Hybrid bonding equipment based on visual alignment

Abstract

The utility model discloses hybrid bonding equipment based on visual alignment, which belongs to the field of bonding processing equipment and comprises a bonding assembly, a first displacement mechanism, a second displacement mechanism, a first visual assembly, an optical calibration assembly, a second visual assembly and a bearing table. According to the technical scheme of the utility model, the position coordinates of the calibration point, the chip to be bonded and the mark point on the target chip can be accurately obtained through the corresponding arrangement of the optical calibration assembly, so that the compensation position information between the two chips can be accurately obtained, and the visual alignment of the two chips before hybrid bonding can be realized. The hybrid bonding equipment provided by the utility model is compact in structure, convenient to use, and capable of accurately completing bonding of a to-be-bonded chip and a target chip on a wafer and accurately realizing visual alignment between the to-be-bonded chip and the target chip before hybrid bonding, so that the alignment precision during hybrid bonding of the chips is effectively ensured, errors in the bonding process are reduced, and the production efficiency is improved. And the quality of a chip product is improved.

Description

Technical Field

[0001] This utility model belongs to the field of bonding processing equipment, specifically relating to a hybrid bonding device based on vision alignment. Background Technology

[0002] Hybrid bonding is a novel semiconductor packaging technology that integrates homogeneous and heterogeneous materials, enabling vertical stacking and thus improving chip performance. Compared to traditional thermoforming bonding, hybrid bonding eliminates the need for solder bumps, allowing for higher interconnect density and reduced chip power consumption.

[0003] Generally, hybrid bonding processes can be divided into three stages: surface treatment, alignment bonding, and post-processing. Surface treatment uses plasma or acid / alkali treatments to clean and activate the chip and wafer surfaces, enhancing adhesion. Alignment bonding involves high-precision alignment of the chip and wafer, ensuring one-to-one pad correspondence, followed by direct bonding under pressure through van der Waals forces and inter-molecular and atomic forces. Post-processing strengthens bonding through annealing, typically at 200-300°C. Throughout the entire process, alignment accuracy is a critical indicator affecting chip electrical connectivity and reliability. Errors in alignment accuracy can significantly impact yield and result in substantial losses. Therefore, accurately and effectively achieving alignment during the bonding process has become a key focus for researchers and a primary challenge to address when improving hybrid bonding efficiency and yield. Utility Model Content

[0004] In view of one or more of the above-mentioned defects or improvement needs of the prior art, this utility model provides a hybrid bonding device based on vision alignment, which can accurately realize vision alignment in the hybrid bonding process, ensure the alignment accuracy of the two objects before hybrid bonding, and improve the quality of hybrid bonding.

[0005] To achieve the above objectives, this utility model provides a hybrid bonding device based on vision alignment, including a bonding component, a first displacement mechanism, a second displacement mechanism, a first vision component, an optical calibration component, a second vision component, and a support stage;

[0006] The support platform is used to support the target chip and is spaced apart from the second vision component in a first direction;

[0007] The bonding assembly includes a bonding head connected to a pressure motor, used to pick up the chip to be bonded and complete the hybrid bonding of the chip to be bonded and the target chip.

[0008] The first displacement mechanism includes a horizontal displacement component, and the second displacement mechanism includes a vertical lifting component and a planar adjustment component. The first vision component and the vertical lifting component are respectively assembled and connected to the horizontal displacement component, so that the horizontal displacement component can drive the bonding component and the first vision component to move synchronously in a first direction. The bonding component is assembled and connected to the vertical lifting component through the planar adjustment component. The vertical lifting component can be used to adjust the lifting and lowering of the bonding component, and the planar adjustment component can be used to adjust the XYθ of the bonding component relative to the first vision component in the plane.

[0009] The first vision component is disposed on one side of the bonding component, and includes a camera module and a semi-transparent semi-reflective mirror and a reflective mirror arranged sequentially in the optical path of the camera module, so that the imaging optical path of the camera module can obtain a first detection light and a second detection light that are parallel to each other and vertically downward after passing through the two mirrors; the second vision component includes a camera module for generating a third detection light that is vertically upward.

