Efficient heat dissipation automobile brake pump
By introducing a combination system of semiconductor cooling chip and fan into the brake pump, the corrosion problem caused by water cooling is solved, achieving a highly efficient water-free heat dissipation effect and extending the service life of the brake pump.
CN223605605UActive Publication Date: 2025-11-28RUIAN BAIHENG AUTO PARTS CO LTD
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Patent Information
- Application Number
- CN202520004716.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2035-01-02
AI Technical Summary
Technical Problem
Existing automotive brake pumps require continuous water replenishment during the cooling process, which can easily lead to internal corrosion and affect their service life.
Method used
The heat dissipation system, which combines a semiconductor cooling chip and a fan, uses a temperature sensor and infrared light to control the fan's start and stop, achieving efficient heat dissipation without water cooling and avoiding corrosion.
Benefits of technology
It achieves efficient heat dissipation without water cooling, avoids corrosion of the brake pump housing, and extends service life.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to the technical field of automobile brake pumps, in particular to an efficient heat dissipation automobile brake pump which comprises a brake pump body, a plurality of first cooling fins are arranged on the surface of the brake pump body in the front-back direction, and the surface of the brake pump body is connected with a ventilation hood through a plurality of second installation blocks. A semiconductor chilling plate is arranged on the inner wall of the rear portion of the ventilation hood, a second fan is rotationally connected to the inner wall of the ventilation hood through two second fan supports, a shielding block is arranged at the front end of the first mounting block, and a cold air control device is arranged outside the shielding block. After the semiconductor chilling plate is powered on, refrigeration can be conducted on the cold end face of the semiconductor chilling plate, when the brake pump body works, the second fan is started, and cold air can be blown out through the second fan. By means of the heat dissipation mode, corrosion of a shell of the brake pump body cannot be caused, and the service life of the brake pump cannot be affected.
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