A thin film that combines thermal conductivity, thermal insulation, and electromagnetic shielding
By using a thin film that combines thermal conductivity, thermal insulation, and electromagnetic shielding in electronic devices, the problems of poor heat dissipation and electromagnetic radiation during high-load operation of electronic devices are solved, achieving heat dissipation and electromagnetic shielding, extending device life and improving user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- IBIH ADVANCED MATERIAL (HENAN) CO LTD
- Filing Date
- 2025-05-21
- Publication Date
- 2026-05-26
AI Technical Summary
Mobile phones and other electronic devices suffer from poor heat dissipation and electromagnetic radiation that is harmful to human health when operating under high load, affecting user experience and device lifespan.
The system employs films that combine thermal conductivity, thermal insulation, and electromagnetic shielding, including high thermal conductivity films, phase change films, and thermal insulation and electromagnetic shielding films. The high thermal conductivity film conducts heat, the phase change film absorbs and stores heat, and the thermal insulation and electromagnetic shielding film shields electromagnetic radiation. The three are stacked together to form a composite structure.
It effectively solves the heat dissipation problem of electronic devices, extends device life, reduces the impact of electromagnetic radiation on the human body, improves user experience and safety, and the thin film structure is lightweight and flexible.
Smart Images
Figure CN224290424U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of functional composite film technology and is applied to electronic components of electronic devices such as mobile phones and wearable devices. Specifically, it relates to a thin film that combines thermal conductivity, thermal insulation, and electromagnetic shielding. Background Technology
[0002] Overheating of electronic devices such as mobile phones and wearable devices has long been a major problem for users, affecting user experience, posing personal safety hazards, and shortening device lifespan. The main reasons for overheating of mobile phones and other electronic devices under high load include:
[0003] (1) High processor load: When running high-load applications such as large games and video editing software, the processor needs to process a large amount of data, which causes transistors to switch on and off rapidly, generating a lot of heat;
[0004] (2) Battery issues: Batteries generate heat during charging and discharging. Using non-original chargers or aging batteries will exacerbate the heat generation.
[0005] (3) Software operation: Some applications have code vulnerabilities, which will consume a lot of resources when running in the background, resulting in high CPU load;
[0006] (4) Background programs: Running multiple background programs at the same time will occupy system resources, causing the processor to work continuously and generate heat.
[0007] Furthermore, as wireless integrated electronic devices, mobile phones and other electronic devices need to transmit and receive radio electromagnetic waves to and from base stations. Due to prolonged close contact with these devices, some of these electromagnetic waves are absorbed by human tissues. The electromagnetic interference, leakage, and pollution caused by these electromagnetic waves all have certain impacts on environmental safety and human health.
[0008] In view of the above, this utility model is hereby proposed. Utility Model Content
[0009] The purpose of this invention is to address the shortcomings of existing technologies by providing a thin film that combines thermal conductivity, thermal insulation, and electromagnetic shielding. This film can effectively solve the problem of poor heat dissipation in electronic devices such as mobile phones under high load, while also reducing the impact of electromagnetic radiation on users.
[0010] In order to achieve the above-mentioned objectives of this utility model, the following technical solution is adopted:
[0011] A thin film that combines thermal conductivity, thermal insulation, and electromagnetic shielding includes a high thermal conductivity film, a phase change film, and a thermal insulation and electromagnetic shielding film, wherein the high thermal conductivity film and the thermal insulation and electromagnetic shielding film are respectively disposed on both sides of the phase change film.
[0012] Furthermore, the thickness of the high thermal conductivity film is 0.01–0.5 mm; the thickness of the phase change film is 0.1–1 mm; and the thickness of the thermal insulation electromagnetic shielding film is 0.05–1.5 mm.
[0013] Furthermore, the high thermal conductivity film includes a thermally conductive film and a thermally conductive coating, wherein the thermally conductive coating is applied to the side of the thermally conductive film close to the phase change film.
[0014] Furthermore, the thermally conductive coating is a boron nitride coating, preferably a vapor-deposited nanoscale boron nitride coating, and the thickness of the thermally conductive coating is 8–20 μm.
[0015] Furthermore, a 0.01-0.03 mm thick polymer film is encapsulated around the phase change film. The high thermal conductivity film and the thermal insulation electromagnetic shielding film are respectively bonded to both sides of the encapsulated phase change film with thermally conductive adhesive, forming a three-layer structure.
