An external heat dissipation device for optical storage products

Abstract

The utility model relates to a kind of external heat dissipation device for light storage product, including fin, fin is connected with heat dissipation substrate, and multiple fixing holes and multiple placement grooves are equipped on heat dissipation substrate;Heat dissipation substrate edge is equipped with sealing groove;Sealing groove is installed with sealing rubber strip.By the device, heat dissipation substrate is fixed to product using screw, and double-fixed mode of sealing groove and sealing rubber strip is used, and it is convenient, stable to install and fix;It is convenient and stable to install: the fixing hole of the radiator of reasonable layout, so that the installation process of radiator on equipment is simple and easy to operate, and it is firm and reliable after installation, and can adapt to the installation needs of different types of equipment;Sealing rubber strip is placed in radiator sealing groove, and radiator is fixed in the corresponding position of product shell using screw through radiator surface mounting hole, the installation of radiator is completed, so that it is put into use for equipment heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology and provides an external heat dissipation device for optical storage products. Background Technology

[0002] During the transmission and use of electrical energy, integrated photovoltaic and energy storage systems require the conversion or regulation of parameters such as voltage and current. During operation, power devices generate a significant amount of heat. For example, in photovoltaic and energy storage inverters, if heat dissipation is not timely and effective, the internal temperature of the equipment will become excessively high, affecting its performance and reliability, and shortening its lifespan.

[0003] The existing installation and fixing methods are not convenient or stable enough, which affects the actual user experience. Utility Model Content

[0004] To achieve the above objectives, the technical solution of this utility model is as follows:

[0005] This utility model provides an external heat dissipation device for optical storage products, including fins, on which a heat dissipation substrate is connected, and the heat dissipation substrate is provided with multiple fixing holes and multiple placement slots.

[0006] The heat dissipation substrate has a sealing groove on its edge.

[0007] As a further improvement, the placement slot includes a temperature sensor placement slot and an alumina ceramic sheet placement slot; the temperature sensor placement slot is equipped with a temperature sensor; and the alumina ceramic sheet placement slot is equipped with an alumina ceramic sheet coated with thermally conductive silicone grease.

[0008] As a further improvement, the thickness of the heat dissipation substrate is 8 mm.

[0009] As a further improvement, the fins are multiple.

[0010] As a further improvement, the height of the fin is 69 mm; the thickness of the fin is 1.5 mm.

[0011] As a further improvement, the center-to-center spacing of the fins is 9.5 mm.

[0012] As a further improvement, the sealing groove is composed of multiple rectangular rings with different inner diameters.

[0013] As a further improvement, a sealing strip is installed inside the sealing groove.

[0014] As a further improvement, a temperature sensor is installed in the temperature sensor placement slot.

[0015] As a further improvement, the alumina ceramic sheet placement groove is equipped with an alumina ceramic sheet coated with thermally conductive silicone grease.

[0016] The above-mentioned technical solution of this utility model has the following beneficial effects:

[0017] This device uses screws to fix the heat sink substrate to the product, employing a dual fixing method of sealing grooves and sealing strips, making installation convenient and stable. The rationally arranged heat sink mounting holes simplify the installation process, ensuring a secure and reliable finish, adaptable to the installation needs of various types of photovoltaic-storage inverters. Sealing strips are placed in the heat sink's sealing grooves, and screws are used through the mounting holes on the heat sink surface to fix it to the corresponding position on the product housing, completing the heat sink installation and enabling it to dissipate heat for the equipment. The upper surface of the heat sink substrate has multiple rectangular alumina ceramic plate placement slots, which can be used to install heat-generating electronic components, ensuring close contact between the heat source and the heat sink for easy heat conduction. The layout of the alumina ceramic plate placement slots evenly distributes heat, preventing localized overheating. The upper surface of the heat sink substrate also has multiple rectangular temperature sensor placement slots for installing temperature sensors. The bottom of the heat sink features a dense fin structure with a specific shape and spacing design, increasing the heat dissipation area while optimizing airflow paths and improving convection heat dissipation efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an external heat dissipation device for a photovoltaic storage product according to the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of the fin of this utility model. Detailed Implementation

[0020] The following embodiments further illustrate the content of this utility model, but should not be construed as limiting the utility model. Any modifications or substitutions made to the methods, steps, or conditions of this utility model without departing from its spirit and essence are within the scope of this utility model.