[0010] The optical calibration component is disposed on the side of the bonding component near the first vision component, and includes a black film layer and a light-transmitting layer disposed sequentially in a first direction, with a calibration point disposed at the bottom of the light-transmitting layer.

[0011] As a further improvement of this utility model, the bottom of the optical calibration component protrudes beyond the bottom of the bonding head, and the distance by which the optical calibration component protrudes is equal to the thickness of the chip to be bonded, so that after the chip to be bonded is adsorbed on the bonding head, the bottom of the optical calibration component is flush with the bottom surface of the chip to be bonded.

[0012] As a further improvement of this utility model, the bottom of the optical calibration component is flush with the bottom of the bonding head, and the depth of field range of the camera module in the second vision component is not less than the thickness of the chip to be bonded.

[0013] As a further improvement of this utility model, the thickness of the black film layer is equal to that of the light-transmitting layer.

[0014] As a further improvement of this utility model, the optical calibration component and the side wall of the bonding head are movably connected by a displacement adjustment mechanism, which is used to adjust the vertical position of the optical calibration component relative to the bonding head.

[0015] As a further improvement of this utility model, the thickness of the optical calibration component in the first direction is 0.5 to 3 times the opening width of the lens barrel of the first vision component.

[0016] As a further improvement of this utility model, the optical calibration component is aligned with both ends of the bonding head in a second direction, and the second direction is a horizontal direction perpendicular to the first direction.

[0017] As a further improvement of this utility model, the first vision component and the second vision component are both two that are spaced apart in the second direction; and the calibration point is also two that are spaced apart in the second direction.

[0018] As a further improvement of this utility model, the bonding head is a suction cup with negative pressure adsorption capability, and multiple adsorption holes are spaced apart on its bottom surface.

[0019] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0020] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include:

[0021] (1) The hybrid bonding device based on vision alignment of this utility model includes a bonding component, a first displacement mechanism, a second displacement mechanism, a first vision component, an optical calibration component, a second vision component and a carrier stage. Through the cooperation of the two vision components and the two displacement mechanisms, and the corresponding setting of the optical calibration component, the position coordinates of the calibration point, the chip to be bonded and the mark point on the target chip can be accurately obtained, thereby accurately obtaining the compensation position information between the two chips, thereby achieving accurate alignment of the two chips before hybrid bonding, ensuring the alignment accuracy of the chips before bonding, avoiding the low yield caused by equipment control errors, and reducing the hybrid bonding cost of the chips.

[0022] (2) The hybrid bonding device based on vision alignment of this utility model, by preferably setting the optical calibration component and its relative position with the first vision component, improves the accuracy of obtaining the calibration point and the second marker point position based on the first vision component, and the accuracy of obtaining the calibration point and the first marker point position based on the second vision component, avoids the alignment error caused by the difference in camera focus, and further improves the accuracy and reliability of vision alignment.

[0023] (3) The hybrid bonding device based on vision alignment of this utility model, by preferably setting two sets of first vision components and two sets of second vision components, and setting two calibration points on the optical calibration component, and by obtaining the corresponding positions of the two sets of first marker points and two sets of second marker points, further improves the accuracy of vision alignment between the chip to be bonded and the target chip, and improves the bonding quality of the chip.

[0024] (4) The hybrid bonding equipment based on vision alignment in this utility model has a compact structure and is easy to use. It can accurately complete the bonding of the chip to be bonded to the target chip on the wafer, and accurately achieve the vision alignment between the chip to be bonded and the target chip before hybrid bonding. It can effectively ensure the alignment accuracy during chip hybrid bonding, reduce equipment errors in the bonding process, improve the quality and yield of chip products, and has good economic value. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of the hybrid bonding device based on vision alignment in an embodiment of this utility model;

[0027] Figure 2 This is a schematic diagram of positioning using a second vision component in an embodiment of this utility model;

[0028] Figure 3 This is a schematic diagram of a single positioning operation using the first vision component in an embodiment of this utility model;

[0029] Figure 4 This is a schematic diagram of secondary positioning using the first vision component in an embodiment of this utility model;

[0030] Figure 5 This is a structural side view of the hybrid bonding device based on vision alignment in an embodiment of this utility model;

[0031] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically:

