Projection device

Abstract

The application relates to the projection field. The application provides a projection device which comprises a mounting shell module, a light-emitting module, an imaging module and an air flow module. The mounting shell module is provided with an air flow channel, the light-emitting module is mounted on the mounting shell module, and the imaging module is located on the light path of the light-emitting module. The imaging module comprises an imaging projection sheet, and the imaging projection sheet is located in the air flow channel. The air flow module is mounted on the mounting shell module, and the air flow module comprises a wind guide part and an air flow generator. The wind guide part is provided with a wind guide cavity which is communicated with the air flow channel, and the air flow generator is located at one end of the wind guide cavity and is used for conveying air flow to the air flow channel through the wind guide cavity. The projection device is provided with a heat dissipation module for the imaging projection sheet, the working temperature of the imaging projection sheet is relatively low, and the service life of the imaging projection sheet is prolonged.

Description

Technical Field

[0001] This application relates to the field of projection technology, and in particular to a projection device. Background Technology

[0002] With the advancement of technology, the application range of projection devices is becoming increasingly wide, and they are widely used in fields such as teaching, conferences, advertising, and interior decoration. As a specific product of projection devices, starry sky projectors are used in interior decoration, for example, to project light spots with specific shapes and colors onto the ceiling or wall, thereby creating a decorative effect of starry sky patterns on the ceiling or wall.

[0003] This type of projection device generally includes a light source, an imaging slide, and a projection lens. The light emitted by the light source passes through the imaging slide, forming a beam of light with a specific shape. This beam is then projected to the outside world through the projection lens. However, the light source generates a significant amount of heat that radiates onto the imaging slide during operation. The continuous exposure of the imaging slide to the light emitted by the light source causes its temperature to rise. If the imaging slide operates at a high temperature for an extended period, its lifespan will be relatively short. Utility Model Content

[0004] This application provides a projection device with good heat dissipation.

[0005] This application provides a projection device including a mounting housing module, a light-emitting module, an imaging module, and an airflow module. The mounting housing module has an airflow channel. The light-emitting module is mounted on the mounting housing module, and the imaging module is located in the optical path of the light-emitting module. The imaging module includes an imaging projection sheet located within the airflow channel. The airflow module is mounted on the mounting housing module and includes a guide vane and an airflow generator. The guide vane has a guide cavity communicating with the airflow channel. The airflow generator is located at one end of the guide cavity and is used to deliver airflow to the airflow channel through the guide cavity.

[0006] In some optional embodiments, the air guide has a first end and a second end that are opposite to each other, the air guide cavity passes through the first end and the second end, and the airflow generator is disposed at the first end; the second end is connected to the airflow channel and is disposed opposite to the imaging projection sheet; the direction from the first end to the second end is the air guide direction, and the angle between the air guide direction and the plane where the imaging projection sheet is located is an acute angle.

[0007] In some optional embodiments, the angle between the airflow direction and the plane where the imaging projector is located is less than or equal to 45 degrees.

[0008] In some optional embodiments, the diameter of the air guide cavity at the first end is larger than the diameter at the second end.

[0009] In some optional embodiments, the airflow module further includes an elastic buffer frame, through which the airflow generator is mounted on the air guide, and the air guide is fixedly connected to the mounting shell module.

[0010] In some optional embodiments, the elastic buffer frame includes a wrapping part with an airflow hole that communicates with the air guide cavity. An airflow generator is disposed inside the airflow hole, and the wrapping part surrounds the outer periphery of the airflow generator.

[0011] In some optional embodiments, the elastic buffer frame further includes multiple elastic connecting parts, which are spaced apart on the outer periphery of the wrapping part and connected to the wrapping part; the multiple elastic connecting parts are respectively fixed to the air guide by fasteners.

[0012] In some optional embodiments, the airflow module further includes a buffer and a connector. The air guide is connected to the mounting shell module through the connector, and the buffer is disposed between the connector and the mounting shell module.

[0013] In some optional embodiments, the air guide includes a body portion and a mounting portion connected to each other, the air guide cavity is disposed in the body portion, and the mounting portion is provided with a mounting through hole; the buffer includes a first elastic pad, a second elastic pad and a connecting pad, the connecting pad is connected between the first elastic pad and the second elastic pad, the connecting pad passes through the mounting through hole, the first elastic pad is stacked between the mounting shell module and the mounting portion, and the second elastic pad is located on the side of the mounting portion away from the first elastic pad; the connecting member abuts against the second elastic pad, and is sequentially disposed through the second elastic pad, the connecting pad and the first elastic pad and fixedly connected to the mounting shell module.

[0014] In some optional embodiments, the light-emitting module includes a circuit board connected to the mounting housing module and a light-emitting element disposed on the circuit board; the projection device also includes a heat sink, which is in contact with the circuit board.

