Uncooled infrared detection pixel, chip, movement and device

By employing an interconnection structure of a first connector and a copper connector in an uncooled infrared detection device, the problem of poor process consistency in hollow columnar structures was solved, achieving stable connection and high-yield production of infrared detection chips.

CN224416250UActive Publication Date: 2026-06-26BEIJING NORTH GAOYE TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
BEIJING NORTH GAOYE TECH CO LTD
Filing Date
2025-06-23
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

In existing uncooled infrared detection equipment, the hollow columnar interconnect structure has poor process consistency, unstable noise, uneven contact resistance, difficulty in achieving small-size pixel design, and differences during mass production, resulting in low chip yield and high cost.

Method used

An interconnection structure including a first connecting part, a first copper connecting part, and a second copper connecting part is adopted. The second copper connecting part is located on the side of the beam structure facing the readout circuit. The beam structure is on a flat plane, realizing a stable connection between the readout circuit and the infrared sensing structure.

Benefits of technology

It improves the stability of the interconnect structure fabrication process, avoids noise instability and poor electrical contact, ensures small uniformity of contact resistance, realizes smaller pixel design and consistency of infrared detection chip, and supports efficient and low-cost mass production.

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Abstract

The present disclosure relates to the technical field of infrared detection, and particularly relates to a non-cooled infrared detection pixel, a chip, a movement and equipment, the non-cooled infrared detection pixel comprising a readout circuit, an infrared sensing structure and one or more first interconnection structures connecting the readout circuit and the infrared sensing structure; the first interconnection structure comprises a first connecting part, a first copper connecting part and a second copper connecting part, two ends of the first copper connecting part are connected with the first connecting part and the second copper connecting part respectively, the first connecting part is connected with the readout circuit, and the second copper connecting part is connected with a beam structure of the infrared sensing structure; wherein at least the second copper connecting part is located on a side of the beam structure facing the readout circuit, and the beam structure is in a flat plane, so that the interconnection structure can solve the problem of unstable noise caused by the interconnection of the infrared detection chip, and can improve the process stability.
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Citation Information

Patent Citations

  • CN113659027B