[0032] 1. Bonding assembly; 2. First displacement mechanism; 3. Second displacement mechanism; 4. First vision assembly; 5. Optical calibration assembly; 6. Second vision assembly; 7. Chip to be bonded; 8. Target chip; 9. Wafer; 10. Support stage;

[0033] 101. Bonding head; 102. Pressure sensor; 103. Pressure motor;

[0034] 201. Translation motor; 202. Translation guide rail; 203. Fixing plate;

[0035] 301. Lifting motor; 302. Lifting guide rail;

[0036] 401. Camera module; 402. First reflecting mirror; 403. Semi-transmissive and semi-reflective mirror; 404. Second reflecting mirror;

[0037] 501. Black film layer; 502. Light-transmitting layer; 503. Calibration point;

[0038] 701, First marker point; 801, Second marker point. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model. Furthermore, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0040] In the description of this utility model, it should be understood that, unless otherwise explicitly specified and limited, the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] Example:

[0045] Please see Figures 1-5 In a preferred embodiment of this utility model, the hybrid bonding device based on vision alignment includes a bonding component 1, a first vision component 4, an optical calibration component 5, a second vision component 6, and a support stage 10.

[0046] The bonding component 1 is used to pick up the chip 7 to be bonded and perform the bonding process; the carrier stage 10 is used to carry the target chip 8, specifically, to carry the wafer 9 on which several target chips 8 are mounted.

[0047] Meanwhile, in the preferred embodiment, the optical calibration component 5 is disposed on one side of the bonding component 1 and is used to cooperate with the first vision component 4 and the second vision component 6 to complete the visual alignment between the first mark point 701 on the chip to be bonded 7 and the second mark point 801 on the target chip 8, so as to ensure accurate alignment between the chip to be bonded 7 and the target chip 8 when the bonding component 1 performs hybrid bonding in the future, and avoid defective products due to the existence of alignment error.

[0048] More specifically, in the preferred embodiment, the first vision component 4 is disposed on one side of the bonding component 1, and the detection light output from the lens of the first vision component 4 consists of two downward-facing parallel beams of light, i.e. Figure 1 The negative direction of the Z-axis is shown in the figure.

[0049] Accordingly, the second vision component 6 is disposed on one side of the support platform 10 along the first direction, i.e. Figure 1 On one side of the X-axis direction, and the third detection light output from the lens of the second vision component 6 is output upwards, that is, as... Figure 1 The positive direction of the Z-axis is shown in the figure.

[0050] Furthermore, in the preferred embodiment, the optical calibration component 5 includes a black film layer 501 and a light-transmitting layer 502 stacked in the X-axis direction, and a calibration point 503 is provided at the bottom of the light-transmitting layer 502. The optical calibration component 5 and the two visual components are visually aligned by imaging the calibration point 503 in the first visual component 4 and the second visual component 6.

[0051] To accurately achieve the visual alignment and hybrid bonding processes, a preferred embodiment further includes a first displacement mechanism 2 and a second displacement mechanism 3. The first displacement mechanism 2 is an X-axis displacement mechanism, comprising a horizontal displacement component to simultaneously drive the bonding component 1 and the first vision component 4 to perform horizontal displacement in a first direction, achieving separate alignment of the bonding component 1 with the second vision component 6 and the support stage 10. Simultaneously, the second displacement mechanism, corresponding to the bonding component 1, includes a vertical lifting component and a planar adjustment component, used to drive the bonding component 1 to move up and down and to perform XYθ adjustment relative to the first vision component 4 in a plane, thereby ensuring accurate alignment between the chip 7 to be bonded and the target chip 8.

[0052] In actual setup, marking points are respectively set on the bottom surface of the chip 7 to be bonded and the top surface of the target chip 8 after being picked up by the bonding component 1, namely the aforementioned first marking point 701 and second marking point 801. Then, the second vision component 6 obtains the position coordinates of the calibration point 503 and the first marking point 701, and the first vision component 4 obtains the position coordinates of the calibration point 503 and the second marking point 801. By using the position of the calibration point 503 as the conversion reference, the position conversion of the first marking point 701 and the second marking point 801 in the same three-dimensional coordinate system is performed. Finally, the compensation position information between the first marking point 701 and the second marking point 801 is obtained, and based on this, the position of the chip 7 to be bonded is adjusted to be aligned with the corresponding target chip 8 before hybrid bonding.

