Silicon optical wafer test equipment and alignment coupling mechanism and test system thereof

Abstract

The utility model discloses a silicon optical wafer test device and an alignment coupling mechanism and a test system thereof. The alignment coupling mechanism comprises an optical fiber coupling module, a piezoelectric displacement table and a tail end connecting structure which are connected in sequence. The optical fiber coupling module comprises three translation assemblies and three rotating assemblies which are sequentially connected in series; the three translation assemblies are used for driving the tail end connecting structure to do translation motion in the first direction, the second direction and the third direction correspondingly. The three rotating assemblies are used for driving the tail end connecting structure to rotate with the first rotating shaft, the second rotating shaft and the third rotating shaft as the center correspondingly. The first direction, the second direction and the third direction are vertical in pairs; the first rotating shaft, the second rotating shaft and the third rotating shaft are perpendicular pairwise. Each assembly only needs to achieve motion adjustment on one degree of freedom, the function is single, precise control over motion adjustment is facilitated, all the assemblies only need to be sequentially connected in series, spliced and connected, implementation is simple and easy, and equipment cost can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of silicon photonics wafer testing technology, and in particular to a alignment coupling mechanism, silicon photonics wafer testing equipment, and silicon photonics wafer testing system. Background Technology

[0002] Silicon photonics wafer testing equipment is primarily used for performance testing of silicon photonic chips formed from wafer fabrication. In actual testing, optical fibers or fiber arrays are used to transmit light waves to the silicon photonic chip and collect the output light waves after transmission through the chip's internal channels. That is, the light waves enter and exit the silicon photonic chip via waveguides on the chip, and the optical performance of the output light waves is tested to evaluate the chip's quality. Therefore, achieving proper optical path alignment and coupling between the optical fiber or fiber array and the waveguide to obtain output light that meets testing requirements or achieves the best performance achievable by the fiber or fiber array is a prerequisite for silicon photonics waveguide performance testing. Since the diameter of the optical fiber is much smaller than the mode field diameter (MFD) of the waveguide, determining the optimal coupling alignment point between the fiber and the waveguide is particularly important. How to simplify the alignment and coupling results between the fiber array or fiber and the waveguide on the wafer during silicon photonics wafer testing is one of the key issues of concern in the industry. Utility Model Content

[0003] The purpose of this invention is to provide a alignment coupling mechanism, silicon photonics wafer testing equipment, and silicon photonics wafer testing system for achieving precise alignment coupling between optical fibers or fiber arrays and silicon photonic waveguides, while reducing the difficulty of alignment coupling, simplifying the equipment structure, making it easy to implement, and reducing equipment costs.

[0004] To solve the above-mentioned technical problems, this utility model provides an alignment coupling mechanism for a silicon photonics wafer testing device, including an optical fiber coupling module; a piezoelectric displacement stage connected to the optical fiber coupling module; and an end connection structure fixedly connected to the piezoelectric displacement stage for connecting the end of an optical fiber array or the end of a single optical fiber.

[0005] The fiber optic coupling module includes three translational components and three rotational components connected in series. The three translational components are used to drive the end connection structure to translate along a first direction, a second direction, and a third direction, respectively. The three rotational components are used to drive the end connection structure to rotate around a first rotation axis, a second rotation axis, and a third rotation axis, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first rotation axis, the second rotation axis, and the third rotation axis are perpendicular to each other.

[0006] In one optional embodiment of this application, the three translation components include a first translation component, a second translation component, and a third translation component connected in series; the three rotation components include a first rotation component, a second rotation component, and a third rotation component connected in series; the third translation component is connected to the first rotation component; the third rotation component is connected to the end connection structure;

[0007] Wherein, the first translation component is used to drive the second translation component, the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along the first direction;

[0008] The second translation component is used to drive the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along the second direction;

[0009] The third translation component is used to drive the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along a third direction.

[0010] The first rotating component is used to drive the second rotating component, the third rotating component, and the end connection structure to rotate synchronously around the first rotating axis as the rotation center;

[0011] The second rotating component is used to drive the third rotating component and the end connection structure to rotate synchronously around the second rotating axis as the rotation center;

[0012] The third rotating component is used to drive the end connection structure to rotate around the third rotating axis as the rotation center;

[0013] The first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction and the third rotation axis are all parallel to each other.

[0014] In an optional embodiment of this application, the end connection structure is detachably connected to one of the first clamping assembly and the second clamping assembly; the first clamping assembly is used to clamp the end of a single optical fiber; the second clamping assembly is used to clamp the end structure of an optical fiber array.

[0015] In one optional embodiment of this application, the first clamping assembly includes an optical fiber clamp that can be detachably connected to the end connection structure, a height detector disposed below the optical fiber clamp, and a probe connected to the height detector;

[0016] The fiber clamp is provided with a first slot that extends vertically and matches the contour shape of the end of the single fiber.

[0017] The tip of the probe extends directly below the first slot;

[0018] The height detector and the fiber optic clamp are detachably connected.

[0019] In one optional embodiment of this application, the second clamping assembly includes a fiber array clamp that can be detachably connected to the end connection structure, and a limiting structure that can be connected to the fiber array clamp;

[0020] The fiber array clamp is provided with a second slot that matches the contour shape of the end of the fiber array.

[0021] The limiting structure and the fiber array clamp are detachably connected, and the limiting recess extends to the bottom of the second slot to limit the height of the fiber array end in the vertical direction.

[0022] In one optional embodiment of this application, the end connection structure is provided with a groove structure; a first magnetic attractor is provided in the groove structure;

[0023] Both the first clamping component and the second clamping component are provided with a second magnetic attractor; the first magnetic attractor and the second magnetic attractor can magnetically attract each other.

[0024] In an optional embodiment of this application, a nanoscale displacement capacitive sensor is further provided on the end connection structure.

[0025] In one optional embodiment of this application, the first translation component, the second translation component, and the third translation component are all translation components with the same structure;

[0026] The translation component includes a base with a strip rail, a slide table with a strip groove that mates with the strip rail, and a drive motor connected to the base and the slide table; the drive motor is used to drive the slide table to slide relative to the base along the extension direction of the strip rail.

