Compact liquid cooling radiator for high-density server based on loop heat pipe

Abstract

The utility model relates to a loop heat pipe-based compact liquid cooling radiator for a high-density server in the technical field of chip heat dissipation. The loop heat pipe-based compact liquid cooling radiator comprises at least one evaporator, a shell-and-tube condenser, at least one steam pipeline, at least one liquid pipeline, a first quick connector and a second quick connector, the evaporator is connected with the shell-and-tube condenser through a steam pipeline and a liquid pipeline; the first quick connector and the second quick connector are arranged on the shell-and-tube condenser; the first quick connector is used for cooling water to enter the shell-and-tube condenser; the second quick connector is used for cooling water to flow out of the shell type condenser; the evaporator comprises a capillary wick; the steam pipeline and the liquid pipeline are flexible pipelines. Under the limitation of a small space, the ultrahigh heat flux density requirement can be met, the liquid leakage risk is avoided, the noise influence and vibration damage are reduced, the service life is long, and the reliability is high; the evaporator and the shell-and-tube condenser are connected through a flexible pipeline, and convenience is provided for miniaturization design of electronic components.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip heat dissipation technical field, especially in compact liquid cooling radiator for high density server based on loop heat pipe. BACKGROUND

[0002] Chip can work stably at its best performance, and heat dissipation technology is indispensable. At present, electronic chips are developing towards miniaturization, light weight and high power density, resulting in the concentration of heat flux density and higher requirements for heat dissipation. The mainstream CPU / GPU power has broken through 400W, and is expected to reach 600W in 2025, with a heat flux density of more than 250W / cm 2 . At the same time, with the continuous increase of computing power demand, integrated circuits are developing towards large scale and high integration, and arranging more servers in limited space has become one of the means to cope with the demand for large computing power.

[0003] Traditional air cooling technology is limited in the face of high heat flux density scene. The fan forced convection has an upper limit of about 150W / cm 2 . High-power chips require multiple fans in parallel, resulting in a sharp increase in noise and energy consumption, and dust blockage problems are significant. Liquid cooling has significantly improved cooling performance compared to air cooling and has become the mainstream solution for chip cooling. However, the cold plate type liquid cooling requires complex piping connections, and leakage risks affect the reliability of the server, while the immersion type liquid cooling is costly and has poor compatibility.

[0004] Patent CN221804654U provides a universal multi-platform 1U server water cooling device, which improves space utilization by integrating the liquid pump with the cold plate. However, the liquid pump used in this patent has noise, vibration and leakage risks. Patent CN210805760U provides a chip liquid cooling heat dissipation device, which improves the circulation efficiency of the cooling liquid through two output pumps to strengthen the heat dissipation of the chip. However, the liquid pump used in this patent has a risk of leakage. Patent CN221352755U provides a server-level chip water cooling radiator based on loop heat pipe. This patent uses loop heat pipe to dissipate heat from the chip, and the two-phase fluid circuit driven by capillary force does not require the use of a liquid pump, avoiding the leakage risk of traditional liquid cooling systems, with long service life and high reliability. However, the use of plate heat exchangers occupies a higher height, making it difficult to meet the height requirements of high-density servers. Utility model content

[0005] To solve the above technical problems, the utility model discloses a kind of compact liquid cooling radiator for high-density server based on loop heat pipe, the radiator is driven with capillary force Evaporator, with shell and tube heat exchanger as condenser formed two-phase fluid circuit, no noise problem, no need pump drive, no leakage risk, strong heat dissipation capacity, simultaneously, shell and tube condenser can make full use of the transverse space of server, effectively handle the restriction of server height on heat control product layout.The technical scheme of the utility model is as follows:

[0006] A kind of compact liquid cooling radiator for high-density server based on loop heat pipe, including at least one evaporator, shell and tube condenser, at least one steam pipe line, at least one liquid pipe line, first quick connector and second quick connector;

[0007] At least one the evaporator is connected shell and tube condenser by at least one steam pipe line and at least one liquid pipe line;

[0008] First quick connector and second quick connector are arranged on shell and tube condenser;

[0009] First quick connector is used for cooling water to enter shell and tube condenser;

[0010] Second quick connector is used for cooling water to flow out from shell and tube condenser;

[0011] The evaporator includes capillary core;

[0012] Steam pipe line and liquid pipe line are flexible pipe line.

[0013] Preferably, the number of evaporator, steam pipe line and liquid pipe line is at least 2.

