Radio frequency feedthrough component, coaxial radio frequency feedthrough component and package for radio frequency circuit

Abstract

The utility model relates to a radio frequency feed-through component, a coaxial radio frequency feed-through component and a packaging piece for a radio frequency circuit. A radio frequency (RF) feedthrough component having an impedance greater than 20 ohms is disclosed. The radio frequency feedthrough component includes a ceramic body having a flexible non-ferrous conductor adhered to an outer peripheral surface of the ceramic body and to an inner peripheral surface of a hole passing through the ceramic body. A non-ferrous conductive lead is disposed through the aperture and projects from at least one side of the aperture. A non-ferrous hermetic seal is formed between a portion of the non-ferrous conductive lead disposed in the hole and a non-ferrous conductor adhered to an inner circumferential surface of the hole. The RF feedthrough component may be assembled in the opening of the conductive housing to form an electromagnetic shielding package for the circuit.

Description

Technical Field

[0001] This disclosure generally relates to radio frequency (RF) feedthrough components, coaxial RF feedthrough components, and packages for RF circuits, and more specifically to ceramic RF feedthrough components and combinations thereof suitable for hermetically sealed circuit packages. Background Technology

[0002] Circuits enclosed in a hermetically sealed package typically include electrical leads or pins through which current and electrical signals are transmitted to and from the circuit. The hermetically sealed design is essential to prevent the penetration of fluids, particles, and other environmental contaminants. The package typically comprises a conductive housing made of metal or a metal-clad insulator. The conductive housing electrically shields the circuit from external interference and prevents the circuit from causing interference outside the package.

[0003] Electrical leads or pins are typically integrated with an insulated feedthrough component assembled in an opening through a conductive housing. The feedthrough component includes a conductive ring surrounding an insulator that electrically insulates the electrical pin or lead from the ring. The insulator is typically borosilicate glass, and both the pin and ring are machined from a metal alloy called Kovar, which has the same coefficient of thermal expansion (CTE) as the glass. During manufacturing, the glass is bonded to the ring and electrical pin by firing the parts positioned in a fixture, which form a glass-metal hermetic seal upon cooling. Alternatively, the ring, glass, and pin can be assembled via an interference fit. For corrosion resistance and solderability, an adhesion layer of nickel and an external gold plating is deposited on the exposed Kovar alloy to complete the assembly. The assembled feedthrough's conductive ring is then soldered to the conductive housing to hermeticly seal the circuit package.

[0004] However, the glass-metal feedthrough components described in this article are labor-intensive and costly to manufacture. Furthermore, glass-metal feedthroughs are poor conductors of RF energy and a source of passive intermodulation (PIM) distortion. These side effects can be attributed to the relatively lossy and iron-containing properties of nickel and Kovar alloys. More specifically, the unplated portions of the Kovar alloy pins within the glass insulator attenuate the RF signal. Additionally, the skin depth at typical RF frequencies is greater than the thickness of the external gold plating, causing RF energy to propagate through the lossy nickel and Kovar alloys. Therefore, there has been a need for improved RF feedthrough components and combinations thereof suitable for hermetically sealed circuit packages. Utility Model Content

[0005] In a first aspect, an radio frequency (RF) feedthrough component is described. The RF feedthrough component includes: a ceramic body having an outer peripheral surface and a hole with an inner peripheral surface; a nonferrous conductor adhered to the outer peripheral surface of the ceramic body and to the inner peripheral surface of the hole; and a nonferrous conductive lead disposed through the hole, a portion of the nonferrous conductive lead being disposed in the hole of the ceramic body, and another portion of the nonferrous conductive lead extending from at least one side of the ceramic body, wherein a nonferrous hermetic seal is formed between the portion of the nonferrous conductive lead disposed in the hole and the nonferrous conductor adhered to the inner peripheral surface of the hole; and wherein the characteristic impedance of the RF feedthrough component is greater than 20 ohms.

[0006] Preferably, the non-ferrous conductor can be flexible.

[0007] Preferably, the non-ferrous conductor may include gap vacancies.

[0008] Preferably, the non-ferrous conductor can be a thick film.

[0009] Preferably, the radio frequency feedthrough component may further include an adhesive film deposited on the ceramic body, wherein the non-ferrous conductor comprises a thin film deposited on the adhesive film.

[0010] Preferably, the RF feedthrough component can be a coaxial device, and the non-ferrous conductive lead can include pins with diameters between 0.009 inches and 0.030 inches, the diameter of the hole can be between 0.011 inches and 0.032 inches, and the outer diameter of the ceramic body can be between 0.071 inches and 0.0470 inches.