[0027] The first slide of the first translation component and the second base of the second translation component are fixedly connected; the second slide of the second translation component and the third base of the third translation component are fixedly connected by a triangular structure.

[0028] The triangular structure includes a first plate and a second plate that are perpendicularly connected to form an L-shaped structure, and an inclined plate that is fixedly connected to the first plate on a first side and to the second plate on a second side; the surface of the first plate facing away from the inclined plate is fixedly connected to the second slide; the surface of the second plate facing away from the inclined plate is fixedly connected to the third base.

[0029] The third rotating component and the third translation component are fixedly connected by a third slide.

[0030] In one optional embodiment of this application, the first rotating component, the second rotating component, and the third rotating component are rotating components with the same structure;

[0031] The rotating assembly includes a concave curved substrate with a concave cylindrical surface, a convex curved substrate with a convex cylindrical surface, and a rotating motor.

[0032] The concave cylindrical surface of the concave curved substrate and the convex cylindrical surface of the convex curved substrate are fitted together and attached to each other, and the concave cylindrical surface and the convex cylindrical surface in the same rotating component are cylindrical surfaces with the same radius.

[0033] The rotary motor is used to drive the convex curved substrate to rotate relative to the concave curved substrate, so that the convex cylindrical surface of the convex curved substrate slides in contact with the concave cylindrical surface of the concave curved substrate.

[0034] In one optional embodiment of this application, an arcuate protrusion is further provided on the concave cylindrical surface of the concave curved substrate; and an arcuate groove is provided on the convex cylindrical surface of the convex curved substrate.

[0035] In the same rotating assembly, the arcuate protrusion is inserted into the arcuate groove, and the center of the arcuate protrusion and the arcuate groove are on the same straight line as the rotation axis of the concave cylindrical surface and the convex cylindrical surface.

[0036] A silicon photonics wafer testing device includes an alignment coupling mechanism as described in any of the preceding claims.

[0037] A silicon photonics wafer testing system, characterized in that it includes the silicon photonics wafer testing equipment as described above; and an optical performance testing machine connected to the silicon photonics wafer testing equipment;

[0038] The optical performance testing machine includes a motion controller that is communicatively connected to the optical fiber coupling module and the piezoelectric displacement stage, a tunable light source and a polarization scrambler connected to the end of the optical fiber array away from the end of the optical fiber, and an optical power meter and a coupling photodetector connected to the output end of the polarization scrambler.

[0039] The present invention provides a alignment coupling mechanism for a silicon photonics wafer testing device, as well as the silicon photonics wafer testing device and testing system. The alignment coupling mechanism of the silicon photonics wafer testing device includes: a first translation component, a second translation component, a third translation component, a first rotation component, a second rotation component, and a third rotation component connected in series, and an end connection structure fixedly connected to the third rotation component. The first translation component drives the second translation component, the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end connection structure to synchronously translate along a first direction. The second translation component drives the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end connection structure to synchronously translate along a first direction. The second direction is translated; the third translation component is used to drive the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along the third direction; the first rotation component is used to drive the second rotation component, the third rotation component, and the end connection structure to rotate synchronously around the first rotation axis as the rotation center; the second rotation component is used to drive the third rotation component and the end connection structure to rotate synchronously around the second rotation axis as the rotation center; the third rotation component is used to drive the end connection structure to rotate around the third rotation axis as the rotation center; wherein, the first direction, the second direction, and the third direction are perpendicular to each other; the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction and the third rotation axis are parallel to each other.

[0040] In the alignment coupling mechanism of the silicon photonics wafer testing equipment of this application, the fiber optic coupling module can realize the driving adjustment of six different degrees of freedom of the fiber array end or single fiber end connected to the end connection structure; thereby realizing the initial pose adjustment of the fiber array end or single fiber end; and the fiber optic coupling module is composed of three translation components and three rotation components connected in series. For each component, only one degree of freedom of motion adjustment is required, which is a single function and helps to ensure precise control of motion adjustment in each degree of freedom, thereby ensuring faster initial alignment between the fiber or fiber array and the silicon photonics waveguide. The coupling reduces the difficulty of alignment coupling; and the components only need to be connected in series sequentially, which is simple and easy to implement, and helps to reduce equipment costs. On this basis, a piezoelectric displacement stage is further set between the fiber coupling module and the end connection structure. After the piezoelectric displacement stage is connected to different excitation voltages, it can drive the end connection structure to perform fine-tuning with higher precision. Thus, in this application, through the mutual cooperation between the fiber coupling module and the piezoelectric displacement stage, the position and attitude of the fiber end can be finely adjusted sequentially, thereby quickly realizing the alignment coupling between the port of the fiber end and the waveguide on the silicon photonic wafer. Attached Figure Description

[0041] To more clearly illustrate the technical solutions of the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the alignment coupling mechanism of the silicon photonics wafer testing equipment provided in the embodiments of this application;

[0043] Figure 2 An exploded view of the alignment coupling mechanism of the silicon photonics wafer testing equipment provided in this application embodiment;

[0044] Figure 3 An exploded view of the end connection structure and the first clamping assembly provided in the embodiments of this application;

[0045] Figure 4 An exploded view of the end connection structure and the second clamping assembly provided in the embodiments of this application;

[0046] Figure 5 A schematic diagram of the structure of a base for a translation component provided in an embodiment of this application;

[0047] Figure 6 This is a schematic diagram of the structure of a slide table for a translation component provided in an embodiment of this application;

[0048] Figure 7 This is a schematic diagram of the structure of a concave curved substrate of a rotating component provided in an embodiment of this application;

[0049] Figure 8 This is a schematic diagram of the structure of a convex curved substrate for a rotating component provided in an embodiment of this application. Detailed Implementation

[0050] The core of this invention is to provide a alignment coupling mechanism for a silicon photonics wafer testing device and the silicon photonics wafer testing device itself. This mechanism enables precise motion adjustment of optical fibers or fiber arrays in six degrees of freedom, thereby accelerating the rapid alignment coupling between the optical fibers or fiber arrays and the silicon photonics waveguide, reducing the difficulty of alignment coupling. Furthermore, the overall structure of the alignment coupling mechanism of the silicon photonics wafer testing device is simple to connect and easy to implement, which helps to reduce equipment costs.

