In-situ CT analysis device for real-time observation of soldering tin melting process

By designing a combination of a heating chamber and an X-ray device, real-time observation and high-precision CT scanning of the solder melting process were achieved. This solved the problems of the inability to observe changes in the solder structure in real time and the interference of the heating device with imaging in the existing technology, and improved the resolution and accuracy of CT scans.

CN224189927UActive Publication Date: 2026-05-01SHENZHEN ZHUO MAO TECH
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Patent Information

Application Number
CN202520969218.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-16
Publication Date
2026-05-01
Estimated Expiration
2035-05-16

AI Technical Summary

Technical Problem

Existing CT equipment cannot observe changes in the internal structure of solder in real time, cannot simulate temperature changes in the actual soldering environment, and traditional heating methods may block X-ray imaging, affecting the resolution and accuracy of CT scans.

Method used

An in-situ CT analysis device was designed, which includes a heating box, an X-ray receiving device, and an X-ray emitting device. A ring-shaped infrared heating tube is used to ensure uniform heating of the solder sample. Combined with the X and Y axis translation mechanism, real-time observation is achieved, avoiding X-ray imaging obstruction.

Benefits of technology

It enables real-time observation of the solder melting process, simulates temperature changes in the real welding environment, improves the resolution and accuracy of CT scans, and solves the problems of lag and destructiveness of traditional methods.

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Abstract

The utility model discloses an in-situ CT (Computed Tomography) analysis device for real-time observation of a soldering tin melting process. The in-situ CT analysis device comprises a heating box, an X-ray receiving device arranged above the heating box and an X-ray emitting device arranged below the heating box, the heating box comprises a mounting box body; a first mounting groove is formed in the top of the mounting box body, and a product clamping mechanism is further mounted in the first mounting groove; and the product clamping mechanism comprises two clamping rods. Based on the X-ray detection principle, the internal structure change in the soldering tin melting process can be observed in real time, the hysteresis and destructive problems of a traditional method are solved, the annular infrared heating pipe is adopted, it can be ensured that a soldering tin sample is evenly heated, temperature change in the real welding environment is simulated, meanwhile, shielding of ray imaging is avoided, and the welding quality is improved. And the resolution and the precision of CT scanning are improved.
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