[0021] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings and examples.

[0022] Please see Figures 1 to 2 As shown, the present invention discloses an external heat dissipation device for optical storage products, including fins 6, a heat dissipation substrate 7 connected to the fins 6, and a plurality of fixing holes 2 and a plurality of placement slots on the heat dissipation substrate 7.

[0023] The heat dissipation substrate 7 has a sealing groove 3 on its edge.

[0024] For example, the heat sink features an integrated rectangular design; the heat sink substrate has sealing grooves around its perimeter; the heat sink is placed outside the product housing for natural cooling; the upper surface of the heat sink substrate has multiple rectangular slots for mounting heat-generating electronic components (IGBTs), ensuring close contact between the heat source and the heat sink for efficient heat conduction. The optimized layout of the slots evenly distributes heat, preventing localized overheating. Multiple rectangular slots on the upper surface of the heat sink substrate are used to mount temperature sensors, collecting heat sink temperature data and transmitting it to the main control board. Mounting holes are distributed along the edges of the upper surface of the heat sink substrate, allowing the heat sink to be secured from within the product using screws or other connectors (e.g., fixing an external heat sink device inside the photovoltaic-storage inverter using screws through the mounting holes along the upper surface of the heat sink substrate). The heat sink is mounted outside the product housing, eliminating the need for separate adhesive application and meeting the product's IP65 waterproof rating.

[0025] In some embodiments of this utility model, the placement groove includes a temperature sensor placement groove 4 and an alumina ceramic sheet placement groove 5; the temperature sensor placement groove 4 is equipped with a temperature sensor; and the alumina ceramic sheet placement groove 5 is equipped with an alumina ceramic sheet coated with thermally conductive silicone grease.

[0026] In some embodiments of this utility model, the thickness of the heat dissipation substrate 7 is 8 mm.

[0027] In some embodiments of this utility model, there are multiple fins 6. The multiple fins 6 have a total fin height of 69mm, a thickness of 1.5mm, and a center-to-center distance of 9.5mm.

[0028] In some embodiments of this utility model, the height of the fin 6 is 69 mm; the thickness of the fin 6 is 1.5 mm.

[0029] In some embodiments of this utility model, the center-to-center spacing of the fins 6 is 9.5 mm.

[0030] For example, the bottom of the radiator is equipped with a dense fin structure. The fins are designed with specific shapes and spacing to increase the heat dissipation area while optimizing the airflow path and improving the convective heat dissipation efficiency.

[0031] In some embodiments of this utility model, the sealing groove 3 is composed of multiple rectangular rings with different inner diameters.

[0032] This invention features highly efficient heat dissipation: the unique placement slot and fin structure design effectively improves heat conduction and convection heat dissipation efficiency, quickly dissipating the heat generated by electronic components into the surrounding environment, maintaining the equipment within a suitable operating temperature range, and enhancing equipment performance and stability. It also offers convenient and stable installation: the rationally arranged mounting holes make the heat sink easy and reliable to install on the equipment, adapting to the installation needs of different types of equipment.

[0033] In some embodiments of this utility model, a sealing strip is installed in the sealing groove 3.

[0034] In some embodiments of this utility model, a temperature sensor is installed in the temperature sensor placement slot 4.

[0035] In some embodiments of this utility model, the alumina ceramic sheet placement groove 5 is equipped with an alumina ceramic sheet coated with thermally conductive silicone grease.

[0036] In this invention, the material selection is as follows: the main body of the heat sink is made of a metal material with good thermal conductivity, such as aluminum alloy or copper alloy, to ensure rapid heat conduction. The fins can be processed using sheet metal of appropriate thickness according to cost and heat dissipation requirements.

[0037] In this invention, the processing and manufacturing typically utilizes a specialized tooth-shaving machine. This machine possesses a high-precision transmission system, tool mounting and adjustment devices, and can precisely control key parameters such as the depth, spacing, and angle of the teeth, ensuring that the processed tooth profile meets the requirements of the radiator's heat dissipation performance and overall quality.