[0015] In some optional embodiments, the mounting housing module includes a first mounting plate and a second mounting plate that are spaced apart from each other, an airflow channel is disposed between the first mounting plate and the second mounting plate, an imaging module is disposed on the second mounting plate, and a heat sink is disposed on the side of the first mounting plate opposite to the airflow channel.

[0016] In some optional embodiments, the mounting shell module further includes a third mounting plate, which is arranged side by side with the second mounting plate on the same side of the first mounting plate. The third mounting plate and the first mounting plate are spaced apart, and the first mounting plate, the second mounting plate and the third mounting plate together define an airflow channel. The projection device further includes a driving module, which is disposed on the third mounting plate and is connected to the imaging projection sheet.

[0017] In some optional embodiments, the imaging module includes a projection bracket with transmission teeth, and the imaging projection sheet is connected to the transmission teeth; the driving module includes a driving motor and a transmission gear set, the transmission gear set is mounted on a third mounting plate and located in the airflow channel and meshes with the transmission teeth; the driving motor is mounted on the side of the third mounting plate away from the airflow channel and is connected to the transmission gear set.

[0018] In some optional embodiments, the projection device further includes a temperature sensor and a controller. The temperature sensor is disposed in the airflow channel, and the controller is electrically connected to the temperature sensor and the light-emitting module.

[0019] In related technologies for projection devices, the light emitted by the light-emitting module passes through the imaging projector, causing heat to concentrate on the projector and its temperature to rise. The projection device provided in this application utilizes an airflow module to promote airflow during operation. The flowing air enters the airflow channel via the airflow generator and the air guide cavity and then flows out. Since the imaging projector is located within the airflow channel, its heat is carried away by the flowing air, preventing the imaging projector from overheating and helping to extend its lifespan.

[0020] Furthermore, by setting up a dedicated airflow channel, the airflow generated by the airflow module is prevented from wandering around and instead concentrated within the airflow channel, efficiently removing heat from the imaging projection sheet. Given the limited fixed airflow volume of the airflow generator, setting up a dedicated airflow channel allows for relatively concentrated airflow and a relatively high airflow velocity within the channel, resulting in relatively high cooling and heat dissipation efficiency for the imaging projection sheet.

[0021] Therefore, in the projection device provided in this application embodiment, the airflow module and airflow channel constitute a dedicated heat dissipation component for the imaging projector. This heat dissipation component keeps the temperature of the imaging projector relatively low during operation. At this time, the power of the light-emitting module can be set relatively high. Even under the illumination of a high-power light source, the heat of the imaging projector will be quickly dissipated by the aforementioned heat dissipation component, preventing excessively high operating temperatures. This provides the possibility for high-power, high-brightness projection conditions in the projection device. Correspondingly, when the light-emitting module of the projection device operates at high power and high brightness parameters, the imaging projector will not reach excessively high temperatures, resulting in relatively high brightness and clearer images projected by the imaging projection device, leading to a better user experience. Attached Figure Description

[0022] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a projection device provided in some embodiments of this application.

[0024] Figure 2 yes Figure 1 A schematic diagram of the projection device from another perspective.

[0025] Figure 3 yes Figure 1 A schematic diagram of the cross-sectional structure of the projection device shown.

[0026] Figure 4 yes Figure 1 The diagram shown omits the outer casing of the projection device.

[0027] Figure 5 yes Figure 4 A schematic diagram of the projection device from another perspective.

[0028] Figure 6 yes Figure 5 The diagram shows the exploded three-dimensional structure of the projection device.

[0029] Figure 7 yes Figure 6 The diagram shows a three-dimensional cross-section of the projection device in its exploded state.

[0030] Figure 8 yes Figure 6 The diagram shows a partial structural schematic of the airflow module, imaging module, and mounting shell module of the projection device in its decomposed state.

[0031] Figure 9 yes Figure 7 A magnified schematic diagram of a portion of the projection device shown.

[0032] Figure 10 yes Figure 6 A three-dimensional exploded view of the airflow module of the projection device shown.

[0033] Figure 11 yes Figure 3 The diagram shows an enlarged view of a portion of the projection device. Detailed Implementation

[0034] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0035] Please see Figure 1 and Figure 2 This application provides a projection device 100 for providing illumination or emitting light onto a light-receiving surface. As an example, the projection device 100 is used to form a projection pattern on a projection surface such as a screen, wall, or floor to convey information, serve as decoration, or attract crowds. The projection device 100 can also use goods or exhibits as projection targets to improve the display effect. The projection pattern formed by the projection device 100 can remain unchanged on the projection surface or other projection objects. The projection pattern can also be in motion. As an example, the projection device 100 is mounted on an application platform via a drive mechanism (such as a swing arm or robotic arm). When the projection device 100 is in operation, the drive mechanism can drive the projection device 100 to move, thereby changing the position of the projection pattern on the projection surface or causing the projection pattern to move between multiple projection surfaces. As another example, the projection device 100 includes a projection film and a light source. When the projection device 100 is in operation, the projection film and the light source are in a state of relative motion, so that the projected content in the projection pattern is in a state of continuous motion on the projection surface. In this example, the projection device 100 may include a starlight, and the projected content in the projection pattern formed by it may be a small light spot, such as a snowflake shape or a polka dot shape, to form a dynamic starry sky effect.