[0053] Specifically, in the preferred embodiment, the bonding assembly 1 includes a bonding head 101, the top of which is connected to the output shaft of the pressure motor 103, and a pressure sensor 102 is provided corresponding to the connection between the two. The pressure of the bonding head 101 during bonding operations can be accurately obtained through the detection of the pressure sensor 102.

[0054] More specifically, in order to accurately pick up the chip 7 to be bonded, the bonding head 101 is preferably set as a suction cup with negative pressure adsorption capability, and multiple adsorption holes are spaced apart on its bottom surface.

[0055] Furthermore, in the preferred embodiment, the first displacement mechanism 2 includes a translation guide rail 202 extending along a first direction, and a translation motor 201 and a fixing plate 203 are provided corresponding to the translation guide rail 202. The translation motor 201 is assembled and connected to the translation guide rail 202, and can perform reciprocating movement relative to the translation guide rail 202 in the first direction during operation. Simultaneously, the fixing plate 203 is fixedly connected to the translation motor 201, and can follow the translation motor 201 in synchronous displacement.

[0056] Accordingly, in the preferred embodiment, the first vision component 4 is mounted on the fixed plate 203, and the bonding component 1 is mounted on the fixed plate 203 by the second displacement mechanism 3.

[0057] In the preferred embodiment, the second displacement mechanism 3 includes a vertically extending lifting guide rail 302 and a lifting motor 301 mounted on the lifting guide rail 302. Through the driving of the lifting motor 301 and the guidance of the lifting guide rail 302, the vertical displacement of the bonding head 101 can be accurately realized.

[0058] Meanwhile, the second displacement mechanism 3 also includes a plane adjustment component (not shown in the figure) corresponding to the bonding component 1 and the first vision component 4, which is used to realize the first directional displacement of the bonding component 1 relative to the first vision component 4.

[0059] For example, in actual setup, the aforementioned plane adjustment component is preferably located between the lifting motor 301 and the pressure motor 103, and more preferably an XYθ displacement adjustment module, which can perform displacement adjustment in the XY axis plane shown in the figure and θ angle adjustment around the plane Z axis to complete the application of compensation position information.

[0060] By combining the first displacement mechanism 2 and the second displacement mechanism 3, the first vision component 4 can move synchronously with the bonding component 1 during the visual alignment process, ensuring that the relative position between the first vision component 4 and the bonding head 101 can be maintained at a small distance, thereby reducing the amount of displacement adjustment of the bonding component 1 relative to the first vision component 4 during the visual alignment process and the compensation position adjustment process.

[0061] Further, in the preferred embodiment, the first vision component 4 includes a camera module 401 and a corresponding visual alignment optical path. The camera module 401 in the preferred embodiment includes a camera, a lens, and a light source, and is capable of emitting detection light into the visual alignment optical path. At the same time, a semi-transparent semi-reflective mirror 403 and a second reflective mirror 404 are sequentially arranged in the visual alignment optical path. The two mirrors are spaced apart in the first direction, so that the detection light emitted by the camera module 401 can obtain a downward first detection light and a transmitted light beam directed towards the second reflective mirror 404 after passing through the semi-transparent semi-reflective mirror 403. The transmitted light is reflected by the second reflective mirror 404 to obtain a second detection light that is spaced a certain distance from the first detection light and parallel to the first detection light.

[0062] In actual setup, the interval between the first detection light and the second detection light ( Figure 4 The dimensions of W3 in the figure correspond to those of the optical calibration component 5 in the first direction (X-axis direction in the figure), ensuring that the two detection lights can simultaneously illuminate the optical calibration component 5 as required by the test.

[0063] Meanwhile, in the preferred embodiment, a first reflector 402 is further preferably provided between the camera module 401 and the semi-transparent and semi-reflective mirror 403 to reflect the detection beam from the camera module 401 to the semi-transparent and semi-reflective mirror 403, thereby facilitating the arrangement of the camera module 401.