[0016] Furthermore, the high thermal conductivity film, the phase change film, and the thermal insulation electromagnetic shielding film are stacked to form a three-layer composite layer, and the outer periphery of the three-layer composite layer is encapsulated with a polymer film material with a thickness of 0.01 to 0.03 mm.
[0017] Furthermore, the phase change film and the thermal insulation electromagnetic shielding film are stacked to form a double-layer composite stack, and a 0.01-0.03 mm thick polymer film is encapsulated on the outer periphery of the double-layer composite stack. The high thermal conductivity film is bonded to one side of the encapsulated double-layer composite stack by thermally conductive adhesive.
[0018] Furthermore, the surface of the high thermal conductivity film is coated with a U-shaped adhesive frame, the phase change film is a hydrogel film, the hydrogel film is coated on the surface of the high thermal conductivity film inside the U-shaped adhesive frame, and the thermal insulation electromagnetic shielding film is adhered to the surface of the high thermal conductivity film through the U-shaped adhesive frame.
[0019] Furthermore, the thermally conductive film is one of copper foil, aluminum foil, or graphene film, with copper foil being preferred.
[0020] Furthermore, the phase change film is a hydrogel film doped with paraffin-based microcapsules.
[0021] Furthermore, the hydrogel film doped with paraffin microcapsules is one of two types: a hydrogel film doped with paraffin@silicon oxide micro / nanocapsules or a hydrogel film doped with paraffin@melamine resin micro / nanocapsules. The phase transition temperature of paraffin is 37–52°C, and the doping amount of phase transition powder micro / nanocapsules accounts for 10–40 wt% of the mass of the hydrogel film.
[0022] Furthermore, the phase change film is a carbon aerogel film or a metal film composite organic phase change material.
[0023] Furthermore, the metal thin film composite organic phase change material is a metal thin film composite organic phase change material with a nano / micro porosity structure. The metal thin film is a copper-based microporous metal film or a nickel-based microporous metal film, preferably a copper-based microporous metal film. The nano / micro porosity structure preferably has internal micro-pores and an outer surface with a nano-pore structure. The organic phase change material is selected from materials with a phase change temperature of 30 to 50°C.
[0024] Furthermore, the heat-insulating electromagnetic shielding film is a foamed material film doped with a light-shielding agent and aerogel.
[0025] Furthermore, the doped opacifier is one of carbon black, silicon carbide, titanium dioxide, zirconium oxide, or potassium hexatitanate whiskers, with a D50 particle size of 0.2–5 μm; the doped aerogel is one of silica aerogel, alumina aerogel, or carbon aerogel, with a D50 particle size of 0.1–30 μm; and the foaming material is foamed flame-retardant silicone rubber or ceramizable foamed silicone rubber.
[0026] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0027] 1. This utility model is a thin film that combines thermal conductivity, thermal insulation, and electromagnetic shielding. By using a high thermal conductivity film to avoid heat accumulation and utilizing a phase change film to quickly absorb the heat from the high thermal conductivity film, combined with a thermal insulation and electromagnetic shielding film, it can effectively solve the problem of poor heat dissipation of electronic devices such as mobile phones under high load, extend the service life of electronic devices, and reduce the impact of electromagnetic radiation on users.
[0028] 2. The high thermal conductivity film of this invention can quickly conduct heat through high thermal conductivity materials. The thermal conductivity film has high thermal conductivity, and the boron nitride coating can not only conduct heat, but also has good electrical insulation and low dielectric properties, which improves safety.
[0029] 3. The phase change film of this invention utilizes the characteristics of phase change materials to absorb and store heat, avoid local overheating, maintain stable internal temperature of electronic devices such as mobile phones, improve temperature uniformity, and avoid temperature fluctuations; the self-healing property of the hydrogel film extends the service life of the film and will not cause a decrease in phase change temperature control performance due to factors such as bumps.
[0030] 4. This utility model utilizes a heat-insulating electromagnetic shielding film, designed with heat-insulating materials and a porous structure, to isolate heat conduction while shielding electromagnetic radiation, improving user experience and ensuring personal safety. The porous structure of the foamed material film, while possessing excellent heat insulation and high-temperature resistance, also provides multiple reflection / scattering interfaces for electromagnetic waves, significantly extending the propagation path of electromagnetic waves, effectively attenuating electromagnetic waves, reducing electromagnetic radiation leakage, and exhibiting superior electromagnetic shielding effectiveness.