[0051] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] like Figures 1 to 4 As shown, Figure 1 This is a schematic diagram of the alignment coupling mechanism of the silicon photonics wafer testing equipment provided in the embodiments of this application; Figure 2 An exploded view of the alignment coupling mechanism of the silicon photonics wafer testing equipment provided in this application embodiment; Figure 3 An exploded view of the end connection structure and the first clamping assembly provided in the embodiments of this application; Figure 4 An exploded view of the end connection structure and the second clamping assembly provided in the embodiments of this application.

[0053] It is understood that the alignment coupling mechanism of the silicon photonics wafer testing equipment in this application is mainly used to control the positional adjustment of the fiber end of the optical fiber or fiber array.

[0054] In one specific embodiment of this application, the alignment coupling mechanism of the silicon photonics wafer testing equipment may include:

[0055] Fiber optic coupling module; piezoelectric displacement stage 7 connected to the fiber optic coupling module; and end connection structure 3 fixedly connected to the piezoelectric displacement stage 7 for connecting fiber array end 6 or single fiber end 5;

[0056] The fiber optic coupling module includes three translational components and three rotational components connected in series. The three translational components are used to drive the end connection structure to translate along the first direction, the second direction, and the third direction, respectively. The three rotational components are used to drive the end connection structure to rotate around the first rotation axis, the second rotation axis, and the third rotation axis, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first rotation axis, the second rotation axis, and the third rotation axis are perpendicular to each other.

[0057] Reference Figure 1 and Figure 2 In this embodiment, the alignment coupling mechanism is used to drive the fiber end of the fiber array or a single fiber to move in space. When the port of the fiber end and the optical interface of the optical waveguide on the silicon photonic wafer reach the optimal coupling position, so that the optical power loss of the optical wave transmission between the port of the fiber end and the optical interface of the optical waveguide is minimized, the alignment coupling between the port of the fiber end and the optical interface of the optical waveguide on the silicon photonic wafer is realized.

[0058] During the alignment and coupling adjustment process, in addition to adjusting the position of the fiber tip in three-dimensional space, it is also necessary to adjust the attitude of the fiber tip, such as its pitch and tilt angles. This requires the alignment and coupling mechanism of the silicon photonics wafer testing equipment to not only realize the translational movement of the fiber tip in three-dimensional space, but also to realize the rotational adjustment of the fiber tip in three-dimensional space to adjust the pitch and tilt angles. To this end, the alignment and coupling mechanism of the silicon photonics wafer testing equipment in this application can drive the fiber tip to achieve six different degrees of freedom of movement.

[0059] Furthermore, in an optional implementation of this embodiment, the three translation components may include a first translation component 11, a second translation component 12, and a third translation component 13 connected in series; the three rotation components include a first rotation component 21, a second rotation component 22, and a third rotation component 23 connected in series; the third translation component 13 is connected to the first rotation component 21; and the third rotation component 23 is connected to the end connection structure 3.

[0060] The first translation component 11 is used to drive the second translation component 12, the third translation component 13, the first rotation component 21, the second rotation component 22, the third rotation component 23, and the end connection structure 3 to translate synchronously along the first direction.

[0061] The second translation component 12 is used to drive the third translation component 13, the first rotation component 21, the second rotation component 22 and the third rotation component 23 and the end connection structure 3 to translate synchronously along the second direction;

[0062] The third translation component 13 is used to drive the first rotation component 21, the second rotation component 22, the third rotation component 23, and the end connection structure 3 to translate synchronously along the third direction.

[0063] The first rotating component 21 is used to drive the second rotating component 22, the third rotating component 23, and the end connection structure 3 to rotate synchronously around the first rotating axis as the rotation center.

[0064] The second rotating component 22 is used to drive the third rotating component 23 and the end connecting structure 3 to rotate synchronously around the second rotating axis as the rotation center.

[0065] The third rotating component 23 is used to drive the end connection structure 3 to rotate around the third rotating axis as the rotation center;

[0066] Among them, the first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction and the third rotation axis are all parallel to each other.

[0067] Reference Figure 1The alignment coupling mechanism of the silicon photonics wafer testing equipment in this application can realize translational movement in two mutually perpendicular directions: a first direction, a second direction, and a third direction. It can also realize rotational movement centered on two mutually perpendicular rotation axes: a first rotation axis, a second rotation axis, and a third rotation axis. (Refer to...) Figure 1 The three-dimensional rectangular coordinate system shown has X-axis, Y-axis and Z-axis parallel to the first direction, second direction and third direction respectively, and X-axis, Y-axis and Z-axis are also parallel to the first rotation axis, second rotation axis and third rotation axis respectively.

[0068] To achieve six degrees of freedom of motion, including translation in three directions and rotation along three rotation axes, the alignment coupling mechanism of the silicon photonics wafer testing equipment in this application employs a corresponding component structure for each degree of freedom. Specifically, the first translation component 11 achieves translation in the first direction, the second translation component 12 achieves translation in the second direction, and the third translation component 13 achieves translation in the third direction. The first rotation component 21 achieves rotation around the first rotation axis, the second rotation component 22 achieves rotation around the second rotation axis, and the third rotation component 23 achieves rotation around the third rotation axis. Thus, each component structure in the alignment coupling mechanism of the silicon photonics wafer testing equipment in this application achieves driving motion in only one degree of freedom, and these component structures are then connected in series.

[0069] In the silicon photonics wafer testing equipment, the alignment coupling mechanism consists of a first translation component 11 directly fixedly connected to the main platform of the silicon photonics wafer testing equipment, and two relatively translatable parts of the second translation component 12 connected to the first translation component 11 and the third translation component 13 respectively; the first rotation component 21 and the second translation component 12 are respectively connected to the two relatively translatable parts of the third translation component 13; similarly, the two relatively rotatable parts of the second rotation component 22 are respectively connected to the first rotation component 21 and the third rotation component 23, and the two relatively rotatable parts of the third rotation component 23 are respectively connected to the second rotation component 22 and the end connection structure 3; the end connection structure 3 is the structure connected to the end of a single optical fiber or an optical fiber array.

