A package chip test fixture

Abstract

The utility model relates to test fixture technical field, and disclose a kind of packaging chip test fixture, including work support platform, the top surface of the work support platform is fixedly connected with the clamping drive cylinder of equidistance distribution, the inside of the clamping drive cylinder is provided with clamping drive assembly, the top surface of the work support platform is fixedly connected with top support plate, the top surface of the top support plate is provided with four square clamping assembly, the top surface of the top support plate is provided with cambered surface clamping assembly, the top surface of the work support platform is provided with lifting support assembly, the utility model is cooperated between four square clamping assembly and cambered surface clamping assembly, so that it is comprehensively fixed clamping to packaging chip, it is comprehensively clamped and fixed to packaging chip by the cooperation between elastic clamping arc plate and buffer clamping plate, to improve the stability of chip clamping, to facilitate subsequent test to packaging chip.

Description

Technical Field

[0001] This utility model relates to the field of test fixture technology, specifically a packaged chip test fixture. Background Technology

[0002] With the continuous development of electronic chip technology, the testing technology of packaged chips has become an important key technology in the electronics industry to ensure product quality and accelerate the production process. Generally, packaged electronic chips need to undergo electrical testing at a preset high temperature to understand the stability of the packaged chips.

[0003] During chip testing, the chip usually needs to be clamped. Most existing clamping tools move a set of clamping blocks by using a threaded rod. However, this clamping method usually involves two sets of clamping blocks moving in opposite directions to complete the clamping, which results in a small contact area between the clamping blocks and the chip. Therefore, the clamping stability is poor for some chips with a certain curvature, which needs to be improved. To this end, we propose a packaged chip testing fixture. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a chip packaging test fixture, which solves the aforementioned problems.

[0006] (II) Technical Solution

[0007] To achieve the above-mentioned objectives, this utility model provides the following technical solution:

[0008] A chip packaging test fixture includes a work support platform. The top surface of the work support platform is fixedly connected to equidistantly distributed clamping drive cylinders. Clamping drive assemblies are disposed inside the clamping drive cylinders. A top support plate is fixedly connected to the top surface of the work support platform. A four-sided clamping assembly is disposed on the top surface of the top support plate. An arc-shaped clamping assembly is disposed on the top surface of the top support plate. A lifting support assembly is disposed on the top surface of the work support platform.

[0009] Preferably, the top surface of the working support platform is fixedly connected to equidistantly distributed top support platforms, the top surface of the working support platform is fixedly connected to equidistantly distributed guide slides, and a bottom square groove is formed in the center of the top surface of the working support platform.

[0010] Preferably, the clamping drive assembly includes a clamping drive cylinder and a drive slide column. The drive slide column is slidably connected to the inner side of the clamping drive cylinder, and a clamping movable slider is fixedly connected to the right side of the drive slide column.

[0011] Preferably, a top support plate is fixedly connected to the top of the top support platform, and a top sliding groove penetrating the bottom is formed on the top surface of the top support plate. The four-way clamping assembly includes a clamping movable slider and a buffer clamping plate. A fixed connection groove is formed on the bottom left side of the clamping movable slider, and a driving slide column is fixedly connected to the inner side of the fixed connection groove. A buffer clamping plate is fixedly connected to the right side of the clamping movable slider. The clamping movable slider is slidably connected to the inner side of the top sliding groove. The top surface of the working support platform is slidably connected to the bottom of the clamping movable slider, and the clamping movable slider is slidably connected to the inner side of the guide slide.

[0012] Preferably, the arc-shaped clamping assembly includes an arc-shaped support plate, an arc-shaped damping spring, an arc-shaped damping slide plate, and an elastic clamping arc plate. The arc-shaped support plate is fixedly connected to the top right side of the clamping movable slider. Equally spaced damping guide sleeves are fixedly connected to the right side of the arc-shaped support plate. An arc-shaped damping spring is fixedly connected to the right side of the arc-shaped support plate. An arc-shaped damping slide plate is fixedly connected to the right side of the arc-shaped damping spring. Equally spaced damping guide posts are fixedly connected to the left side of the arc-shaped damping slide plate. Damping guide posts are slidably connected to the inner side of the damping guide sleeves. An elastic clamping arc plate is fixedly connected to the right side of the arc-shaped damping slide plate.

