IC removal device and TOC analysis system

Abstract

The embodiment of the utility model discloses an IC removal device and a TOC analysis system, and relates to the technical field of TOC detection. The IC removal device includes an upper case, a lower case, and a permselective membrane. A first groove is formed in the upper shell, first fixing pieces are arranged at the two ends of the upper shell, and the first groove is used for containing oxycarbide. A second groove is formed in the lower shell, fixing grooves are formed in the two ends of the lower shell, the second groove is used for containing sample fluid, a second fixing piece is arranged in each fixing groove, the upper shell and the lower shell are fixed in an involution mode, and the first fixing piece is inserted into the fixing grooves and abuts against the second fixing pieces, so that the upper shell and the lower shell are detachably fixed. And the selective permeable membrane is arranged between the upper shell and the lower shell and is used for allowing oxycarbide to pass through.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of TOC detection, in particular to an IC removal device and a TOC analysis system. BACKGROUND

[0002] A total organic carbon (TOC) analyzer is widely used in the municipal water supply, pharmaceutical, food and beverage, and microelectronics industries for quantitative detection of organic pollutants in water. The principle of the TOC analyzer is to detect the total carbon (TC) and inorganic carbon (IC) content in the sample at the same time, and calculate the TOC content of the sample according to the following formula: TOC = TC - IC.

[0003] As can be seen from the above formula, when the IC content in the sample is too high, the cumulative error effect will affect the TOC detection accuracy. The traditional method for removing IC is to first adjust the sample to be acidic, and then use an IC removal device to remove IC, because when IC exists in the form of carbonic acid, it can be precipitated from the liquid stream. However, the current IC removal device has a low IC removal rate. CONTENT OF THE INVENTION

[0004] The embodiments of the present application provide an IC removal device and a TOC analysis system to improve the problem of low IC removal rate of the IC removal device.

[0005] In a first aspect, the embodiments of the present application provide an IC removal device, comprising:

[0006] an upper shell having a first recess for accommodating carbon oxides, and first fixing members at both ends of the upper shell;

[0007] a lower shell having a second recess for accommodating sample fluid, and fixing grooves at both ends of the lower shell, and second fixing members in the fixing grooves, the upper shell and the lower shell being fixed together, the first fixing members being inserted into the fixing grooves and abutting against the second fixing members to detachably fix the upper shell and the lower shell, and the first recess and the second recess being arranged in alignment to form a gas precipitation space;

[0008] a selective permeation membrane arranged between the upper shell and the lower shell, and a portion of the selective permeation membrane being located in the gas precipitation space to separate the first recess and the second recess, the selective permeation membrane being used for the carbon oxides to pass through.

[0009] In some embodiments of the present application, the fixing groove comprises a vertical groove and a horizontal groove, the vertical groove is communicated with the horizontal groove to form an L-shaped fixing groove, the first fixing member is inserted into the vertical groove, and the second fixing member is slidably arranged in the horizontal groove and abuts against the first fixing member.

[0010] In some embodiments of the present application, the second fixing member comprises an abutting member and an elastic member, one end of the elastic member is connected to an inner wall of the horizontal groove away from the vertical groove, the other end of the elastic member is connected to the abutting member, and the abutting member abuts against the first fixing member or extends into the vertical groove away from the elastic member.

[0011] In some embodiments of the present application, when the abutting member abuts against the first fixing member, the elastic member is in a compressed state; when the abutting member does not abut against the first fixing member and extends into the vertical groove, the elastic member is in a natural state.

[0012] In some embodiments of the present application, an inner wall of the horizontal groove away from the vertical groove is provided with a positioning column, and the elastic member is sleeved on the positioning column.

[0013] In some embodiments of the present application, one end of the first fixing member away from the upper shell is provided with a contact inclined surface, one end of the second fixing member facing the vertical groove is provided with a guide inclined surface, and the contact inclined surface is parallel to the guide inclined surface, so that when the first fixing member is inserted into the vertical groove, the contact inclined surface can push the second fixing member to slide away from the vertical groove and compress the elastic member.

