Chip taking and placing device and semiconductor die bonder
By setting multiple parallel picking components in the chip pick-and-place device and utilizing a three-dimensional moving mechanism, the problem of low efficiency in traditional chip pick-and-place devices is solved, achieving high-efficiency chip pick-and-place and improved die bonding efficiency.
CN224124556UActive Publication Date: 2026-04-14SHENZHEN LIANDE SEMICON TECH CO LTD
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Patent Information
- Application Number
- CN202520527580.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2026-04-14
- Estimated Expiration
- 2035-03-25
AI Technical Summary
Technical Problem
The structural design of traditional chip pick-and-place devices results in low chip pick-and-place efficiency, which affects die bonding efficiency.
Method used
Design a chip pick-and-place device that employs a pick-up mechanism and a moving mechanism. The pick-up mechanism is equipped with at least two parallel pick-up components, and the moving mechanism moves in three dimensions to simultaneously pick up multiple chips, thereby improving pick-and-place efficiency.
Benefits of technology
This enables synchronous chip pickup and placement, improving chip pick-up and placement efficiency, thereby enhancing die bonding efficiency.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to a chip pick-and-place device and a semiconductor die bonder, in the chip pick-and-place device, a moving mechanism is utilized to drive a pick-up mechanism to move in a first direction and a second direction, so that the pick-up mechanism moves to a position above a chip to be processed. According to the pick-up mechanism, at least two parallel pick-up assemblies are arranged on the mounting seat, so that the mounting seat is driven by the moving mechanism to move along the third direction, each pick-up assembly respectively picks up the corresponding chip, at least two chips can be synchronously picked up in the die bonding process, the pick-and-place efficiency of the chips is effectively improved, and the die bonding efficiency is further improved.
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