Millimeter wave isolation driving circuit and electronic equipment

Abstract

The utility model provides a millimeter wave isolation drive circuit and an electronic device. The drive circuit comprises a low-voltage side control module, a high-voltage side control module and a millimeter wave isolation module. The low-voltage side control module is connected with the high-voltage side control module through the millimeter wave isolation module; a power supply circuit is also included; the power supply circuit comprises an inverter, a transformer, a rectifier and a feedback adjustment module which are connected in sequence; primary coils of the inverter and the transformer are positioned on the low-voltage side; the input end of the inverter is connected with a low-voltage side power supply; a secondary coil of the transformer, the rectifier and the feedback adjustment module are located at a high-voltage side; the output end of the rectifier is also connected with the high-voltage side control module; the output end of the feedback adjustment module is connected with the low-voltage side control module through the millimeter wave isolation module; and the low-voltage side control module is also connected with the inverter. According to the utility model, the power supply design can be optimized, and the isolation performance can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to digital isolator technical field, concretely relates to millimeter wave isolation drive circuit, electronic equipment. BACKGROUND

[0002] High voltage circuit has extensive application in people's daily life, for example, power supply circuit and motor drive circuit etc.;The battery fast charging technology used in handheld device is the classic application of high voltage circuit. Among them, the isolation drive of power device in high voltage circuit has extensive application demand.

[0003] Typical isolation drive circuit is usually composed of low voltage field, isolator and high voltage field. Among them, the low voltage field is usually controller and drive signal;The high voltage field is usually protection circuit and drive circuit. The signal needs to be transmitted between the high voltage field and the low voltage field, and high isolation is required to prevent the high voltage field from damaging the low voltage field. The device used to transmit the signal is called isolator.

[0004] The high voltage side of the current mainstream isolator adopts external power supply, and this power supply mode has the following disadvantages:

[0005] (1) Slow power-on speed;The power side needs an additional power-on structure;

[0006] (2) High static current and high voltage in high voltage circuit;Therefore, the power loss is large, which can reach hundreds of milliwatts;

[0007] (3) Affected by the outside world;When the high voltage side power supply fails seriously, the high voltage side protection circuit is easy to be damaged. INVENTION CONTENTS

[0008] The utility model aims at solving one of the above technical problems at least to some extent. Therefore, one purpose of the utility model is to provide a millimeter wave isolation drive circuit, which can optimize power supply design and improve isolation performance.

[0009] The second purpose of the utility model is to provide an electronic device, the power supply design and isolation performance of the drive circuit of which are optimized.

[0010] To achieve the above purpose, the first aspect of the utility model provides a millimeter wave isolation drive circuit, which comprises a low voltage side control module located in the low voltage side, a high voltage side control module located in the high voltage side and a millimeter wave isolation module. The low voltage side control module is connected with the high voltage side control module through the millimeter wave isolation module.

[0011] The power supply circuit comprises an inverter, a transformer, a rectifier and a feedback adjustment module connected in sequence; the inverter and the primary coil of the transformer are located at the low-voltage side; the input end of the inverter is connected with a low-voltage side power supply; the secondary coil of the transformer, the rectifier and the feedback adjustment module are located at the high-voltage side; the output end of the rectifier is further connected with the high-voltage side control module; the output end of the feedback adjustment module is connected with the low-voltage side control module through the millimeter wave isolation module; and the low-voltage side control module is further connected with the inverter.

[0012] According to the millimeter wave isolation driving circuit, the millimeter wave isolation module is used for isolation transmission between the low-voltage side and the high-voltage side, so that the driving circuit has the advantages that the bandwidth of the isolation transmission can reach 1Mbps to 10Gbps, is suitable for any scene, and has the advantage of fast isolation transmission speed; the millimeter wave carrier antenna is small and supports in-chip embedding, has the advantages of higher integration, smaller size and lower cost; the millimeter wave wireless isolation mode will not cause metal short circuit even if it is punched, and has higher isolation safety and isolation reliability. More importantly, the optimized power supply design of the low-voltage side power-on can not only reduce power consumption and optimize heat dissipation, but also can strengthen loop control and more accurately monitor the high-voltage side power supply state, so as to widen the application scene of the driving circuit.

[0013] In addition, the millimeter wave isolation driving circuit according to the above-mentioned embodiments of the utility model can also have the following additional technical features:

[0014] Optionally, the millimeter wave isolation module comprises a low-voltage side isolation circuit and a high-voltage side isolation circuit; the low-voltage side isolation circuit is located at the low-voltage side, and the high-voltage side isolation circuit is located at the high-voltage side; the low-voltage side isolation circuit is connected with the low-voltage side control module, the high-voltage side isolation circuit is connected with the high-voltage side control module, and the low-voltage side isolation circuit and the high-voltage side isolation circuit are connected based on millimeter wave wireless connection.