[0011] Preferably, the RF feedthrough component may include an impedance of 50 ohms, wherein the ceramic body has a relative permittivity between 5 and 9.

[0012] Preferably, the RF feedthrough component may include an impedance of 75 ohms, wherein the ceramic body has a relative permittivity between 5 and 9.

[0013] Secondly, a coaxial radio frequency (RF) feedthrough component is described. This coaxial RF feedthrough component includes: a ceramic body having an outer peripheral surface and a hole with an inner peripheral surface; a nonferrous metal mesh adhered to the outer peripheral surface of the ceramic body and to the inner peripheral surface of the hole; and a nonferrous conductive lead disposed through the hole, a portion of the nonferrous conductive lead being disposed in the hole, and another portion of the nonferrous conductive lead extending from opposite sides of the ceramic body, wherein a nonferrous hermetic seal is formed between the portion of the nonferrous conductive lead disposed in the hole and the nonferrous metal mesh adhered to the inner peripheral surface of the hole; and wherein the characteristic impedance of the coaxial RF feedthrough component is greater than 20 ohms.

[0014] Preferably, the coaxial RF feedthrough component may include a low-pass cutoff frequency between 75 GHz and 8 GHz, as given by the following expression:

[0015]

[0016] Where D is the outer diameter of the ceramic body, d is the diameter of the hole, and ε r It is the relative permittivity of the ceramic body.

[0017] Preferably, the characteristic impedance can be between 50 ohms and 75 ohms, including 50 ohms and 75 ohms.

[0018] Preferably, the non-ferrous metal mesh may include gaps or vacancies, wherein the non-ferrous metal mesh is flexible.

[0019] Thirdly, a package for radio frequency (RF) circuits is described. The package includes: an electrically shielded housing including a conductive opening extending through a wall portion of the electrically shielded housing; and a coaxial RF feedthrough comprising: a nonferrous conductor adhered to an outer peripheral surface of a ceramic body and adhered to an inner peripheral surface of a hole passing through the ceramic body; a nonferrous conductive lead disposed through the hole and electrically connected to the nonferrous conductor on the inner peripheral surface of the hole, the coaxial RF feedthrough having an impedance greater than 20 ohms; the ceramic body is disposed in the conductive opening of the electrically shielded housing, and the nonferrous conductor on the outer peripheral surface of the ceramic body is electrically connected to the conductive opening, wherein the coaxial RF feedthrough is hermetically sealed to the electrically shielded housing.

[0020] Preferably, the nonferrous conductor may include gap vacancies, wherein the nonferrous conductor is flexible.

[0021] Preferably, the coaxial RF feedthrough component may have an impedance of 50 ohms.

[0022] Preferably, the nonferrous conductive lead may include pins with diameters between 0.009 inches and 0.030 inches, the diameter of the hole may be between 0.011 inches and 0.032 inches, and the outer diameter of the ceramic body may be between 0.071 inches and 0.0390 inches, wherein the coaxial RF feedthrough component has a low-pass cutoff frequency between 75 GHz and 9 GHz.

[0023] Preferably, the coaxial RF feedthrough component may have an impedance of 75 ohms.

[0024] Preferably, the nonferrous conductive lead may include pins with diameters between 0.009 inches and 0.015 inches, the diameter of the hole may be between 0.011 inches and 0.017 inches, and the outer diameter of the ceramic body may be between 0.180 inches and 0.470 inches, wherein the coaxial RF feedthrough component has a low-pass cutoff frequency between 30 GHz and 8 GHz. Attached Figure Description

[0025] The objects, features, and advantages of this disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. The drawings depict only representative embodiments and should not be considered as limiting the scope of the invention.

[0026] Figure 1 This is a cross-sectional view of a ceramic RF feedthrough component.

[0027] Figure 2 It is a three-dimensional diagram of a non-ferrous conductor on a ceramic body.

[0028] Figure 3 This is a partial exploded view of the ceramic RF feedthrough component and the conductive housing.

[0029] Figure 4 This is a cross-sectional view of a ceramic RF feedthrough component assembled with a conductive housing.

[0030] Those skilled in the art will understand that: the accompanying drawings are for simplicity and clarity and may therefore not be drawn to scale and may not include well-known features; the order in which actions or steps occur may differ from the order described; unless otherwise stated, the order or occurrence of these actions or steps may be simultaneous, and the terms and expressions used herein have the meanings understood by those skilled in the art, unless the different meanings are expressly attributed to them herein. Detailed Implementation

[0031] This disclosure generally relates to radio frequency (RF) feedthrough components (also referred to herein as “feedthroughs”), and more specifically to ceramic RF feedthrough components and combinations thereof suitable for hermetically sealed circuit packages.