[0014] Preferably, the evaporator further includes bottom shell, liquid accumulator housing, capillary core, steam pipe line connector and liquid pipe line connector;

[0015] The bottom shell includes bottom surface;

[0016] Bottom shell is processed with several bottom surface grooves;

[0017] Bottom shell and liquid accumulator housing are sealingly connected;

[0018] Bottom surface groove and bottom surface are sintered with copper powder layer;

[0019] One side of bottom shell is provided with steam pipe line interface for connecting steam pipe line connector;

[0020] The lower surface of liquid accumulator housing is processed with sealing groove;

[0021] Liquid pipe line connector is arranged on one side of liquid accumulator housing;

[0022] The capillary core is arranged between the bottom shell and the liquid reservoir shell;

[0023] The bottom shell and the liquid reservoir shell are sealingly connected;

[0024] The steam pipe connector is connected to the steam pipe, and the liquid pipe connector is connected to the liquid pipe.

[0025] Preferably, the capillary core is a nickel sintered porous material with a porosity greater than 70%, a pore size less than 50 μm, and an equivalent thermal conductivity less than 5 W / (mK).

[0026] Preferably, the shell-and-tube condenser comprises a barrel, a steam inlet, a condensed liquid outlet, a cooling water inlet, a cooling water outlet, a first tube sheet, a first head, a second tube sheet, a second head, and a heat exchange tube;

[0027] The heat exchange tube passes through the first tube sheet and the second tube sheet, the barrel is sleeved on the heat exchange tube and welded with the first tube sheet and the second tube sheet, the first head is welded with the first tube sheet, the second head is welded with the second tube sheet, the cooling water inlet is welded with the first head, the cooling water outlet is welded with the second head, the cooling water inlet is connected to the first quick connector, the second quick connector is connected to the cooling water outlet, the steam inlet is connected to the steam pipe, and the condensed liquid outlet is connected to the liquid pipe.

[0028] Preferably, the bottom shell is made of copper;

[0029] The liquid reservoir shell, the steam pipe connector, and the liquid pipe connector are made of stainless steel.

[0030] Preferably, the shell-and-tube condenser, the steam pipe, and the liquid pipe are made of stainless steel.

[0031] Preferably, the evaporator is a flat plate type evaporator.

[0032] The advantages of the present utility model are as follows:

[0033] 1. Compared with other server liquid cooling devices, the loop heat pipe radiator driven by capillary force can meet the high heat flux density requirement under the limitation of small space, effectively ensuring the stable operation of the chip.

[0034] 2. The chip radiator based on the loop heat pipe does not need to be driven by a pump, and the full-closed system is connected by welding between components, avoiding the risk of liquid leakage, reducing the noise influence and vibration damage, and having long service life and high reliability.

[0035] 3, the traditional heat pipe relies on gravity operation, unable to adapt to the multi-angle installation of the server, and the heat transfer distance is limited. The loop heat pipe is driven by capillary force, and the evaporator and the shell and tube condenser are connected by flexible pipeline, which has the characteristics of reverse gravity and long heat transfer distance, and can meet the multi-angle layout of the radiator in the high-density server;

[0036] 4, using the shell and tube condenser, the internal space of the server can be fully utilized, and the height requirement of the high-density server is met. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only one embodiment of the present application, and those skilled in the art can obtain other drawings according to these drawings without creating any creative labor.

[0038] Wherein the same parts are indicated by the same reference numerals. It should be noted that the words "front", "back", "left", "right", "up" and "down" used in the following description refer to the directions in the drawings, and the words "bottom surface" and "top surface", "inner" and "outer" respectively refer to the direction towards or away from the geometric center of a particular part.

[0039] Figure 1 It is a structure schematic view of a high-density server compact liquid cooling radiator embodiment based on loop heat pipe.

[0040] Figure 2 It is Figure 1 The cross-sectional view of the evaporator in the embodiment shown in the figure;

[0041] Figure 3 It is Figure 1 The structure schematic view of the bottom shell in the evaporator in the embodiment shown in the figure;

[0042] Figure 4 It is Figure 1 The structure schematic view of the shell and tube condenser in the embodiment shown in the figure;

[0043] Figure 5 It is Figure 1 The structure schematic view of the shell and tube condenser in the embodiment shown in the figure after removing the barrel;

[0044] Figure 6 It is a structure schematic view of another high-density server compact liquid cooling radiator embodiment based on loop heat pipe.