[0014] In some embodiments of the present application, the first groove is a reciprocatingly bent snake shape, and / or the second groove is a reciprocatingly bent snake shape.

[0015] In some embodiments of the present application, a plurality of speed reduction protrusions are arranged in the first groove and / or the second groove.

[0016] In some embodiments of the present application, the IC removal device further comprises two clamping members, the two clamping members are respectively arranged at two ends of the upper shell, the clamping members are clamped to one side of the upper shell away from the lower shell and one side of the lower shell away from the upper shell, so that the upper shell and the lower shell are pressed towards each other.

[0017] In a second aspect, embodiments of the present application provide a TOC analysis system comprising the IC removal device according to the first aspect.

[0018] It can be seen that the IC removal device disclosed by the embodiment of the application realizes the precipitation of carbon oxides in the sample fluid by using the upper shell, the lower shell and the selective permeation membrane. Since the selective permeation membrane is used, the precipitation rate of carbon oxides is improved. In detail, the first recess is first formed in the upper shell for accommodating carbon oxides, the second recess is formed in the lower shell for accommodating the sample fluid, the selective permeation membrane is arranged between the first recess and the second recess to isolate the first recess and the second recess, so that the carbon oxides in the sample fluid can enter the first recess through the selective permeation membrane, the removal of carbon oxides is completed, and the removal rate of carbon oxides is improved. Moreover, by using the first fixing member of the upper shell and the second fixing member of the lower shell, the first fixing member can be inserted into the fixing groove of the lower shell and abut against the second fixing member, so that the upper shell and the lower shell can be quickly disassembled, and the subsequent cleaning, maintenance and replacement of the upper shell, the lower shell and the selective permeation membrane are facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0020] Figure 1 A structural block diagram of an IC removal device provided by the embodiment of the application is provided.

[0021] Figure 2 A partial structural cross-sectional schematic view of an IC removal device provided by the embodiment of the application is provided.

[0022] Figure 3 An exploded schematic view of Figure 2 .

[0023] Figure 4 A structural schematic view of the first recess of the upper shell in the IC removal device provided by the embodiment of the application is provided.

[0024] Figure 5 A structural schematic view of the second recess of the lower shell in the IC removal device provided by the embodiment of the application is provided.

[0025] Explanation of reference signs:

[0026] 1, upper shell; 11, first groove; 12, first fixing member; 13, first mounting groove; 2, lower shell; 21, second groove; 22, second fixing member; 221, abutting member; 222, elastic member; 23, second mounting groove; 24, fixing groove; 241, vertical groove; 242, horizontal groove; 243, positioning column; 25, deceleration protrusion; 3, selective permeation membrane; 4, clamping member; 5, vacuum pump; 6, air purification column; 7, heating member. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative work fall within the scope of the present application.

[0028] In the description of the present application, it should be understood that the words "first", "second" are only used for description purpose, and cannot be understood as indicating or implying relative importance or indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0029] Figure 1 The structural block diagram of the IC removal device provided in the embodiment is shown in Figure 2 The partial structural section schematic diagram of the IC removal device provided in the embodiment is shown in Figure 1 and Figure 2 The present embodiment provides an IC removal device, and accordingly, a TOC analysis system is provided.

[0030] The TOC analysis system includes the IC removal device, and further includes a carbon content detection module, which detects the sample fluid after the IC is removed.