[0038] In this invention, installation and use are as follows: During installation, the power electronic device (IGBT) and the alumina ceramic plate are placed in the rectangular placement groove on the upper surface of the heat sink. The ceramic plate is positioned to insulate between the power semiconductor device and the heat sink. An appropriate amount of thermally conductive silicone grease is applied to the front and back of the ceramic plate to enhance heat conduction. An adhesive strip is placed in the heat sink's sealing groove. Screws are used to fix the heat sink to the corresponding position on the product housing through the mounting holes on the heat sink surface, completing the heat sink installation and enabling it to be used for equipment heat dissipation.

[0039] exist Figure 1 The device includes an AL1060 heatsink body 1, mounting holes 2, a heatsink sealing groove 3, a temperature sensor placement groove 4, and an alumina ceramic plate placement groove 5. The bottom also includes fins 6 and a heat dissipation substrate 7. The alumina ceramic plate placement groove 5 has multiple... Figure 1 There are two rows of holes in the upper left corner, each with multiple mounting holes 2 (heat sink mounting holes). There are four temperature sensor placement slots 4, each also with mounting holes 2. The mounting holes 2 are used to secure the device with bolts. The mounting holes 2 are threaded holes.

[0040] In summary, this device uses screws to fix the heat sink substrate to the product, employing a dual fixing method of sealing grooves and sealing strips, making installation convenient and stable. The rationally arranged heat sink mounting holes simplify the installation process, ensuring a secure and reliable finish, adaptable to various equipment types. Sealing strips are placed in the heat sink's sealing grooves, and screws are used through the mounting holes on the heat sink surface to fix it to the corresponding position on the product housing, completing the heat sink installation and enabling it to dissipate heat for the equipment. The upper surface of the heat sink substrate has multiple rectangular alumina ceramic plate placement slots, which can be used to install heat-generating electronic components, ensuring close contact between the heat source and the heat sink for easy heat conduction. The layout of the alumina ceramic plate placement slots evenly distributes heat, preventing localized overheating. The upper surface of the heat sink substrate also has multiple rectangular temperature sensor placement slots for installing temperature sensors. The bottom of the heat sink features a dense fin structure with a specific shape and spacing design, increasing the heat dissipation area while optimizing airflow paths and improving convection heat dissipation efficiency.

[0041] The above-described embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made by those skilled in the art to the technical solutions of the present utility model without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. An external heat dissipation device for optical storage products, comprising fins (6), wherein a heat dissipation substrate (7) is connected to the fins (6), characterized in that, The heat dissipation substrate (7) is provided with multiple fixing holes (2) and multiple placement slots; The heat dissipation substrate (7) has a sealing groove (3) at its edge; A sealing strip is installed inside the sealing groove (3).

2. An external heat dissipation device for photovoltaic storage products according to claim 1, characterized in that, The placement slots include a temperature sensor placement slot (4) and an alumina ceramic sheet placement slot (5).

3. An external heat dissipation device for photovoltaic storage products according to claim 1, characterized in that, The thickness of the heat dissipation substrate (7) is 8 mm.

4. An external heat dissipation device for photovoltaic storage products according to claim 1, characterized in that, The fins (6) are multiple.

5. An external heat dissipation device for photovoltaic storage products according to claim 4, characterized in that, The height of the fin (6) is 69 mm; the thickness of the fin (6) is 1.5 mm.

6. An external heat dissipation device for a photovoltaic storage product according to claim 4, characterized in that, The center-to-center spacing of the fins (6) is 9.5 mm.

7. An external heat dissipation device for photovoltaic storage products according to claim 1, characterized in that, The sealing groove (3) is composed of multiple rectangular rings with different inner diameters.

8. An external heat dissipation device for photovoltaic storage products according to claim 2, characterized in that, The temperature sensor is installed in the temperature sensor placement slot (4).

9. An external heat dissipation device for photovoltaic storage products according to claim 2, characterized in that, The alumina ceramic sheet placement groove (5) is equipped with an alumina ceramic sheet coated with thermal grease.

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