Mounting structure for improving heat dissipation of diode

Abstract

The utility model discloses an installation structure of improving diode heat conduction, including the mounting panel, is equipped with a plurality of insertion hole to be opened on the mounting panel, and the insertion hole all has and inserts the light emitting diode, and the light emitting diode bottom is provided with the heat conduction pad, and the mounting panel inside is provided with the fixed mechanism, and the mounting panel lower surface is provided with the insulating layer, and the insulating layer lower surface is provided with the heat conduction plate, and the heat conduction plate lower surface is equipped with the heat dissipation subassembly, and the heat conduction plate lower surface is provided with a plurality of convex strips, and the heat dissipation subassembly top is equipped with a plurality of recesses, and the convex strip is inserted in the recess. The utility model discloses through setting up the heat conduction pad, and the heat conduction pad penetrates the insulating layer and directly sticks with the heat conduction plate, and constructs the short path heat conduction channel from diode chip to the heat conduction plate, and the thermal resistance is reduced greatly, and sets up the fixed mechanism, and rotates the screw rod and can realize two -way clamping or loosening simultaneously, and the elastic rubber pad of clamping surface and arc recess can avoid diode shell damage, and can fill the gap through elastic deformation, and ensure the stability of holding.

Description

Technical Field

[0001] This utility model relates to the field of diode thermal conductivity technology, and specifically to an installation structure for improving the thermal conductivity of diodes. Background Technology

[0002] In the fields of lighting, display, and electronic equipment, light-emitting diodes (LEDs) are widely used due to their advantages such as low energy consumption, long lifespan, and fast response speed. However, LEDs generate a lot of heat during operation. If the heat cannot be dissipated in time, it will cause the junction temperature to rise, leading to problems such as accelerated light decay, color drift, and even burnout, which seriously affects the performance and lifespan of the LEDs.

[0003] Traditional mounting structures often use insulating materials (such as ordinary ceramics and plastics) with low thermal conductivity, resulting in significant heat loss during transfer and inefficient heat conduction from the LED chip to the heat dissipation components. Furthermore, interfacial thermal resistance exists between the insulating layer and the metal heat-conducting plate, causing significant heat attenuation during multi-layered interface transfer. Therefore, there is an urgent need to design a mounting structure that improves the thermal conductivity of the diode to address these issues. Utility Model Content

[0004] The purpose of this invention is to provide a mounting structure that improves the thermal conductivity of diodes, thereby addressing the aforementioned shortcomings in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A mounting structure for improving diode thermal conductivity includes a mounting plate with a plurality of insertion holes, each containing a light-emitting diode (LED). A thermal pad is positioned at the bottom of each LED. A fixing mechanism is located inside the mounting plate. An insulating layer is provided on the lower surface of the mounting plate, and a heat-conducting plate is positioned on the lower surface of the insulating layer. A heat dissipation assembly is positioned on the lower surface of the heat-conducting plate, with a plurality of protrusions on the lower surface of the heat-conducting plate. A plurality of grooves are formed on the top of the heat dissipation assembly, and the protrusions are inserted into the grooves.

[0007] In a preferred embodiment of this utility model, the fixing mechanism includes a sliding groove formed in the mounting plate, wherein a first claw and a second claw are slidably disposed in the sliding groove, the first claw and the second claw are respectively located on both sides of the light-emitting diode, and the tail of the first claw and the second claw are provided with threaded holes, and a screw is threaded into the threaded holes.

[0008] In a preferred embodiment of this utility model, the bottom of the light-emitting diode is provided with a pin, and the mounting plate is provided with a conductive line inside, the conductive line being in contact with the pin.

[0009] In a preferred embodiment of this utility model, a plurality of heat dissipation fins are provided on the bottom surface of the heat dissipation component, and the heat dissipation fins are arc-shaped.

[0010] In a preferred embodiment of this utility model, one end of the screw passes through the mounting plate and extends to the outside, and a knob is fixedly connected to the extended end of the screw.

[0011] In a preferred embodiment of this utility model, the clamping surfaces of both the first and second jaws are provided with elastic rubber pads, and the surface of the rubber pads is provided with arc-shaped grooves adapted to the housing of the light-emitting diode. The thread direction in the threaded hole at the tail of the first jaw is right-hand helix, and the thread direction in the threaded hole at the tail of the second jaw is left-hand helix.