[0045] In the above drawings, each figure number mark represents:

[0046] 1, first evaporator;

[0047] 1-1, bottom shell;

[0048] 1-1-1, bottom surface groove;

[0049] 1-1-2, bottom surface;

[0050] 1-1-3, steam pipe interface;

[0051] 1-2, liquid accumulator shell;

[0052] 1-2-1, sealing groove;

[0053] 1-3, capillary core;

[0054] 1-4, steam pipe connector;

[0055] 1-5, liquid pipe connector;

[0056] 2, shell-and-tube condenser;

[0057] 2-1, barrel;

[0058] 2-2, steam inlet;

[0059] 2-3, condensate outlet;

[0060] 2-4, cooling water inlet;

[0061] 2-5, cooling water outlet;

[0062] 2-6, first tube sheet;

[0063] 2-7, first head;

[0064] 2-8, second tube sheet;

[0065] 2-9, second head;

[0066] 2-10, heat exchange tube;

[0067] 3, first steam pipe;

[0068] 4, first liquid pipe;

[0069] 5, first quick connector;

[0070] 6, second quick connector;

[0071] 7, second evaporator;

[0072] 8, second steam pipe;

[0073] 9, second liquid pipe;

[0074] 10, first tee joint;

[0075] 11, second tee;

[0076] 12, steam dry pipe line;

[0077] 13, liquid dry pipe line. DETAILED DESCRIPTION

[0078] The technical solutions of the present application will be described clearly and completely in combination with the embodiments of the present application and the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0079] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs; the terms used in the specific embodiments are only for the purpose of describing the specific embodiments and are not intended to limit the present application; the terms "include" and "have" and any variations thereof in the specification and claims of the present application and the above description of drawings are intended to cover non-exclusive inclusion.

[0080] In the description of the specific embodiments of the present application, the technical terms "first", "second" and the like are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified.

[0081] In the present application, "embodiment" means that the specific features, structures or properties described in combination with the embodiment can be included in at least one embodiment of the present application. The phrase appears at various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment to other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described in the present application can be combined with other embodiments.

[0082] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in the present application generally represents a "or" relationship between the front and rear associated objects.

[0083] The embodiments of the present application will be described more specifically through the embodiments. It should be noted that the embodiments of the present application are not limited to these embodiments.

[0084] In a specific embodiment 1, as shown in the figure, a high-density server compact liquid cooling radiator based on loop heat pipe includes a first evaporator 1, a shell-and-tube condenser 2, a first vapor pipe 3, a first liquid pipe 4, a first quick connector 5 and a second quick connector 6. Figure 1

[0085] The first quick connector 5 and the second quick connector 6 are connected to an external cold source.

[0086] As shown in the figure, the first evaporator 1 includes a bottom shell 1-1, a reservoir shell 1-2, a capillary wick 1-3, a vapor pipe connector 1-4 and a liquid pipe connector 1-5. Figure 2 As shown in the figure, the bottom shell 1-1 is made of copper, and a plurality of bottom surface grooves 1-1-1 are machined on the bottom shell 1-1. A layer of copper powder with a thickness of about 0.5 mm is sintered on the surface of the bottom surface grooves 1-1-1 and the bottom surface 1-1-2. A vapor pipe interface 1-1-3 is provided on one side of the bottom shell 1-1.

[0087] Figure 3 The reservoir shell 1-2 is made of stainless steel, and a sealing groove 1-2-1 is machined on the bottom surface of the reservoir shell 1-2. The liquid pipe connector 1-5 is provided on one side of the reservoir shell 1-2.

[0088] The capillary wick 1-3 is a nickel sintered porous material with a porosity greater than 70%, a pore size less than 50 μm and an equivalent thermal conductivity less than 5 W / (mK).

[0089] The vapor pipe connector 1-4 is made of stainless steel, and the vapor pipe connector 1-4 is laser welded to the bottom shell 1-1 through the vapor pipe interface 1-1-3.

[0090] The capillary wick 1-3 is assembled into the bottom shell 1-1, the reservoir shell 1-2 is covered and pressed tightly, the sealing groove 1-2-1 is pressed into the capillary wick 1-3 to seal the first evaporator 1, and the bottom shell 1-1 and the reservoir shell 1-2 are connected by brazing.

[0091] As shown in the figure, the shell-and-tube condenser 2 includes a barrel 2-1, a vapor inlet 2-2, a condensed liquid outlet 2-3, a cooling water inlet 2-4, a cooling water outlet 2-5, a first tube sheet 2-6, a first head 2-7, a second tube sheet 2-8, a second head 2-9 and heat exchange tubes 2-10.

[0092] As shown in the figure, the shell-and-tube condenser 2 includes a barrel 2-1, a vapor inlet 2-2, a condensed liquid outlet 2-3, a cooling water inlet 2-4, a cooling water outlet 2-5, a first tube sheet 2-6, a first head 2-7, a second tube sheet 2-8, a second head 2-9 and heat exchange tubes 2-10. Figure 4 Figure 5 All components of the shell-and-tube condenser 2 are made of stainless steel.