[0031] 5. The film of this utility model, which combines thermal conductivity, thermal insulation, and electromagnetic shielding, is lighter, thinner, and more flexible while ensuring performance. The entire film product can be completely folded without material breakage. Attached Figure Description
[0032] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0033] Figure 1 This is a schematic diagram of the thin film structure of this utility model that combines thermal conductivity, thermal insulation, and electromagnetic shielding.
[0034] Figure 2 Appendix to this utility model Figure 1 Enlarged view of a portion of point A in the middle;
[0035] Figure 3 This is a diagram of the thin film assembly structure of Embodiment 3 of this utility model, which combines thermal conductivity, thermal insulation, and electromagnetic shielding.
[0036] Figure 4 This is a diagram of the thin film assembly structure of Embodiment 4 of the present invention, which combines thermal conductivity, thermal insulation, and electromagnetic shielding.
[0037] Figure 5 This is a diagram of the thin film assembly structure of Embodiment 5 of the present invention, which combines thermal conductivity, thermal insulation, and electromagnetic shielding.
[0038] Figure 6 This is a schematic diagram of the structure of the phase change film coated on the surface of the high thermal conductivity film in Embodiment 6 of this utility model;
[0039] Figure 7 This is a diagram of the thin film assembly structure of Embodiment 6 of this utility model, which combines thermal conductivity, thermal insulation, and electromagnetic shielding.
[0040] Figure label:
[0041] 1-High thermal conductivity thin film;
[0042] 101 - Thermally conductive thin film; 102 - Thermally conductive coating;
[0043] 2-Phase change thin films;
[0044] 3-Heat-insulating electromagnetic shielding film;
[0045] 4-Polymer membrane materials;
[0046] 5- Thermal conductive adhesive;
[0047] 6-Ring Glue Box. Detailed Implementation
[0048] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of this utility model, but not all embodiments, and are only used to illustrate this utility model, and should not be regarded as limiting the scope of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.
[0049] Example 1
[0050] A thin film that combines thermal conductivity, thermal insulation, and electromagnetic shielding, such as Figure 1 As shown, it includes a high thermal conductivity film 1, a phase change film 2, and a thermal insulation electromagnetic shielding film 3, with the high thermal conductivity film 1 and the thermal insulation electromagnetic shielding film 3 respectively disposed on both sides of the phase change film 2.
[0051] The thickness of the high thermal conductivity film 1 is 0.01 to 0.5 mm, including but not limited to 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, and 0.5 mm.
[0052] The phase change film 2 has a thickness of 0.1 to 1 mm, including but not limited to 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, and 1 mm.
[0053] The thickness of the heat-insulating electromagnetic shielding film 3 is 0.05 to 1.5 mm, including but not limited to 0.05 mm, 0.06 mm, 0.08 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, and 1.5 mm.
[0054] Example 2
[0055] The difference between this embodiment and Embodiment 1 is that: Figure 2 As shown, the high thermal conductivity film 1 includes a thermally conductive film 101 and a thermally conductive coating 102, with the thermally conductive coating 102 applied to the side of the thermally conductive film 101 close to the phase change film 2.
[0056] The thermally conductive film 101 is one of copper foil, aluminum foil, or graphene film, with copper foil being preferred.
[0057] The thermally conductive coating 102 has a thickness of 8–20 μm, including but not limited to 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, and 20 μm. Because boron nitride has a hexagonal layered structure similar to graphene, the thermally conductive coating 102 not only conducts heat but also has good electrical insulation and low dielectric properties.
[0058] Optionally, the thermally conductive coating 102 is a boron nitride coating, preferably a vapor-deposited nanoscale boron nitride coating.
[0059] Example 3
[0060] The difference between this embodiment and Embodiment 1 is that: Figure 3 As shown, a polymer film 4 is encapsulated around the phase change film 2. A high thermal conductivity film 1 and a thermally insulating electromagnetic shielding film 3 are respectively bonded to both sides of the encapsulated phase change film 2 by thermally conductive adhesive 5, forming a three-layer structure.
[0061] The thickness of the polymer membrane 4 is 0.01 to 0.03 mm, including but not limited to 0.01 mm, 0.02 mm, and 0.03 mm.
[0062] Example 4
[0063] The difference between this embodiment and Embodiment 1 is that: Figure 4 As shown, a high thermal conductivity film 1, a phase change film 2, and a thermal insulation electromagnetic shielding film 3 are stacked to form a three-layer composite layer, and a polymer film material 4 is encapsulated around the three-layer composite layer.