[0064] More specifically, in the preferred embodiment, the second reflector 404 is disposed on the side of the semi-transparent semi-reflective mirror 403 close to the bonding assembly 1, that is, the second detection light is located between the first detection light and the bonding head 101.

[0065] Furthermore, in the preferred embodiment, the optical calibration component 5 includes a black film layer 501 and a light-transmitting layer 502 stacked in a first direction, and the center distance between the two layers is further preferably equal to the distance between the first detection light and the second detection light.

[0066] Meanwhile, a calibration point 503 is provided on the bottom surface of the light-transmitting layer 502, so that the corresponding detection beam (the second detection beam in the preferred embodiment) can pass through the light-transmitting layer 502 and complete the imaging of the calibration point 503, thereby obtaining the position information of the calibration point 503 in the corresponding coordinate system.

[0067] More specifically, in the preferred embodiment, the optical calibration component 5 is disposed on the side of the bonding head 101 close to the first vision component 4, and the bottom of the optical calibration component 5 protrudes from the bottom surface of the bonding head 101. The protrusion distance is preferably equal to the thickness of the chip 7 to be bonded, so that after the bonding head 101 completes the picking of the chip 7 to be bonded, the calibration point 503 and the first marking point 701 are on the same horizontal plane.

[0068] Based on the above-mentioned settings of the optical calibration component 5, it is also convenient for the second vision component 6 to quickly and accurately complete the positioning and shooting of the calibration point 503 and the first marker point 701 when performing visual positioning.

[0069] For the second vision component 6 in the preferred embodiment, it is preferably a camera component, including a camera, a lens and a light source, and its arrangement can be further preferably the same as that of the camera module 401.

[0070] Of course, depending on the actual setup requirements, the optical calibration component 5 can also preferably be configured so that its bottom is flush with the bottom of the bonding head 101. In this case, the second vision component 6 is preferably a camera component with a depth of field range not less than the thickness of the chip 7 to be bonded. This approach can reduce the installation difficulty of the optical calibration component 5 to a certain extent and reduce the impact of the optical calibration component 5 on other chips besides the target chip 8 during subsequent hybrid bonding.

[0071] For example, in a more specific preferred embodiment, the optical calibration component 5 is preferably movably connected to the side wall of the bonding head 101 via a displacement adjustment mechanism, which can adjust the vertical position of the optical calibration component 5 relative to the bonding head 101 as needed.

[0072] During actual alignment, after the chip 7 to be bonded is picked up, the position of the bonding component 1 in the first direction is preferably adjusted to the following position:

[0073] The optical calibration component 5 does not block the first detection light reflected by the semi-transparent and semi-reflective mirror 403, and the second detection light output after being reflected by the second mirror 404 is directed toward the black film layer 501.

[0074] Simultaneously, the vertical distance H1 between the chip to be bonded 7 and the target chip 8 is adjusted to be equal to the distance W3 between the semi-transparent and semi-reflective mirror 403 and the second reflector 404. This setting ensures that the optical path lengths of the first detection light for capturing the second marker point 801 and the second detection light for capturing the calibration point 503 are equal.

[0075] By setting the optical calibration component 5 to be flush with the bottom of the chip 7 to be bonded, and setting the distance between the chip 7 to be bonded and the target chip 8 to be equal to the distance between the two detection beams emitted by the first vision component 4, the alignment focus of each detection beam at the required shooting point is consistent, thereby reducing the visual accuracy error caused by the inconsistency of focus.

[0076] More preferably, in actual setup, the thickness W2 of the optical calibration component 5 in the first direction is preferably 0.5 to 3 times the opening width W1 of the lens barrel of the first vision component 4.

[0077] For example, in the preferred embodiment, W1 is 1~10mm and W2 is 0.5~30mm.

[0078] More preferably, the thickness of the black film layer 501 and the light-transmitting layer 502 in the optical calibration component 5 is preferably equal, and their respective thicknesses are preferably 0.25mm to 15mm.