[0015] Optionally, the low-voltage side power supply is further connected with the low-voltage side control module and the low-voltage side isolation circuit respectively; and the output end of the rectifier is further connected with the high-voltage side isolation circuit and the feedback adjustment module respectively.

[0016] Optionally, the power supply circuit further comprises a first voltage stabilizer and a second voltage stabilizer; the first voltage stabilizer is located at the low-voltage side, and the second voltage stabilizer is located at the high-voltage side; the low-voltage side power supply is connected with the low-voltage side control module and the low-voltage side isolation circuit through the first voltage stabilizer respectively; the output end of the rectifier is divided into two paths, one of which is connected with the high-voltage side control module, the high-voltage side isolation circuit and the feedback adjustment module through the second voltage stabilizer respectively, and the other of which is directly connected with the feedback adjustment module.

[0017] Optionally, the low-voltage side isolation circuit comprises a first transmitting unit, a first transmitting antenna, a second receiving antenna and a second receiving unit; the first transmitting unit is connected with the driving signal output end of the low-voltage side control module and the first transmitting antenna respectively; the second receiving unit is connected with the feedback signal input end of the low-voltage side control module and the second receiving antenna respectively.

[0018] The high-voltage side isolation circuit comprises a first receiving antenna, a first receiving unit, a second transmitting unit and a second transmitting antenna; the first receiving unit is connected with the driving signal input end of the high-voltage side control module and the first receiving antenna respectively; the second transmitting unit is connected with the feedback signal output end of the feedback adjustment module and the second transmitting antenna respectively.

[0019] Optionally, the inverter comprises a lower inverter bridge, an upper inverter bridge and a control switch; the low-voltage side control module is connected with the lower inverter bridge and the upper inverter bridge connected in sequence through the control switch; the connection line between the lower inverter bridge and the upper inverter bridge is connected with the primary coil.

[0020] Optionally, the lower inverter bridge and the upper inverter bridge are mirror image structures, and each of them comprises two MOS transistors, two capacitors and two resistors; the two resistors connected in series are connected between the gates of the two MOS transistors; the gate of each of the two MOS transistors is connected with the drain of the other MOS transistor through a capacitor; the sources of the two MOS transistors are connected.

[0021] The drains of the two MOS transistors in the lower inverter bridge are connected with the drains of the two MOS transistors in the upper inverter bridge respectively; the drains of the two MOS transistors in the lower inverter bridge are also connected with the two ends of the primary coil respectively; the sources of the two MOS transistors in the upper inverter bridge are connected with the low-voltage side power supply; the sources of the two MOS transistors in the lower inverter bridge are connected with the control switch.

[0022] Optionally, the two MOS transistors in the lower inverter bridge are N-channel MOS transistors; the two MOS transistors in the upper inverter bridge are P-channel MOS transistors.

[0023] Optionally, the rectifier comprises rectifier diode D1, rectifier diode D2, rectifier diode D3, rectifier diode D4 and capacitor C5.

[0024] The rectifier diode D1 and the rectifier diode D3 are connected in series in the same direction; the rectifier diode D2 and the rectifier diode D4 are connected in series in the same direction; one end of the secondary coil is connected to a connecting line between the rectifier diode D1 and the rectifier diode D3, and the other end is connected to a connecting line between the rectifier diode D2 and the rectifier diode D4; after the rectifier diode D1 and the rectifier diode D3 connected in series, the rectifier diode D2 and the rectifier diode D4 connected in series and the capacitor C5 are connected in parallel, one end is connected to the ground, and the other end is used as an output end of the rectifier.

[0025] To achieve the above object, the second aspect of the utility model provides an electronic device, including the above-mentioned millimeter wave isolation drive circuit.

[0026] According to the electronic device provided by the embodiment, the millimeter wave isolation drive circuit is used, so that the isolation drive performance is more stable, safe and reliable, and the isolation transmission speed is also significantly improved. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 A circuit structure schematic diagram of the millimeter wave isolation drive circuit provided by the utility model embodiment is shown in the figure;

[0028] Figure 2 A specific structure schematic diagram of the millimeter wave isolation drive circuit provided by the utility model embodiment is shown in the figure;

[0029] Figure 3 A circuit structure schematic diagram of the inverter to the rectifier of the power supply circuit in the millimeter wave isolation drive circuit provided by the utility model embodiment is shown in the figure;

[0030] Figure 4 A principle schematic diagram of the monitoring feedback regulation loop in the millimeter wave isolation drive circuit provided by the utility model embodiment is shown in the figure;

[0031] Figure 5 A signal time sequence waveform diagram of the feedback loop in the millimeter wave isolation drive circuit provided by the utility model embodiment is shown in the figure. DETAILED DESCRIPTION

[0032] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the utility model, and cannot be understood as a limitation of the utility model.