[0031] Please refer to Figure 2 and Figure 3The IC removing device comprises an upper shell 1, a lower shell 2 and a selective permeation membrane 3. The upper shell 1 is provided with a first recess 11 for accommodating carbon oxides, and the two ends of the upper shell 1 are provided with first fixing members 12. The lower shell 2 is provided with a second recess 21 for accommodating sample fluid, and the two ends of the lower shell 2 are provided with fixing grooves 24. The second fixing members 22 are arranged in the fixing grooves 24. The upper shell 1 and the lower shell 2 are fixed in a clamped manner. The first fixing members 12 are inserted into the fixing grooves 24 and abut against the second fixing members 22, so that the upper shell 1 and the lower shell 2 can be detachably fixed. The first recess 11 and the second recess 21 are arranged in a positionally accurate manner to form a gas precipitation space. The selective permeation membrane 3 is arranged between the upper shell 1 and the lower shell 2, and a part of the selective permeation membrane 3 is located in the gas precipitation space to separate the first recess 11 from the second recess 21. The selective permeation membrane 3 is used for allowing carbon oxides to pass through, i.e., carbon oxides such as carbon monoxide and carbon dioxide can move from one side of the selective permeation membrane 3 to the other side, while other substances cannot. In the sample fluid in the second recess 21, the carbon oxides can pass through the selective permeation membrane 3 and enter the first recess 11. Further, the selective permeation membrane 3 has a sheet-like structure, so that the permeation rate of carbon oxides is greatly improved, and the IC removal rate is also greatly improved.

[0032] It should be noted that the selective permeation membrane 3 has a sheet-like structure with a thickness of 10 μm to 200 μm. The carbon oxide permeation efficiency of the selective permeation membrane 3 with such a small thickness is higher. In this embodiment, the thickness of the selective permeation membrane 3 is 100 μm. It can be understood that in other embodiments, the selective permeation membrane 3 with a thickness of 10 μm or 200 μm can also be selected.

[0033] The technical scheme provided in the present application uses the upper shell 1, the lower shell 2 and the selective permeation membrane 3 to realize the precipitation of carbon oxides in the sample fluid. Because the selective permeation membrane 3 is used, the precipitation rate of carbon oxides is improved. In detail, the first recess 11 is formed in the upper shell 1 to accommodate carbon oxides, the second recess 21 is formed in the lower shell 2 to accommodate sample fluid, and the selective permeation membrane 3 is arranged between the first recess 11 and the second recess 21 to separate the first recess 11 from the second recess 21. The carbon oxides in the sample fluid can pass through the selective permeation membrane 3 and enter the first recess 11, so that the removal of carbon oxides is completed and the removal rate of carbon oxides is improved. Further, the first fixing members 12 of the upper shell 1 can be inserted into the fixing grooves 24 of the lower shell 2 and abut against the second fixing members 22, so that the upper shell 1 and the lower shell 2 can be quickly disassembled, and the subsequent cleaning, maintenance and replacement of the upper shell 1, the lower shell 2 and the selective permeation membrane 3 are facilitated.

[0034] In some embodiments, please refer toFigure 2 and Figure 3 The fixed groove 24 comprises a vertical groove 241 and a horizontal groove 242. The vertical groove 241 is communicated with the horizontal groove 242 so that the fixed groove 24 is L-shaped. The first fixing member 12 is inserted into the vertical groove 241, and the second fixing member 22 is slidingly arranged in the horizontal groove 242. When the upper shell 1 and the lower shell 2 are closed and fixed, the first fixing member 12 is inserted into the vertical groove 241, and the second fixing member 22 is pressed to avoid the horizontal groove 242. The inner wall of the vertical groove 241 and the second fixing member 22 form a clamping action on the first fixing member 12, so as to realize the quick fixing of the upper shell 1 and the lower shell 2.

