Wafer cleaning tank

Abstract

The utility model relates to a wafer cleaning tank, and belongs to the technical field of wafer production equipment. The air injection tank is arranged in the overflow tank, impurities floating on the liquid surface can be blown to the other side by the air injected from the air injection tank, the impurities floating on the treatment liquid are prevented from floating on the liquid surface all the time, the impurities can flow into the overflow tank along with water flow, and the wafer cleaning effect is improved.

Description

Technical Field

[0001] This application belongs to the field of wafer manufacturing equipment technology, and in particular relates to a wafer cleaning tank. Background Technology

[0002] In semiconductor wafer manufacturing, processing solutions are often used to treat wafers, a process commonly known as cleaning. Tank cleaning equipment is a common type of wafer chemical cleaning equipment. In various common cleaning process configurations, hydrofluoric acid solutions of different relative concentrations, such as HF, DHF, and BOE, are often used as cleaning solutions to clean the wafers.

[0003] Common cleaning tanks include a main tank and an overflow tank. After the treatment solution fills the main tank, it flows out from the overflow tanks on both sides of the main tank. However, during the cleaning process, some impurity particles will float to the surface of the liquid. Since the treatment solution flows into the main tank and then flows away from both sides, the impurities on the surface, especially in the middle of the liquid, are difficult to be washed away by the water flow, resulting in low cleanliness of the treatment solution and a poor cleaning effect. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a wafer cleaning tank with better cleaning effect in order to overcome the shortcomings of the existing technology.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A wafer cleaning tank, comprising:

[0007] The main tank is used to hold wafers and can also hold processing fluid to process the wafers in the main tank; the processing fluid can be various cleaning fluids, process liquids, or water and drying fluids.

[0008] An overflow tank is provided on both sides of the main tank to collect the treatment liquid that overflows from the main tank. An inclined baffle is provided above the overflow tank.

[0009] An air jet channel is provided inside the overflow channel, and an air jet port is provided on the side wall of the main channel. The air jet port is connected to the air jet channel. The air jet channel located on one side of the overflow channel is used to spray gas to blow impurities floating on the surface of the treatment liquid in the main channel to the other side of the overflow channel, so that the impurities flow out of the main channel through the overflow channel on the other side.

[0010] Preferably, in the wafer cleaning tank of this utility model, the top surface of the sidewall between the main tank and the overflow tank is an inclined surface, the top surface of the sidewall is lower on the side closer to the overflow tank and higher on the side closer to the main tank, and the top surface of the jet tank is coplanar with the inclined surface.

[0011] Preferably, in the wafer cleaning tank of this invention, the bottom of the jet tank is connected to a vent pipe, and the vent pipe passes through the bottom of the overflow tank and is connected to an external gas generating device.

[0012] Preferably, in the wafer cleaning tank of this utility model, the jet troughs are arranged in the overflow troughs on both sides of the main tank, and the jet troughs on both sides alternately spray gas, that is, the jet troughs on both sides cannot usually spray gas at the same time.

[0013] Preferably, in the wafer cleaning tank of this invention, the jet nozzle blows gas obliquely upwards, aiming at the middle of the main tank and the area near the jet nozzle.

[0014] Preferably, in the wafer cleaning tank of this utility model, a negative pressure tank is provided on the outside of the overflow tank. The negative pressure tank is connected to an air extraction device to maintain negative pressure in the negative pressure tank so as to extract some gas overflowing from both sides of the main tank.

[0015] Preferably, in the wafer cleaning tank of this utility model, the overflow tank and the negative pressure tank extend to one side to form an extension portion that exceeds the length of the main tank. The extension portion is provided with an air extraction hole and a vent. The air extraction hole is connected to the negative pressure tank. The vent is located at the bottom of the overflow tank. The bottom of the overflow tank is a slope, and the vent is located at the lowest point of the bottom surface of the overflow tank.

[0016] Preferably, the wafer cleaning tank of this utility model further includes a liquid level tube, which is connected to a liquid level tube connection port at the bottom of the main tank. The liquid level tube is equipped with multiple liquid level sensors to sense the liquid level in the main tank. One end of the liquid level tube is an open opening, and the height of the open opening is greater than the liquid level of the processing liquid in the main tank, thus ensuring that the liquid level in the liquid level tube and the liquid level in the main tank are always at the same height.

[0017] Preferably, in the wafer cleaning tank of this invention, the bottom of the main tank also has a processing liquid inlet and a processing liquid outlet. The processing liquid inlet is connected to a spray pipe in the main tank, and the processing liquid can be injected into the main tank through the processing liquid inlet.

[0018] The beneficial effects of this utility model are:

[0019] The wafer cleaning tank of this invention has an air jet channel in the overflow tank. The air jet channel sprays out other substances that can blow impurities floating on the liquid surface to the other side, preventing impurities floating on the liquid surface from floating on the liquid surface indefinitely, so that the impurities can flow into the overflow tank with the water flow, thereby improving the wafer cleaning effect. Attached Figure Description

[0020] The technical solution of this application will be further described below with reference to the accompanying drawings and embodiments.