[0013] Preferably, the lifting support assembly includes a lifting drive cylinder, a lifting drive slide rod, and a top clamping support plate. The lifting drive cylinder is fixedly connected to the inner side of the bottom square groove, the lifting drive slide rod is slidably connected to the inner top of the lifting drive cylinder, and the top clamping support plate is fixedly connected to the top surface of the lifting drive slide rod.

[0014] (III) Beneficial Effects

[0015] Compared with the prior art, the advantages of this utility model are:

[0016] This utility model utilizes the cooperation between the four-sided clamping component and the curved surface clamping component to achieve comprehensive fixation of the packaged chip. The cooperation between the elastic clamping curved plate and the buffer clamping plate further secures the packaged chip, thereby improving the stability of chip clamping and facilitating subsequent testing of the packaged chip. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram showing the overall structure of this utility model disassembled;

[0019] Figure 3 This is a cross-sectional view of the overall structure of this utility model;

[0020] Figure 4This is a cross-sectional schematic diagram of the arc-shaped clamping component in part of the structure of this utility model.

[0021] In the diagram: 1. Working support platform; 2. Clamping drive cylinder; 3. Clamping moving slider; 4. Buffer clamping plate; 5. Top support plate; 6. Curved support plate; 7. Curved shock-absorbing spring; 8. Curved shock-absorbing slide plate; 9. Elastic clamping curved plate; 10. Top support platform; 11. Guide slide; 12. Drive slide column; 13. Fixed connection groove; 14. Lifting drive cylinder; 15. Lifting drive slide rod; 16. Top clamping support plate; 17. Top slide groove; 18. Bottom square groove; 19. Shock-absorbing guide sleeve; 20. Shock-absorbing guide column. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a technical solution;

[0024] A chip packaging test fixture includes a work support platform 1, with equidistantly distributed clamping drive cylinders 2 fixedly connected to the top surface of the work support platform 1, clamping drive components disposed inside the clamping drive cylinders 2, a top support plate 5 fixedly connected to the top surface of the work support platform 1, a square clamping component disposed on the top surface of the top support plate 5, an arc-shaped clamping component disposed on the top surface of the top support plate 5, and a lifting support component disposed on the top surface of the work support platform 1.

[0025] Furthermore, the top surface of the working support platform 1 is fixedly connected with equidistantly distributed top support platforms 10, and the top surface of the working support platform 1 is fixedly connected with equidistantly distributed guide slides 11. A bottom square groove 18 is opened in the middle of the top surface of the working support platform 1.

[0026] Furthermore, the clamping drive assembly includes a clamping drive cylinder 2 and a drive slide column 12. The drive slide column 12 is slidably connected to the inner side of the clamping drive cylinder 2, and a clamping movable slider 3 is fixedly connected to the right side of the drive slide column 12. Through the action of the clamping drive assembly, power is provided to the clamping movable slider to complete the clamping.

[0027] Furthermore, a top support plate 5 is fixedly connected to the top of the top support platform 10. A top sliding groove 17 penetrating the bottom is opened on the top surface of the top support plate 5. The four-way clamping assembly includes a clamping movable slider 3 and a buffer clamping plate 4. A fixed connection groove 13 is opened on the bottom left side of the clamping movable slider 3. A drive sliding column 12 is fixedly connected to the inner side of the fixed connection groove 13. A buffer clamping plate 4 is fixedly connected to the right side of the clamping movable slider 3. The clamping movable slider 3 is slidably connected to the inner side of the top sliding groove 17. The top surface of the working support platform 1 is slidably connected to the bottom of the clamping movable slider 3. The clamping movable slider 3 is slidably connected to the inner side of the guide slide 11. Through the action of the four-way clamping assembly, the chip is initially clamped from four directions. At the same time, the buffer clamping plate 4 can provide a certain buffer protection for the chip to prevent damage to the chip during the clamping process.