[0035] Further, the second fixing member 22 comprises an abutting member 221 and an elastic member 222. One end of the elastic member 222 is connected to an inner wall of the horizontal groove 242 away from the vertical groove 241, and the other end is connected to the abutting member 221. The end of the abutting member 221 away from the elastic member 222 abuts against the first fixing member 12 or extends into the vertical groove 241. Specifically, when the upper shell 1 and the lower shell 2 are not closed and fixed, the elastic member 222 is in a natural state, the abutting member 221 is slidingly arranged in the horizontal groove 242, and under the action of the natural state of the elastic member 222, the end of the abutting member 221 away from the elastic member 222 extends into the vertical groove 241. At this time, the first fixing member 12 is located outside the vertical groove 241 or inside the vertical groove 241 but above the second fixing member 22, avoiding the action force between the first fixing member 12 and the second fixing member 22. When the upper shell 1 and the lower shell 2 are closed and fixed, the first fixing member 12 is inserted into the vertical groove 241 and presses the abutting member 221, so that the abutting member 221 slides into the horizontal groove 242 away from the vertical groove 241, and the elastic member 222 is compressed. The elastic member 222 gives the abutting member 221 an opposite force, so that the abutting member 221 always abuts against the first fixing member 12, and the inner wall of the vertical groove 241 clamps the first fixing member 12, realizing the quick fixing of the upper shell 1 and the lower shell 2. When it is needed to separate the upper shell 1 and the lower shell 2, the upper shell 1 is pulled upward, so that the first fixing member 12 is pulled out of the vertical groove 241, and the abutting member 221 extends into the vertical groove 241 under the elastic force of the elastic member 222 returning to the original state.

[0036] In some embodiments, an inner wall of the horizontal groove 242 away from the vertical groove 241 is provided with a positioning column 243, and the elastic member 222 is sleeved on the positioning column 243, which is beneficial to the positioning and installation of the elastic member 222 and improves the stability of the elastic member 222 in the deformation and recovery process.

[0037] In some embodiments, the first fixing member 12 is provided with a contact slope at one end away from the upper shell 1, and the second fixing member 22 is provided with a guide slope at one end toward the vertical groove 241, the contact slope is parallel to the guide slope, so that when the first fixing member 12 is inserted into the vertical groove 241, the contact slope can push the second fixing member 22 to slide away from the vertical groove 241 and compress the elastic member 222. Specifically, when the first fixing member 12 is inserted into the vertical groove 241, the contact slope of the first fixing member 12 will contact the guide slope of the second fixing member 22, and when the first fixing member 12 continues to be inserted into the vertical groove 241, the contact slope of the first fixing member 12 will press the guide slope of the second fixing member 22, so that the second fixing member 22 is retracted into the horizontal groove 242, the elastic member 222 is pressed, and the elastic member 222 is in a compressed state, until the first fixing member 12 contacts the bottom wall of the vertical groove 241, and the second fixing member 22 always abuts against the first fixing member 12 under the action of the elastic member 222.

[0038] Please refer to Figure 4 and Figure 5 In some embodiments, the first groove 11 is a reciprocatingly bent serpentine shape.

[0039] In some embodiments, the second groove 21 is a reciprocatingly bent serpentine shape, and the first groove 11 and the second groove 21 can both be serpentine shapes, or one of the grooves can be a serpentine shape, without limitation. The serpentine shape of the groove is beneficial to prolong the flow path of the fluid as much as possible in a limited shell area. Specifically, when the second groove 21 is a serpentine shape, the sample fluid can flow in the second groove 21 for a longer path, so that the carbon oxides in the sample fluid have a longer time to be precipitated into the first groove 11, thereby improving the precipitation rate of the carbon oxides.

[0040] Further, a plurality of speed reduction protrusions 25 are arranged in the first groove 11 and / or the second groove 21, so as to slow down the flow speed of the sample fluid and / or the carbon oxides, further improve the precipitation rate of the carbon oxides, and improve the removal rate of the carbon oxides.

[0041] In some embodiments, the IC removal device further comprises two clamping members 4, which are respectively arranged at two ends of the upper shell 1, and the clamping members 4 are clamped to one side of the upper shell 1 away from the lower shell 2 and one side of the lower shell 2 away from the upper shell 1, so as to press the upper shell 1 and the lower shell 2 toward each other. The clamping end of the clamping member 4 has elastic properties, and in a natural state, the distance between the two clamping ends of the clamping member 4 is smaller than the distance between the top surface of the upper shell 1 and the bottom surface of the lower shell 2, that is, when the clamping member 4 clamps the upper and lower shells 2, the clamping end of the clamping member 4 will be deformed and expanded, thereby enhancing the clamping force of the clamping member 4 on the upper and lower shells 2, and improving the fastening degree and sealing degree of the fixed upper and lower shells 2.