[0079] For example, in actual setup, the length of the optical calibration component 5 in the second direction is preferably equal to the length of the bonding head 101 in the second direction, and both ends of the optical calibration component 5 along the second direction are flush with the two end faces of the bonding head 101, such as... Figure 5 As shown in the diagram. It should be noted that the second direction mentioned above is a horizontal direction perpendicular to the first direction, i.e., as shown in the diagram. Figure 1 The Y-axis direction is shown in the figure.

[0080] In practice, in the preferred embodiment, a first coordinate system {name1} is established based on the bonding component 1 and the first vision component 4, and a second coordinate system {name2} is established based on the second vision component 6.

[0081] Based on this, set A matrix is ​​used to transform the vectors described in the second coordinate system {name2} to their description in the first coordinate system {name1}. In a two-dimensional planar coordinate system... The preferred matrix is ​​3×3.

[0082] The transformation matrix formula is as follows:

[0083]

[0084] In the formula, X and Y describe the origin of the {name2} coordinate system. O name2 The position coordinates in the {name1} coordinate system; Defined as the rotation matrix of the {name2} coordinate system relative to the {name1} coordinate system, it is used to characterize the rotation angles of the X and Y axes and describes the orientation of the {name2} coordinate system relative to the {name1} coordinate system. R 11 , R 12 , R 21 , R 22 For unknown quantities, calibration vectors can be used. P 1. P 2. Solve for the coordinates in the {name1} and {name2} coordinate system.

[0085] Through the design of the above transformation matrix formula, after the two vision components have acquired the position information of each point, the transformation of coordinate positions in the two coordinate systems can be accurately completed, thereby accurately acquiring the compensation position information between the second marker point 801 and the first marker point 701, and completing the visual alignment of the chip to be bonded 7 relative to the target chip 8.

[0086] For example, if a vector is known P The description in the second coordinate system {name2} is name2 P Meanwhile, the transformation matrix is ​​known. Then the vector P Description in the first coordinate system {name1}:

[0087] name1 P = name2 P

[0088] For the two vision components, they can accurately obtain the position coordinates of the calibration point 503 and the corresponding marker point in the two coordinate systems, and then obtain a vector based on the bright spot in each of the two coordinate systems; based on the aforementioned transformation matrix formula, they can accurately obtain the position compensation information between the first marker point 701 and the second marker point 801, and complete the alignment between the chip to be bonded 7 and the target chip 8.

[0089] Of course, besides the method of setting up separate coordinate systems for the two visual components and performing coordinate transformation as described above, other methods can be used to confirm the coordinates of the two marker points. For example, the two visual components can be marked in a large spatial coordinate system, and the alignment information between the two marker points can be obtained by acquiring the coordinates in that spatial coordinate system.

[0090] After alignment is completed, the bonding head 101 is pressed down. When the pressure reaches 1~5N, the vacuum is broken, and the two chips are tightly bonded together, completing the direct bonding process.

[0091] In a preferred embodiment, after the wafer 9 and the target chip 8 are loaded onto the carrier stage 10, the position of the carrier stage 10 remains fixed, and the relative position between the second vision component 6 and the carrier stage 10 is also fixed. However, in actual installation, a displacement mechanism can preferably be provided for the carrier stage 10 to adjust the position of the carrier stage 10 and the relative position between the carrier stage 10 and the second vision component 6 within the entire device.

[0092] In addition, a displacement mechanism can be preferably provided for the second vision component 6, which will not be elaborated here.

[0093] As another aspect of this utility model, based on the aforementioned hybrid bonding device, a hybrid bonding method based on vision alignment is further proposed, which preferably includes the following process:

[0094] (1) Control the bonding head 101 to adsorb the chip 7 to be bonded, so that the first mark point 701 on the chip 7 to be bonded faces downward; accordingly, the wafer 9 with several target chips 8 is loaded onto the carrier stage 10;

[0095] During process (1), it is preferable to calibrate the optical calibration component 5 to the following position: the black film layer 501 is aligned with the second detection light emitted from the second reflector 404, and the first detection light emitted from the semi-transparent and semi-reflective mirror 403 passes over the optical calibration component 5 and is emitted downward.

[0096] Meanwhile, it is preferable to align the bottom of the optical calibration component 5 with the bottom of the chip 7 to be bonded, and to calibrate the vertical distance between the calibration point 503 and the target chip 8 to be equal to the distance between the two detection beams in the first vision component 4.