[0064] The thickness of the polymer membrane 4 is 0.01 to 0.03 mm, including but not limited to 0.01 mm, 0.02 mm, and 0.03 mm.
[0065] Example 5
[0066] The difference between this embodiment and Embodiment 1 is that: Figure 5 As shown, the phase change film 2 and the thermal insulation electromagnetic shielding film 3 are superimposed to form a double-layer composite stack. The outer periphery of the double-layer composite stack is encapsulated with a polymer film 4, and the high thermal conductivity film 1 is bonded to one side of the encapsulated double-layer composite stack by thermally conductive adhesive 5.
[0067] The thickness of the polymer membrane 4 is 0.01 to 0.03 mm, including but not limited to 0.01 mm, 0.02 mm, and 0.03 mm.
[0068] Example 6
[0069] The difference between this embodiment and Embodiment 1 is that: Figure 6 and Figure 7As shown, the surface of the high thermal conductivity film 1 is coated with a U-shaped adhesive frame 6. The phase change film 2 is a hydrogel film, which is coated on the surface of the high thermal conductivity film 1 inside the U-shaped adhesive frame 6. The thermal insulation electromagnetic shielding film 3 is adhered to the surface of the high thermal conductivity film 1 through the U-shaped adhesive frame 6. When the film product is under pressure, the U-shaped adhesive frame 6 can prevent the hydrogel from overflowing and can also seal the moisture in the hydrogel.
[0070] The phase change film 2 is a hydrogel film. The flexible hydrogel film is placed between the high thermal conductivity film 1 and the thermal insulation electromagnetic shielding film 3 to further improve the flexibility and bendability of the overall film product and avoid material deformation and breakage when bent.
[0071] Example 7
[0072] The difference between this embodiment and embodiment 1 is that the phase change film 2 is a hydrogel film doped with paraffin microcapsules, the hydrogel film serves as a self-healing carrier, and the phase change powder serves as the main body for temperature control.
[0073] Optionally, the hydrogel film doped with paraffin microcapsules is either a hydrogel film doped with paraffin@silicon oxide micro / nanocapsules or a hydrogel film doped with paraffin@melamine resin micro / nanocapsules, with a paraffin phase transition temperature of 37–52°C and the doping amount of phase transition powder micro / nanocapsules accounting for 10–40 wt% of the mass of the hydrogel film.
[0074] Example 8
[0075] The difference between this embodiment and embodiment 1 is that the phase change film 2 is a carbon aerogel film or a metal film composite organic phase change material.
[0076] Optionally, the metal thin film composite organic phase change material is a nano / micro porous structure metal thin film composite organic phase change material, and the organic phase change material is selected from materials with a phase change temperature of 30 to 50°C.
[0077] The metal thin film is a copper-based microporous metal film or a nickel-based microporous metal film, preferably a copper-based microporous metal film.
[0078] The preferred nano / micro pore structure is one where the internal micro pores are nano pores and the outer surface is a nano pore structure.
[0079] Nano / micro porosity structures include three types: nanostructures, microstructures, and structures with internal micro-pores and an outer nano-pore structure. The latter, where the internal micro-pores have an outer nano-pore structure, allows for a larger filling capacity of phase change material compared to nanostructures, while also preventing leakage of the phase change material during solid-liquid transitions.
[0080] The composite method for metal thin film-organic phase change materials is solution impregnation.
[0081] Example 9
[0082] The difference between this embodiment and Embodiment 1 is that the heat-insulating electromagnetic shielding film 3 is a foamed material film doped with a light-shielding agent and aerogel, with a thermal conductivity ≤0.03W / mK.
[0083] Optionally, the foaming material is directly mixed with the opacifier powder or aerogel powder, wherein the opacifier powder accounts for 5-15 wt% of the total mass and the aerogel powder accounts for 3-10 wt% of the total mass.
[0084] Optionally, the doped opacifier is one of carbon black, silicon carbide, titanium dioxide, zirconium oxide, or potassium hexatitanate whiskers, with a D50 particle size of 0.2–5 μm.
[0085] Optionally, the doped aerogel is one of silica aerogel, alumina aerogel, or carbon aerogel, with a D50 particle size of 0.1–30 μm.
[0086] Optionally, the foaming material is foamed flame-retardant silicone rubber or ceramizable foamed silicone rubber. Ceramizable foamed silicone rubber can form a porous ceramic body at temperatures above 400°C, while still maintaining high temperature resistance and high thermal insulation.