[0028] Furthermore, the curved surface clamping assembly includes a curved surface support plate 6, a curved surface damping spring 7, a curved surface damping slide plate 8, and an elastic clamping curved plate 9. The curved surface support plate 6 is fixedly connected to the top right side of the clamping movable slider 3. The right side of the curved surface support plate 6 is fixedly connected to equidistantly distributed damping guide sleeves 19. The right side of the curved surface support plate 6 is fixedly connected to the curved surface damping spring 7. The right side of the curved surface damping spring 7 is fixedly connected to the curved surface damping slide plate 8. The left side of the curved surface damping slide plate 8 is fixedly connected to equidistantly distributed damping guide posts 20. The damping guide posts 20 are slidably connected to the inner side of the damping guide sleeves 19. The right side of the curved surface damping slide plate 8 is fixedly connected to the elastic clamping curved plate 9. Through the action of the curved surface clamping assembly, after the four-sided clamping assembly initially clamps the chip, the elastic clamping curved plate 9 moves closer to the chip from the curved surface direction of the chip, cooperating with the buffer clamping plate 4 to fully and tightly clamp the chip. The elastic properties of the arc-shaped shock-absorbing spring 7 and the elastic clamping arc plate 9 can adapt to different curvatures and sizes of the chip, ensuring that uniform and stable pressure is applied to the chip during clamping, effectively improving the stability of chip clamping and preventing the chip from shifting during testing.

[0029] Furthermore, the lifting support assembly includes a lifting drive cylinder 14, a lifting drive slide rod 15, and a top clamping support plate 16. The lifting drive cylinder 14 is fixedly connected to the inner side of the bottom square groove 18, and the lifting drive slide rod 15 is slidably connected to the top inner side of the lifting drive cylinder 14. The top clamping support plate 16 is fixedly connected to the top surface of the lifting drive slide rod 15. Through the action of the lifting support assembly, before clamping the packaged chip for testing, the lifting drive cylinder 14 works to raise the top clamping support plate 16 to a suitable position, providing bottom support for the chip and ensuring that the chip is in a stable state during clamping, which facilitates subsequent testing operations.

[0030] Working principle: The clamping drive cylinder 2 is activated, pushing the drive slide column 12 to slide inside it. Since the right side of the drive slide column 12 is fixedly connected to the clamping movable slider 3, and the bottom left side of the clamping movable slider 3 is fixed to the drive slide column 12 via the fixed connection groove 13, the drive slide column 12 drives the clamping movable slider 3 to move. Simultaneously, the bottom of the clamping movable slider 3 is slidably connected to the top surface of the work support table 1, and it slides inside the guide slide table 11. This sliding connection method ensures that the clamping movable slider 3 can only move smoothly along the set direction without deviation or shaking. As the clamping movable slider 3 moves, the buffer clamping plate 4 fixedly connected to its right side also moves accordingly. Simultaneously, multiple clamping drive cylinders 2 work together, causing the buffer clamping plates 4 in relative positions to move in opposite directions, initially clamping the chip from four directions. The buffer clamping plates 4 provide a certain degree of buffer protection for the chip, preventing damage during clamping. While clamping in four directions, the clamping moving slider 3 moves, and the arc-shaped support plate 6 fixedly connected to its right top also moves. The arc-shaped shock-absorbing spring 7 and the shock-absorbing guide sleeve 19 fixedly connected to the right side of the arc-shaped support plate 6 move together. The right side of the arc-shaped shock-absorbing spring 7 is connected to the arc-shaped shock-absorbing slide plate 8, and the shock-absorbing guide post 20 fixed to the left side of the arc-shaped shock-absorbing slide plate 8 slides inside the shock-absorbing guide sleeve 19. The structure allows the curved surface damping slide plate 8 to move relatively stably along the direction of the damping guide post 20 when subjected to external forces. Simultaneously, the curved surface damping spring 7 acts as a buffer and damper. The elastic clamping arc plate 9, fixed to the right side of the curved surface damping slide plate 8, moves together with the slide plate 8. After the four-way clamping assembly initially clamps the chip, the elastic clamping arc plate 9 moves further closer to the chip from the curved surface direction, cooperating with the buffer clamping plate 4 to provide comprehensive and tight clamping of the chip. The elastic characteristics of the curved surface damping spring 7 and the elastic clamping arc plate 9 can adapt to different curvatures and sizes of the chip, ensuring uniform and stable pressure is applied to the chip during clamping, effectively improving… To ensure chip clamping stability and prevent chip displacement during testing, a comprehensive chip clamping process is achieved. After clamping, the lifting drive cylinder 14 is activated, and the lifting drive slide 15, which is slidably connected to its top inner side, moves up and down under the action of the cylinder. The top surface of the lifting drive slide 15 is fixedly connected to the top surface clamping support plate 16, which rises and falls with the lifting drive slide 15. Before clamping and testing the packaged chip, the lifting drive cylinder 14 raises the top surface clamping support plate 16 to a suitable position, providing bottom support for the chip and ensuring that the chip remains stable during clamping, facilitating subsequent testing operations.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip packaging test fixture, comprising a work support stage (1), characterized in that: The top surface of the work support platform (1) is fixedly connected with equidistantly distributed clamping drive cylinders (2), and the inner side of the clamping drive cylinders (2) is provided with clamping drive components. The top surface of the work support platform (1) is fixedly connected with a top support plate (5), and the top surface of the top support plate (5) is provided with a square clamping component. The top surface of the top support plate (5) is provided with an arc-shaped clamping component. The top surface of the work support platform (1) is provided with a lifting support component.

