A cooling liquid circulating device for cutting silicon wafers

Abstract

The utility model discloses a cooling liquid circulating device for silicon wafer cutting, including processing box, the cutting assembly is installed on the inside wall upper end of processing box, the side wall of processing box is connected with the supporting plate, is installed with drive mechanism on the supporting plate, is installed with filter mechanism on drive mechanism and processing box, the outside of processing box is connected with cooling mechanism, when moving back, the filter plate will move to the storage box, and the scraper will clean the upper end surface of filter plate, and the impurity falls to the inclined plate below the push plate, realizes the effect of delaying filter plate blockage, reduces the frequency of filter plate cleaning replacement, and the impurity is pushed to the bottom end of the inclined plate by the push plate, realizes the accumulation of the impurity, simultaneously, when pushing back, the connecting plate will push the waste liquid filtered below the filter plate, and the filtered waste liquid is pushed into the drain pipe, and then flows into the cooling box, realizes the effect of collecting and cooling of the filtered waste liquid.

Description

Technical Field

[0001] This utility model relates to the field of cooling devices, and in particular to a coolant circulation device for silicon wafer cutting. Background Technology

[0002] Silicon, comprising 25.8% of the Earth's crust, provides an inexhaustible source for silicon production. As one of the most abundant elements in the Earth's crust, silicon's abundance is one of the reasons it has become a primary material in photovoltaics, particularly for products like solar cells destined for large-scale market entry.

[0003] Modern silicon wafer dicing equipment typically includes a dicing component and a cooling component. The cooling component sprays coolant onto the dicing component to cool it down. The sprayed coolant then falls into a collection tank located below the dicing component for collection and filtration before entering the cooling component. Conventional filters typically use screens to filter the waste liquid, preventing impurities from entering the cooling component. However, this can easily clog the screens, increasing the frequency of maintenance and cleaning. Therefore, a coolant circulation device for silicon wafer dicing is needed to reduce the frequency of screen cleaning. Utility Model Content

[0004] The purpose of this invention is to provide a cooling fluid circulation device for silicon wafer cutting, which overcomes the defect that the filter screen is easily clogged.

[0005] The technical solution to achieve the above objective is: a cooling liquid circulation device for silicon wafer cutting, comprising a processing tank, a cutting assembly installed on the upper end of the inner side wall of the processing tank, a support plate connected to the side wall of the processing tank, a driving mechanism installed on the support plate, a filtering mechanism installed on the driving mechanism and the processing tank, and a cooling mechanism connected to the outer side of the processing tank.

[0006] The filtration mechanism includes an inclined plate, a pusher plate, a filter plate, a perforation, a storage box, a scraper, and a drain pipe. The inclined plate is connected to the bottom inner end of the processing box. A perforation is opened on one side wall of the processing box. A drain pipe is also connected and communicated on one side wall of the processing box. A storage box is connected to the outer side wall of the processing box. Two arrayed scrapers are connected to the inner side wall of the processing box. The side wall of the filter plate is movably connected to the perforation. The planar side wall of the pusher plate is connected to the filter plate.

[0007] Preferably, the perforation is parallel to the top inclined surface of the inclined plate, the side wall of the filter plate is parallel to the top inclined surface of the inclined plate, the bottom end of the push plate is movably attached to the top inclined surface of the inclined plate, the push plate is triangular prism in shape, the inclined side wall of the push plate is parallel to one side wall of the treatment box, and the pipe is located above the top of the inclined plate.

[0008] Preferably, one end opening of the storage box is aligned and connected with the perforation, one end of the filter plate is located inside the storage box, and the side wall of the filter plate moves through the perforation.

[0009] Preferably, the two scrapers are distributed parallel to each other along the top inclined surface of the inclined plate, with one of the scrapers located above the perforation, and the bottom sidewall of the scraper is in contact with the top of the filter plate.

[0010] Preferably, the side wall of the processing box is movably connected to a first sealing door, and the top side wall of the storage box is rotatably connected to a second sealing door.

[0011] Preferably, the driving mechanism includes a hydraulic cylinder, a driving rod, and a connecting plate. The top end of the support plate is connected to the hydraulic cylinder. A through hole is provided on the side wall of the processing box. The side wall of the driving rod passes through the through hole. A sealing ring is fitted at the connection between the driving rod and the through hole. One end of the driving rod is connected to the connecting plate. The side wall of the connecting plate away from the driving rod is connected to the push plate. The top end of the connecting plate is connected to the filter plate. The bottom end of the connecting plate is movably attached to the top inclined surface of the inclined plate. The bottom ends of the push plate and the connecting plate are both distributed parallel to the top inclined surface of the inclined plate. The driving rod is distributed parallel to the top inclined surface of the inclined plate.