[0032] The RF feedthrough components described herein typically include nonferrous conductors selectively adhered to the outer peripheral surface of a ceramic body and to the inner peripheral surface of a hole passing through the ceramic body. Nonferrous conductive leads are disposed through the hole and extend from one or both sides of the hole. A portion of the nonferrous conductive leads disposed within the hole is hermetically sealed to a thick-film conductor adhered to the surface of the hole. The representative impedance of the ceramic RF feedthrough components described herein is greater than 20 ohms.

[0033] exist Figure 1 In this design, the coaxial radio frequency (RF) feedthrough component 100 includes an annular ceramic body 110 having an outer peripheral surface 112 and a hole with an inner peripheral surface 114. Representative ceramic materials include alumina and aluminum nitride, as well as other ceramic formulations. Ceramics, particularly Class 1 COG ceramics, exhibit good temperature stability from -55°C to 125°C. More specific ceramic material properties are further described herein.

[0034] exist Figure 2 In this embodiment, a nonferrous conductor 116 adheres to the outer peripheral surface 112 of the ceramic body and the inner peripheral surface 114 of the hole. The nonferrous conductor may include silver, palladium, or other relatively soft metals or alloys thereof, which can accommodate the thermal expansion and contraction of the ceramic body. In one implementation, the nonferrous metal has a purity of at least 90%.

[0035] exist Figure 2 In this embodiment, the nonferrous conductor 116 is configured as a flexible metal mesh 118 adhered to the outer and inner peripheral surfaces of the ceramic body. The mesh structure includes vacancies 119, which enhance the ability of the soft metal to expand and contract together with the ceramic body. In one implementation, a thick-film technique is used to deposit the nonferrous conductor onto the ceramic body. More specifically, a thick-film paste comprising a soft nonferrous metal, oxide, or alloy thereof mixed with glass frit in a slurry is applied to selected portions of the ceramic body. The thick-film paste can be applied to the ceramic body in spraying, dipping, screen printing, stencil printing, or other deposition operations. The ceramic body selectively coated with the thick-film paste is then subjected to a firing operation, during which the glass powder is burned off, thereby creating vacancies in the nonferrous conductors on the ceramic body. For illustrative purposes, Figure 2 The diagram shows vacancies 119 as discrete openings. In fact, vacancies are microscopic interstitial spaces between the constituent elements of a nonferrous conductor. These vacancies define a metallic mesh on the outer and inner circumferential surfaces of the ceramic body and increase the flexibility of the nonferrous conductor. The nonferrous conductor can have a thickness of approximately 0.0015 inches and can be constructed in layers to increase the thickness.

[0036] Alternatively, nonferrous conductors can be formed on the ceramic body using thin-film technology. Thin-film processes typically involve sputtering a thin adhesive layer onto a selected surface of the ceramic body before sputtering a conductive layer onto it. In one implementation, the nonferrous conductive layer comprises a copper film deposited on the adhesive layer and a gold film subsequently deposited on the copper film. One or more other nonferrous conductive materials can be used instead of the representative copper and gold films. In some thin-film processes, the adhesive layer comprises a ferrihydride compound. Therefore, ceramic RF feedthroughs comprising thin-film nonferrous conductors deposited on a thin-film ferrihydride adhesive layer may not perform as well as ceramic RF feedthroughs comprising the aforementioned nonferrous thick-film conductors. However, ceramic RF feedthroughs comprising one or more nonferrihydride thin-film conductive layers deposited on a ferrihydride thin-film adhesive layer still perform significantly better than prior art RF feedthroughs comprising Kovar alloys and glass (e.g., producing less PIM distortion).

[0037] In another alternative, nonferrous conductors can be directly bonded to the ceramic body. Direct bonding processes typically involve high-temperature oxidation of copper or other nonferrous conductors in nitrogen or other suitable atmospheres with controlled oxygen content. Nonferrous conductors applied using thin-film or direct bonding techniques may be less flexible than those applied using thick-film techniques.

[0038] In some implementations, the ceramic RF feedthrough component may include any combination of thick film, thin film, or directly bonded nonferrous conductors. For example, one or more thin film nonferrous conductors may be deposited on an adhesion layer on the inner peripheral surface 114 of a hole (with conductive leads disposed in the hole), and thick film nonferrous conductors may be deposited on the outer peripheral surface 112 of the ceramic body.