[0070] Based on this, when the first translation component 11 in this application translates along the first direction at the end of the optical fiber connected to the drive and the end connection structure 3, the first translation component 11 can drive the second translation component 12, the third translation component 13, the first rotation component 21, the second rotation component 22 and the third rotation component 23 and the end connection structure 3, etc., to translate synchronously along the first direction, thereby indirectly driving the end of the optical fiber to translate along the first direction.

[0071] Similarly, the second translation component 12 also drives the fiber end to translate in the second direction by driving the entire structure, including the third translation component 13, the first rotation component 21, the second rotation component 22, the third rotation component 23, and the end connection structure 3, to translate synchronously in the second direction. The second translation component 12 drives the fiber end to translate in the second direction by driving the first rotation component 21, the second rotation component 22, the third rotation component 23, and the end connection structure 3 to translate synchronously in the third direction.

[0072] The first rotating component 21 drives the second rotating component 22 and the third rotating component 23, as well as the end connection structure 3, to rotate synchronously around the first rotating axis, thereby indirectly driving the fiber end to rotate around the first rotating axis. Similarly, the second rotating component 22 drives the third rotating component 23 and the end connection structure 3 to rotate synchronously around the second rotating axis, thereby indirectly driving the fiber end to rotate around the first rotating axis. The third rotating component 23 directly drives the end connection structure 3 to rotate the fiber end around the third rotating axis. Thus, the movement of the six different free ends of the fiber end is finally realized.

[0073] Based on the above discussion, each component structure in the alignment coupling mechanism of the silicon photonics wafer testing equipment of this application only needs to achieve driving movement in a single degree of freedom, which simplifies the complexity of the motion trajectory required by each component structure, thereby ensuring the accuracy of the driving motion of the alignment coupling mechanism of the silicon photonics wafer testing equipment in each degree of freedom; furthermore, the various component structures in this embodiment only need to be simply spliced ​​together in sequence, making the entire structure of the alignment coupling mechanism of the silicon photonics wafer testing equipment simpler and easier to implement, completely eliminating the need for complex mechanical structures, which helps to reduce the equipment cost of the alignment coupling mechanism of the silicon photonics wafer testing equipment.

[0074] As described above, the alignment coupling mechanism of the silicon photonics wafer testing equipment in this application may need to realize the movement adjustment of the fiber end of a single optical fiber, or it may need to realize the movement adjustment of the fiber end of an optical fiber array. Therefore, in an optional embodiment of this application, the alignment coupling mechanism of the silicon photonics wafer testing equipment may further include:

[0075] The end connection structure 3 is detachably connected to one of the first clamping assembly and the second clamping assembly; the first clamping assembly is used to clamp the end 5 of a single optical fiber; the second clamping assembly is used to clamp the end structure of the optical fiber array.

[0076] In this embodiment, the end connection structure 3 of the alignment coupling mechanism can be detachably connected to both the first clamping component and the second clamping component. Therefore, in practical applications, the clamping component connected to the end connection structure 3 can be switched between the first clamping component and the second clamping component at any time based on testing needs, providing convenience for users' actual application needs.

[0077] In addition, in order to facilitate quick disassembly and switching between the first clamping assembly and the second clamping assembly and the end connecting structure 3 respectively, a groove structure can be further provided on the end connecting structure 3; a first magnetic attractor is provided in the groove structure.

[0078] Both the first clamping assembly and the second clamping assembly are provided with a second magnetic attractor; the first magnetic attractor and the second magnetic attractor can magnetically attract each other.

[0079] It is understandable that a groove structure is provided on the end connecting structure 3 so that the first magnetic attractor and the second magnetic attractor are attracted to each other within the groove structure. In practical applications, the first and second clamping structures should be equipped with protrusions that match the shape of the groove structure, and the second magnetic attractor also has a surface with a concave-convex structure. Thus, the mutual cooperation between the groove structure and the protrusion structure can, to a certain extent, limit the relative positional relationship between the end connecting structure 3 and the first clamping assembly, as well as between the end connecting structure 3 and the first clamping assembly. Of course, in practical applications, the second magnetic attractor can also be directly set to protrude outward from the surface of the first and second clamping assemblies, and have a shape that matches the shape of the groove structure. This allows the first and second magnetic attractors to attract each other, while the groove structure limits the second magnetic attractor, thus also limiting the relative positional relationship between the end connecting structure 3 and the first clamping assembly, as well as between the end connecting structure 3 and the first clamping assembly.

[0080] like Figure 3 As shown, Figure 3 An exploded view of the end connection structure and the first clamping assembly provided in this application embodiment; in an optional embodiment of this application, the first clamping assembly may include:

[0081] The fiber optic clamp 311 is detachably connected to the end connection structure 3, the height detector 312 is disposed below the fiber optic clamp 311, and the probe 313 is connected to the height detector 312.

[0082] The fiber optic clamp 311 is provided with a first slot 3110 that extends vertically and matches the contour shape of the end of a single fiber optic cable.

[0083] The tip of probe 313 extends directly below the first slot 3110;

[0084] A detachable connection between the height detector 312 and the fiber optic clamp 311.

[0085] Reference Figure 3 In this embodiment, the fiber optic clamp 311 is generally in the form of a plate-shaped block structure, and one end is provided with a first slot 3110 that extends in a generally vertical direction. The shape of the first slot 3110 matches the shape and contour of the end of the single fiber optic cable 5, and is generally cylindrical.

[0086] Based on this, a height detector 312 and a probe 313 are connected below the first slot 3110. When the end of a single optical fiber 5 is inserted into the first slot 3110 and its port extends out from below the first slot 3110, the port of the end of the single optical fiber 5 should be exactly abutting against the probe 313. Thus, the probe 313 can limit the port of the end of the single optical fiber 5 from extending further downward, that is, it limits the height of the port of the end of the single optical fiber 5 in the pointing direction. In addition, because the probe 313 is also connected to the height detector 312, the height detector 312 can detect the relative height of other structural components (such as silicon photonic wafers) below, avoiding collisions between the end of the single optical fiber 5 and the structural components below it, thus preventing damage.

[0087] exist Figure 3 In the embodiment shown, a pad 314 of a certain thickness is provided between the fiber optic clamp 311 and the height detector 312, thereby creating a sufficiently large distance between the probe 313 and the first slot 3110, ensuring that the length of the single fiber end 5 extending downward from below the first slot 3110 is sufficiently long.