[0097] (2) Control the first displacement mechanism 2 to work, driving the bonding component 1 to move above the second vision component 6, such as Figure 2 As shown in the diagram; at this time, the first visual component 4 moves synchronously with the bonding component 1;

[0098] (3) Control the second vision component 6 to work, and obtain the position coordinates of the calibration point 503 and the first marker point 701 in the second coordinate system respectively;

[0099] (4) Control the first displacement mechanism 2 to work, and drive the first vision component 4 to move above the target chip 8; at this time, the bonding component 1 moves synchronously with the first vision component 4;

[0100] (5) Control the second displacement mechanism 3 to work, drive the bonding component 1 to translate relative to the first vision component 4, and mark the black film layer 501 on the optical path of the second reflector 404, and mark the second mark point 801 on the target chip 8 on the optical path of the semi-transparent and semi-reflective mirror 403, control the first vision component 4 to work, and obtain the position coordinates of the second mark point 801 in the first coordinate system.

[0101] The above alignment process (5) can be completed in process (1) or after completing process (4), which will not be elaborated here.

[0102] (6) Control the second displacement mechanism 3 to continue to drive the bonding component 1 to translate relative to the first vision component 4 (i.e., along) Figure 4 (Move in the negative X-axis direction) to calibrate the black film layer 501 onto the optical path of the semi-transparent and semi-reflective mirror 403, and calibrate the calibration point 503 onto the optical path of the second reflector 404; thereafter, the camera module 401 continues to take pictures to obtain the position coordinates of the calibration point 503 in the first coordinate system;

[0103] (7) Perform coordinate transformation between the second coordinate system and the first coordinate system. Based on the position coordinates of the first marker point 701, the calibration point 503 and the second marker point 801, calculate the compensation position difference between the first marker point 701 and the second marker point 801. Control the second displacement mechanism 3 to perform compensation movement based on the compensation position difference, so that the first marker point 701 moves to directly above the second marker point 801, and complete the alignment between the chip to be bonded 7 and the target chip 8.

[0104] In a preferred embodiment, the coordinate transformation between the two coordinate systems is accomplished by the aforementioned transformation matrix formula, which will not be elaborated here.

[0105] (8) Control the pressure motor 103 in the bonding assembly 1 to work, press down the bonding head 101, so that the chip to be bonded 7 and the aligned target chip 8 are tightly attached until the bonding process is completed.

[0106] In another preferred embodiment, the calibration points 503 at the bottom of the light-transmitting layer 502 are two located at opposite ends of the Y-axis, and the first marking point 701 on the chip to be bonded 7 and the second marking point 801 on the target chip 8 are also two located in the Y-axis direction. Correspondingly, two first vision components 4 (i.e., as shown in the image) are provided in the Y-axis direction of the second displacement mechanism 3. Figure 5 The visual components 4a and 4b are in the middle, and the second visual component 6 is also set as two sets in the Y-axis direction.

[0107] At this time, in the above process (3), the two second vision components 6 respectively obtain the position coordinates of the two calibration points 503 at the bottom of the light-transmitting layer 502 and the two first mark points 701 of the chip to be bonded 7 near the end of the optical calibration component 5 in the second coordinate system.

[0108] Meanwhile, in the above processes (5) and (6), the two first vision components 4 respectively obtain the position coordinates of the two second marker points 801 at one end of the X-axis direction of the target chip 8 and the two calibration points 503 at the bottom of the light-transmitting layer 502 in the first coordinate system.

[0109] Subsequently, in the above process (7), based on the multiple position coordinates obtained in the first coordinate system and the second coordinate system, the compensation position difference between the two first marker points 701 and the two second marker points 801 is calculated, and then the position of the chip to be bonded 7 is adjusted according to the compensation position difference, so that the chip to be bonded 7 and the target chip 8 are accurately aligned in the Z-axis direction.

[0110] Finally, the hybrid bonding between the chip to be bonded 7 and the target chip 8 is completed by the lifting and lowering movement of the bonding component 1 in the Z-axis direction.