[0012] Preferably, the cooling mechanism includes a cooling tank, cooling pipes, a water pump, connecting pipes, branch pipes, and nozzles. The bottom end of the connecting pipes is connected to and communicates with the cooling tank. Multiple cooling pipes are connected to the side wall of the cooling tank. A water pump is connected to the side wall of the cooling tank. The output end of the water pump is connected to a connecting pipe. The top opening of the connecting pipe is connected to a branch pipe. The bottom end of the branch pipe is connected to and communicates with a nozzle.

[0013] Preferably, the top of the processing box is connected to a bracket, the side wall of the bracket is connected to a connecting pipe, the nozzle is located above the cutting assembly, the spray range of the multiple nozzles can cover the cutting assembly, and the cooling pipe is made of a heat-conducting metal pipe.

[0014] The beneficial effects of this utility model are:

[0015] 1) After the waste liquid is filtered by the filter plate, it flows to the inclined plate below the filter plate. Impurities are filtered onto the upper wall of the filter plate. The drive mechanism is activated, causing the connecting plate to move the push plate and filter plate back and forth. The push plate pushes down and squeezes the waste liquid located at the bottom of the inclined plate, allowing the waste liquid to flow along the push plate to the top of the filter plate. The waste liquid that initially falls onto the inclined plate is then filtered. Then, as the filter plate moves backward, it moves into the collection box. The scraper cleans the upper surface of the filter plate, causing impurities to fall onto the inclined plate below the push plate. This delays filter plate clogging and reduces the frequency of filter plate cleaning and replacement. Impurities are then pushed by the push plate to the bottom of the inclined plate for accumulation and collection. At the same time, as the connecting plate moves backward, it pushes the filtered waste liquid located below the filter plate into the drain pipe, which then flows into the cooling box, achieving the effect of collecting and cooling the filtered waste liquid.

[0016] 2) After the filtered waste liquid flows into the cooling tank, the cooling water flows into the cooling pipe, so that the cooling pipe can absorb the heat of the waste liquid in the cooling tank and cool down the waste liquid in the cooling tank. The water pump is started to pump the filtered waste liquid into the connecting pipe and flow into the branch pipe, and finally spray it onto the cutting component from the nozzle, so as to achieve the effect of recycling the coolant. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0018] Figure 2 This is a cross-sectional bottom view of the structure of this utility model;

[0019] Figure 3 This is a cross-sectional top view of the structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the cross-sectional structure of the storage box of this utility model;

[0021] Figure 5 This is a schematic diagram of the nozzle structure of this utility model.

[0022] Icon labels:

[0023] 1. Processing box; 2. Cutting assembly; 3. Support plate; 4. Drive mechanism; 401. Hydraulic cylinder; 402. Drive rod; 403. Connecting plate; 5. Filtration mechanism; 501. Inclined plate; 502. Push plate; 503. Filter plate; 504. Perforation; 505. Storage box; 506. Scraper; 507. Pipeline; 6. Cooling mechanism; 601. Cooling box; 602. Cooling pipe; 603. Water pump; 604. Connecting pipe; 605. Branch pipe; 606. Nozzle; 7. First sealing door; 8. Bracket; 9. Second sealing door. Detailed Implementation

[0024] The technical solution of this utility model will now be clearly and completely described in conjunction with the accompanying drawings. In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] The present invention will be further described below with reference to the accompanying drawings.

[0026] Reference Appendix Figure 1-5 A cooling fluid circulation device for silicon wafer cutting includes a processing tank 1, a cutting assembly 2 installed on the upper end of the inner side wall of the processing tank 1, a support plate 3 connected to the side wall of the processing tank 1, a drive mechanism 4 installed on the support plate 3, a filter mechanism 5 installed on the drive mechanism 4 and the processing tank 1, a cooling mechanism 6 connected to the outer side of the processing tank 1, a first sealing door 7 movably connected to the side wall of the processing tank 1, and a second sealing door 9 rotatably connected to the top side wall of the storage box 505, which can facilitate cleaning of the inside of the storage box 505.