[0088] Furthermore, when actually adjusting the alignment and coupling between the port of the single fiber end 5 and the optical interface of the optical waveguide, it is necessary to remove the height sensor and probe 313 from the fiber clamp 311 to ensure that the port of the single fiber end 5 is fully exposed. This facilitates the subsequent adjustment of the position of the single fiber end 5, allowing the camera and other vision systems to capture the image of the port of the single fiber end 5. In practical applications, the pad 314, height detector 312, and probe 313 can be fixedly connected together, while the pad 314 is detachably connected to the fiber clamp 311. Thus, after the end of the tube fiber is inserted into the fiber clamp 311 and its vertical height is adjusted, the pad 314, height detector 312, and probe 313 can be detached together. In addition, to simplify the operation of the detachable connection between the fiber optic clamp 311 and the pad 314, a sliding strip and a sliding groove 1021 that can be interlocked can be provided between the lower surface of the fiber optic clamp 311 and the upper surface of the pad 314, thereby realizing the detachable connection between the fiber optic clamp 311 and the pad 314, that is, realizing the detachable connection between the height detector 312 and the probe 313 and the fiber optic clamp 311.

[0089] Furthermore, as described above, the first clamping assembly and the end connection structure 3 can be detachably connected to each other via a first magnetic chuck and a second magnetic chuck, wherein the second magnetic chuck can be disposed on the surface where the fiber optic clamp 311 and the end connection structure 3 are in contact with each other.

[0090] Based on the above discussion, such as Figure 4 As shown, in another optional implementation of this embodiment, the second clamping component for clamping the fiber array end 6 may include:

[0091] A fiber array clamp 321 that can be detachably connected to the end connection structure 3, and a limiting structure 323 that can be connected to the fiber array clamp;

[0092] The fiber array clamp 321 is provided with a second slot 322 that matches the contour shape of the fiber array end 6.

[0093] The limiting structure 323 and the fiber array clamp 321 are detachably connected, and the limiting recess 3231 extends to the bottom of the second slot 322 to limit the height of the fiber array end 6 in the vertical direction.

[0094] The fiber array clamp 321 in this embodiment is similar to the fiber array clamp 311 in the first clamping assembly, and also has a second slot 322 extending approximately vertically. The shape and structure of the second slot 322 are approximately similar to the shape and structure of the fiber array end 6. It is located at one end of the fiber array clamp and is cuboid in shape, penetrating the fiber array clamp 321 along its thickness direction. In order to limit the position of the fiber array end 6 extending from the lower end of the second slot 322, a limiting structure 323 is further provided below the fiber array clamp. When the port of the fiber array end 6 extends downward from the lower end of the second slot 322, it can extend to abut against the platform of the limiting recess 3231 in the limiting structure 323. The platform of the limiting recess 3231 and the length direction of the second slot 322 are perpendicular to each other.

[0095] It is understood that the limiting structure 323 in this embodiment can be a block structure with a certain thickness, and the area below the second slot 322 is provided with a recessed structure, that is, forming a limiting recess 3231. There should be a sufficient height difference between the platform of the limiting recess 3231 and the upper surface of the limiting structure 323, so as to ensure that the length of the light array end extending downward from below the second slot 322 is large enough.

[0096] Furthermore, in this embodiment, the limiting structure 323 also needs to be detached from the fiber array clamp 321 when aligning and coupling between the fiber array end 6 and the optical interface of the optical waveguide. In this embodiment, the limiting structure 323 and the fiber array clamp can also be detachably connected using snap-fit ​​or magnetic attraction, etc., and this application does not specifically limit this.

[0097] Based on any of the above embodiments, the driving movement accuracy achieved by the first translation component 11, the second translation component 12, the third translation component 13, the first rotation component 21, the second rotation component 22, and the third rotation component 23 in the alignment coupling mechanism of this application is relatively limited and difficult to reach the millimeter level. It can only achieve coarse adjustment of the attitude position of the end 5 of a single optical fiber and the end 6 of the optical fiber array.

[0098] Therefore, in another optional embodiment of this application, a piezoelectric displacement stage 7 can also be connected to the end connection structure 3. Specifically, the piezoelectric displacement stage 7 can be disposed between the third rotating component 23 and the end connection structure 3; the piezoelectric displacement stage 7 can achieve minute expansion and contraction movements by applying different voltages, thereby driving the end connection structure 3 and the optical fiber end to perform fine-tuning with higher precision; and as the piezoelectric displacement stage 7 expands and contracts, it causes minute movements in the single optical fiber end 5 and the optical fiber array end 6, thereby changing the coupling state between the optical fiber port and the optical interface of the optical waveguide. When the two reach the best coupling state, the optical power of the light wave transmitted from the optical waveguide to the optical fiber port is the maximum. Thus, the photodetector used for coupling connected to the other end of the single optical fiber or optical fiber array can also collect the maximum optical power, thereby determining that the alignment coupling accuracy between the optical fiber port and the optical interface of the optical waveguide is the best at this time.

[0099] Furthermore, to avoid the problem of the optical fiber end being too low or too high during the drive movement with the optical fiber coupling module, a nano-displacement capacitance sensor can be further set between the end connection structure 3 and the third rotating component 23. This sensor can detect the distance between the end connection structure 3 and other components below it, thus preventing accidental collisions.

[0100] To further illustrate the technical solution of this application, the specific structures of the first translation component 11, the second translation component 12, the third translation component 13, the first rotation component 21, the second rotation component 22, and the third rotation component 23 in the alignment coupling mechanism of the silicon photonics wafer testing equipment of this application will be described in detail below with specific embodiments.

[0101] Reference Figure 5 and Figure 6 , Figure 5 A schematic diagram of the base 101 of a translation component provided in this application embodiment; Figure 6 This is a schematic diagram of the structure of a slide table 102 of a translation component provided in an embodiment of this application.

