Vehicle-mounted entertainment system host and vehicle
By setting up independent heat dissipation modules inside the in-vehicle entertainment system host, and having each heat dissipation module form its own air duct, the problem of simultaneous heat dissipation in existing technologies is solved. This enables the distributed arrangement and synchronous heat dissipation of multiple PCB boards, improving heat dissipation efficiency, the heat dissipation effect of the heat dissipation modules, and the performance of the host.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FULSCIENCE AUTOMOTIVE ELECTRONICS CO LTD
- Filing Date
- 2025-05-20
- Publication Date
- 2026-05-26
AI Technical Summary
Existing in-vehicle entertainment system head units cannot effectively dissipate heat from two PCB boards simultaneously within a limited space, and the heat dissipation structure occupies installation space, affecting the head unit's performance.
An independent heat dissipation module, including a heat sink and a fan, is installed inside the housing of the in-vehicle entertainment system host. The heat sink forms a heat dissipation channel and multiple heat dissipation sections. The heat dissipation sections are attached to the heat-generating components of the chip module's control components, realizing the distributed arrangement and synchronous heat dissipation of multiple PCB boards.
It enables simultaneous heat dissipation of multiple PCBs, avoids occupying installation space, and improves heat dissipation and host performance.
Smart Images
Figure CN224290420U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation in in-vehicle entertainment systems, and in particular to an in-vehicle entertainment system host and vehicle. Background Technology
[0002] With the development of in-vehicle entertainment systems, the heat generated by the chip modules inside the system's main unit is increasing. Given the limited size of the main unit, the chip modules typically use two PCBs. Common heat dissipation solutions for this structure include... Figure 1 as well as Figure 2 The two types shown.
[0003] Figure 1 The proposed design features a side-mounted fan, with the air duct cover and die-cast aluminum housing forming the air duct. Figure 2 The illustrated solution uses a top-mounted fan, with the air duct shroud and die-cast aluminum casing forming the air duct. In both existing cooling solutions, the heat dissipation structure utilizes several components to create a relatively concentrated PCB board. This means that when both PCB boards are large and contain heat-generating components, neither solution can simultaneously cool both boards. Furthermore, when cooling the lower PCB board, the heatsink fins occupy space, limiting the size of the upper PCB board and impacting system performance. Utility Model Content
[0004] In view of this, the purpose of this application is to provide a vehicle infotainment system host and vehicle to solve the problem that the heat dissipation structure in the existing vehicle infotainment system host cannot simultaneously dissipate heat from two (or more) PCB boards and affects the installation space of the PCB boards.
[0005] In accordance with the above objectives, a first aspect of this utility model provides a vehicle entertainment system host, wherein the vehicle entertainment system host comprises:
[0006] case;
[0007] A chip module, located inside the housing, includes multiple control components;
[0008] A heat dissipation module includes a heat sink and a fan. The heat sink has a heat dissipation channel and multiple heat dissipation parts. The fan is disposed at the end of the heat dissipation channel. The heat-generating element of each control component is attached to the heat dissipation part.
[0009] Preferably, the heat sink is formed in a cuboid shape, and a cavity is formed inside the heat sink. The cavity extends through both ends of the heat sink along its length to form the heat dissipation channel.
[0010] Preferably, the heat dissipation portion is located on the side of the heat dissipation component, and the heat dissipation portions located at both ends in the height direction of the heat dissipation component are defined as the first heat dissipation portion, and the heat dissipation portions located at both ends in the width direction of the heat dissipation component are defined as the second heat dissipation portion.
[0011] Preferably, each of the first heat dissipation portions includes a plurality of first heat dissipation fins, the plurality of first heat dissipation fins being arranged at intervals along the width direction of the heat dissipation component, and each of the first heat dissipation fins extending along the length direction of the heat dissipation component.
[0012] Preferably, the bottom end of each of the first heat dissipation fins is connected to the inner sidewall of the heat dissipation component.