[0027] The filtration mechanism 5 includes an inclined plate 501, a pusher plate 502, a filter plate 503, a perforation 504, a storage box 505, a scraper 506, and a drain pipe 507. The inclined plate 501 is connected to the inner bottom of the processing box 1. A perforation 504 is provided on one side wall of the processing box 1. A drain pipe 507 is also connected to and communicates with one side wall of the processing box 1. The storage box 505 is connected to the outer side wall of the processing box 1. Two arrayed scrapers 506 are connected to the inner side wall of the processing box 1. The side wall of the filter plate 503 is movably connected to the perforation 504. The flat side wall of the pusher plate 502 is connected to the filter plate 503. The perforation 504 is parallel to the inclined surface at the top of the inclined plate 501. The side wall of the filter plate 503 is parallel to the inclined plate 501. The top inclined surface of 01 is parallel, the bottom end of the push plate 502 is in contact with the top inclined surface of the inclined plate 501, the shape of the push plate 502 is triangular prism, the side wall of the inclined surface of the push plate 502 is parallel to one side wall of the processing box 1, the pipe 507 is located above the top of the inclined plate 501, one end opening of the storage box 505 is aligned and connected with the perforation 504, one end of the filter plate 503 is located inside the storage box 505, the side wall of the filter plate 503 moves through the perforation 504, two scrapers 506 are distributed parallel to the top inclined surface of the inclined plate 501, one of the scrapers 506 is located above the perforation 504, and the bottom side wall of the scraper 506 is in contact with the top of the filter plate 503.

[0028] Nozzle 606 sprays coolant onto the surface of cutting assembly 2, cooling it. The cooled waste liquid flows onto filter plate 503 and inclined plate 501. After being filtered by filter plate 503, the waste liquid flows to inclined plate 501 below filter plate 503. Impurities are filtered onto the upper sidewall of filter plate 503. Drive mechanism 4 is activated, causing connecting plate 403 to move push plate 502 and filter plate 503 back and forth. Push plate 502 pushes downwards, squeezing the waste liquid at the bottom of inclined plate 501, allowing it to flow along push plate 502 to the top of filter plate 503. This filters the waste liquid initially falling onto inclined plate 501. Then, filter plate 506... 03 When moving backward, the filter plate 503 moves into the collection box 505. The scraper 506 scrapes the upper surface of the filter plate 503, causing impurities to fall onto the inclined plate 501 below the push plate 502, thus delaying the clogging of the filter plate 503 and reducing the frequency of cleaning and replacement of the filter plate 503. The impurities are then pushed by the push plate 502 to the bottom of the inclined plate 501, achieving accumulation and collection of impurities. At the same time, when the connecting plate 403 is pushed backward, it pushes the filtered waste liquid located below the filter plate 503, causing the filtered waste liquid to enter the drain pipe 507 and then flow into the cooling box 601, achieving the effect of collecting and cooling the filtered waste liquid.

[0029] Reference Appendix Figure 1 and attached Figure 4 The drive mechanism 4 includes a hydraulic cylinder 401, a drive rod 402, and a connecting plate 403. The top of the support plate 3 is connected to the hydraulic cylinder 401. The side wall of the processing box 1 has a through hole. The side wall of the drive rod 402 passes through the through hole. A sealing ring is fitted at the connection between the drive rod 402 and the through hole. One end of the drive rod 402 is connected to the connecting plate 403. The side wall of the connecting plate 403 away from the drive rod 402 is connected to the push plate 502. The top of the connecting plate 403 is connected to the filter plate 503. The bottom end of the connecting plate 403 is in contact with the top inclined surface of the inclined plate 501. The bottom ends of the push plate 502 and the connecting plate 403 are both parallel to the top inclined surface of the inclined plate 501. The drive rod 402 is parallel to the top inclined surface of the inclined plate 501.

[0030] Start the hydraulic cylinder 401. The hydraulic cylinder 401 drives the drive rod 402 to move back and forth, so that the drive rod 402 is flush with the top inclined surface of the inclined plate 501, and the drive rod 402 drives the connecting plate 403 to move back and forth along the top inclined surface of the inclined plate 501.

[0031] Reference Appendix Figure 1-5The cooling mechanism 6 includes a cooling tank 601, cooling pipes 602, a water pump 603, a connecting pipe 604, a branch pipe 605, and a nozzle 606. The bottom end of the exhaust pipe 507 is connected to and communicates with the cooling tank 601. Multiple cooling pipes 602 are connected to the side wall of the cooling tank 601. The water pump 603 is connected to the side wall of the cooling tank 601. The output end of the water pump 603 is connected to the connecting pipe 604. The top opening of the connecting pipe 604 is connected to the branch pipe 605. The bottom end of 605 is connected to and communicates with a nozzle 606. The top of the processing box 1 is connected to a bracket 8. The side wall of the bracket 8 is connected to a connecting pipe 604. The nozzle 606 is located above the cutting assembly 2. The spray range of multiple nozzles 606 can cover the cutting assembly 2. The cooling pipe 602 is made of heat-conducting metal pipe. The cooling pipe 602 passes through the cooling box 601, and the circulating cooling water flows to the cooling pipe 602. One end of the connecting pipe 604 passes through the side wall of the cooling box 601.