[0039] exist Figure 1 In the ceramic body, a nonferrous conductive lead 120, which is disposed through and fixed to the hole in the ceramic body, extends from one or both of the opposite sides of the ceramic body. A portion of the nonferrous conductive lead located within the hole is hermetically sealed with a nonferrous conductor 116 adhered to the surface of the hole. The nonferrous conductive lead can be configured as a pin with a specific diameter or some other cross-sectional shape.

[0040] In one implementation, through Figure 1 The nonferrous solder 117 shown forms an hermetically sealed seal. The solder can be a high-temperature non-leaching solder. One such solder is a Sn10 formulation primarily containing lead and smaller amounts of other elements (such as silver). Lead solder is relatively soft and will maintain a hermetically sealed seal as the ceramic body expands and contracts in most operating environments. In one implementation, the nonferrous conductive leads comprise pure silver or copper coated with pure silver. As used herein, "pure" means a purity of not less than 90%. Alternatively, other nonferrous conductors may be used.

[0041] The manufacturing cost of RF feedthrough components, including those with nonferrous metals deposited on the ceramic body described herein, is significantly lower than that of prior art glass-metal feedthroughs. Thick film and other nonferrous deposition processes are less labor-intensive than machining Kovar alloy ferrules and conductive leads, followed by assembling prior art glass-metal feedthroughs. Furthermore, the ceramic RF feedthrough components described herein exhibit significantly better performance compared to prior art glass-metal feedthroughs, partly due to a significant reduction in RF attenuation caused by the use of nonferrous conductors, reduced PIM distortion, and the low CTE of ceramics.

[0042] The characteristic impedance Z of the coaxial ceramic RF feedthrough component o It is given by the following expression (Equation I):

[0043]

[0044] Where D is the outer diameter of the ceramic body, d is the diameter of the pore, and ε r It is the relative permittivity of the ceramic body.

[0045] The ceramic RF feedthrough components described in this article can have any characteristic impedance. Representative ceramic RF feedthrough components described herein have a characteristic impedance greater than 20 ohms. 50 ohms and 75 ohms are the most common. Feedthroughs with 50 ohms are typically used in RF (including microwave) applications. Feedthroughs with 75 ohms are typically used in cable and satellite television, as well as video applications. Other less common RF feedthrough component characteristic impedances include 125 ohms used in the aerospace industry and 92 ohms specified by the Nuclear Instrument Module (NIM) standard for experimental research.

[0046] For most RF feedthrough applications, the electrical and mechanical constraints of the host device determine the characteristic impedance and size of the RF feedthrough, as shown in Equation I. Representative nonferrous conductive pin dimensions and ceramic body dimensions of the coaxial ceramic RF feedthroughs with 50-ohm and 75-ohm impedances described herein are shown in Table I below.

[0047] Table I

[0048] ohm pin diameter Relative permittivity outer diameter inner diameter Cutoff frequency (GHz) 50 0.009 5 0.071 0.011 74.33823738 50 0.015 5 0.110 0.017 47.98195322 50 0.018 5 0.129 0.020 40.91484383 50 0.020 5 0.142 0.022 37.16911869 50 0.030 5 0.206 0.032 25.62143133 50 0.009 9 0.134 0.011 29.35820896 50 0.015 9 0.208 0.017 18.91346154 50 0.018 9 0.240 0.020 16.39166667 50 0.020 9 0.269 0.022 14.62453532 50 0.030 9 0.390 0.032 10.08717949 75 0.009 5 0.180 0.011 29.32230474 75 0.015 5 0.279 0.017 18.91761596 75 0.009 9 0.470 0.011 8.370212766

[0049] The low-pass cutoff frequency of the coaxial ceramic RF feedthrough component is given by the following expression (Equation II):

[0050]

[0051] Where D is the outer diameter of the ceramic body, d is the diameter of the pore, and ε rThis is the relative permittivity of the ceramic body. Table I above includes the cutoff frequencies of representative feedthroughs with 50 ohms and 75 ohms impedance as described herein. The 50-ohm coaxial ceramic RF feedthrough includes low-pass cutoff frequencies between 75 GHz and 10 GHz. The 75-ohm coaxial ceramic RF feedthrough includes low-pass cutoff frequencies between 30 GHz and 8 GHz. Other cutoff frequencies can be selected by appropriately choosing the ceramic body size and relative permittivity.