[0013] Preferably, in the longitudinal section of the heat sink, the tips of the plurality of first heat sink fins in each first heat sink portion are arranged in an arc shape, and the arc shape arches toward the direction away from the inner sidewall of the heat sink.
[0014] The longitudinal section is perpendicular to the length direction of the heat sink.
[0015] Preferably, the chip module includes at least a first control element and a second control element, the first control element and the second control element being located at the top and bottom of the heat sink respectively, such that the heating element of the first control element and the heating element of the second control element are respectively attached to the corresponding first heat sink.
[0016] Preferably, each of the second heat dissipation portions includes a plurality of second heat dissipation fins, the plurality of second heat dissipation fins being arranged at intervals along the height direction of the heat dissipation component, and each of the second heat dissipation fins extending along the length direction of the heat dissipation component.
[0017] Preferably, the housing includes a bottom plate and a cuboid-shaped top cover, the top cover having a through hole corresponding to the fan.
[0018] According to a second aspect of the present invention, a vehicle is provided, wherein the vehicle includes an in-vehicle entertainment system host as described above.
[0019] According to the present invention, an in-vehicle entertainment system host and vehicle are provided. An independent heat dissipation module is installed inside the housing of the in-vehicle entertainment system host, making it suitable for various host sizes. The heat dissipation module includes a heat sink and a fan. The heat sink forms a heat dissipation channel and multiple heat dissipation sections. Thus, the heat dissipation module forms its own airflow channel, and the heat dissipation sections effectively increase the heat dissipation effect. In this host, multiple control components of the chip module can be distributed on different sides of the heat sink, allowing the heat-generating element of each control component to be in contact with the heat dissipation section. Therefore, the heat dissipation structure can simultaneously dissipate heat from two (or even more) PCBs without occupying PCB installation space, i.e., it does not affect the PCB installation dimensions.
[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of the host unit of an in-vehicle entertainment system in the prior art;
[0023] Figure 2 This is another structural diagram of the host unit of an in-vehicle entertainment system in the prior art;
[0024] Figure 3 This is an exploded view of the in-vehicle entertainment system host according to an embodiment of this utility model;
[0025] Figure 4 This is an exploded view of the heat dissipation module according to an embodiment of the present invention;
[0026] Figure 5 This is a cross-sectional view of the heat sink component according to an embodiment of this utility model.
[0027] Icons: 11-Top cover; 12-Base plate; 21-First control component; 22-Second control component; 23-Heating element; 31-Fan; 32-Heat sink; 321-First heat sink fin; 322-Second heat sink fin; 323-Open structure; 324-Heat dissipation channel; 325-Mounting hole; 326-Connection hole. Detailed Implementation
[0028] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.
[0029] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.
[0030] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.
[0031] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.
[0032] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.
[0033] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.
[0034] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.
[0035] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.
[0036] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.
[0037] According to a first aspect of this utility model, a vehicle entertainment system host is provided, such as... Figures 3 to 5 As shown, the in-vehicle entertainment system host in this embodiment includes a housing and a chip module and a heat dissipation module located inside the housing. The chip module includes multiple control components (essentially referring to a PCB board). The specific structure of the aforementioned parts of the in-vehicle entertainment system host according to this utility model will be described in detail below.
[0038] In this embodiment, as Figure 3As shown, the housing includes a base plate 12 and a cuboid-shaped top cover 11, which can be detachably connected by screws or other means to facilitate the maintenance and replacement of the heat dissipation module and chip module described below. This technology is conventional in the field, so the specific connection structure between the top cover 11 and the base plate 12 will not be described in detail. Furthermore, it should be noted that there are no specific limitations on the specifications and dimensions of the housing; they can be determined based on actual needs, such as the specifications of the heat dissipation module and chip module described below.