[0032] After the filtered waste liquid flows into the cooling tank 601, the cooling water flows into the cooling pipe 602, so that the cooling pipe 602 can absorb the heat of the waste liquid in the cooling tank 601 and cool down the waste liquid in the cooling tank 601. The water pump 603 is started to pump the filtered waste liquid into the connecting pipe 604 and flow into the branch pipe 605. Finally, it is sprayed from the nozzle 606 onto the cutting assembly 2, realizing the effect of recycling the coolant.

[0033] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A cooling liquid circulating device for cutting silicon wafers, comprising a processing box (1), a cutting assembly (2) being installed on the upper end of the inner side wall of the processing box (1), characterized in that, The side wall of the processing box (1) is connected to a support plate (3), a drive mechanism (4) is installed on the support plate (3), a filter mechanism (5) is installed on the drive mechanism (4) and the processing box (1), and a cooling mechanism (6) is connected to the outside of the processing box (1). The filtration mechanism (5) includes an inclined plate (501), a pusher plate (502), a filter plate (503), a perforation (504), a storage box (505), a scraper (506), and a drain pipe (507). The inner bottom of the processing box (1) is connected to the inclined plate (501). A perforation (504) is provided on one side wall of the processing box (1). A drain pipe (507) is also connected and communicated on one side wall of the processing box (1). A storage box (505) is connected to the outer side wall of the processing box (1). Two arrayed scrapers (506) are connected to the inner side wall of the processing box (1). The side wall of the filter plate (503) is movably connected to the perforation (504). The planar side wall of the pusher plate (502) is connected to the filter plate (503).

2. The cooling liquid circulating device for cutting a silicon wafer according to claim 1, wherein The perforation (504) is parallel to the top inclined surface of the inclined plate (501), the side wall of the filter plate (503) is parallel to the top inclined surface of the inclined plate (501), the bottom end of the push plate (502) is in contact with the top inclined surface of the inclined plate (501), the shape of the push plate (502) is a triangular prism, the inclined side wall of the push plate (502) is parallel to one side wall of the treatment box (1), and the pipe (507) is located above the top of the inclined plate (501).

3. The cooling liquid circulating device for cutting a silicon wafer according to claim 1, wherein One end of the storage box (505) is aligned and connected with the perforation (504), and one end of the filter plate (503) is located inside the storage box (505). The side wall of the filter plate (503) moves through the perforation (504).

4. The cooling liquid circulating device for cutting a silicon wafer according to claim 3, wherein The two scrapers (506) are distributed in parallel along the top inclined surface of the inclined plate (501), with one of the scrapers (506) located above the perforation (504), and the bottom sidewall of the scraper (506) is in contact with the top of the filter plate (503).

5. The cooling liquid circulating device for cutting a silicon wafer according to claim 1, wherein The processing box (1) is movably connected to a first sealing door (7) on its side wall, and the storage box (505) is rotatably connected to a second sealing door (9) on its top side wall.

6. The cooling fluid circulation device for silicon wafer cutting according to claim 1, characterized in that, The driving mechanism (4) includes a hydraulic cylinder (401), a driving rod (402), and a connecting plate (403). The top of the support plate (3) is connected to the hydraulic cylinder (401). The side wall of the processing box (1) has a through hole. The side wall of the driving rod (402) passes through the through hole. A sealing ring is fitted at the connection between the driving rod (402) and the through hole. One end of the driving rod (402) is connected to the connecting plate (403). The side wall away from the drive rod (402) is connected to the push plate (502). The top of the connecting plate (403) is connected to the filter plate (503). The bottom of the connecting plate (403) is in contact with the top inclined surface of the inclined plate (501). The bottom of the push plate (502) and the bottom of the connecting plate (403) are both parallel to the top inclined surface of the inclined plate (501). The drive rod (402) is parallel to the top inclined surface of the inclined plate (501).

7. A cooling fluid circulation device for silicon wafer cutting according to claim 1, characterized in that, The cooling mechanism (6) includes a cooling box (601), cooling pipes (602), a water pump (603), a connecting pipe (604), a branch pipe (605), and a nozzle (606). The bottom end of the drain pipe (507) is connected to and communicates with the cooling box (601). Multiple cooling pipes (602) are connected to the side wall of the cooling box (601). A water pump (603) is connected to the side wall of the cooling box (601). The output end of the water pump (603) is connected to the connecting pipe (604). The top opening of the connecting pipe (604) is connected to the branch pipe (605). The bottom end of the branch pipe (605) is connected to and communicates with the nozzle (606).

8. A cooling fluid circulation device for silicon wafer cutting according to claim 7, characterized in that, The top of the processing box (1) is connected to a bracket (8), the side wall of the bracket (8) is connected to a connecting pipe (604), the nozzle (606) is located above the cutting assembly (2), and the spraying range of multiple nozzles (606) can cover the cutting assembly (2). The cooling pipe (602) is made of heat-conducting metal pipe.

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