2. The packaged chip test fixture according to claim 1, characterized in that: The top surface of the working support platform (1) is fixedly connected with equidistantly distributed top support platforms (10), and the top surface of the working support platform (1) is fixedly connected with equidistantly distributed guide slides (11). A bottom square groove (18) is opened in the middle of the top surface of the working support platform (1).

3. The packaged chip test fixture according to claim 1, characterized in that: The clamping drive assembly includes a clamping drive cylinder (2) and a drive slide column (12). The drive slide column (12) is slidably connected to the inner side of the clamping drive cylinder (2), and a clamping moving slider (3) is fixedly connected to the right side of the drive slide column (12).

4. A packaged chip test fixture according to claim 2, characterized in that: The top of the top support platform (10) is fixedly connected to a top support plate (5). The top surface of the top support plate (5) is provided with a top sliding groove (17) that runs through the bottom. The four-sided clamping assembly includes a clamping movable slider (3) and a buffer clamping plate (4). The bottom left side of the clamping movable slider (3) is provided with a fixed connection groove (13). The inner side of the fixed connection groove (13) is fixedly connected to a driving slide column (12). The right side of the clamping movable slider (3) is fixedly connected to a buffer clamping plate (4). The inner side of the top sliding groove (17) is slidably connected to the clamping movable slider (3). The top surface of the working support platform (1) is slidably connected to the bottom of the clamping movable slider (3). The inner side of the guide slide (11) is slidably connected to the clamping movable slider (3).

5. A packaged chip test fixture according to claim 4, characterized in that: The arc-shaped clamping assembly includes an arc-shaped support plate (6), an arc-shaped damping spring (7), an arc-shaped damping slide plate (8), and an elastic clamping arc plate (9). The right top of the clamping sliding block (3) is fixedly connected to the arc-shaped support plate (6). The right side of the arc-shaped support plate (6) is fixedly connected to equidistantly distributed damping guide sleeves (19). The right side of the arc-shaped support plate (6) is fixedly connected to the arc-shaped damping spring (7). The right side of the arc-shaped damping spring (7) is fixedly connected to the arc-shaped damping slide plate (8). The left side of the arc-shaped damping slide plate (8) is fixedly connected to equidistantly distributed damping guide columns (20). The inner side of the damping guide sleeve (19) is slidably connected to the damping guide column (20). The right side of the arc-shaped damping slide plate (8) is fixedly connected to the elastic clamping arc plate (9).

6. A packaged chip test fixture according to claim 2, characterized in that: The lifting support assembly includes a lifting drive cylinder (14), a lifting drive slide rod (15), and a top clamping support plate (16). The lifting drive cylinder (14) is fixedly connected to the inner side of the bottom square groove (18). The lifting drive slide rod (15) is slidably connected to the inner top of the lifting drive cylinder (14). The top surface of the lifting drive slide rod (15) is fixedly connected to the top surface clamping support plate (16).

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