[0012] In a preferred embodiment of this utility model, the heat-conducting plate is made of oxygen-free copper plate, and a thermally conductive gel is coated between the upper surface of the heat-conducting plate and the insulating layer.

[0013] In a preferred embodiment of this utility model, the thermal pad penetrates the insulating layer and is attached to the top surface of the thermal plate.

[0014] In the above technical solution, the mounting structure for improving diode thermal conductivity provided by this utility model has the following beneficial effects:

[0015] (1) By setting up a thermal pad, the thermal pad penetrates the insulating layer and is directly attached to the thermal plate, thus creating a short-path heat conduction channel from the diode chip to the thermal plate, which greatly reduces thermal resistance.

[0016] (2) By setting a fixing mechanism, the bidirectional clamping of the first and second jaws, combined with the reverse spiral design of the threaded holes at the tails of the two, can achieve bidirectional clamping or loosening simultaneously by rotating the screw. The elastic rubber pad and arc groove on the clamping surface can not only prevent damage to the diode shell, but also fill the gap through elastic deformation to ensure the stability of the clamping.

[0017] (3) By setting up a heat-conducting plate and heat dissipation components, heat can be quickly transferred to the heat dissipation components and dissipated quickly through heat dissipation fins. The arc-shaped heat dissipation fins increase the heat dissipation area. Combined with the large-area contact between the heat dissipation components and the heat-conducting plate, heat can be quickly dispersed to the fins, further improving the overall efficiency of the heat dissipation system. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1This is a perspective view of a mounting plate structure provided for an embodiment of the mounting structure for improving the thermal conductivity of a diode according to the present invention.

[0020] Figure 2 This is a perspective view of the fixing mechanism structure provided in an embodiment of the mounting structure for improving the thermal conductivity of a diode according to the present invention.

[0021] Figure 3 This is a cross-sectional view of the mounting plate structure provided in an embodiment of the mounting structure for improving the thermal conductivity of a diode according to the present invention.

[0022] Figure 4 This is a bottom view of a heat dissipation assembly structure provided in an embodiment of the mounting structure for improving the thermal conductivity of a diode according to this utility model.

[0023] Figure 5 This is an exploded view of the mounting plate structure provided in an embodiment of the mounting structure for improving the thermal conductivity of a diode according to this utility model.

[0024] 1. Mounting plate; 11. Socket; 2. Light-emitting diode; 21. Pin; 3. Fixing mechanism; 31. Claw 1; 32. Claw 2; 33. Screw; 34. Sliding groove; 4. Heat dissipation assembly; 41. Heat dissipation fins; 42. Groove; 5. Heat-conducting plate; 51. Raised strip; 6. Conductive circuit; 7. Insulating layer; 8. Thermal pad. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0026] like Figure 1-5 As shown in the figure, the present invention provides an installation structure for improving the heat conduction of diodes, including a mounting plate 1. The mounting plate 1 has a plurality of insertion holes 11, and each insertion hole 11 is used to insert a light-emitting diode 2. A heat-conducting pad 8 is provided at the bottom of the light-emitting diode 2. A fixing mechanism 3 is provided inside the mounting plate 1. An insulating layer 7 is provided on the lower surface of the mounting plate 1. A heat-conducting plate 5 is provided on the lower surface of the insulating layer 7. A heat dissipation component 4 is provided on the lower surface of the heat-conducting plate 5. A plurality of protrusions 51 are provided on the lower surface of the heat-conducting plate 5. A plurality of grooves 42 are provided on the top of the heat dissipation component 4, and the protrusions 51 are inserted into the grooves 42.

[0027] In this embodiment, the mounting plate 1 is made of a high-temperature resistant insulating material, such as an epoxy resin board. It can not only provide a stable mounting base for the light-emitting diode 2, but also prevent the conductive line 6 from short-circuiting with the external structure. The mounting plate 1 has several insertion holes 11 arranged in a matrix to ensure that multiple diodes do not interfere with each other when working at the same time, and also to reserve enough space for heat dissipation. Light-emitting diodes 2 are inserted into each insertion hole 11. A thermal pad 8 is provided at the bottom of the light-emitting diode 2. The thermal pad 8 is made of high thermal conductivity silicone material, which has good flexibility and thermal conductivity.