[0036] Please see Figure 3 In this embodiment, the projection device 100 includes a mounting housing module 20, a light-emitting module 30, an imaging module 40, and an airflow module 50. The light-emitting module 30, imaging module 40, and airflow module 50 are respectively mounted on the mounting housing module 20. The light-emitting module 30 emits light from a light source, which, after passing through the imaging module 40, forms the pattern light required for projection under the action of the imaging module 40. The airflow module 50 promotes airflow around the imaging module 40 to remove the heat generated during operation, thereby ensuring that the projection device 100 operates at a suitable temperature.

[0037] Furthermore, the mounting housing module 20 is provided with an airflow channel 201, and the light-emitting module 30 can be fixedly mounted on the mounting housing module 20. The imaging module 40 is located in the optical path of the light-emitting module 30, and the imaging module 40 includes an imaging projection sheet 43, which is located in the airflow channel 201.

[0038] The airflow module 50 can be fixedly installed on the mounting housing module 20. The airflow module 50 includes an air guide 51 and an airflow generator 53. The air guide 51 is provided with an air guide cavity 5111 that communicates with the airflow channel 201. The airflow generator 53 is located at one end of the air guide cavity 5111 and is used to deliver airflow to the airflow channel 201 through the air guide cavity 5111.

[0039] When the projection device 100 is working, the light emitted by the light-emitting module 30 passes through the imaging projection sheet 43, causing heat to easily concentrate on the imaging projection sheet 43, and the temperature of the imaging projection sheet 43 will rise. In this embodiment, the airflow module 50 promotes airflow when it is working. The flowing air flows into the airflow channel 201 through the airflow generator 53 and the air guide cavity 5111 and then flows out. Since the imaging projection sheet 43 is set in the airflow channel 201, its heat will be carried away by the flowing air, avoiding the phenomenon of excessively high operating temperature of the imaging projection sheet 43 and helping to extend the service life of the imaging projection sheet 43. Furthermore, by setting a dedicated airflow channel 201, the airflow generated by the airflow module 50 will not wander around, but will be concentrated in the airflow channel 201, efficiently carrying away the heat of the imaging projection sheet 43. With the limited fixed air intake of the airflow generator 53, setting a dedicated airflow channel 201 can make the airflow in the airflow channel 201 relatively concentrated and the airflow velocity relatively high, and its cooling and heat dissipation efficiency for the imaging projection sheet 43 is also relatively high.

[0040] Therefore, in the projection device 100 of this application embodiment, the airflow module 50 and the airflow channel 201 constitute a heat dissipation assembly dedicated to the imaging projection sheet 43. This heat dissipation assembly keeps the temperature of the imaging projection sheet 43 relatively low during operation. At this time, the power of the light-emitting module 30 can be set to a relatively high level. Even under the illumination of a high-power light source, the heat of the imaging projection sheet 43 will be quickly dissipated by the aforementioned heat dissipation assembly, preventing excessively high operating temperatures. This provides the possibility for high-power, high-brightness projection operation of the projection device 100. Correspondingly, when the light-emitting module 30 of the projection device 100 operates at high power and high brightness parameters, the imaging projection sheet 43 will not have excessively high temperatures, resulting in relatively high brightness and clearer images projected by the imaging projection device 100, leading to a better user experience.

[0041] The following sections will introduce each component of the projection device 100 and its specific structure.

[0042] Please refer to it again. Figure 3 The projection device 100 also includes a housing 10, which houses the components of the projection device 100, such as the mounting housing module 20, the light-emitting module 30, the imaging module 40, and the airflow module 50 mentioned above. This specification does not limit the shape of the housing 10; it can be spherical, square, irregular three-dimensional, etc. The housing 10 has an inner cavity 11, a first vent 13, and a second vent 15. The inner cavity 11 houses the components of the projection device 100. The first vent 13 is located on one side of the housing 10 and connects the inner cavity 11 to the outside. The second vent 15 is located on the other side of the housing 10 and connects the inner cavity 11 to the outside.

[0043] In this embodiment, the first vent 13 and the second vent 15 are used to allow airflow guided by the airflow generator 50 to pass through. They are located on opposite sides of the housing 10, and the airflow channel 201 extends between the first vent 13 and the second vent 15, with an extending direction X. Specifically, as an example, the first vent 13 and the second vent 15 are basically arranged on the same straight line, and the airflow channel 201 extends in the direction from the first vent 13 to the second vent 15, so that the airflow channel 201 is in a roughly straight-line extension shape. Turbulence is not easily generated when the airflow flows, so the noise of the airflow is relatively small, thereby making the noise of the projection device 100 relatively small when it is working.

