Anisotropic conductive film attaching machine

Abstract

The utility model discloses an anisotropic conductive film pasting machine, including ACF pasting machine body, the outer wall fixed connection of ACF pasting machine body has workstation, the top fixed connection of workstation has back type support spare, the top fixed connection of back type support spare has the guide plate, the top of guide plate is equipped with two T type long grooves, and the inner wall of two T type long grooves all are connected with T type block slidingly. The utility model discloses a plurality of connecting rod pressing mechanism of electric push rod drive, and the stable fixing of substrate is realized through the synchronous down pressure of four rubber sleeves, effectively prevents the displacement problem in the process of pasting, and significantly improves the pasting accuracy, and T type long groove and T type block sliding structure cooperation movable pasting board, realize the quick adjustment of substrate position, satisfy the technological demand of different pasting position, adopt the cooperation of sliding slot type L type board with adjustable nut, make two L type boards can be according to different size substrate flexible adjustment fixed position, and the equipment adaptability is improved greatly.

Description

Technical Field

[0001] This utility model relates to the field of ACF bonding machine technology, and in particular to an anisotropic conductive film bonding machine. Background Technology

[0002] An anisotropic conductive film (ACF) bonding machine is a device specifically designed for bonding anisotropic conductive film (ACF) onto electronic components. ACF is a polymer material mainly composed of resin adhesive and conductive particles. Its working principle involves using the conductive particles to connect the electrodes between the IC chip and the substrate, creating conductivity while simultaneously preventing short circuits between adjacent electrodes, thus achieving conductivity in the Z-axis direction.

[0003] In existing technologies, traditional ACF bonding machines mostly use a single pressing mechanism or vacuum adsorption to fix the substrate. During high-speed bonding, the substrate is prone to displacement or loosening, resulting in ACF bonding position deviation and affecting product yield. Since the size and bonding position of different substrate models vary, the pressing mechanism of existing equipment often cannot be adjusted quickly, requiring the replacement of fixtures or manual repositioning, which reduces production efficiency. Therefore, we propose an anisotropic conductive film bonding machine to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an anisotropic conductive film bonding machine.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An anisotropic conductive film (ACF) bonding machine includes an ACF bonding machine body. A worktable is fixedly connected to the outer wall of the ACF bonding machine body. A U-shaped support is fixedly connected to the top of the worktable. A guide plate is fixedly connected to the top of the U-shaped support. Two T-shaped slots are formed on the top of the guide plate. T-shaped blocks are slidably connected to the inner walls of the two T-shaped slots. The same bonding plate is fixedly connected to the top of the two T-shaped blocks. Two rectangular slots are formed on the outer wall of the bonding plate. Two strip slots are formed on the outer wall of the guide plate. L-shaped plates are slidably connected to the inner walls of the two strip slots. Straight rods are fixedly connected to the outer walls of the two L-shaped plates. Rubber sleeves are fixedly fitted onto the outer walls of the four straight rods. A lifting assembly is provided at the bottom of the L-shaped plates.

[0007] Preferably, the lifting assembly includes four threaded rods, the bottoms of the two L-shaped plates are fixedly connected to the tops of the four threaded rods respectively, the outer walls of the four threaded rods are slidably fitted with the same lifting plate, the interior of the ACF bonding machine body is fixedly connected to a frame, the top of the frame is fixedly connected to an electric push rod, the top of the output end of the electric push rod is fixedly connected to the bottom of the lifting plate, and the lifting assembly drives the four rubber sleeves to move downward to fix the position of the substrate.

[0008] Preferably, the top of the U-shaped support member is fixedly connected to two guide strips, which assist the attachment plate in linear movement.

[0009] Preferably, the outer walls of the four threaded rods are all threaded with nuts, and the L-shaped plate is fixed to the top of the lifting plate by setting the nuts.

[0010] Preferably, the bottom of the L-shaped plate is slidably connected to the top of the lifting plate.

[0011] Preferably, the outer wall of the lifting plate has two sliding grooves, the inner walls of the two sliding grooves are slidably connected to the outer walls of the four threaded rods, and the four threaded rods move linearly along the two sliding grooves in pairs.

[0012] Compared with the prior art, the advantages of this utility model are:

[0013] This solution employs a multi-link pressing mechanism driven by an electric push rod. The substrate is stably fixed by the synchronous pressing of four rubber sleeves, effectively preventing displacement during the bonding process and significantly improving bonding accuracy. A T-shaped long groove and a sliding T-block structure, combined with a movable bonding plate, enable rapid adjustment of the substrate position to meet the process requirements of different bonding locations. A sliding L-shaped plate with an adjustable nut allows the two L-shaped plates to be flexibly adjusted and fixed according to substrates of different sizes, greatly improving the equipment's adaptability. Attached Figure Description

[0014] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a three-dimensional structural diagram of an anisotropic conductive film bonding machine proposed in this utility model;

[0016] Figure 2 This is a front cross-sectional view of an anisotropic conductive film bonding machine proposed in this utility model.

[0017] Figure 3 This is a side cross-sectional view of an anisotropic conductive film bonding machine proposed in this utility model.

[0018] Figure 4 This is a partial cross-sectional structural diagram of an anisotropic conductive film bonding machine proposed in this utility model;

[0019] Figure 5 This is a partial cross-sectional three-dimensional structural diagram of an anisotropic conductive film attaching machine proposed in this utility model.