[0102] In an optional embodiment of this application, the fiber optic coupling module may further include:

[0103] The first translation component 11, the second translation component 12, and the third translation component 13 are all translation components with the same structure;

[0104] The translation assembly includes a base 101 having a strip rail 1011, a slide table 102 having a strip groove that mates with the strip rail 1011, and a drive motor connected to the base 101 and the slide table 102; the drive motor is used to drive the slide table 102 to slide relative to the base 101 along the extension direction of the strip rail 1011.

[0105] The first slide of the first translation component 11 and the second base of the second translation component 12 are fixedly connected; the second slide of the second translation component 12 and the third base of the third translation component 13 are fixedly connected by a triangular structure 41.

[0106] The triangular structure 41 includes a first plate and a second plate that are perpendicularly connected to each other to form an L-shaped structure, and an inclined plate that is fixedly connected to the first plate and the second plate that is fixedly connected to the second plate; the surface of the first plate facing away from the inclined plate is fixedly connected to the second slide; the surface of the second plate facing away from the inclined plate is fixedly connected to the third base.

[0107] The third slide of the third rotating component 23 and the third translation component 13 are fixedly connected.

[0108] exist Figure 5 and Figure 6 In the illustrated embodiment, the base 101 and slide 102 of the translation component are generally plate-shaped structures. There are two parallel slide rails 1011 on one surface of the base 101, and a groove 1021 that cooperates with the two slide rails 1011 on one surface of the slide 102. In this embodiment, the width of the groove 1021 is the same as the distance between the opposite sides of the two slide rails 1011, that is, the two slide rails 1011 are in the same groove 1021 and are in close contact with the two side walls of the groove 1021. A drive motor is provided at the center of the groove 1021, which can drive the slide 102 to slide relative to the base 101 in the direction of the slide rails 1011.

[0109] In this embodiment, the tight interlocking sliding connection between the slide groove 1021 and the slide rail 1011 ensures the stability of the relative motion process between the base 101 and the slide table 102, thereby ensuring the stability of the fiber coupling module in the translational movement of the fiber end in three different degrees of freedom.

[0110] Based on this, the structure, mutual connection method, and driving motion method of the first base, first slide, and first drive motor in the first translation component 11, the structure, mutual connection method, and driving motion method of the second base, second slide, and second drive motor in the second translation component 12, and the structure, mutual connection method, and driving motion method of the third base, third slide, and third drive motor in the third translation component 13 are all consistent with... Figure 5 and Figure 6 The base 101, slide 102 and drive motor in the translation assembly shown are identical in structure, mutual connection method and drive motion method, and will not be repeated in this embodiment.

[0111] Furthermore, in the first translation component 11 of this embodiment, the length extension direction of the first strip rail on the first slide should be parallel to the first direction; similarly, the length extension direction of the second strip rail on the second slide in the second translation component 12 should be parallel to the second direction; and the length extension direction of the third strip rail on the third slide in the third translation component 13 should be parallel to the third direction.

[0112] Reference Figure 1 and Figure 2 For the first translation component 11 and the second translation component 12, they can be directly connected to each other through a fixed connection between the first slide and the second base; while the third base and the second slide can be fixedly connected to each other using a triangular structure 41. In this triangular structure 41, the first and second perpendicular plates form an L-shaped structure, and then an inclined plate is placed between the first and second plates, so that the inclined plate and the L-shaped structure form a triangular structure, thereby ensuring the stability of the connection structure between the third base and the second slide, and further ensuring the smoothness of the mutual transmission of driving motion between the second translation component 12 and the third translation component 13.

[0113] Based on the above embodiments, referring to Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of the concave curved substrate 201 structure of a rotating component provided in an embodiment of this application; Figure 8 This is a schematic diagram of the structure of a convex curved substrate 202 of a rotating component provided in an embodiment of this application.

[0114] In another optional embodiment of this application, the fiber optic coupling module may further include:

[0115] The first rotating component 21, the second rotating component 22, and the third rotating component 23 are rotating components with the same structure;

[0116] The rotating assembly includes a concave curved substrate 201 having a concave cylindrical surface 2010, a convex curved substrate 202 having a convex cylindrical surface 2020, and a rotating motor.

[0117] The concave cylindrical surface 2010 of the concave curved substrate 201 and the convex cylindrical surface 2020 of the convex curved substrate 202 are fitted together and disposed in a mutually compatible manner, and the concave cylindrical surface 2010 and the convex cylindrical surface 2020 in the same rotating component are cylindrical surfaces with the same radius.

[0118] A rotary motor is used to drive the convex curved substrate 202 to rotate relative to the concave curved substrate 201, so that the convex cylindrical surface 2020 of the convex curved substrate 202 slides in contact with the concave cylindrical surface 2010 of the concave curved substrate 201.

[0119] Reference Figure 7 and Figure 8 Each rotating component in this embodiment includes a concave curved substrate 201 and a convex curved substrate 202. The concave curved substrate 201 is a plate-like structure with one side being a concave cylindrical surface 2010 and the other side being a flat surface. The convex curved substrate 202 is a plate-like structure with one side being a convex cylindrical surface 2020 and the other side being a flat surface. In the same rotating component, the concave cylindrical surface 2010 and the convex cylindrical surface 2020 have the same radius, that is, the two surfaces can fit together. The rotation axes of the concave cylindrical surface 2010 and the convex cylindrical surface 2020 are collinear. Thus, when the rotating motor drives the convex curved substrate 202 to maintain the relative sliding of the convex cylindrical surface 2020 and the concave cylindrical surface 2010 in contact with each other, the convex curved substrate 202 rotates relative to the concave curved substrate 201 about the rotation axis of the convex cylindrical surface 2020.

[0120] Based on the above discussion, the connection structure and movement mode between the first concave curved substrate, the first concave curved substrate and the first rotary motor in the first rotating component 21 of this embodiment, the connection structure and movement mode between the second concave curved substrate, the second concave curved substrate and the second rotary motor in the second rotating component 22, and the connection structure and movement mode between the third concave curved substrate, the third concave curved substrate and the third rotary motor in the third rotating component 23 are all similar to... Figure 7 and Figure 8 The concave curved substrate 201 and the connection structure and movement mode between the concave curved substrate 201 and the rotary motor in the rotating assembly shown are the same, and will not be repeated in this application.