[0039] In this embodiment, the heat dissipation module is independently housed inside the casing, meaning it can achieve heat dissipation on its own without needing to cooperate with other components to form an airflow channel. Specifically, as shown... Figure 4 As shown, the heat dissipation module includes a heat sink 32 formed in a cuboid shape. A cavity is formed inside the heat sink 32, extending through both ends of the heat sink 32 along its length to form a heat dissipation channel 324. Further, heat dissipation portions are formed on the sides of the heat sink 32. The heat dissipation portions located at both ends in the height direction of the heat sink 32 are defined as first heat dissipation portions, and the heat dissipation portions located at both ends in the width direction of the heat sink 32 are defined as second heat dissipation portions.
[0040] like Figures 4 to 5 As shown, each first heat dissipation section includes a plurality of first heat dissipation fins 321, which are spaced apart along the width direction of the heat dissipation component 32, and each first heat dissipation fin 321 extends along the length direction of the heat dissipation component 32; furthermore, the bottom end of each first heat dissipation fin 321 is connected to the inner sidewall of the heat dissipation component 32 (which may be welded), while the heat dissipation component 32... Figure 5 In the longitudinal section shown, the tops of the multiple first heat dissipation fins 321 (in each first heat dissipation section) are distributed in an arc shape. The arc shape arches towards the direction away from the inner wall of the heat dissipation member 32. That is, along the width line of the heat dissipation member 32, the first heat dissipation fins 321 in the middle are higher, and the first heat dissipation fins 321 at both ends are lower. In this way, the heat source with higher heat generation can be arranged in the middle of the first heat dissipation section (i.e., the arc-shaped arch) to facilitate heat dissipation.
[0041] For example, in this embodiment, the chip module specifically includes a first control element 21 and a second control element 22. The first control element 21 and the second control element 22 are located at the top and bottom of the heat sink 32, respectively, so that the heating element 23 of the first control element 21 and the heating element 23 of the second control element 22 are respectively attached to the corresponding first heat sink. In this way, the first control element 21 and the second control element 22 can be cooled synchronously (the heating element 23 can be bonded to the heat sink with structural adhesive, which can further improve the stability of the connection between the chip module and the heat sink module). In addition, the first control element 21 and the second control element 22 are distributed at the top and bottom of the heat sink 32, so that their installation space and size do not affect each other.
[0042] It should be noted that the aforementioned longitudinal section is perpendicular to the length direction of the heat sink 32. Furthermore, there are no specific limitations on the number, spacing, and specifications of the first heat sink fins 321; these can be determined comprehensively based on actual conditions, such as the specifications of the heat sink 32, to meet the heat dissipation requirements of the chip module.
[0043] In this embodiment, as Figure 5 As shown, each second heat dissipation section includes multiple second heat dissipation fins 322, which are spaced apart along the height direction of the heat dissipation component 32, and each second heat dissipation fin 322 extends along the length direction of the second heat dissipation component 32. Similarly, the number, spacing, and specifications of the second heat dissipation fins 322 are not specifically limited, and are determined based on actual conditions such as the specifications of the heat dissipation component 32, as long as the heat dissipation requirements of the chip module are met. When the chip module has three or four control components, their heat-generating elements 23 can be attached to the second heat dissipation section to improve heat dissipation efficiency.
[0044] Furthermore, such as Figure 4 As shown, the first end of the heat sink 32 along its length has a U-shaped open structure 323 for mounting the fan 31; correspondingly, the upper cover 11 has a through hole corresponding to the fan 31. Figures 4 to 5 As shown, the end face of the open structure 323 has a mounting hole 325 corresponding to the fan 31, and the two can be detachably connected by screws or other structural components. In this way, the heat dissipation module can form its own air duct (without having to consider using other parts to form an air duct), thereby increasing the flexibility of the control components layout. That is, multiple control components can be distributed to facilitate the even release of heat from the heat source to the heat dissipation part.