[0044] Furthermore, the outer casing 10 may also be provided with a light-transmitting hole (not shown in the figure), which connects the inner cavity 11 to the outside. The light-transmitting hole is used to allow light from the light-emitting module 30 to pass through.

[0045] Please see Figure 3 and Figure 4 The mounting housing module 20 is disposed in the inner cavity 11 of the outer shell 10. The mounting housing module 20 is used to mount the light-emitting module 30, the imaging module 40, and the airflow module 50, and also to define the airflow channel 201. In this embodiment, the mounting housing module 20 and the light-transmitting hole are arranged at intervals relative to each other. The imaging module 40 is disposed on the side of the mounting housing module 20 facing the light-transmitting hole, while the light-emitting module 30 and the airflow module 50 are both disposed on the side of the mounting housing module 20 away from the light-transmitting hole, so that the main components can be staggered, making full use of the internal space of the shell 10, which is beneficial to the miniaturization of the projection device 10.

[0046] Please see Figure 5 and Figure 6In some embodiments, the mounting housing module 20 includes a first mounting plate 21 and a second mounting plate 23, which are disposed at a distance from each other. The distance between the first mounting plate 21 and the second mounting plate 23 is used to form at least a portion of the structure of the airflow channel 201, so the airflow channel 201 is disposed between the first mounting plate 21 and the second mounting plate 23.

[0047] In some embodiments of this application, a first mounting plate 21 is used to mount the light-emitting module 30 and the airflow module 50. The first mounting plate 21 is generally plate-shaped and is located between the first vent 13 and the second vent 15, extending generally in the direction from the first vent 13 to the second vent 15. That is, the extending direction of the first mounting plate 21 is approximately the same as the extending direction X of the airflow channel 201. The plane on which the first mounting plate 21 is located is generally parallel to the plane on which the light-transmitting hole is located, that is, the plane on which the first mounting plate 21 is located is generally perpendicular to the axis of the light-transmitting hole.

[0048] The second mounting plate 23 is disposed on the side of the first mounting plate 21 facing the light-transmitting hole and is used to mount the imaging module 40. The imaging module 40 is disposed on the side of the second mounting plate 23 facing the light-transmitting hole and is substantially coaxial with the light-transmitting hole. Specifically, in this embodiment, the second mounting plate 23 is generally plate-shaped and is generally parallel to the first mounting plate 21. The second mounting plate 23 and the first mounting plate 21 can be fixedly connected by screws or mechanical clips to enhance the structural strength of the mounting shell module 20.

[0049] In some embodiments, the mounting housing module 20 further includes a third mounting plate 25, which is used to mount other components of the projection device 100, such as the driving components of the imaging projection sheet 43. The third mounting plate 25 and the second mounting plate 12 are arranged side by side on the same side of the first mounting plate 21, that is, the third mounting plate 25 is located on the side of the first mounting plate 21 facing the light-transmitting hole. The third mounting plate 25 is generally plate-shaped and is spaced apart from the first mounting plate 21. The gap between the third mounting plate 25 and the first mounting plate 21 is used to form at least a portion of the structure of the airflow channel 201. Therefore, the airflow channel 201 is also disposed between the first mounting plate 21 and the third mounting plate 25. The first mounting plate 21, the second mounting plate 23, and the third mounting plate 25 together form the airflow channel 201.

[0050] As a specific example, the third mounting plate 25 is located on the side of the second mounting plate 23 near the second vent 15. The two are basically arranged on the same plane and are arranged along the extension direction X of the airflow channel 201. This ensures that there are no excessive undulations or corners within the airflow channel 201, resulting in smoother airflow and less noise. The third mounting plate 25 and the first mounting plate 21, or the second mounting plate 23, can be fixedly connected by screws or mechanical clips to enhance the structural strength of the mounting housing module 20.

[0051] Please see Figure 7 The light-emitting module 30 is disposed on the side of the mounting housing module 20 opposite to the light-transmitting hole. Specifically, the light-emitting module 30 can be mounted on the first mounting plate 21. In this embodiment, the light-emitting module 30 includes a circuit board 33 and a light-emitting element 35. The circuit board 33 is connected to the mounting housing module 20, and the light-emitting element 35 is disposed on the circuit board 33. The light-emitting side of the light-emitting element 35 is disposed towards the imaging projection sheet 43 in the airflow channel 201 to send light source light towards the imaging projection sheet 43. In some embodiments, in order to dissipate heat from the light-emitting module 30, the projection device 100 may also include a heat sink 72, which contacts the circuit board 33 to dissipate heat from the circuit board 33. The heat sink 72 can be a finned heat sink, a phase-change heat sink, etc., and this specification does not limit it.