[0021] Figure 1 This is a schematic diagram of the structure of a wafer cleaning tank according to an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of a wafer cleaning tank equipped with a liquid level tube.

[0023] Figure 3 This is a schematic diagram of the rear end of the wafer cleaning tank according to an embodiment of this application;

[0024] Figure 4 This is a longitudinal sectional view of a wafer cleaning tank according to an embodiment of this application;

[0025] Figure 5 This is a perspective cross-sectional view of a wafer cleaning tank according to an embodiment of this application.

[0026] The attached figures are labeled as follows:

[0027] 1. Main slot;

[0028] 2. Overflow channel;

[0029] 3. Liquid level tube;

[0030] 21. Extension section;

[0031] 22 Overflow space;

[0032] 23. Jet duct;

[0033] 24. Negative pressure tank;

[0034] 25 baffles;

[0035] 110 Processing fluid inlet;

[0036] 111 Processing fluid outlet;

[0037] 112 Liquid level pipe connection port;

[0038] 211 air extraction port;

[0039] 212 exhaust port;

[0040] 231. Jet nozzle;

[0041] 232 Ventilation tube. Detailed Implementation

[0042] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0043] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0044] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0045] The technical solution of this application will now be described in detail with reference to the accompanying drawings and embodiments.

[0046] Example

[0047] This embodiment provides a wafer cleaning tank, such as Figure 1 As shown, it includes:

[0048] Main tank 1 is used to hold wafers and can hold processing fluid to process the wafers in the main tank 1; the processing fluid can be various cleaning fluids, process liquids, or water and drying fluids.

[0049] Overflow tank 2 is provided on both sides of the main tank 1 to receive the treatment liquid overflowing from the main tank 1. The overflow tank 2 has an inclined baffle 25 above it.

[0050] An air jet channel 23 is provided inside the overflow tank 2, and an air jet port 231 is provided on the side wall of the main tank 1. The air jet port 231 is connected to the air jet channel 23. The air jet channel 23 located on one side of the overflow tank 2 is used to spray gas to blow impurities floating on the surface of the treatment liquid in the main tank 1 to the other side of the overflow tank 2, so that the impurities flow out of the main tank 1 through the overflow tank 2 on the other side. During overflow, the treatment liquid must pass through the overflow space 22.

[0051] In this embodiment, the wafer cleaning tank has an air jet 23 inside the overflow tank 2. The air jet 23 sprays out impurities floating on the liquid surface to the other side, preventing impurities from remaining on the surface of the processing liquid and allowing them to flow into the overflow tank 2 with the water flow, thus improving the wafer cleaning effect. The baffle 25 reduces the area of ​​the opening at the top of the overflow tank 2, and the inclined baffle 25 also allows liquid that condenses or drips onto the baffle 25 to flow down the inclined surface.

[0052] Preferably, the top surface of the sidewall between the main tank 1 and the overflow tank 2 is an inclined surface, with the side of the sidewall closer to the overflow tank 2 being lower and the side closer to the main tank 1 being higher. The top surface of the jet chute 23 is coplanar with the inclined surface. This allows the treatment liquid entering the overflow tank 2 to flow smoothly down. The jet chute 23 shares the sidewall of the main tank 1 with the main tank 1.

[0053] Preferably, the bottom of the jet trough 23 is connected to the vent pipe 232, which passes through the bottom of the overflow trough 2 and connects to an external gas generating device. The vent pipe 232 and the bottom of the overflow trough 2 are sealed.

[0054] Preferably, the jet trough 23 is disposed in the overflow trough 2 on both sides of the main trough 1, and the jet trough 23 on both sides alternately ejects gas, that is, the jet trough 23 on both sides cannot eject gas at the same time.

[0055] Preferably, such as Figure 4 As shown by the dotted line, the jet nozzle 231 blows gas obliquely upward, aiming at the middle of the main tank 1 and the area near the jet nozzle 23, which is more conducive to the impurities in the middle of the main tank 1 being carried away by the water flow generated by the airflow.

[0056] Preferably, a negative pressure groove 24 is provided on the outside of the overflow groove 2. The negative pressure groove 24 is connected to the air extraction device to maintain a negative pressure inside the negative pressure groove 24, so as to extract some of the gas overflowing from both sides of the main groove 1. It should be noted that the cover will cover the main groove 1, but the cover cannot be completely sealed. Some gas generated by the treatment liquid will overflow from both sides of the cover. Therefore, the negative pressure groove 24 can prevent some polluting gases from being released into the air.

