the cutting fluid is first injected into the third filter tank 10 through the water injection tank 18 by external force. When starting cutting, the water pump 17 is turned on. The water pump 17 transports the cutting fluid inside the third filter tank 10 through the delivery branch pipe 5 to the connecting pipe 6, and sprays it on the silicon cutting part through the universal nozzle 7. The cutting fluid cools and flushes the silicon cutting part, flushes the cutting debris down and falls into the top of the support platform 1, and then the cutting fluid flows into the first filter 11 through the reflux discharge tank 3. The refluxed cutting fluid enters the first filter tank 8 through the filtration of the first filter 11 and is filtered through the second filter 12 and flows into the second filter 12 away from the first filter 11. On the other hand, when the water level of the cutting fluid reaches the inner side of the top of the first guide tube 13, the cutting fluid flows into the interior of the second filter tank 9 through the first guide tube 13. The cutting fluid inside the second filter tank 9 is filtered by the activated carbon filter plate 14 and flows into the side of the activated carbon filter plate 14 away from the first guide tube 13. When the water level in the second filter tank 9 reaches the inner side of the top of the second guide tube 15, the cutting fluid flows into the interior of the third filter tank 10 through the second guide tube 15, and is filtered by the compressed activated carbon filter plate 16 and enters the side of the compressed activated carbon filter plate 16 away from the second guide tube 15. At this time, the injection of cutting fluid into the third filter tank 10 is stopped, and the cutting part of the silicon material can be continuously cooled and rinsed through circulating filtration.

[0025] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A planar processing device for cutting silicon materials, comprising a support platform (1) and a recovery and filtering device (2), characterized in that: The recovery filter device (2) comprises a first filter tank (8), a second filter tank (9) and a third filter tank (10), wherein a second filter screen (12) is fixedly installed inside the first filter tank (8), a first filter screen (11) is fixedly installed on one side of the top of the first filter tank (8), the second filter tank (9) is fixedly connected to one side of the first filter tank (8), an activated carbon filter plate (14) is movably inserted inside the second filter tank (9), and three first guide pipes (13) are fixedly installed inside the second filter tank (9) on a side close to the first filter tank (8), and the top of the first guide pipe (13) passes through the side wall of the first filter tank (8) close to the second filter tank (9).

2. The planar processing device for silicon material cutting according to claim 1, characterized in that: The third filter tank (10) is fixedly connected to the side of the second filter tank (9) away from the first filter tank (8), and a compressed activated carbon filter plate (16) is movably inserted into the inner side of the third filter tank (10). Three second guide pipes (15) are fixedly installed inside the side of the third filter tank (10) close to the second filter tank (9), and the top end of the second guide pipe (15) passes through the side wall of the second filter tank (9) close to the third filter tank (10). The inner bottom end of the third filter tank (10) is located on the side of the compressed activated carbon filter plate (16) away from the second guide pipe (15) and is fixedly installed with a water pump (17). The output end of the water pump (17) is fixedly installed with a delivery branch pipe (5). The outer top end of the third filter tank (10) is located on the side of the compressed activated carbon filter plate (16) close to the water pump (17) and is fixedly connected with a water injection tank (18).

3. The planar processing device for silicon material cutting according to claim 1, characterized in that: A cutting table (4) is fixedly mounted at the middle of the top of the support platform (1), four connecting pipes (6) are symmetrically fixedly mounted at both ends of the cutting table (4), a universal nozzle (7) is fixedly mounted at the top of the connecting pipe (6), and a reflux discharge groove (3) is provided on one side of the support platform (1).

4. A planar processing device for silicon material cutting according to claim 2 or 3, characterized in that: The delivery branch pipe (5) passes through the top end of the support platform (1), and the branch end of the delivery branch pipe (5) is fixedly mounted on the bottom end of the connecting pipe (6).

5. The planar processing device for cutting silicon material according to claim 3, characterized in that: Drain holes are evenly distributed throughout the top of the cutting table (4).

6. The planar processing device for silicon material cutting according to claim 2, characterized in that: The first filter tank (8), the second filter tank (9) and the third filter tank (10) in the recovery and filtration device (2) are all made of transparent materials, and the first filter tank (8), the second filter tank (9) and the third filter tank (10) are all fixedly installed at the bottom end of the support platform (1), and the water injection tank (18) is located outside the support platform (1).

7. The planar processing device for silicon material cutting according to claim 3, characterized in that: One end of the reflux discharge trough (3) away from the support platform (1) is located inside the top end of the first filter screen (11).

8. The planar processing device for silicon material cutting according to claim 2, characterized in that: The first flow guide pipe (13) is located on one side of the second filter screen (12), and the first filter screen (11) is located on the other side of the second filter screen (12).

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