[0052] In some embodiments, the light-emitting module 30 further includes a mounting base 31, which is fixedly connected to the side of the first mounting plate 21 opposite to the airflow channel 201 and is used to mount the circuit board 33. The mounting base 31 has a receiving cavity 311 that extends through the opposite ends of the mounting base 31. The axial direction of the receiving cavity 311 coincides with or is approximately parallel to the axial direction of the light-transmitting hole. When the light-emitting module 30 is installed in the receiving cavity 311, the light from the light source can propagate in a straight line, ensuring minimal light loss and ultimately ensuring relatively high brightness of the projected pattern.

[0053] The heat sink 72 is located on the side of the mounting base 30 away from the first mounting plate 21 and covers the end of the receiving cavity 311. The circuit board 33 is located inside the receiving cavity 311 and stacked on the heat sink 72. The circuit board 33 is indirectly connected to the first mounting plate 21 through the heat sink 72 and the mounting base 30. During operation, the light-emitting element 35 and the circuit board 33 generate a large amount of heat, which is conducted to the heat sink 72 and dissipated to the outside by the heat sink 72. Since the heat sink 72 is located on the side of the first mounting plate 21 away from the airflow channel 201, the first mounting plate 21 can basically separate the heat sink 72 from the airflow channel 201. The heat dissipated by the heat sink 72 will not affect the temperature rise of the imaging projection sheet 43 in the airflow channel 201, nor will it increase the heat dissipation load of the airflow module 50, thereby ensuring effective heat dissipation of the imaging projection sheet 43. In addition, the heat sink 72 and the first mounting plate 21 are separated by the mounting base 31. While the heat sink 73 dissipates heat for the light-emitting module 30, the airflow module 50 and the airflow channel 201 dissipate heat for the imaging projection sheet 43. The heat of the two will not be transferred to each other, achieving basically independent heat dissipation. The heat dissipation efficiency of the imaging device 100 is relatively high.

[0054] Furthermore, to ensure smooth propagation of the light source from the light-emitting module 30, the mounting housing module 20 may be provided with a light channel (not shown in the figure). The light channel is located between the receiving cavity 311 of the light-emitting module 30 and the light-transmitting hole of the housing 10. As an example, the first mounting plate 21 is provided with a first through hole 211, and the second mounting plate 23 is provided with a second through hole 231. The receiving cavity 311, the first through hole 211, the second through hole 231, and the light-transmitting hole are basically coaxially arranged and sequentially connected. The light source emitted by the light-emitting element 35 mounted in the receiving cavity 311 is propagated to the outside through the first through hole 211, the second through hole 231, and the light-transmitting hole. The imaging module 40 may be disposed in the second through hole 231. In the embodiments of this application, the specific form of the light-emitting element 35 is not limited, and it may include one or more of the following light-emitting mechanism types: halogen lamp, laser lamp, LED lamp, etc. Furthermore, the airflow channel 201 is located between the first through hole 211 and the second through hole 231, and the first through hole 211 and the second through hole 231 are respectively connected to the airflow channel 201.

[0055] In this embodiment, the light-emitting module 30 may further include a first lens assembly 37. The first lens assembly 34 is disposed in the receiving cavity 311 and located in the optical path of the light-emitting element 35. The first lens assembly 37 is used to shape the light from the light-emitting element 35 to form light from the light source. The shaping process may include at least one of divergence, convergence, or homogenization. The first lens assembly 37 may include one or more optical lenses, the optical axes of which are substantially parallel or coincident with the optical axis of the imaging module 40. Further, in this embodiment, a portion of the structure of the first lens assembly 37 passes through the first through hole 211 and is located in the airflow channel 201, so that the heat generated by the first lens assembly 37 under the illumination of the light-emitting element 35 can be carried away by the airflow in the airflow channel 201, avoiding excessive temperature rise and ensuring high reliability of the light-emitting module 30.

[0056] Please also refer to Figure 8 and Figure 9 The imaging module 40 is disposed in the second through hole 231 and spaced apart from the first lens assembly 37. In this embodiment, the imaging module 40 includes a projection bracket 41 and the aforementioned imaging projection sheet 43. The projection bracket 41 is mounted on the second mounting plate 23 and is at least partially located on the side of the second through hole 231 facing the airflow channel 201. The projection bracket 41 is generally annular in shape and has a light-transmitting hole 411. The two ends of the light-transmitting hole 411 are respectively connected to the airflow channel 201 and the second through hole 231, and are generally coaxial with the second through hole 231.

[0057] The imaging projector 43 is installed inside the light-transmitting hole 411. Of the two opposing surfaces on the imaging projector 43, one faces the airflow channel 201 and the other faces the second through hole 231. Therefore, neither side surface of the imaging projector 43 is attached to any other components, which facilitates airflow to remove heat from both sides and improves the heat dissipation efficiency of the imaging projector 43.