[0121] Based on this, the planar side of the first concave curved substrate and the third translation component 13 are fixedly connected, the planar side of the first convex curved substrate and the planar side of the second concave curved substrate are fixedly connected, and the planar side of the second convex curved substrate and the planar side of the third concave curved substrate are fixedly connected; and the coaxial rotation axis of the concave cylindrical surface 2010 of the first concave curved substrate and the convex cylindrical surface 2020 of the first convex curved substrate is a first rotation axis parallel to the first direction; the coaxial rotation axis of the concave cylindrical surface 2010 of the second concave curved substrate and the convex cylindrical surface 2020 of the second convex curved substrate is a second rotation axis parallel to the second direction; the coaxial rotation axis of the concave cylindrical surface 2010 of the third concave curved substrate and the convex cylindrical surface 2020 of the third convex curved substrate is a third rotation axis parallel to the third direction.

[0122] In addition, refer to Figure 1 and Figure 2In order to ensure that the first rotating component 21, the second rotating component 22 and the third rotating component 23 have sufficient space to move and avoid collision during their respective rotational movements, the planar side of the first concave curved substrate and the third translation component 13, the planar side of the first convex curved substrate and the planar side of the second concave curved substrate, and the planar side of the second convex curved substrate and the planar side of the third concave curved substrate can be connected to each other by a T-shaped platform 42 or an L-shaped platform 43, that is, by a T-shaped structure or an L-shaped structure formed by two mutually perpendicular flat plate structures, wherein one flat plate structure is attached to one planar side and the other flat plate structure is attached to the other planar side.

[0123] In this embodiment, in order to achieve relative rotational motion, cylindrical surfaces that can fit together are formed on two plate-shaped substrates in each rotating component. Thus, during the driving rotation, the sliding rotation is achieved by keeping the two cylindrical surfaces in contact with each other. At this time, the concave cylindrical surface 2010 provides a limiting rotation track for the sliding rotation of the convex cylindrical surface 2020, which can largely achieve stability during the rotation process, avoid the problem of shaking during the rotational motion, and improve the driving accuracy of the rotational motion.

[0124] Based on this, in order to further improve the tightness of the fit between the concave cylindrical surface 2010 and the convex cylindrical surface 2020, and to further improve the stability of the relative rotational motion between the convex curved substrate 202 and the concave curved substrate 201, in another optional embodiment of this embodiment, it further includes:

[0125] The concave cylindrical surface 2010 of the concave curved substrate 201 is also provided with an arc-shaped protrusion 2011; the convex cylindrical surface 2020 of the convex curved substrate 202 has an arc-shaped groove 2021.

[0126] In the same rotating assembly, the arc-shaped protrusion 2011 is inserted into the arc-shaped groove 2021, and the center of the arc-shaped protrusion 2011 and the arc-shaped groove 2021 are on the same straight line as the rotation axis of the concave cylindrical surface 2010 and the convex cylindrical surface 2020.

[0127] Further reference Figure 7 and Figure 8In this embodiment, an arcuate protrusion 2011 is further provided on the concave cylindrical surface 2010 of the concave curved substrate 201, and an arcuate groove 2021 is provided on the convex cylindrical surface 2020 of the convex curved substrate 202. The arcuate protrusion 2011 and the arcuate groove 2021 can be interlocked and cooperate with each other. Thus, as the convex curved substrate 202 maintains the convex cylindrical surface 2020 and rotates and slides relative to the concave curved substrate 201 while the convex cylindrical surface 2020 is in contact with each other, the arcuate protrusion 2011 also slides and rotates within the arcuate groove 2021. In this embodiment, the mutual contact between the arcuate protrusion 2011 and the arcuate groove 2021 can further limit the offset between the convex curved substrate 202 and the concave curved substrate 201 perpendicular to the rotation axis, that is, further limit the relative rotational movement of the two, thereby improving the stability during the rotational movement.

[0128] In summary, in the alignment coupling mechanism of the silicon photonics wafer testing equipment of this application, the fiber optic coupling module can realize the driving adjustment of six different degrees of freedom of the fiber array end or single fiber end connected to the end connection structure; thereby realizing the initial pose adjustment of the fiber array end or single fiber end; and the fiber optic coupling module is composed of three translation components and three rotation components connected in series. For each component, only one degree of freedom of motion adjustment is required, which is a single function and helps to ensure precise control of motion adjustment in each degree of freedom, thereby ensuring faster initial alignment coupling between the fiber or fiber array and the silicon photonics waveguide. This reduces the difficulty of alignment and coupling; and the components only need to be connected in series sequentially, which is simple and easy to implement, and helps to reduce equipment costs. On this basis, a piezoelectric displacement stage is further set between the fiber coupling module and the end connection structure. After the piezoelectric displacement stage is connected to different excitation voltages, it can drive the end connection structure to perform fine-tuning with higher precision. Thus, in this application, through the mutual cooperation between the fiber coupling module and the piezoelectric displacement stage, the position and attitude of the fiber or fiber array can be finely adjusted sequentially, thereby enabling the rapid alignment and coupling of the end of the fiber or fiber array with the waveguide on the silicon photonics wafer.

[0129] This application also provides an embodiment of a silicon photonics wafer testing apparatus, including the alignment coupling mechanism of the silicon photonics wafer testing apparatus as described in any of the preceding claims.

[0130] This application also provides a silicon photonics wafer testing system, including the silicon photonics wafer testing equipment as described above; and an optical performance testing machine connected to the silicon photonics wafer testing equipment;

[0131] The optical performance testing machine includes a motion controller that is communicatively connected to the optical fiber coupling module and the piezoelectric displacement stage, a tunable light source and a polarization scrambler connected to the end of the optical fiber array away from the end of the optical fiber, and an optical power meter and a coupling photodetector connected to the output end of the polarization scrambler.

[0132] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that the elements inherent in a process, method, article, or apparatus that includes a list of elements are included. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. Additionally, portions of the technical solutions provided in the embodiments of this application that are consistent with the implementation principles of corresponding technical solutions in the prior art have not been described in detail to avoid excessive elaboration.