[0042] Further, a sealing groove (not shown in the figure) is formed at the position where the upper shell 1 and the lower shell 2 are aligned, and when the sealing groove of the upper shell 1 and the sealing groove of the lower shell 2 are matched, an annular sealing channel is formed. A sealing ring (not shown in the figure) is arranged in the sealing channel to improve the sealing between the upper shell 1 and the lower shell 2. Specifically, the sealing ring is placed in the sealing groove of the lower shell 2, and then the upper shell 1 is fixed on the lower shell 2. The sealing groove of the upper shell 1 is aligned with the sealing groove of the lower shell 2. The sealing groove of the upper shell 1 and the sealing groove of the lower shell 2 both press the sealing ring to a certain extent, so that the sealing ring can completely fill the sealing channel and improve the sealing.

[0043] In some embodiments, referring to Figure 3 , the upper shell 1 is provided with a first mounting groove 13 surrounding the first recess 11, and the lower shell 2 is provided with a second mounting groove 23 surrounding the second recess 21. When the upper shell 1 and the lower shell 2 are aligned and fixed, the first mounting groove 13 and the second mounting groove 23 are aligned to form a space capable of accommodating the edge of the selective permeation membrane 3. The edge of the selective permeation membrane 3 is placed on the second mounting groove 23 of the lower shell 2, and the middle part of the selective permeation membrane 3 covers the opening of the second recess 21. The upper shell 1 is matched and fixed on the lower shell 2, the first mounting groove 13 matches the edge of the selective permeation membrane 3, and the upper half of the edge of the selective permeation membrane 3 is located in the first mounting groove 13. The first mounting groove 13 and the second mounting groove 23 jointly clamp and fix the selective permeation membrane 3.

[0044] In some embodiments, the upper shell 1 is provided with a first inlet (not shown in the figure) and a first outlet (not shown in the figure) communicating with the first recess 11. The first inlet and the first outlet correspond to the two ends of the first recess 11 respectively to allow gas to enter and exit the first recess 11. The lower shell 2 is provided with a second inlet (not shown in the figure) and a second outlet (not shown in the figure) communicating with the second recess 21. The second inlet and the second outlet correspond to the two ends of the second recess 21 respectively to allow sample fluid to enter and exit the second recess 21.

[0045] In some embodiments, referring to Figure 1 , the IC removal device further comprises a vacuum pump 5 and an air purification column 6. The air purification column 6 and the vacuum pump 5 both communicate with the first recess 11. In this way, the air entering the first recess 11 is purified and filtered by the air purification column 6, and a vacuum is formed in the first recess 11 by the vacuum pump 5, thereby accelerating the separation of carbon oxides from the sample fluid and improving the IC removal rate.

[0046] Specifically, the air purification column 6 is capable of absorbing carbon dioxide, moisture and dust and other impurities in the air, and the air purification column 6 is in communication with the first inlet, and the air filtered by the air purification column 6 enters the first recess 11 from the first inlet. The vacuum pump 5 is in communication with the first outlet.

[0047] In the embodiment, please refer to Figure 2 The IC removal device further comprises a heating element 7, and the heating element 7 is arranged on the side of the second recess 21 away from the first recess 11, so that the sample fluid in the second recess 21 is kept within a preset temperature range by the heating element 7, thereby helping to accelerate the separation of carbon oxides in the sample fluid. Specifically, the heating element 7 is installed on the lower side of the lower shell 2. Optionally, the preset temperature range is 25-40℃. Optionally, the heating element 7 is a semiconductor heating sheet.