Claims
1. A thin film that combines thermal conductivity, thermal insulation, and electromagnetic shielding, characterized in that, It includes a high thermal conductivity film (1), a phase change film (2) and a thermally insulating electromagnetic shielding film (3), wherein the high thermal conductivity film (1) and the thermally insulating electromagnetic shielding film (3) are respectively disposed on both sides of the phase change film (2).
2. The thin film with thermal conductivity, thermal insulation, and electromagnetic shielding properties according to claim 1, characterized in that, The high thermal conductivity film (1) has a thickness of 0.01 to 0.5 mm; the phase change film (2) has a thickness of 0.1 to 1 mm; and the thermal insulation electromagnetic shielding film (3) has a thickness of 0.05 to 1.5 mm.
3. The thin film combining thermal conductivity, thermal insulation, and electromagnetic shielding according to claim 1 or 2, characterized in that, The high thermal conductivity film (1) includes a thermally conductive film (101) and a thermally conductive coating (102), wherein the thermally conductive coating (102) is coated on the side of the thermally conductive film (101) close to the phase change film.
4. The thin film with thermal conductivity, thermal insulation, and electromagnetic shielding properties according to claim 3, characterized in that, The thermally conductive coating (102) is a boron nitride coating, and the thickness of the thermally conductive coating (102) is 8 to 20 μm.
5. The thin film combining thermal conductivity, thermal insulation, and electromagnetic shielding according to claim 1 or 2, characterized in that, The phase change film (2) is encapsulated with a 0.01-0.03 mm thick polymer film (4) on its outer periphery. The high thermal conductivity film (1) and the thermal insulation electromagnetic shielding film (3) are respectively bonded to both sides of the encapsulated phase change film by thermally conductive adhesive (5) to form a three-layer structure.
6. The thin film combining thermal conductivity, thermal insulation, and electromagnetic shielding according to claim 1 or 2, characterized in that, The high thermal conductivity film (1), the phase change film (2) and the thermal insulation electromagnetic shielding film (3) are stacked to form a three-layer composite stack, and a 0.01-0.03 mm thick polymer film material (4) is encapsulated on the outer periphery of the three-layer composite stack.
7. The thin film combining thermal conductivity, thermal insulation, and electromagnetic shielding according to claim 1 or 2, characterized in that, The phase change film (2) and the thermal insulation electromagnetic shielding film (3) are stacked to form a double-layer composite stack. The outer periphery of the double-layer composite stack is encapsulated with a 0.01-0.03 mm thick polymer film (4). The high thermal conductivity film (1) is bonded to one side of the encapsulated double-layer composite stack by thermally conductive adhesive (5).
8. The thin film combining thermal conductivity, thermal insulation, and electromagnetic shielding according to claim 1 or 2, characterized in that, The surface of the high thermal conductivity film (1) is coated with a U-shaped adhesive frame (6), the phase change film (2) is a hydrogel film, the hydrogel film is coated on the surface of the high thermal conductivity film (1) inside the U-shaped adhesive frame (6), and the heat-insulating electromagnetic shielding film (3) is adhered to the surface of the high thermal conductivity film (1) through the U-shaped adhesive frame (6).
9. The thin film with thermal conductivity, thermal insulation, and electromagnetic shielding as described in claim 3, characterized in that, The thermally conductive film (101) is one of copper foil, aluminum foil, or graphene film.
10. The thin film combining thermal conductivity, thermal insulation, and electromagnetic shielding according to claim 1 or 2, characterized in that, The phase change film (2) is a type of hydrogel film, carbon aerogel film, or metal film composite organic phase change material doped with paraffin microcapsules.
11. The thin film combining thermal conductivity, thermal insulation, and electromagnetic shielding according to claim 1 or 2, characterized in that, The heat-insulating electromagnetic shielding film (3) is a foamed material film doped with light-shielding agents and aerogel.
12. The thin film with thermal conductivity, thermal insulation, and electromagnetic shielding properties according to claim 11, characterized in that, The doped opacifier is one of carbon black, silicon carbide, titanium dioxide, zirconium oxide, or potassium hexatitanate whiskers; the doped aerogel is one of silica aerogel, alumina aerogel, or carbon aerogel; and the foaming material is foamed flame-retardant silicone rubber or ceramizable foamed silicone rubber.