[0052] In a representative 50-ohm implementation shown in Table I, the RF feedthrough is a coaxial device with non-ferrous conductive leads including pins with diameters between 0.009 inches and 0.030 inches. The ceramic body has a relative permittivity of 5, with an inner diameter between 0.011 inches and 0.032 inches and an outer diameter between 0.071 inches and 0.0206 inches.

[0053] In another representative 50-ohm implementation shown in Table I, the RF feedthrough is a coaxial device with non-ferrous conductive leads including pins with diameters between 0.009 inches and 0.030 inches. The ceramic body has a relative permittivity of 9, with an inner diameter between 0.011 inches and 0.032 inches and an outer diameter between 0.134 inches and 0.390 inches.

[0054] In a representative 75-ohm implementation shown in Table I, the RF feedthrough is a coaxial device with non-ferrous conductive leads including pins with diameters between 0.009 inches and 0.015 inches. The ceramic body has a relative permittivity of 5, with an inner diameter between 0.011 inches and 0.017 inches and an outer diameter between 0.180 inches and 0.279 inches.

[0055] In another representative 75-ohm implementation shown in Table I, the RF feedthrough is a coaxial device with non-ferrous conductive leads including pins with a diameter of 0.009 inches, a ceramic body with a relative permittivity of 9, an inner diameter of 0.011 inches, and an outer diameter of 0.470 inches.

[0056] More generally, the characteristic impedance, size, and relative permittivity of ceramic RF feedthrough components may differ from the examples in Table I.

[0057] In use, one or more ceramic RF feedthrough components can be assembled with a conductive housing to form a hermetically sealed and electromagnetically shielded package for RF circuitry. Figure 3 and Figure 4In this embodiment, the radio frequency (RF) circuit package 200 includes an electrically shielded housing 210, which includes a conductive opening 212 extending through a wall portion 214 of the housing. The circuit package may also include an opening 216 through which circuitry can be mounted within the housing before a cover (not shown) is placed over the opening 216 and hermetically sealed. The housing may comprise a metallic material or an insulator coated with a conductive material on its inner or outer surfaces for electromagnetic shielding. The conductive opening 212 may be adjacent to other conductive portions of the housing. A ceramic RF feedthrough component 100 assembled with the housing 210 includes a nonferrous conductor 116 adhered to the outer peripheral surface of an annular ceramic body 110, as described herein. Nonferrous conductive leads 120 disposed through holes are electrically connected to nonferrous conductors on the inner peripheral surface of the holes, as described herein. The annular ceramic body 110 of the RF feedthrough component 100 is disposed within the conductive opening 212 of the housing. The nonferrous conductor 116 on the outer peripheral surface of the ceramic body is electrically connected to the conductive opening 212. The hermetic seal between the conductive opening 212 and the annular ceramic body 110 can be formed by the high-temperature non-leaching solder described herein. Figure 3 and Figure 4 The ceramic RF feedthrough component 100 shown can be implemented according to any representative implementation disclosed and proposed herein.

[0058] While this disclosure and its contents, which are currently considered to be the best mode thereof, have been described in a manner that establishes ownership and enables those skilled in the art to make and use it, it should be understood and appreciated that many equivalent substitutions and changes may be made to the representative embodiments described herein without departing from the scope and spirit of the invention, which is not limited to the described embodiments but rather to the appended claims and their equivalents.

Claims

1. A radio frequency feedthrough component, characterized in that, The RF feedthrough component includes: A ceramic body having an outer peripheral surface and a hole with an inner peripheral surface; A nonferrous conductor, which adheres to the outer peripheral surface of the ceramic body and to the inner peripheral surface of the hole; and A non-ferrous conductive lead is provided, which passes through the hole, with a portion of the non-ferrous conductive lead disposed within the hole in the ceramic body, and another portion of the non-ferrous conductive lead extending from at least one side of the ceramic body. Specifically, a nonferrous hermetic seal is formed between the portion of the nonferrous conductive lead disposed in the hole and the nonferrous conductor adhered to the inner circumferential surface of the hole; and The characteristic impedance of the radio frequency feedthrough component is greater than 20 ohms.

2. The radio frequency feedthrough component according to claim 1, characterized in that, The non-ferrous conductor is flexible.

3. The radio frequency feedthrough component according to claim 2, characterized in that, The non-ferrous conductor includes gaps or vacancies.

4. The radio frequency feedthrough component according to claim 3, characterized in that, The non-ferrous conductor is a thick film.