[0028] Specifically, an insulating layer 7 is provided on the lower surface of the mounting plate 1. The insulating layer 7 is made of aluminum nitride ceramic material, which not only has excellent insulation performance but also has a high thermal conductivity. While achieving electrical isolation between the mounting plate 1 and the heat-conducting plate 5, it can also assist in the transfer of some heat, further improving the heat dissipation efficiency of the overall structure. A heat-conducting plate 5 is provided on the lower surface of the insulating layer 7. The heat-conducting plate 5 is made of oxygen-free copper plate. A heat dissipation component 4 is provided on the lower surface of the heat-conducting plate 5. Several protrusions 51 are provided on the lower surface of the heat-conducting plate 5. Several grooves 42 are opened on the top of the heat dissipation component 4. The protrusions 51 are inserted into the grooves 42. The protrusions 51 and the grooves 42 are interference fit. This design increases the contact area between the two and improves the heat dissipation efficiency.

[0029] In this embodiment, the fixing mechanism 3 includes a sliding groove 34 opened in the mounting plate 1. The inner wall of the sliding groove 34 is precision machined to ensure that the first claw 31 and the second claw 32 slide smoothly in the groove and reduce frictional resistance. The first claw 31 and the second claw 32 are slidably arranged in the sliding groove 34 respectively. The first claw 31 and the second claw 32 are made of high-strength alloy material and have good elasticity and wear resistance. The first claw 31 and the second claw 32 are located on both sides of the light-emitting diode 2 respectively. The tail of the first claw 31 and the second claw 32 are provided with threaded holes, and the screw 33 is threaded in the threaded holes.

[0030] In this embodiment, the bottom of the light-emitting diode 2 is provided with a pin 21. The pin 21 is made of tin-plated copper, which has good conductivity and solderability. The mounting plate 1 is provided with a conductive line 6, which is in contact with the pin 21.

[0031] In this embodiment, the heat dissipation component 4 is made of aluminum alloy and undergoes anodizing treatment to form a dense oxide film on the surface, which not only improves its corrosion resistance but also enhances its radiative heat dissipation capacity. Several heat dissipation fins 41 are provided on the bottom surface of the heat dissipation component 4. The heat dissipation fins 41 are arc-shaped. Compared with traditional straight fins, the arc-shaped design can guide air to form turbulence between the fins, accelerate the air flow speed, and improve the convective heat dissipation efficiency.

[0032] In this embodiment, the screw 33 is made of stainless steel. One end of the screw 33 passes through the mounting plate 1 and extends to the outside. A knob is fixedly connected to the extended end of the screw 33 to facilitate the operator to rotate the screw 33.

[0033] In this embodiment, both the clamping surfaces of claw 1 31 and claw 2 32 are provided with elastic rubber pads. The elastic rubber pads are made of silicone rubber, which can provide sufficient clamping force and avoid squeezing damage to the housing of LED 2. The surface of the rubber pad is provided with an arc-shaped groove that fits the housing of LED 2, which can increase the contact area between the two and improve the clamping stability. The thread direction in the threaded hole at the tail of claw 1 31 is right-hand helix, and the thread direction in the threaded hole at the tail of claw 2 32 is left-hand helix.

[0034] In this embodiment, the heat-conducting plate 5 is made of oxygen-free copper plate, and thermally conductive gel is coated between the upper surface of the heat-conducting plate 5 and the insulating layer 7, which can fill the tiny gaps between the two and further reduce the contact thermal resistance.

[0035] In this embodiment, the thermal pad 8 penetrates the insulating layer 7 and is attached to the top surface of the thermal plate 5. The thermal pad 8 can undergo slight deformation, which can tightly adhere to the bottom of the diode and the top surface of the thermal plate 5, minimizing contact thermal resistance and ensuring efficient heat transfer.

[0036] Working steps: 1. Place the thermal pad 8 into the insertion hole 11 of the mounting plate 1, ensuring that one end of the thermal pad 8 is located in the insertion hole 11 and the other end passes through the insulating layer 7 and is attached to the top surface of the thermal plate 5. Then place the insulating layer 7 on the thermal plate 5 and then install the mounting plate 1 on the insulating layer 7.