[0033] The millimeter wave isolation driving circuit adopts the optimized power supply design of low-voltage side power-on, can not only reduce power consumption, but also can strengthen loop feedback control, improve the monitoring precision of high-voltage side circuit state, and thus broaden the application scenarios.

[0034] In order to better understand the above technical solutions, the exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided so that the present application can be more thoroughly understood and the scope of the present application can be fully conveyed to those skilled in the art.

[0035] In order to better understand the above technical solutions, the exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided so that the present application can be more thoroughly understood and the scope of the present application can be fully conveyed to those skilled in the art.

[0036] Figure 1 A circuit structure schematic diagram of a millimeter wave isolation driving circuit provided by the present application embodiment.

[0037] As Figure 1 shown, the millimeter wave isolation driving circuit provided by the present application embodiment includes a low-voltage side control module located at the low-voltage side, a high-voltage side control module located at the high-voltage side, and a millimeter wave isolation module; the low-voltage side control module and the high-voltage side control module are in wireless isolation communication interaction through the millimeter wave isolation module.

[0038] The millimeter wave isolation driving circuit of the present embodiment further includes a power supply circuit; as Figure 1 shown, the power supply circuit includes an inverter, a transformer, a rectifier, and a feedback adjustment module; the inverter, the transformer, the rectifier, and the feedback adjustment module are connected in sequence. Among them, the primary coil of the inverter and the transformer is located at the low-voltage side; the input end of the inverter is connected with the low-voltage side power supply VCC1; the secondary coil of the transformer, the rectifier, and the feedback adjustment module are located at the high-voltage side; the output end voltage VCCS of the rectifier will be divided into two paths, one path is delivered to the high-voltage side control module for high-voltage side module power supply; the other path is delivered to the input end of the feedback adjustment module for feedback monitoring; the output end of the feedback adjustment module is connected with the low-voltage side control module through the millimeter wave isolation module; the low-voltage side control module is also connected with the inverter.

[0039] The power supply circuit comprises a low-voltage side power supply VCC1, an inverter, a transformer, and a rectifier, adopts a low-voltage side power-on mode, and supplies power to each module of the high-voltage side. The monitoring feedback regulation loop is composed of an inverter, a transformer, a rectifier, an output power supply VCCS, a feedback adjustment module, a millimeter wave isolation module, a low-voltage side control module, and an inverter, and accurately monitors the state of the high-voltage side circuit, specifically the output voltage state of the high-voltage side.

[0040] In some specific embodiments, the power supply circuit further comprises a first voltage stabilizer and a second voltage stabilizer; for the low-voltage side and the high-voltage side, respectively, to perform voltage stabilization and filtering processing before supplying power to each module, to ensure the stability of the power supply voltage.

[0041] Specifically, the first voltage stabilizer LDO1 is located on the low-voltage side, and the second voltage stabilizer LDO2 is located on the high-voltage side; on the low-voltage side, the low-voltage side power supply voltage VCC1 passes through the first voltage stabilizer LDO1 and is connected to each power-consuming module on the low-voltage side, respectively, to supply power to the power-consuming module. The power-consuming module on the low-voltage side includes but is not limited to a low-voltage side control module and a low-voltage side isolation circuit. On the high-voltage side, the voltage VCCS output by the output end of the rectifier is divided into two paths, one of which passes through the second voltage stabilizer LDO2 and is connected to each power-consuming module on the high-voltage side, respectively, to supply power to the power-consuming module. Here, the power-consuming module on the high-voltage side includes but is not limited to the high-voltage side control module, the high-voltage side isolation circuit, and the feedback adjustment module. The other path is directly output to the feedback adjustment module for high-voltage side voltage monitoring.

[0042] In some specific embodiments, the low-voltage side control module can be implemented by a controller and fault monitoring module; the high-voltage side control module can be implemented by a gate driver and logic module; and the feedback adjustment module can be implemented by a feedback adjustment and fault monitoring module.

[0043] In combination Figure 1 It is understood that the working principle of the power supply circuit of the millimeter wave isolation driving circuit provided in the embodiment is as follows:

[0044] For the power supply circuit: the low-voltage side power supply voltage VCC1 is converted into an alternating voltage after passing through the inverter, is transmitted to the rectifier on the high-voltage side through the transformer, is converted into a direct current voltage VCCS after rectification and filtering processing by the rectifier, and is output. The direct current voltage VCCS has a large ripple and noise, and can be stabilized and filtered by the second voltage stabilizer LDO2 before being supplied to each power-consuming module on the high-voltage side.