[0093] All components of the shell-and-tube condenser 2 are made of stainless steel.

[0094] ​​​The two ends of the heat exchange tube 2-10 are welded to the tube holes of the first tube plate 2-6 and the second tube plate 2-8 respectively.

[0095] The two ends of the shell 2-1 are welded to the first tube plate 2-6 and the second tube plate 2-8 respectively.

[0096] The first head 2-7 is welded to the other side of the first tube plate 2-4, and the second head 2-9 is welded to the other side of the second tube plate 2-5.

[0097] The steam inlet 2-2 and the condensate outlet 2-3 are arranged on the same side of the shell-and-tube condenser 2, and the cooling water inlet 2-4 and the cooling water outlet 2-5 are welded to the first head 2-7 and the second head 2-9 respectively.

[0098] The first steam pipe 3 is a flexible pipe made of stainless steel, and the first steam pipe 3 is welded to the steam pipe connector 1-4 and the steam inlet 2-2.

[0099] The first liquid pipe 4 is a flexible pipe made of stainless steel, and the first liquid pipe 4 is welded to the liquid pipe connector 1-5 and the condensate outlet 2-3.

[0100] The cooling water inlet 2-4 is welded to the first quick connector 5, and the cooling water outlet 2-5 is welded to the second quick connector 6.

[0101] In this embodiment, the working medium filled in the loop formed by the first evaporator 1, the first steam pipe 3, the shell of the shell-and-tube heat exchanger 2, and the first liquid pipe 4 is water.

[0102] In this embodiment, the bottom shell 1-1 of the first evaporator 1 is attached to the chip, and the bottom groove 1-1-1 increases the heating area. When the working medium receives the heat generated by the chip, the water evaporates on the surface of the copper powder layer of the bottom shell 1-1, and the porous copper powder layer provides capillary driving force for the entire system. The steam is collected to the steam pipe interface 1-1-3 along the steam channel formed between the bottom grooves 1-1-1, the steam enters the shell-and-tube condenser 2 through the steam inlet 2-4 by the first steam pipe 3, and the steam in the shell is condensed into liquid after heat exchange with the cooling water in the tube, and then enters the first liquid pipe 4 through the condensate outlet 2-5. The liquid working medium returns to the liquid reservoir shell 1-2 through the liquid pipe connector 1-5, and the capillary core 1-3 continuously supplies liquid to the copper powder layer of the bottom shell 1-1, thereby forming a self-circulating two-phase fluid loop.

[0103] In a preferred embodiment 2, as Figure 6As shown, a compact liquid-cooled radiator for high-density servers based on a loop heat pipe multi-evaporator parallel configuration includes a first evaporator 1, a shell-and-tube condenser 2, a first vapor line 3, a first liquid line 4, a first quick connector 5, a second quick connector 6, a second evaporator 7, a second vapor line 8, a second liquid line 9, a first tee 10, a second tee 11, a vapor dry line 12, and a liquid dry line 13.

[0104] It should be noted that in this embodiment, the first evaporator 1 and the second evaporator 7 have completely identical structures. The first evaporator 1 in this embodiment has the same structure as the first evaporator in Embodiment 1. The shell-and-tube condenser 2 in this embodiment has the same structure as the shell-and-tube condenser in Embodiment 1. The first vapor line 3, the first liquid line 4, the first quick connector 5, and the second quick connector 6 have the same structures as the first vapor line 3, the first liquid line 4, the first quick connector 5, and the second quick connector 6 in Embodiment 1. For ease of understanding and simplification, the specific structural details of the first evaporator 1, the second evaporator 7, and the shell-and-tube condenser 2 in this embodiment follow the specific structural details and reference numerals of Embodiment 1.

[0105] In this embodiment, the steam main line 12 and the liquid main line 13 are flexible lines. The steam inlet 2-2, the second tee 11, and the steam main line 12 of the shell-and-tube condenser 2 are welded together, and the condensate outlet 2-3, the first tee 10, and the liquid main line 13 are welded together. The first steam line 3 is a flexible line, connecting the second tee 11 and the steam line connector 1-4. The second steam line 8 is a flexible line, connecting the other side of the second tee 11 and the steam line connector 1-4 of the second evaporator 1. The first liquid line 4 is a flexible line, connecting the first tee 10 and the liquid line connector 1-5. The second liquid line 9 is a flexible line, connecting the other side of the first tee 10 and the liquid line connector 1-5 of the second evaporator 1.