5. The radio frequency feedthrough component according to claim 3, characterized in that, The radio frequency feedthrough component further includes an adhesive film deposited on the ceramic body, wherein the non-ferrous conductor comprises a thin film deposited on the adhesive film.

6. The radio frequency feedthrough component according to claim 3, characterized in that, The RF feedthrough component is a coaxial device, and the non-ferrous conductive leads include pins with diameters between 0.009 inches and 0.030 inches, the orifice diameter is between 0.011 inches and 0.032 inches, and the outer diameter of the ceramic body is between 0.071 inches and 0.0470 inches.

7. The radio frequency feedthrough component according to claim 6, characterized in that, The radio frequency feedthrough component includes a 50-ohm impedance, wherein the ceramic body has a relative permittivity between 5 and 9.

8. The radio frequency feedthrough component according to claim 6, characterized in that, The radio frequency feedthrough component includes a impedance of 75 ohms, wherein the ceramic body has a relative permittivity between 5 and 9.

9. A coaxial radio frequency feedthrough component, characterized in that, The coaxial RF feedthrough component includes: A ceramic body having an outer peripheral surface and a hole with an inner peripheral surface; A non-ferrous metal mesh, which is adhered to the outer peripheral surface of the ceramic body and to the inner peripheral surface of the holes; and A non-ferrous conductive lead is provided, passing through the hole, with a portion of the non-ferrous conductive lead disposed within the hole and another portion extending from opposite sides of the ceramic body. Specifically, a non-ferrous hermetic seal is formed between the portion of the non-ferrous conductive lead disposed in the hole and the non-ferrous metal mesh adhered to the inner circumferential surface of the hole; and The characteristic impedance of the coaxial RF feedthrough component is greater than 20 ohms.

10. The coaxial radio frequency feedthrough component according to claim 9, characterized in that, The coaxial RF feedthrough component includes a low-pass cutoff frequency between 75 GHz and 8 GHz, as given by the following expression: Where D is the outer diameter of the ceramic body, d is the diameter of the hole, and ε r It is the relative permittivity of the ceramic body.

11. The coaxial radio frequency feedthrough component according to claim 10, characterized in that, The characteristic impedance is between 50 ohms and 75 ohms, including 50 ohms and 75 ohms.

12. The coaxial radio frequency feedthrough component according to any one of claims 9 to 11, characterized in that, The non-ferrous metal mesh includes gaps and vacancies, wherein the non-ferrous metal mesh is flexible.

13. A package for radio frequency circuits, characterized in that, The package includes: An electrically shielded housing, the electrically shielded housing including a conductive opening extending through a wall portion of the electrically shielded housing; and A coaxial radio frequency feedthrough component, the coaxial radio frequency feedthrough component comprising: A nonferrous conductor, which adheres to the outer peripheral surface of the ceramic body and to the inner peripheral surface of a hole passing through the ceramic body; and A non-ferrous conductive lead, which passes through the hole and is electrically connected to the non-ferrous conductor on the inner circumferential surface of the hole. The impedance of the coaxial RF feedthrough component is greater than 20 ohms; The ceramic body is disposed in the conductive opening of the electrically shielded housing, and the non-ferrous conductor on the outer peripheral surface of the ceramic body is electrically connected to the conductive opening. The coaxial radio frequency feedthrough component is hermetically sealed to the electrically shielded housing.

14. The package for radio frequency circuits according to claim 13, characterized in that, The nonferrous conductor includes gap vacancies, wherein the nonferrous conductor is flexible.

15. The package for radio frequency circuits according to claim 14, characterized in that, The coaxial RF feedthrough component has an impedance of 50 ohms.

16. The package for radio frequency circuits according to claim 15, characterized in that, The nonferrous conductive leads include pins with diameters between 0.009 inches and 0.030 inches, the orifices have diameters between 0.011 inches and 0.032 inches, and the ceramic body has an outer diameter between 0.071 inches and 0.0390 inches, wherein the coaxial RF feedthrough has a low-pass cutoff frequency between 75 GHz and 9 GHz.

17. The package for radio frequency circuits according to claim 14, characterized in that, The coaxial RF feedthrough component has an impedance of 75 ohms.

18. The package for radio frequency circuits according to claim 17, characterized in that, The nonferrous conductive leads include pins with diameters between 0.009 inches and 0.015 inches, the orifices have diameters between 0.011 inches and 0.017 inches, and the ceramic body has an outer diameter between 0.180 inches and 0.470 inches, wherein the coaxial RF feedthrough has a low-pass cutoff frequency between 30 GHz and 8 GHz.

Images