[0045] Furthermore, protrusions are formed on the four edges of the heat sink 32, and these protrusions are provided with connecting holes 326 to facilitate the assembly of the heat sink 32 with the housing. In this embodiment, there are no specific limitations on the specifications, materials, etc. of the heat sink 32. For example, it can be formed as a sheet metal part or a die-cast aluminum part. In order to achieve the above-mentioned technical effects, the heat sink 32 should have a good heat dissipation coefficient.
[0046] According to the present invention, an independent heat dissipation module is set inside the housing of the in-vehicle entertainment system host, making it suitable for various sizes of host. The heat dissipation module includes a heat sink 32 and a fan 31. The heat sink 32 forms a heat dissipation channel 324 and multiple heat dissipation parts. In this way, the heat dissipation module forms its own air duct, which is transparent, straight and has excellent airflow control. The heat dissipation parts further enhance the heat dissipation effect of the heat dissipation module. In this host, multiple control components of the chip module can be distributed on different sides of the heat sink 32, so that the heat-generating element 23 of each control component can be in contact with the heat dissipation part. Thus, the heat dissipation structure can dissipate heat from two (or even more) PCB boards at the same time, without occupying the installation space of the PCB board, that is, without affecting the installation size of the PCB board.
[0047] According to a second aspect of the present invention, a vehicle is provided, the vehicle including an in-vehicle entertainment system host as described above.
[0048] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.
Claims
1. A vehicle entertainment system host, characterized in that, The in-vehicle entertainment system host includes: case; A chip module, located inside the housing, includes multiple control components; A heat dissipation module includes a heat sink and a fan. The heat sink has a heat dissipation channel and multiple heat dissipation parts. The fan is disposed at the end of the heat dissipation channel. The heat-generating element of each control component is attached to the heat dissipation part.
2. The in-vehicle entertainment system host according to claim 1, characterized in that, The heat sink is formed into a cuboid-like structure, and a cavity is formed inside the heat sink. The cavity extends through both ends of the heat sink along its length to form the heat dissipation channel.
3. The in-vehicle entertainment system host according to claim 2, characterized in that, The heat dissipation portion is located on the side of the heat dissipation component. The heat dissipation portions located at both ends in the height direction of the heat dissipation component are defined as the first heat dissipation portion, and the heat dissipation portions located at both ends in the width direction of the heat dissipation component are defined as the second heat dissipation portion.
4. The in-vehicle entertainment system host according to claim 3, characterized in that, Each of the first heat dissipation sections includes a plurality of first heat dissipation fins, which are arranged at intervals along the width direction of the heat dissipation component, and each of the first heat dissipation fins extends along the length direction of the heat dissipation component.
5. The in-vehicle entertainment system host according to claim 4, characterized in that, The bottom end of each of the first heat dissipation fins is connected to the inner sidewall of the heat dissipation component.
6. The in-vehicle entertainment system host according to claim 5, characterized in that, In the longitudinal section of the heat sink, the tips of the plurality of first heat sink fins in each first heat sink part are arranged in an arc shape, and the arc shape arches toward the direction away from the inner sidewall of the heat sink. The longitudinal section is perpendicular to the length direction of the heat sink.
7. The in-vehicle entertainment system host according to claim 6, characterized in that, The chip module includes at least a first control element and a second control element, which are located at the top and bottom of the heat sink, respectively, such that the heating element of the first control element and the heating element of the second control element are respectively attached to the corresponding first heat sink.
8. The in-vehicle entertainment system host according to claim 3, characterized in that, Each of the second heat dissipation sections includes a plurality of second heat dissipation fins, which are spaced apart along the height direction of the heat dissipation component, and each of the second heat dissipation fins extends along the length direction of the heat dissipation component.
9. The in-vehicle entertainment system host according to claim 1, characterized in that, The housing includes a base plate and a cuboid-shaped top cover, the top cover having a through hole corresponding to the fan.
10. A vehicle, characterized in that, The vehicle includes an in-vehicle entertainment system head unit as claimed in any one of claims 1 to 9.