[0037] 2. Align the groove 42 on the top of the heat dissipation component 4 with the protrusion 51 on the lower surface of the heat conduction plate 5 to complete the plug-in connection between the heat dissipation component 4 and the heat conduction plate 5.

[0038] 3. Insert the LED 2 into the insertion hole 11 of the mounting plate 1, so that the pin 21 at the bottom of the LED 2 contacts and connects with the conductive line 6 inside the mounting plate 1. Rotate the screw 33 to drive the first claw 31 and the second claw 32 to move towards each other along the sliding groove 34 until the LED 2 is tightly clamped, thus completing the fixing of the LED 2.

[0039] IV. The heat generated by the light-emitting diode 2 during operation is transferred to the heat-conducting pad 8 through the bottom. The heat-conducting pad 8 directly conducts the heat to the heat-conducting plate 5. The heat-conducting plate 5 transfers the heat to the heat dissipation component 4. The arc-shaped heat dissipation fins 41 at the bottom of the heat dissipation component 4 are in full contact with the air, dissipating the heat into the air.

[0040] 5. When it is necessary to replace or repair the LED 2, rotate the screw 33 in the opposite direction to move the first pawl 31 and the second pawl 32 in the opposite direction along the sliding groove 34 to loosen the LED 2, so that it can be taken out from the insertion hole 11.

[0041] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A mounting structure for improving the thermal conductivity of a diode, comprising a mounting plate (1), characterized in that, The mounting plate (1) has several insertion holes (11), each of which is fitted with a light-emitting diode (2). A heat-conducting pad (8) is provided at the bottom of the light-emitting diode (2). A fixing mechanism (3) is provided inside the mounting plate (1). An insulating layer (7) is provided on the lower surface of the mounting plate (1). A heat-conducting plate (5) is provided on the lower surface of the insulating layer (7). A heat dissipation component (4) is provided on the lower surface of the heat-conducting plate (5). Several protrusions (51) are provided on the lower surface of the heat-conducting plate (5). Several grooves (42) are provided on the top of the heat dissipation component (4). The protrusions (51) are inserted into the grooves (42).

2. The mounting structure for improving diode thermal conductivity according to claim 1, characterized in that, The fixing mechanism (3) includes a sliding groove (34) opened in the mounting plate (1). A first claw (31) and a second claw (32) are slidably arranged in the sliding groove (34). The first claw (31) and the second claw (32) are located on both sides of the light-emitting diode (2). The tail of the first claw (31) and the second claw (32) are both provided with threaded holes, and a screw (33) is threaded in the threaded holes.

3. The mounting structure for improving diode thermal conductivity according to claim 1, characterized in that, The light-emitting diode (2) has a pin (21) at its bottom, and the mounting plate (1) has a conductive line (6) inside, which is in contact with the pin (21).

4. The mounting structure for improving diode thermal conductivity according to claim 1, characterized in that, The heat dissipation assembly (4) has several heat dissipation fins (41) on its bottom surface, and the heat dissipation fins (41) are arc-shaped.

5. The mounting structure for improving diode thermal conductivity according to claim 2, characterized in that, One end of the screw (33) passes through the mounting plate (1) and extends to the outside, and a knob is fixedly connected to the extended end of the screw (33).

6. The mounting structure for improving diode thermal conductivity according to claim 2, characterized in that, Both the clamping surfaces of the first (31) and the second (32) are provided with elastic rubber pads. The surface of the rubber pads is provided with arc-shaped grooves that are adapted to the housing of the light-emitting diode (2). The thread direction in the threaded hole at the tail of the first (31) is right-hand helix, and the thread direction in the threaded hole at the tail of the second (32) is left-hand helix.

7. The mounting structure for improving diode thermal conductivity according to claim 1, characterized in that, The heat-conducting plate (5) is made of oxygen-free copper plate, and a heat-conducting gel is coated between the upper surface of the heat-conducting plate (5) and the insulating layer (7).

8. The mounting structure for improving diode thermal conductivity according to claim 1, characterized in that, The heat-conducting pad (8) penetrates the insulating layer (7) and is attached to the top surface of the heat-conducting plate (5).

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