Non-polar LED lamp filament structure

Abstract

The utility model discloses a non-polar LED filament structure which comprises a substrate, an LED chip is arranged on the substrate, a protection block is fixedly connected to the substrate, a heat dissipation groove is formed in the protection block, and the protection block is of a multi-layer composite structure and is sequentially provided with a light-transmitting layer, a high-temperature-resistant layer and a heat conduction layer from outside to inside. And the high-temperature-resistant layer covers the lower surface of the light-transmitting layer. Through the arrangement of the heat dissipation groove and the heat conduction layer, under the action of the heat conduction layer, the overall heat conduction effect of the protection block can be improved, and therefore heat generated when the LED chip works can be transmitted to the protection block and then dissipated to the external environment through the protection block, heat dissipation of the LED chip is achieved, and the service life of the LED chip is prolonged. The LED chips can work at a proper temperature all the time, so that the influence on the overall service life of the lamp filament is avoided, the contact area between the protection blocks and air can be increased under the action of the heat dissipation grooves, and the overall heat dissipation effect of the protection blocks can be improved.

Description

Technical Field

[0001] The utility model relates to the field of LED lamps, in particular to a non-polar LED filament structure. Background Art

[0002] Non-polarized LED filaments refer to LED filaments that do not require consideration of positive and negative polarity when used. There is no need to distinguish polarity, which simplifies the installation process, reduces the risk of installation errors, and improves installation efficiency. They are usually composed of a metal substrate, LED chips, packaging materials, and other parts.

[0003] In the prior art, the filament usually relies on the LED chip to generate light source during use. In order to protect the LED chip, packaging materials are usually used to protect the LED chip. However, a certain amount of heat will be generated during the light emission of the LED chip. If the packaging material has poor heat dissipation effect and cannot dissipate the heat generated by the LED chip in time, the LED chip will be in a high-temperature environment for a long time, which may cause the LED chip to age faster due to the high temperature, and may affect the normal service life of the LED filament. Therefore, a non-polar LED filament structure is needed. Utility Model Content

[0004] The purpose of the present utility model is to solve at least one of the technical problems existing in the prior art, and to provide a non-polar LED filament structure. By setting the heat dissipation groove and the heat-conducting layer, under the action of the heat-conducting layer, the overall thermal conductivity of the protective block can be improved, so that the heat generated by the LED chip during operation can be transferred to the protective block, and then dissipated to the external environment through the protective block, thereby realizing the heat dissipation of the LED chip, so that the LED chip can always maintain an appropriate temperature for operation, thereby avoiding affecting the overall service life of the filament, and under the action of the heat dissipation groove, the contact area between the protective block and the air can be increased, thereby improving the overall heat dissipation effect of the protective block, and by setting the high-temperature resistant layer and the light-transmitting layer, the overall high-temperature resistance and light transmittance of the protective block can be improved, so that the protective block will not affect its own service life due to high temperature, and the protective block can smoothly transmit the light generated by the LED chip to the external environment.

[0005] The utility model also provides the above-mentioned non-polarity LED filament structure, including a substrate, an LED chip is arranged on the substrate, a protective block is fixedly connected to the substrate, a heat dissipation groove is opened on the protective block, and the protective block is a multi-layer composite structure, and a light-transmitting layer, a high-temperature resistant layer and a heat-conducting layer are arranged in sequence from the outside to the inside.

[0006] According to the non-polar LED filament structure, the high-temperature resistant layer covers the lower surface of the light-transmitting layer, and the heat-conducting layer covers the lower surface of the high-temperature resistant layer.

[0007] According to the non-polarity LED filament structure, the substrate is provided with two connection holes distributed on the left and right, which can connect the filament as a whole with other devices.

[0008] According to the non-polar LED filament structure, the light-transmitting layer is made of polycarbonate, which improves the overall light-transmitting effect of the protective block.

[0009] According to the non-polar LED filament structure, the material of the high-temperature resistant layer is polytetrafluoroethylene, which can improve the overall high-temperature resistance of the protective block.

[0010] According to the non-polar LED filament structure, the heat-conducting layer is made of hexagonal boron nitride, which can improve the overall heat-conducting effect of the protective block.

[0011] According to the non-polarity LED filament structure, the protective block contacts the LED chip, and the number of the LED chips is multiple.