[0133] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. A alignment coupling mechanism for a silicon photonics wafer testing device, characterized in that, It includes an optical fiber coupling module; a piezoelectric displacement stage connected to the optical fiber coupling module; and an end connection structure fixedly connected to the piezoelectric displacement stage for connecting the end of an optical fiber array or the end of a single optical fiber. The fiber optic coupling module includes three translational components and three rotational components connected in series. The three translational components are used to drive the end connection structure to translate along a first direction, a second direction, and a third direction, respectively. The three rotational components are used to drive the end connection structure to rotate around a first rotation axis, a second rotation axis, and a third rotation axis, respectively. The first direction, the second direction, and the third direction are perpendicular to each other. The first rotation axis, the second rotation axis, and the third rotation axis are perpendicular to each other.

2. The alignment coupling mechanism of the silicon photonics wafer testing equipment as described in claim 1, characterized in that, The three translation components include a first translation component, a second translation component, and a third translation component connected in series; the three rotation components include a first rotation component, a second rotation component, and a third rotation component connected in series; the third translation component is connected to the first rotation component; the third rotation component is connected to the end connection structure; Wherein, the first translation component is used to drive the second translation component, the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along the first direction; The second translation component is used to drive the third translation component, the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along the second direction; The third translation component is used to drive the first rotation component, the second rotation component, the third rotation component, and the end connection structure to translate synchronously along a third direction. The first rotating component is used to drive the second rotating component, the third rotating component, and the end connection structure to rotate synchronously around the first rotating axis as the rotation center; The second rotating component is used to drive the third rotating component and the end connection structure to rotate synchronously around the second rotating axis as the rotation center; The third rotating component is used to drive the end connection structure to rotate around the third rotating axis as the rotation center; The first direction and the first rotation axis, the second direction and the second rotation axis, and the third direction and the third rotation axis are all parallel to each other.

3. The alignment coupling mechanism of the silicon photonics wafer testing equipment as described in claim 2, characterized in that, The end connection structure is detachably connected to one of the first clamping assembly and the second clamping assembly; the first clamping assembly is used to clamp the end of a single optical fiber; the second clamping assembly is used to clamp the end structure of an optical fiber array.

4. The alignment coupling mechanism of the silicon photonics wafer testing equipment as described in claim 3, characterized in that, The first clamping assembly includes an optical fiber clamp that can be detachably connected to the end connection structure, a height detector disposed below the optical fiber clamp, and a probe connected to the height detector; The fiber clamp is provided with a first slot that extends vertically and matches the contour shape of the end of the single fiber. The tip of the probe extends directly below the first slot; The height detector and the fiber optic clamp are detachably connected.

5. The alignment coupling mechanism of the silicon photonics wafer testing equipment as described in claim 3, characterized in that, The second clamping assembly includes a fiber array clamp that can be detachably connected to the end connection structure, and a limiting structure that can be connected to the fiber array clamp; The fiber array clamp is provided with a second slot that matches the contour shape of the end of the fiber array. The limiting structure and the fiber array clamp are detachably connected, and the limiting recess extends to the bottom of the second slot to limit the height of the fiber array end in the vertical direction.

6. The alignment coupling mechanism of the silicon photonics wafer testing equipment as described in claim 3, characterized in that, The end connection structure is provided with a groove structure; a first magnetic attractor is provided in the groove structure; Both the first clamping component and the second clamping component are provided with a second magnetic attractor; the first magnetic attractor and the second magnetic attractor can magnetically attract each other.

7. The alignment coupling mechanism of the silicon photonics wafer testing equipment as described in claim 2, characterized in that, The end connection structure is also equipped with a nanometer displacement capacitive sensor.

8. The alignment coupling mechanism of the silicon photonics wafer testing equipment as described in any one of claims 2 to 7, characterized in that, The translation component includes a base with a strip rail, a slide table with a strip groove that mates with the strip rail, and a drive motor connected to the base and the slide table; the drive motor is used to drive the slide table to slide relative to the base along the extension direction of the strip rail. The first slide of the first translation component and the second base of the second translation component are fixedly connected; the second slide of the second translation component and the third base of the third translation component are fixedly connected by a triangular structure. The triangular structure includes a first plate and a second plate that are perpendicularly connected to form an L-shaped structure, and an inclined plate that is fixedly connected to the first plate on a first side and to the second plate on a second side; the surface of the first plate facing away from the inclined plate is fixedly connected to the second slide; the surface of the second plate facing away from the inclined plate is fixedly connected to the third base. The third rotating component and the third translation component are fixedly connected by a third slide.

9. The alignment coupling mechanism of the silicon photonics wafer testing equipment as described in any one of claims 2 to 7, characterized in that, The rotating assembly includes a concave curved substrate with a concave cylindrical surface, a convex curved substrate with a convex cylindrical surface, and a rotating motor. The concave cylindrical surface of the concave curved substrate and the convex cylindrical surface of the convex curved substrate are fitted together and attached to each other, and the concave cylindrical surface and the convex cylindrical surface in the same rotating component are cylindrical surfaces with the same radius. The rotary motor is used to drive the convex curved substrate to rotate relative to the concave curved substrate, so that the convex cylindrical surface of the convex curved substrate slides in contact with the concave cylindrical surface of the concave curved substrate.

10. The alignment coupling mechanism of the silicon photonics wafer testing equipment as described in claim 9, characterized in that, The concave cylindrical surface of the concave curved substrate is further provided with an arc-shaped protrusion; the convex cylindrical surface of the convex curved substrate is provided with an arc-shaped groove. In the same rotating assembly, the arcuate protrusion is inserted into the arcuate groove, and the center of the arcuate protrusion and the arcuate groove are on the same straight line as the rotation axis of the concave cylindrical surface and the convex cylindrical surface.

11. A silicon photonics wafer testing device, characterized in that, Includes the alignment coupling mechanism of the silicon photonics wafer testing equipment as described in any one of claims 1 to 10.

12. A silicon photonics wafer testing system, characterized in that, Includes the silicon photonics wafer testing equipment as described in claim 11; and an optical performance testing machine connected to the silicon photonics wafer testing equipment; The optical performance testing machine includes a motion controller that is communicatively connected to the optical fiber coupling module and the piezoelectric displacement stage, a tunable light source and a polarization scrambler connected to one end of the optical fiber array away from the end of the optical fiber, and an optical power meter and a photodetector for coupling connected to the output end of the polarization scrambler.

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