[0045] For the monitoring feedback regulation loop, i.e. Figure 1 The blue transmission line in the figure: in order to keep the output voltage of the inverter stable, a monitoring feedback regulation loop is specially provided to realize accurate voltage feedback monitoring. Specifically, the inverter output voltage transmitted to the high-voltage side through the transformer, i.e. the output voltage VCCS of the rectifier, will be directly transmitted to the feedback adjustment module, compared with the preset reference voltage, and a control signal is generated, which is then sent to the low-voltage side control module on the low-voltage side in the form of millimeter wave transmission through the millimeter wave isolation module; the low-voltage side control module processes and generates an ON / OFF signal for controlling the inverter switch, and sends it to the inverter; the ON / OFF signal can turn on / off the inverter, so as to control whether the inverter continues to oscillate and transmit energy to the high-voltage side, thereby controlling the voltage value of VCCS output by the high-voltage side.

[0046] In combination with Figure 1 It is understood that the working principle of the millimeter wave isolation driving circuit provided by the embodiment for isolation transmission is as follows:

[0047] For the driving signal transmission line, i.e. Figure 1 The green transmission line in the figure: after the driving signal IN is input to the low-voltage side control module on the low-voltage side, it is confirmed and processed, and then transmitted to the high-voltage side control module on the high-voltage side in the form of wireless millimeter wave by the millimeter wave isolation module, and converted into the driving signal OUT in the VCC2 voltage domain by the high-voltage side control module.

[0048] For the error feedback loop, i.e. Figure 1 The yellow transmission line in the figure: when the high-voltage side control module on the high-voltage side detects a circuit abnormality (such as overcurrent, overtemperature, short circuit, etc.), it generates an abnormal state signal Fault, which is then transmitted to the low-voltage side control module on the low-voltage side in the form of wireless millimeter wave by the millimeter wave isolation module, and the low-voltage side control module generates an input disable signal MUTE according to the abnormal state signal Fault to control the driver to stop transmitting the driving signal IN.

[0049] The millimeter wave isolation driving circuit provided by the embodiment has the following two significant features:

[0050] (1) The millimeter wave isolation transmission is adopted, the bandwidth of the isolation transmission can reach 1 Mbps to 10 Gbps, which is suitable for any scene and has the advantage of fast isolation transmission speed; the millimeter wave carrier antenna is small, and can be embedded in a chip by using standard CMOS process or other standard packaging process, which has the advantages of higher integration, smaller size, lower cost and greater competitive advantage; the millimeter wave wireless isolation method will not cause metal short circuit even if it is broken, which has higher isolation safety and reliability.

[0051] (2) The low-voltage side power-on optimized power supply design can not only reduce power consumption and optimize heat dissipation, but also can strengthen loop control, more accurately monitor the high-voltage side power supply state, and greatly widen the application scenarios of the driving circuit.

[0052] Figure 2 A specific structure schematic diagram of the millimeter wave isolation driving circuit is provided for the embodiments of the utility model.

[0053] The embodiment is based on Figure 1 The embodiment is further expanded, and the millimeter wave isolation module is refined.

[0054] In the embodiment, the millimeter wave isolation module includes a low-voltage side isolation circuit and a high-voltage side isolation circuit; the low-voltage side isolation circuit is located on the low-voltage side, and the high-voltage side isolation circuit is located on the high-voltage side; the low-voltage side isolation circuit is connected with the low-voltage side control module, the high-voltage side isolation circuit is connected with the high-voltage side control module, and the low-voltage side isolation circuit and the high-voltage side isolation circuit are connected based on millimeter wave wireless connection. In addition, the low-voltage side power supply (specifically through the first voltage stabilizer LDO1) is also connected with the low-voltage side control module and the low-voltage side isolation circuit respectively to provide power supply for them; the output end (specifically through the second voltage stabilizer LDO2) of the rectifier is also connected with the high-voltage side isolation circuit and the feedback adjustment module respectively to provide power supply for them.

[0055] As Figure 2 The low-voltage side isolation circuit in the millimeter wave isolation module specifically includes: a first transmitting unit TX1, a first transmitting antenna, a second receiving antenna, and a second receiving unit RX2; the first transmitting unit TX1 is connected with the drive signal output end of the low-voltage side control module and the first transmitting antenna respectively; the second receiving unit RX2 is connected with the feedback signal input end of the low-voltage side control module and the second receiving antenna respectively. In addition, the power supply voltage VCC1 output by the first voltage stabilizer LDO1 is specifically connected to the first transmitting unit TX1 and the second receiving unit RX2 in the low-voltage side isolation circuit respectively.

[0056] Correspondingly, the high-voltage side isolation circuit includes a first receiving antenna, a first receiving unit RX1, a second transmitting unit TX2, and a second transmitting antenna; the first receiving unit RX1 is connected with the drive signal input end of the high-voltage side control module and the first receiving antenna respectively; the second transmitting unit TX2 is connected with the feedback signal output end of the feedback adjustment module and the second transmitting antenna respectively. In addition, the power supply voltage VCCS output by the second voltage stabilizer LDO2 is specifically connected to the first receiving unit RX1 and the second transmitting unit TX2 in the high-voltage side isolation circuit respectively.