[0012] According to the non-polarity LED filament structure, the heat dissipation slots are multiple and distributed in a linear array, which can improve the overall heat dissipation efficiency of the protective block.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0015] Figure 1 This is the overall structural diagram of a non-polarity LED filament structure of the utility model;

[0016] Figure 2 This is a structural diagram of the substrate portion of a non-polar LED filament structure of the present invention;

[0017] Figure 3 This is a structural diagram of a cross-section of a protective block of a non-polar LED filament structure of the present invention;

[0018] Figure 4 This is a structural schematic diagram of the cross-section of the heat dissipation groove of a non-polar LED filament structure of the present invention.

[0019] Legend:

[0020] 1. Substrate; 2. LED chip; 3. Protective block; 4. Heat dissipation slot; 5. Light-transmitting layer; 6. High-temperature resistant layer; 7. Heat-conducting layer; 8. Connection hole. DETAILED DESCRIPTION

[0021] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0022] Reference Figure 1-4 , an embodiment of the present invention is a non-polar LED filament structure, which includes a substrate 1, an LED chip 2 is arranged on the substrate 1, a protective block 3 is in contact with the LED chip 2, the number of LED chips 2 is multiple, a protective block 3 is fixedly connected to the substrate 1, a heat dissipation slot 4 is opened on the protective block 3, the number of the heat dissipation slots 4 is multiple and distributed in a linear array, the protective block 3 is a multi-layer composite structure, and a light-transmitting layer 5, a high-temperature resistant layer 6 and a heat-conducting layer 7 are sequentially arranged from the outside to the inside, the high-temperature resistant layer 6 covers the lower surface of the light-transmitting layer 5, and the heat-conducting layer 7 covers the lower surface of the high-temperature resistant layer 6, a connecting hole 8 is opened on the substrate 1, the number of the connecting holes 8 is two and distributed on the left and right, the material of the light-transmitting layer 5 is polycarbonate, the material of the high-temperature resistant layer 6 is polytetrafluoroethylene, and the material of the heat-conducting layer 7 is hexagonal boron nitride.

[0023] Working principle: The device as a whole can be connected to other devices through the connection hole 8 on the substrate 1. When the filament is in use, the heat generated by the LED chip 2 during operation can be absorbed by the heat conductive layer 7 provided on the protective block 3 because hexagonal boron nitride has good thermal conductivity. Then, the heat is contacted with the air through the protective block 3, so that the heat in the protective block 3 can be dissipated to the outside world, thereby achieving heat dissipation for the LED chip 2, so that the LED chip 2 can always work at a suitable temperature, and the heat dissipation groove 4 opened on the protective block 3 can increase the heat dissipation of the LED chip 2. The area in contact with the air of the protective block 3 can speed up the heat dissipation speed of the protective block 3 and improve the overall heat dissipation effect of the protective block 3. The high-temperature resistant layer 6 provided on the protective block 3 can improve the overall high-temperature resistance of the protective block 3 because polytetrafluoroethylene has good high-temperature resistance, so that the service life of the protective block 3 will not be affected by high temperature. The light-transmitting layer 5 provided on the protective block 3 can improve the overall light-transmitting effect of the protective block 3 because polycarbonate has good light-transmitting performance, so that the light generated by the LED chip 2 when working can be smoothly transmitted to the outside world.

[0024] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A non-polar LED filament structure, characterized in that: include: A substrate (1) is provided with an LED chip (2), a protective block (3) is fixedly connected to the substrate (1), a heat dissipation groove (4) is provided on the protective block (3), and the protective block (3) is a multi-layer composite structure, and is provided with a light-transmitting layer (5), a high-temperature resistant layer (6), and a heat-conducting layer (7) in sequence from the outside to the inside.

2. The non-polar LED filament structure according to claim 1, characterized in that: The high temperature resistant layer (6) covers the lower surface of the light-transmitting layer (5), and the heat-conducting layer (7) covers the lower surface of the high temperature resistant layer (6).

3. The non-polar LED filament structure according to claim 1, characterized in that: The base plate (1) is provided with connection holes (8), and the number of the connection holes (8) is two and they are distributed on the left and right sides.

4. The non-polar LED filament structure according to claim 1, characterized in that: The material of the light-transmitting layer (5) is polycarbonate.

5. The non-polar LED filament structure according to claim 1, characterized in that: The material of the high temperature resistant layer (6) is polytetrafluoroethylene.

6. The non-polar LED filament structure according to claim 1, characterized in that: The material of the heat-conducting layer (7) is hexagonal boron nitride.

7. The non-polar LED filament structure according to claim 1, characterized in that: The protective block (3) is in contact with the LED chip (2), and there are multiple LED chips (2).

8. The non-polar LED filament structure according to claim 1, characterized in that: The heat dissipation slots (4) are multiple in number and distributed in a linear array.

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