[0106] In this embodiment, the working principle of the first evaporator 1 and the second evaporator 7 is basically the same as that in embodiment 1.

[0107] The difference between this embodiment and embodiment 1 is that this embodiment is applicable to multi-chip heat dissipation. By connecting the first evaporator 1 and the second evaporator 7 in parallel, multiple chips can achieve efficient heat dissipation.

[0108] In this embodiment, the first evaporator 1 and the second evaporator 7 are flat plate evaporators.

[0109] It can be understood that the specific embodiments of the present application are not limited to Examples 1 and 2, and when facing the heat dissipation environment of high density and multi-chip, the person skilled in the art can undoubtedly draw the technical scheme of connecting more evaporators in parallel to meet the actual needs based on the content of the present application combined with the common knowledge. Such implementation does not exceed the scope of the present application and does not exceed the understanding range of the person skilled in the art.

[0110] It should be pointed out that the above only describes the preferred embodiments of the present application and does not limit the present application. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A compact liquid-cooled heat sink for high-density servers based on loop heat pipes, characterized in that, It includes at least one evaporator, a shell-and-tube condenser, at least one vapor line, at least one liquid line, a first quick connector, and a second quick connector. At least one of the evaporators is connected to the shell-and-tube condenser via at least one of the vapor lines and at least one of the liquid lines; The first quick connector and the second quick connector are disposed on the shell-and-tube condenser; The first quick connector is used for cooling water to enter the shell-and-tube condenser; The second quick connector is used for cooling water to flow out of the shell-and-shell condenser; The evaporator includes a capillary wick; The steam pipeline and the liquid pipeline are flexible pipelines.

2. The high-density compact liquid-cooled heat sink for servers based on loop heat pipes according to claim 1, characterized in that, The number of the evaporator, the vapor pipeline, and the liquid pipeline is at least 2.

3. The high-density compact liquid-cooled heat sink for servers based on loop heat pipes according to claim 1, characterized in that, The evaporator also includes a bottom shell, a liquid reservoir shell, a capillary wick, a vapor line connector, and a liquid line connector; The bottom shell includes a bottom surface; The bottom shell is machined with several bottom surface grooves; The bottom shell and the liquid reservoir shell are sealed together. The bottom groove and the bottom surface are sintered with a copper powder layer; A steam pipe interface for connecting the steam pipe connector is provided on one side of the bottom shell. A sealing groove is machined on the lower surface of the liquid reservoir housing; The liquid pipeline connector is located on one side of the liquid reservoir housing; The capillary core is disposed between the bottom shell and the liquid reservoir shell; The bottom shell is sealed to the liquid reservoir shell; The steam pipeline is connected to the steam pipeline; the liquid pipeline is connected to the liquid pipeline.

4. The high-density compact liquid-cooled heat sink for servers based on loop heat pipes according to claim 1, characterized in that, The capillary core is a nickel sintered porous material with a porosity greater than 70%, a pore size less than 50 μm, and an equivalent thermal conductivity less than 5 W / (mK).

5. The high-density compact liquid-cooled heat sink for servers based on loop heat pipes according to claim 1, characterized in that, A shell-and-tube condenser includes a shell, a steam inlet, a condensate outlet, a cooling water inlet, a cooling water outlet, a first tube sheet, a first end cap, a second tube sheet, a second end cap, and heat exchange tubes. The heat exchange tube passes through the first tube sheet and the second tube sheet. The cylinder is fitted into the heat exchange tube and welded to the first tube sheet and the second tube sheet. The first end cap is welded to the first tube sheet, and the second end cap is welded to the second tube sheet. The cooling water inlet is welded to the first end cap, and the cooling water outlet is welded to the second end cap. The cooling water inlet is connected to the first quick connector, and the second quick connector is connected to the cooling water outlet. The steam inlet is connected to the steam pipeline, and the condensate outlet is connected to the liquid pipeline.

6. The high-density compact liquid-cooled heat sink for servers based on loop heat pipes according to claim 3, characterized in that, The bottom shell is made of copper. The liquid reservoir housing, the vapor pipeline connector, and the liquid pipeline connector are made of stainless steel.

7. The high-density compact liquid-cooled heat sink for servers based on loop heat pipes according to claim 1, characterized in that, The shell-and-tube condenser, the vapor pipeline, and the liquid pipeline are made of stainless steel.

8. The high-density compact liquid-cooled heat sink for servers based on loop heat pipes according to claim 1, characterized in that, The evaporator is a flat plate evaporator.

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