[0057] In some embodiments, the low-voltage side isolation circuit and the high-voltage side isolation circuit are packaged together in a millimeter wave isolation chip. That is, the millimeter wave isolation module is in the form of a millimeter wave isolation chip. The millimeter wave isolation module has the advantages of higher integration, smaller size and lower cost.

[0058] In combination Figure 2 It is understood that the millimeter wave isolation module provided by the embodiment has the following working principle for isolating transmission:

[0059] Isolation transmission of the drive signal, that is, Figure 2 The green transmission line in the figure: after the drive signal IN is input to the low-voltage side control module of the low-voltage side, it is confirmed and processed, and then is transmitted to the first transmitting unit TX1 of the low-voltage side isolation circuit for encoding and transmitted by the first transmitting antenna in the form of wireless millimeter wave; after the drive signal is received by the first receiving antenna of the high-voltage side isolation circuit, it is processed by the first receiving unit RX1, and then is transmitted to the high-voltage side control module, which converts it into the drive signal OUT in the voltage domain of VCC2.

[0060] Isolation transmission of the error feedback loop, that is, Figure 2 The yellow transmission line in the figure: after the high-voltage side control module of the high-voltage side detects a circuit abnormality (such as overcurrent, overtemperature, short circuit, etc.), an abnormal state signal Fault is generated, which is then processed by the second transmitting unit TX2 of the high-voltage side isolation circuit for encoding and transmitted by the second transmitting unit in the form of wireless millimeter wave; after being received by the second receiving antenna of the low-voltage side isolation circuit, it is processed by the second receiving unit RX2, and then is transmitted to the low-voltage side control module of the low-voltage side; the low-voltage side control module generates an input disable signal MUTE according to the abnormal state signal Fault to control the driver to stop transmitting the drive signal IN.

[0061] Isolation transmission of the VCCS monitoring feedback loop, that is, Figure 2 The blue transmission line in the figure: after the high-voltage side control module of the high-voltage side compares the voltage VCCS output by the rectifier with a preset reference voltage, a control signal is generated; the control signal is processed by the second transmitting unit TX2 of the high-voltage side isolation circuit for encoding and transmitted by the second transmitting unit in the form of wireless millimeter wave; after being received by the second receiving antenna of the low-voltage side isolation circuit, it is processed by the second receiving unit RX2, and then is transmitted to the low-voltage side control module of the low-voltage side; the low-voltage side control module generates an ON / OFF signal for controlling the inverter switch according to the control signal, and sends the ON / OFF signal to the inverter; the ON / OFF signal can open / close the inverter, so as to control whether the inverter continues to oscillate and transmit energy to the high-voltage side, thereby controlling the voltage value of VCCS output by the high-voltage side.

[0062] Figure 3The utility model provides a kind of inverter to rectifier's circuit structure schematic diagram of power supply circuit in millimeter wave isolation drive circuit provided by the utility model embodiment. Figure 4 The utility model provides a kind of principle schematic diagram of monitoring feedback regulation loop in millimeter wave isolation drive circuit provided by the utility model embodiment. Figure 5 The utility model provides a kind of signal timing waveform diagram of feedback loop in millimeter wave isolation drive circuit provided by the utility model embodiment.

[0063] The embodiment based on any of the above embodiments is further extended, and is further refined for the circuit power supply.

[0064] The inverter in the power supply circuit of the embodiment, as shown in Figure 3 It is full-bridge inverter, including lower inverter bridge, upper inverter bridge and control switch MT;Lower inverter bridge and upper inverter bridge are two bridge arm structures of full-bridge inverter.The low-voltage side control module is connected with the lower inverter bridge and the upper inverter bridge in order by the control switch MT;The connection line between the lower inverter bridge and the upper inverter bridge is connected with the primary coil Ls of transformer.

[0065] Specifically, as shown in Figure 3 The lower inverter bridge and the upper inverter bridge are mirror image structure, and each include two MOS tubes, two capacitors and two resistors.The upper inverter bridge includes MOS tube MP1, MOS tube MP2, resistor R1, resistor R2, capacitor C1 and capacitor C2;The lower inverter bridge includes MOS tube MN1, MOS tube MN2, resistor R3, resistor R4, capacitor C3 and capacitor C4.The gate of MOS tube MP1 and the gate of MOS tube MP2 of the upper inverter bridge are connected by series-connected resistor R1 and resistor R2, in addition, the gate of MOS tube MP1 is also connected to the drain of MOS tube MP2 through capacitor C2;The gate of MOS tube MP2 is also connected to the drain of MOS tube MP1 through capacitor C1;And the source of MOS tube MP1 and the source of MOS tube MP2 are connected to low-voltage side power supply VCC1 after being connected.Correspondingly, the gate of MOS tube MN1 and the gate of MOS tube MN2 of the lower inverter bridge are connected by series-connected resistor R3 and resistor R4, in addition, the gate of MOS tube MN1 is also connected to the drain of MOS tube MN2 through capacitor C4;The gate of MOS tube MN2 is also connected to the drain of MOS tube MN1 through capacitor C3;And the source of MOS tube MN1 and the source of MOS tube MN2 are connected to control switch MT.