[0058] In this embodiment, the imaging projector 43 is located in the airflow channel 201, and the extension direction of its plane is approximately the same as the extension direction X of the airflow channel 201. Therefore, when the airflow flows through the airflow channel 201, most of the airflow will flow over the surface of the imaging projector 43, thereby efficiently removing the heat from the imaging projector 43. Furthermore, since the airflow direction is approximately the same as the extension direction of the imaging projector 43, the airflow will not directly impact the imaging projector 43, and the noise generated during its flow is relatively small.

[0059] This application specification does not limit the specific structure of the imaging projection sheet 43. As an example, the imaging projection sheet 43 can be a single-layer structure, such as coating a light-blocking layer like ink on a glass substrate to form the desired projection pattern, or coating an acrylic sheet with a light-blocking layer like ink to form the desired projection pattern. These projection patterns can be specific characters, stars, etc.

[0060] As another example, please refer to Figure 9 The imaging projection sheet 43 can be a multi-layered structure. For example, it may include a carrier layer 431 and a film layer 433. The film layer 433 has a pattern, and when light passes through the film layer 433, the pattern's light transmission or blocking effect can form the pattern light to be projected. The film layer 433 is attached to the carrier layer 431, which is connected to the projection bracket 41. The carrier layer 431 can support and protect the film layer 433, and can also conduct heat away from the film layer 433 to avoid excessive heat accumulation on the film layer 433. In this example, there can be one or more carrier layers 431, which can be stacked on one or both sides of the film layer 433. The material of film layer 433 may include at least one or more of the following materials: polycarbonate (PC), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), etc.

[0061] In some embodiments, the imaging module 40 may further include a lens barrel 44 and a second lens assembly 45. The lens barrel 44 is mounted on the second mounting plate 23 on the side facing the light-transmitting hole of the housing 10. The second lens assembly 45 is mounted inside the lens barrel 44 and is opposite to the second through hole 231. The second lens assembly 45 and the imaging projection sheet 43 are disposed at a distance from each other. The optical axis of the second lens assembly 45 is substantially parallel to or coincident with the optical axis of the first lens assembly 37. It is used to shape the light transmitted through the imaging projection sheet 43 to form patterned light rays. The shaping process of the second lens assembly 45 includes at least one of divergence, convergence, or homogenization. The second lens assembly 45 may include one or more optical lenses, the optical axes of which are substantially parallel to or coincident with the optical axis of the first lens assembly 37.

[0062] Furthermore, in this embodiment, since the second through hole 231 and the airflow channel 201 are connected, part of the structure of the second lens assembly 45 can be exposed to the airflow in the airflow channel 201 through the second through hole 231. This allows the heat generated by the second lens assembly 45 under the illumination of the light-emitting element 35 to be carried away by the airflow in the airflow channel 201, avoiding excessive temperature rise and ensuring high reliability of the imaging module 40.

[0063] In some embodiments, the projection device 100 may further include a drive module 60, which is mounted on the mounting housing module 20 and connected to the imaging projection sheet 43. The drive module 60 is used to drive the imaging projection sheet 43 to move, so that the projected pattern has a certain motion effect on the corresponding projection surface, forming a special decorative light effect and improving the user experience. As an example, the drive module 60 may be a linear drive mechanism, such as a linear motor, a miniature linear cylinder, etc., which is used to drive the imaging projection sheet 43 to move in a straight line, thereby giving the projected pattern a linear motion effect. As another example, the drive module 60 may be a circumferential drive mechanism, such as a rotary motor, a servo motor, etc., which is used to drive the imaging projection sheet 43 to move in a circle, thereby giving the projected pattern a circular motion effect.

[0064] exist Figure 9 In the illustrated embodiment, the drive module 60 is a circumferential drive mechanism, which includes a drive motor 62 and a transmission gear set 64. The drive motor 62 is disposed on the side of the third mounting plate 25 opposite to the airflow channel 201, and the transmission gear set 64 is driveably connected between the drive motor 62 and the imaging projection sheet 43. Specifically, the projection bracket 41 may include a main body 413 and a transmission part 415. The main body 413 is rotatably disposed on the second mounting plate 23, and the main body 413 has a generally annular structure and defines the aforementioned light-transmitting hole 411. The transmission part 415 is disposed around the outer periphery of the main body 413. The transmission part 415 has multiple transmission teeth, which mesh with the transmission gear set 64. The imaging projection sheet 43 is indirectly connected to the transmission part 415 through the main body 413. When the drive motor 62 is working, it drives the imaging projection sheet 43 to rotate through the transmission gear set 64 and the transmission part 415, thereby giving the projected pattern a circumferential motion light effect on the projection surface.