[0111] The hybrid bonding equipment based on vision alignment in this invention has a compact structure and is easy to use. It can accurately complete the bonding of the chip to be bonded to the target chip on the wafer, and accurately achieve visual alignment between the chip to be bonded and the target chip before hybrid bonding. This effectively ensures the alignment accuracy during chip hybrid bonding, reduces equipment errors in the bonding process, improves the quality and yield of chip products, and has good economic value.

[0112] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A vision alignment based hybrid bonding apparatus, comprising: The bonding assembly, the first displacement mechanism, the second displacement mechanism, the first vision assembly, the optical calibration assembly, the second vision assembly and the bearing table are included. The bearing table is used for bearing a target chip, which is arranged in a first direction with the second vision assembly. The bonding assembly includes a bonding head connected with a pressure motor, which is used for taking a chip to be bonded and completing hybrid bonding of the chip to be bonded and the target chip. The first displacement mechanism includes a horizontal displacement assembly, and the second displacement mechanism includes a vertical lifting assembly and a plane adjusting assembly; the first vision assembly and the vertical lifting assembly are respectively assembled with the horizontal displacement assembly, so that the horizontal displacement assembly can drive the bonding assembly and the first vision assembly to synchronously displace in the first direction; the bonding assembly is assembled with the vertical lifting assembly through the plane adjusting assembly, so that the vertical lifting assembly can adjust the lifting of the bonding assembly, and the plane adjusting assembly can adjust the XYθ of the bonding assembly relative to the first vision assembly in a plane. The first vision assembly is arranged on one side of the bonding assembly and includes a camera module and a semi-transmissive and semi-reflective mirror and a reflective mirror arranged in sequence on a light path of the camera module, so that a shooting light path of the camera module can obtain first detection light and second detection light which are parallel to each other and vertically downward after passing through the two mirrors; the second vision assembly includes a camera module, which is used for generating third detection light which is vertically upward. The optical calibration assembly is arranged on one side of the bonding assembly close to the first vision assembly, and includes a black film layer and a light transmission layer arranged in sequence in the first direction, and a calibration point is arranged at the bottom of the light transmission layer.

2. The vision alignment based hybrid bonding apparatus according to claim 1, wherein, The bottom of the optical calibration assembly protrudes from the bottom of the bonding head, and the protruding distance of the optical calibration assembly is equal to the thickness of the chip to be bonded, so that the bottom of the optical calibration assembly is flush with the bottom surface of the chip to be bonded after the chip to be bonded is adsorbed on the bonding head.

3. The vision alignment based hybrid bonding apparatus according to claim 1, wherein, The bottom of the optical calibration assembly is flush with the bottom of the bonding head, and the depth of field range of the camera module in the second vision assembly is not less than the thickness of the chip to be bonded.

4. The vision alignment based hybrid bonding apparatus according to any one of claims 1 to 3, wherein The thickness of the black film layer is equal to the thickness of the light transmission layer.

5. The vision alignment based hybrid bonding apparatus according to any one of claims 1 to 3, wherein The bottom of the optical calibration assembly is flush with the bottom of the bonding head, and the depth of field range of the camera module in the second vision assembly is not less than the thickness of the chip to be bonded.

6. The vision alignment based hybrid bonding apparatus according to any one of claims 1 to 3, wherein The black film layer and the light transmission layer have equal thickness.

7. The vision alignment based hybrid bonding apparatus according to any one of claims 1 to 3, wherein The optical calibration assembly and the side wall of the bonding head are movably connected through a displacement adjusting mechanism, which is used for adjusting the vertical position of the optical calibration assembly relative to the bonding head.

8. The vision alignment based hybrid bonding apparatus according to claim 7, wherein, The thickness of the optical calibration assembly in the first direction is 0.5-3 times the opening width of the first vision assembly lens barrel.

9. The vision alignment based hybrid bonding apparatus according to any one of claims 1 to 3, 8, wherein The optical calibration assembly is flush with the two side end faces of the bonding head at both ends thereof in the second direction, and the second direction is a horizontal direction perpendicular to the first direction. The first vision assembly and the second vision assembly are both arranged in the second direction. The bonding head is a suction disc with negative pressure adsorption capacity, and a plurality of adsorption holes are arranged on the bottom surface thereof.

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