[0066] In some specific embodiments, the two MOS tubes in the lower inverter bridge are N-channel MOS tubes;The two MOS tubes in the upper inverter bridge are P-channel MOS tubes.

[0067] In some embodiments, the control switch MT is a MOS tube, the gate of which is connected to the low-voltage side control module, the source of which is connected to the ground, and the drain of which is connected to the source of the MOS tube MN1 and the source of the MOS tube MN2.

[0068] In the above-mentioned inverter, the bias voltage VBP between the resistor R1 and the resistor R2 in the upper inverter bridge, the bias voltage VBN between the resistor R3 and the resistor R4 in the lower inverter bridge, and the capacitors C1 to C4 and the resistors R1 to R4 can change the bias conditions of the four power MOS, so as to adjust the oscillation performance of the inverter.

[0069] The rectifier in the power supply circuit of the embodiment, as shown in Figure 3 includes the rectifier tube D1, the rectifier tube D2, the rectifier tube D3, the rectifier tube D4, and the capacitor C5.

[0070] Specifically, the rectifier tube D1 and the rectifier tube D3 are connected in the same direction in series, i.e., the anode of the rectifier tube D1 is connected to the cathode of the rectifier tube D3; the rectifier tube D2 and the rectifier tube D4 are connected in the same direction in series, i.e., the anode of the rectifier tube D2 is connected to the cathode of the rectifier tube D4; one end of the secondary coil Lp is connected to the connecting line between the rectifier tube D1 and the rectifier tube D3, i.e., the anode of the rectifier tube D1, and the other end is connected to the connecting line between the rectifier tube D2 and the rectifier tube D4, i.e., the anode of the rectifier tube D2; after the series-connected rectifier tube D1 and rectifier tube D3, the series-connected rectifier tube D2 and rectifier tube D4, and the capacitor C5 are connected in parallel, one end is connected to the ground, and the other end is taken as the output end VCCS of the rectifier, i.e., the cathode of the rectifier tube D1, the cathode of the rectifier tube D2, and one end of the capacitor C5 are connected to take the voltage output end VCCS of the secondary coil, and the anode of the rectifier tube D3, the anode of the rectifier tube D4, and the other end of the capacitor C5 are connected.

[0071] The working principle of the inverter-transformer-rectifier in the above-mentioned power supply circuit of the embodiment is as follows:

[0072] The inverter is powered by the low-voltage side power supply VCC1; when the ON / OFF signal output by the low-voltage side control module is high, the control switch MT will be connected, and the current will flow through the primary coil Ls of the transformer; at the same time, the two MOS tubes in the lower inverter bridge and the upper inverter bridge that are cross-coupled will be designed to make the entire circuit meet the oscillation condition, and in the case that there is current in the primary coil Ls, VP1 and VP2 generated by the oscillation of the lower inverter bridge and the upper inverter bridge will become alternating voltage, and will be transmitted to the secondary coil Lp through the primary coil Ls. The secondary coil Lp outputs alternating current to the rectifier bridge composed of the rectifier tubes D1 to D4 for rectification, and then the capacitor C5 is used for filtering and voltage stabilization, so as to obtain a relatively stable VCCS power supply voltage.

[0073] From the above, the inverter-transformer-rectifier circuit structure in the power supply circuit provided by the embodiment can realize the effect of powering from the low-voltage side and continuously and stably supplying power to the high-voltage side. Meanwhile, the circuit structure of the power supply circuit has the advantages of simplicity, practicality, and easy implementation.

[0074] In addition, it can be understood that, if the control switch MT of the inverter in the power supply circuit is always in the on state, that is, the inverter is always in the oscillation state, then the secondary coil Lp in the transformer on the high-voltage side will directly receive power, and the capacitor C5 in the rectifier will be in a continuous charging state, thereby causing the output voltage VCCS of the rectifier to continuously rise. This will cause power waste and unstable working conditions. For this reason, the embodiment of the utility model also introduces a monitoring feedback regulation loop to dynamically adjust the output voltage VCCS of the rectifier, ensure the stability of the power supply voltage on the high-voltage side, and prevent power waste.