[0020] In the diagram: 1. ACF bonding machine body; 2. Worktable; 3. Reverse support component; 4. Guide bar; 5. Guide plate; 6. T-block; 7. Bonding plate; 8. Rectangular groove; 9. L-shaped plate; 10. Straight rod; 11. Rubber sleeve; 12. Threaded rod; 13. Lifting plate; 14. Frame; 15. Electric push rod; 16. Nut. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0022] Depend on Figures 1-5 As shown, an anisotropic conductive film (ACF) bonding machine is disclosed, comprising an ACF bonding machine body 1. A worktable 2 is fixedly connected to the outer wall of the ACF bonding machine body 1. The surface of the worktable 2 is flat to ensure the stability of the equipment operation. A U-shaped support 3 is fixedly connected to the top of the worktable 2. Two guide bars 4 are fixedly connected to the top of the U-shaped support 3. The two guide bars 4 assist the bonding plate 7 in linear movement. A guide plate 5 is fixedly connected to the top of the U-shaped support 3. Two T-shaped slots are formed on the top of the guide plate 5. T-shaped blocks 6 are slidably connected to the inner walls of the two T-shaped slots. The same bonding plate 7 is fixedly connected to the top of the two T-shaped blocks 6.

[0023] The outer wall of the attachment plate 7 has two rectangular grooves 8, the outer wall of the guide plate 5 has two strip grooves, the inner walls of the two strip grooves are slidably connected to L-shaped plates 9, the outer walls of the two L-shaped plates 9 are fixedly connected to straight rods 10, and the outer walls of the four straight rods 10 are fixedly fitted with rubber sleeves 11. The rubber sleeves 11 are supported by the straight rods 10 and can be replaced periodically.

[0024] The bottom of the L-shaped plate 9 is provided with a lifting assembly, which includes four threaded rods 12. The bottom of the two L-shaped plates 9 is fixedly connected to the top of the four threaded rods 12 respectively. The L-shaped plates 9 slide along the top of the lifting plate 13. The same lifting plate 13 is slidably sleeved on the outer wall of the four threaded rods 12. Two sliding grooves are opened on the outer wall of the lifting plate 13. The inner wall of the two sliding grooves is slidably connected to the outer wall of the four threaded rods 12 respectively.

[0025] The bottom of the L-shaped plate 9 is slidably connected to the top of the lifting plate 13. The ACF bonding machine body 1 is fixedly connected to the frame 14. The top of the frame 14 is fixedly connected to the electric push rod 15. The top of the output end of the electric push rod 15 is fixedly connected to the bottom of the lifting plate 13. The outer walls of the four threaded rods 12 are all threaded with nuts 16. The nuts 16 cooperate with the threaded rods 12 to fix the L-shaped plate 9 to the top of the lifting plate 13.

[0026] Working principle: When the ACF bonding machine body 1 is in use, the substrate is placed on top of the bonding plate 7. As the electric push rod 15 rotates, it drives the lifting plate 13 to move downward. The downward movement of the lifting plate 13 drives the two L-shaped plates 9 and the four straight rods 10 to move downward, thereby driving the four rubber sleeves 11 to move downward, fixing the substrate on top of the bonding plate 7 for easy subsequent bonding. The bonding plate 7 can be moved by the two T-shaped slots and the two T-shaped blocks 6 to change the subsequent bonding position of the substrate. Rotating the four nuts 16 releases the position fixation of the two L-shaped plates 9. The two L-shaped plates 9 move along the two sliding grooves and the strip groove, changing the position of the four rubber sleeves 11 to meet the fixing requirements of different substrates.

[0027] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. Furthermore, the structure and principle of the components known to those skilled in the art can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0028] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An anisotropic conductive film attaching machine, comprising an ACF attaching machine body (1), characterized in that, The outer wall of the ACF bonding machine body (1) is fixedly connected to a worktable (2). The top of the worktable (2) is fixedly connected to a U-shaped support (3). The top of the U-shaped support (3) is fixedly connected to a guide plate (5). The top of the guide plate (5) has two T-shaped long slots. The inner walls of the two T-shaped long slots are slidably connected to T-shaped blocks (6). The tops of the two T-shaped blocks (6) are fixedly connected to the same bonding plate (7). The outer wall of the bonding plate (7) has two rectangular slots (8). The outer wall of the guide plate (5) has two strip slots. The inner walls of the two strip slots are slidably connected to L-shaped plates (9). The outer walls of the two L-shaped plates (9) are fixedly connected to straight rods (10). The outer walls of the four straight rods (10) are fixedly fitted with rubber sleeves (11). The bottom of the L-shaped plates (9) is provided with a lifting assembly.

2. The anisotropic conductive film bonding machine according to claim 1, characterized in that, The lifting assembly includes four threaded rods (12), the bottoms of the two L-shaped plates (9) are fixedly connected to the tops of the four threaded rods (12), the outer walls of the four threaded rods (12) are slidably fitted with the same lifting plate (13), the interior of the ACF bonding machine body (1) is fixedly connected to a frame (14), the top of the frame (14) is fixedly connected to an electric push rod (15), and the top of the output end of the electric push rod (15) is fixedly connected to the bottom of the lifting plate (13).

3. The anisotropic conductive film bonding machine according to claim 1, characterized in that, The top of the U-shaped support (3) is fixedly connected to two guide bars (4).

4. The anisotropic conductive film bonding machine according to claim 2, characterized in that, The outer walls of the four threaded rods (12) are all threaded with nuts (16).

5. The anisotropic conductive film bonding machine according to claim 2, characterized in that, The bottom of the L-shaped plate (9) is slidably connected to the top of the lifting plate (13).

6. The anisotropic conductive film bonding machine according to claim 2, characterized in that, The outer wall of the lifting plate (13) has two sliding grooves, and the inner walls of the two sliding grooves are slidably connected to the outer walls of the four threaded rods (12).

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