[0057] Preferably, the overflow trough 2 and the negative pressure trough 24 extend to one side to form an extension 21, which exceeds the length of the main trough 1. The extension 21 is provided with an air extraction hole 211 and an exhaust port 212. The air extraction hole 211 is connected to the negative pressure trough 24. The exhaust port 212 is located at the bottom of the overflow trough 2. The bottom of the overflow trough 2 is a slope. The exhaust port 212 is located at the lowest point of the bottom surface of the overflow trough 2.

[0058] Preferably, the wafer cleaning tank further includes a liquid level pipe 3, which is connected to the liquid level pipe connection port 112 at the bottom of the main tank 1. The liquid level pipe 3 is equipped with multiple liquid level sensors to sense the liquid level in the main tank 1. One end of the liquid level pipe 3 is an open opening, and the height of the open opening is greater than the liquid level of the processing liquid in the main tank 1, thus ensuring that the liquid level in the liquid level pipe 3 and the liquid level in the main tank 1 are always at the same height.

[0059] like Figure 3 As shown, the bottom of the main tank 1 also has a treatment liquid inlet 110 and a treatment liquid outlet 111. The treatment liquid inlet 110 is connected to the spray pipe in the main tank 1, and treatment liquid can be injected into the main tank 1 through the treatment liquid inlet 110.

[0060] It should be noted that, in order to prevent the treatment fluid from entering the jet tank 23, the jet tank 23 is in a state of ejecting gas when the treatment fluid is added to the main tank 1.

[0061] Based on the above-described preferred embodiments according to this application, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this application. The technical scope of this application is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A wafer cleaning tank, characterized in that, include: The main tank (1) is used to hold wafers and can hold processing fluid to process the wafers in the main tank (1); The processing fluid here can be various cleaning fluids, process fluids, or water and drying fluids; An overflow tank (2) is provided on both sides of the main tank (1) to receive the treatment liquid overflowing from the main tank (1). An inclined baffle (25) is provided above the overflow tank (2). An air jet channel (23) is provided inside the overflow channel (2). An air jet port (231) is provided on the side wall of the main channel (1). The air jet port (231) is connected to the air jet channel (23). The air jet channel (23) located on one side of the overflow channel (2) is used to spray gas to blow the impurities floating on the surface of the treatment liquid in the main channel (1) to the other side of the overflow channel (2), so that the impurities flow out of the main channel (1) through the overflow channel (2) on the other side.

2. The wafer cleaning tank according to claim 1, characterized in that, The top surface of the sidewall between the main channel (1) and the overflow channel (2) is an inclined surface. The side of the top surface of the sidewall closer to the overflow channel (2) is lower, and the side closer to the main channel (1) is higher. The top surface of the jet channel (23) is coplanar with the inclined surface.

3. The wafer cleaning tank according to claim 1, characterized in that, The bottom of the jet trough (23) is connected to the vent pipe (232), which passes through the bottom of the overflow trough (2) and is connected to an external gas generating device.

4. The wafer cleaning tank according to claim 1, characterized in that, The jet troughs (23) are located in the overflow troughs (2) on both sides of the main trough (1). The jet troughs (23) on both sides alternately spray gas, that is, the jet troughs (23) on both sides cannot usually spray gas at the same time.

5. The wafer cleaning tank according to claim 1, characterized in that, The jet nozzle (231) blows gas upward at an angle, aiming at the middle of the main slot (1) and the area near the jet slot (23).

6. The wafer cleaning tank according to claim 1, characterized in that, A negative pressure trough (24) is provided on the outside of the overflow trough (2). The negative pressure trough (24) is connected to the air extraction device to maintain negative pressure in the negative pressure trough (24) so ​​as to extract some gas overflowing from both sides of the main trough (1).

7. The wafer cleaning tank according to claim 1, characterized in that, The overflow trough (2) and the negative pressure trough (24) extend to one side to form an extension that exceeds the length of the main trough (1). The extension is provided with an air extraction hole (211) and an air vent (212). The air extraction hole (211) is connected to the negative pressure trough (24). The air vent (212) is located at the bottom of the overflow trough (2). The bottom of the overflow trough (2) is a slope. The air vent (212) is located at the lowest point of the bottom surface of the overflow trough (2).

8. The wafer cleaning tank according to claim 1, characterized in that, The wafer cleaning tank also includes a level tube (3), which is connected to the level tube connection port (112) at the bottom of the main tank (1). Multiple level sensors are installed on the level tube (3) to sense the level in the main tank (1). One end of the level tube (3) is an open opening, and the height of the open opening is greater than the level of the processing liquid in the main tank (1). This ensures that the level in the level tube (3) and the level in the main tank (1) are always the same.

9. The wafer cleaning tank according to claim 1, characterized in that, The bottom of the main tank (1) also has a treatment liquid inlet (110) and a treatment liquid outlet (111). The treatment liquid inlet (110) is connected to the spray pipe in the main tank (1), and treatment liquid can be injected into the main tank (1) through the treatment liquid inlet (110).

Images