[0075] In the following, the monitoring feedback regulation loop for dynamically adjusting VCCS and the error feedback loop for implementing abnormal error feedback are collectively referred to as the feedback loop of the drive circuit. In combination with Figure 4 It is understood that the working principle of the feedback loop is as follows:

[0076] The drive circuit needs to feed back two signals to the low-voltage side: the abnormal state signal Fault (such as overcurrent, overtemperature, and short circuit, etc.) of the drive circuit and the deviation signal of the voltage VCCS at the output end of the rectifier compared with the reference voltage VREF. After the two feedback signals are encoded by the encoder Encoder to generate the Code signal, they are transmitted by the second transmitting unit TX2 of the millimeter wave isolation module to control the second transmitting antenna to transmit; after being received by the second receiving antenna, they are decoded by the decoder Decoder to generate the corresponding input disable signal MUTE or the signal ON / OFF for controlling the inverter switch, so as to control whether the drive circuit transmits the drive signal IN or the inverter on the low-voltage side of the power supply circuit continues to oscillate and transmit energy to the high-voltage side.

[0077] As Figure 5 shown, the timing waveforms of the signals in the feedback loop of the drive circuit are as follows: when the abnormal state signal Fault is detected to be valid, that is, an error occurs, in the t0 to t5 time period; and in the t2 to t5 time period, the voltage VCCS at the output end of the rectifier exceeds the reference voltage VREF, and the energy is excessive, so the inverter needs to be turned off.

[0078] The encoder has an encoding period Ten, and when the clock rising edge comes, the current state is encoded in time sequence:

[0079] No pulses in a cycle represent no error occurrence (i.e. no abnormal state signal Fault is detected) and the voltage VCCS is lower than the reference voltage VREF;

[0080] One pulse represents no error occurrence and the voltage VCCS is higher than the reference voltage VREF;

[0081] Two pulses represent error occurrence and the voltage VCCS is lower than the reference voltage VREF;

[0082] Three pulses represent error occurrence and the voltage VCCS is higher than the predetermined value.

[0083] Due to the timing transmission characteristics, the ON / OFF signal and the input disable signal MUTE will lag behind one cycle plus channel delay time.

[0084] The utility model embodiment further provides an electronic device, including the millimeter wave isolation drive circuit that any embodiment described above.

[0085] Here, the specific content of the millimeter wave isolation drive circuit will not be repeated, please refer to the record of each embodiment above for details.

[0086] The electronic device described in the embodiment can be any electronic device with isolation driving requirements, such as power supply equipment, motor drive equipment, handheld equipment, etc., such as automobile charging pile and LED drive, etc.

[0087] The electronic device provided in the embodiment, wherein the millimeter wave isolation drive circuit for isolation driving, since high and low voltage sides are isolated and transmitted in a millimeter wave wireless manner, has all the advantages of millimeter wave technology, including but not limited to: fast isolation transmission speed, higher integration, smaller size, lower cost, higher isolation safety and isolation reliability, etc. More importantly, the driving circuit optimizes the power-on mode, adopts an optimized power supply design with low-voltage side power-on, which not only reduces power consumption and optimizes heat dissipation, but also strengthens loop control and more accurately monitors the high-voltage side power supply state, making the power supply of the electronic device more stable. Therefore, the electronic device of the embodiment can make its isolation driving performance more stable, safe and reliable, and the isolation transmission speed can also be significantly improved.

[0088] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the present application can be in the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can be in the form of a computer program product implemented on one or more computer usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer usable program code.

[0089] The present application is described in reference to the flow diagrams and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each flow and / or block in the flow diagrams and / or block diagrams, and combinations of flows and / or blocks in the flow diagrams and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general purpose computer, a special purpose computer, an embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flow diagrams and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 means for carrying out the functions specified in the flow diagram

[0090] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions means which implement the function specified in the flow diagrams and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 means for carrying out the functions specified in the flow diagram

[0091] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flow diagrams and / or block diagrams. Figure 1 one or more flows and / or blocks Figure 1 means for carrying out the functions specified in the flow diagram

[0092] It should be noted that any references made in the claims to an "apparatus" or "means" should not be construed to cover the corresponding structures only. The phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting. The use of "including" and "comprising" and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. The terms "mounted" and "connected" and variations thereof are used broadly and encompass both direct and indirect mounting or connecting, as well as fixed and removable mounting or connecting. The use of the terms "mounted" and "connected" and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. The use of the terms "first", "second", and others if used, is meant to indicate different stages of the same process or different processes and does not indicate an ordering, unless specifically stated otherwise. The use of the terms "first", "second", and others if used, is meant to indicate different stages of the same process or different processes and does not indicate an ordering, unless specifically stated otherwise.

[0093] While the preferred embodiments of the application have been described, additional variations and modifications can be made to the embodiments by those skilled in the art once they learn of the basic inventive concepts. Such variations and modifications are also within the scope of the application. Accordingly, the appended claims are intended to cover all such variations and modifications as falling within the scope of the application.