[0048] According to the IC removal device provided in the embodiment, the working principle of the IC removal device is as follows:

[0049] In use, the vacuum pump 5 forms a vacuum environment in the first recess 11, and at the same time, the sample fluid flows into the second recess 21 from the second inlet and flows along the second recess 21 to the second outlet. When the sample fluid flows through the second recess 21, the temperature of the sample fluid is kept within a preset temperature range by the heating element 7, and the carbon oxides in the sample fluid are quickly separated from the sample fluid under the action of vacuum and heating, and enter the first recess 11 through the selective permeation membrane 3, and then are discharged from the first outlet.

[0050] The embodiment of the present application also provides a TOC analysis system comprising the IC removal device described above. Since the TOC analysis system comprises the IC removal device described above, it also has all the beneficial effects of the IC removal device, which will not be described here.

[0051] The above has described the basic concept, and it is obvious that the above detailed disclosure is only taken as an example and does not constitute a limitation on the present application for those skilled in the art. Although it is not explicitly stated here, those skilled in the art can make various modifications, improvements and corrections to the present application. Such modifications, improvements and corrections are suggested in the present application, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present application.

[0052] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0053] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0054] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that patent application are incorporated herein by reference, except for historical application documents that are inconsistent with or conflict with the content of this application, and documents that limit the broadest scope of the claims of this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0055] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An IC removing apparatus characterized by comprising: The IC removal device comprises: an upper shell provided with a first recess for accommodating carbon oxides, and first fixing members at two ends of the upper shell; a lower shell provided with a second recess for accommodating sample fluid, and a fixing groove at two ends of the lower shell, the fixing groove being provided with second fixing members, the upper shell and the lower shell being fixed together, the first fixing members being inserted into the fixing groove and abutting against the second fixing members, so that the upper shell and the lower shell are detachably fixed, and the first recess and the second recess are arranged in position to form a gas precipitation space; a selective permeation membrane arranged between the upper shell and the lower shell, and a part of the selective permeation membrane being located in the gas precipitation space to separate the first recess from the second recess, the selective permeation membrane being used for allowing the carbon oxides to pass through.

2. The IC removal apparatus according to claim 1, characterized by The fixing groove comprises a vertical groove and a horizontal groove, the vertical groove being communicated with the horizontal groove to form an L-shaped fixing groove, the first fixing members being inserted into the vertical groove, and the second fixing members being slidably arranged in the horizontal groove and abutting against the first fixing members.

3. The IC removal apparatus according to claim 2, wherein The second fixing members comprise abutting members and elastic members, one end of each elastic member being connected to an inner wall of the horizontal groove away from the vertical groove, the other end of each elastic member being connected to an abutting member, and one end of each abutting member away from the elastic member abutting against the first fixing members or extending into the vertical groove.

4. The IC removal apparatus according to claim 3, wherein When the abutting members abut against the first fixing members, the elastic members are in a compressed state; when the abutting members do not abut against the first fixing members and extend into the vertical groove, the elastic members are in a natural state.

5. The IC removal apparatus according to claim 3, wherein An inner wall of the horizontal groove away from the vertical groove is provided with a positioning column, and the elastic members are sleeved on the positioning column.

6. The IC removal apparatus according to claim 3, wherein One end of the first fixing members away from the upper shell is provided with a contact inclined surface, one end of the second fixing members facing the vertical groove is provided with a guide inclined surface, and the contact inclined surface is parallel to the guide inclined surface, so that when the first fixing members are inserted into the vertical groove, the contact inclined surface can push the second fixing members to slide away from the vertical groove and compress the elastic members.

7. The IC removal device according to any one of claims 1 to 6, characterized by The first recess and / or the second recess is / are in a reciprocating and bending serpentine shape.

8. The IC removal apparatus according to claim 7, wherein The first recess and / or the second recess is / are provided with a plurality of speed reduction protrusions.

9. The IC removal device according to any one of claims 1 to 6, characterized by The IC removal device further comprises two clamping members respectively arranged at two ends of the upper shell, the clamping members being clamped to one side of the upper shell away from the lower shell and one side of the lower shell away from the upper shell, so that the upper shell and the lower shell are pressed towards each other.

10. A TOC analysis system characterized by, The IC removal device comprises any one of claims 1 to 9.

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