[0065] Furthermore, the transmission gear set 64 may include one or more gears, which are disposed on the side of the third mounting plate 25 facing the airflow channel 201, that is, the transmission gear set 64 is located inside the airflow channel 201. Therefore, the drive motor 62 and the transmission gear set 62 are respectively located on opposite sides of the third mounting plate 25. Since the temperature rise of the drive motor 62 is relatively high under normal circumstances, isolating it outside the airflow channel 201 can avoid the adverse effects of the heat of the drive motor 62 on the imaging projection sheet 43. At the same time, the transmission gear set 62 has a certain temperature rise when it is working. By placing it inside the airflow channel 201 and on the side of the imaging projection sheet 43 near the second vent 15, the airflow will flow through the transmission gear set 62 after passing through the imaging projection sheet 43, and will also carry away the heat on the transmission gear set 64. This can make full use of the heat dissipation effect of the airflow module 50 and improve the overall heat dissipation efficiency of the projection device 100. Meanwhile, by using the third mounting plate 25 as the mounting base for the transmission gear set 64 and also as the boundary limiting element for the airflow channel 201, the full utilization of the physical structure is achieved, simplifying the overall structure of the projection device 100.

[0066] In some embodiments, to achieve dynamic control based on the temperature of the projection device 100 for better thermal management, the projection device 100 may further include a temperature sensor 74 and a controller 76. The temperature sensor 74 is disposed in the airflow channel 201, and the controller 76 is electrically connected to the temperature sensor 74 and the light-emitting module 30. The controller 76 may be an integrated circuit board, a control chip, or other components, and may be mounted on the mounting housing module 20, for example, on the first mounting plate 21, and located outside the airflow channel 201 to prevent the temperature rise of the controller 76 from affecting the imaging projection sheet 43. The temperature sensor 74 may be implemented using a thermistor, an infrared sensor, or a thermocouple, and may be mounted in the airflow channel 201, for example, on the second mounting plate 23 near the imaging projection sheet 43. The temperature sensor 74 is used to detect the temperature within the airflow channel 201, and the controller 76 is used to acquire the temperature data detected by the temperature sensor 74 and control the operation of the light-emitting module 30 based on this operating data. As an example, when the temperature data obtained by the controller 76 shows that the temperature inside the airflow channel 201 is higher than a preset threshold (e.g., 65 degrees Celsius), the controller 76 controls the light-emitting module 30 to stop working in order to avoid damage to the imaging projection sheet 43 caused by working at high temperatures for a long time.

[0067] Please see Figure 10 In this embodiment, the airflow module 50 is mounted on the first mounting plate 21 and is located on the side of the first mounting plate 21 opposite to the airflow channel 21. Specifically, the air guide 51 is fixedly mounted on the first mounting plate 21.

[0068] In this embodiment, the air guide 51 includes a body portion 511 and a mounting portion 513 connected to each other. The body portion 511 is generally hollow and cylindrical, and the aforementioned air guide cavity 5111 is disposed in the body portion 511, extending through opposite ends of the body portion 511. Specifically, the body portion 511 has a first end 5113 and a second end 5115 that are opposite to each other, and the air guide cavity 5111 extends through the first end 5113 and the second end 5115. The second end 5115 communicates with the airflow channel 201 and is disposed opposite to the imaging projection sheet 43. The airflow generator 53 is disposed in the first end 5113. The direction from the first end 5113 to the second end 5115 is defined as the air guide direction Y, and the angle between the air guide direction Y and the plane containing the imaging projection sheet 43 is an acute angle. The airflow generated by the airflow generator 53 flows along the airflow direction Y. The second end 5115 is positioned opposite the imaging projection plate 43. After the airflow flows out along the second end 5115, it can directly blow onto the imaging projection plate 43, avoiding airflow loss caused by the airflow passing through an excessively long conduction path. When the angle between the airflow direction Y and the plane where the imaging projection plate 43 is located is an acute angle, the cooling airflow can blow onto the imaging projection plate 43 from the side instead of from the front, avoiding wind noise caused by the cooling airflow directly hitting the imaging projection plate 43. This improves the heat dissipation effect while reducing noise. Furthermore, the angle between the airflow direction Y and the plane where the imaging projection plate 43 is located can be set to less than or equal to 45 degrees, such as 45 degrees, 40 degrees, 30 degrees, etc. Setting this angle to be smaller can further reduce wind noise.

[0069] Further, please refer to Figure 11 , Figure 11 The area depicted using a dotted pattern can be understood as the main space through which the cooling airflow passes. Since the plane of the imaging projection sheet 43 is positioned along the extension direction X of the airflow channel 201, the angle between the airflow direction Y and the extension direction X of the airflow channel 201 also satisfies the above-mentioned limitations, meaning it can be set to less than or equal to 45 degrees, such as 45 degrees, 40 degrees, 30 degrees, etc. The cooling airflow will make a bend as it enters the airflow channel 201 from the air guide cavity 5111, but the bend angle is obtuse. This avoids turbulence and noise caused by right-angle or acute-angle turns in the cooling airflow. Therefore, in this embodiment, the cooling airflow flows relatively smoothly with less noise.