[0094] Obviously, various modifications and changes can be made to the present application by those skilled in the art without departing from the spirit and scope of the present application. Thus, it is intended that the present application cover the modifications and changes as long as they come within the scope of the appended claims and their equivalents.

[0095] In the description of the present application, it is to be understood that the terms "first", "second", "third" and the like in the description and in the claims, if any, are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of use in either order. It is also to be understood that the terminology "at least one" is used herein to describe any one or any combination of any two or more of the identifiable members in a non- exhaustive list of members.

[0096] In the present application, unless specifically defined otherwise, the terms "mounting", "connection", "connecting", "fixed", and the like are to be construed as broadly as possible, for example, they can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through intermediate medium; can be internal communication of two elements, or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0097] In the present application, unless specifically defined otherwise, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0098] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, different embodiments or examples described in the present specification and the features of different embodiments or examples can be combined and combined by those skilled in the art without contradiction.

[0099] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A millimeter wave isolation driver circuit, comprising: The power supply circuit comprises a low-voltage side control module, a high-voltage side control module and a millimeter wave isolation module; the low-voltage side control module is connected with the high-voltage side control module through the millimeter wave isolation module; The power supply circuit further comprises a first voltage stabilizer and a second voltage stabilizer; the first voltage stabilizer is located at the low-voltage side, and the second voltage stabilizer is located at the high-voltage side; the low-voltage side power supply is connected with the low-voltage side control module and the low-voltage side isolation circuit through the first voltage stabilizer; the output end of the rectifier is connected with the high-voltage side control module, the high-voltage side isolation circuit and the feedback adjustment module through the second voltage stabilizer, and is directly connected with the feedback adjustment module.

2. A millimeter wave isolation driver circuit as claimed in claim 1, wherein, The low-voltage side isolation circuit comprises a first transmitting unit, a first transmitting antenna, a second receiving antenna and a second receiving unit; the first transmitting unit is connected with the driving signal output end of the low-voltage side control module and the first transmitting antenna respectively; the second receiving unit is connected with the feedback signal input end of the low-voltage side control module and the second receiving antenna respectively; 3. A millimeter wave isolation driver circuit as claimed in claim 2, wherein, The high-voltage side isolation circuit comprises a first receiving antenna, a first receiving unit, a second transmitting unit and a second transmitting antenna; the first receiving unit is connected with the driving signal input end of the high-voltage side control module and the first receiving antenna respectively; the second transmitting unit is connected with the feedback signal output end of the feedback adjustment module and the second transmitting antenna respectively.

4. A millimeter wave isolation driver circuit as claimed in claim 3, wherein, The inverter comprises a lower inverter bridge, an upper inverter bridge and a control switch; the low-voltage side control module is connected with the lower inverter bridge and the upper inverter bridge through the control switch; the connection line between the lower inverter bridge and the upper inverter bridge is connected with the primary coil.

5. A millimeter wave isolation driver circuit as claimed in claim 2, wherein, ​ ​ 6. A millimeter wave isolation driver circuit as claimed in claim 1, wherein, ​ 7. A millimeter wave isolation driver circuit as claimed in claim 6, wherein, The lower inverse variable bridge and the upper inverse variable bridge are mirror image structures, and each comprises two MOS transistors, two capacitors and two resistors; the two resistors are connected in series between the gates of the two MOS transistors; the gate of each of the two MOS transistors is connected to the drain of the other MOS transistor through a capacitor; and the sources of the two MOS transistors are connected. The drains of the two MOS transistors in the lower inverse variable bridge are connected to the drains of the two MOS transistors in the upper inverse variable bridge; the drains of the two MOS transistors in the lower inverse variable bridge are also connected to the two ends of the primary coil; the sources of the two MOS transistors in the upper inverse variable bridge are connected to the low-voltage side power supply; and the sources of the two MOS transistors in the lower inverse variable bridge are connected to the control switch.

8. A millimeter wave isolation driver circuit as claimed in claim 7, wherein, The two MOS transistors in the lower inverse variable bridge are N-channel MOS transistors; and the two MOS transistors in the upper inverse variable bridge are P-channel MOS transistors.

9. A millimeter wave isolation driver circuit as claimed in claim 1, wherein, The rectifier comprises rectifier tubes D1, D2, D3, D4 and a capacitor C5. The rectifier tubes D1 and D3 are connected in series in the same direction; the rectifier tubes D2 and D4 are connected in series in the same direction; one end of the secondary coil is connected to a connecting line between the rectifier tubes D1 and D3, and the other end is connected to a connecting line between the rectifier tubes D2 and D4; the rectifier tubes D1 and D3 connected in series, the rectifier tubes D2 and D4 connected in series and the capacitor C5 are connected in parallel, one end of which is grounded, and the other end is used as the output end of the rectifier.

10. An electronic device, comprising: The millimeter wave isolation driving circuit comprises the millimeter wave isolation driving circuit according to any one of claims 1 to 9.

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