[0070] In this embodiment, the diameter of the air guide cavity 5111 at the first end 5113 is larger than the diameter at the second end 5115. The larger diameter at the first end 5113 facilitates the introduction of almost all the airflow generated by the airflow generator 53 into the air guide cavity 5111. Meanwhile, the relatively smaller diameter at the outlet of the air guide cavity 5111 helps to concentrate the airflow within the air guide cavity 5111 onto the imaging projection sheet 43, improving airflow efficiency and avoiding airflow waste. Simultaneously, the larger inlet and smaller outlet of the air guide cavity 5111 helps to accelerate the airflow velocity at the outlet (i.e., at the second end 5115). Therefore, even with a relatively low power output, the airflow generator 53 can achieve a relatively high airflow velocity, resulting in relatively high heat dissipation efficiency. Therefore, in this embodiment, to meet certain airflow velocity or heat dissipation efficiency requirements, a lower power or smaller volume airflow generator 53 can be selected, which is beneficial for miniaturization or low-cost implementation of the projection device 100.

[0071] In this embodiment, the inner surface of the air guide 51 is a smooth curved surface. Specifically, the body portion 511 has an inner surface facing the air guide cavity 5111, which is arranged in a surrounding manner to define the boundary contour of the air guide cavity 5111, so the inner surface is in direct contact with the heat dissipation airflow. Designing the inner surface as a smooth curved surface prevents sharp corners from being generated inside the air guide cavity 5111, avoiding the phenomenon that sharp corners cause airflow turbulence and wind noise, and further reducing heat dissipation wind noise. It should be understood that in this embodiment, "smooth curved surface" should be understood as the inner surface of the air guide 51 being a guided and continuous curved surface without abrupt corners.

[0072] Please refer to it again. Figure 10 The mounting portion 513 of the air guide 51 is connected to the outer periphery of the body portion 511 and protrudes relative to the outer surface of the body portion 511. The mounting portion 513 is used to connect the body portion 511 to the first mounting plate 21. As an example, the mounting portion 513 is generally plate-shaped and has a mounting through hole 5131. The mounting portion 513 can be connected to the first mounting plate 21 by means of a fastener and the engagement between the mounting hole 5131.

[0073] Furthermore, in this embodiment, the airflow module 50 also includes a buffer 58 and a connector 59. The air guide 51 is connected to the mounting shell module 20 via the connector 59, and the buffer 58 is disposed between the connector 58 and the mounting shell module 20. The buffer 58 can be an elastic silicone pad, a rubber pad, a spring pad, etc., and it can be clamped between the air guide 51 and the mounting shell module 20 to buffer the impact vibration that occurs between the air guide 51 and the mounting shell module 20.

[0074] As a specific example, the buffer 58 is a block made of rubber or silicone, which may include a first elastic pad 581, a second elastic pad 583, and a connecting pad 585, with the connecting pad 581 connecting between the first elastic pad 581 and the second elastic pad 583. The first elastic pad 581, the second elastic pad 583, and the connecting pad 585 can all be relatively thin plate-like structures. The connecting pad 585 passes through the mounting hole 5131 of the air guide 51. The first elastic pad 513 is clamped between the first mounting plate 21 of the mounting housing module 20 and the mounting portion 513 of the air guide 51. The second elastic pad 583 is located on the side of the mounting portion 513 opposite to the first elastic pad 581.

[0075] The connector 59 abuts against the second elastic pad 583 and is sequentially inserted through the second elastic pad 583, the connecting pad 585, and the first elastic pad 581, and is fixedly connected to the mounting housing module 20. Specifically, in this embodiment, the connector 59 can be a fastener such as a screw or bolt, which has a head and a threaded portion. The buffer 58 has a central hole, through which the threaded portion of the connector 59 passes and is threadedly connected to the first mounting plate 21, so that the head of the connector 59 abuts against the second elastic pad 583. Thus, there are buffer and shock-absorbing parts between each pair of connected components. For example, there are corresponding buffer and shock-absorbing parts between the first mounting plate 21 and the mounting part 513, and between the head of the connector 59 and the mounting part 513, which helps to improve the buffer and shock-absorbing effect of the buffer 58. When the airflow generator 53 causes vibration during operation, the vibration transmitted through the air guide 51 can be absorbed by the buffer 58, further reducing the noise of heat dissipation operation. In practical applications, there can be multiple connectors 59 and mounting parts 513. Multiple connectors 59 and mounting parts 513 are arranged one-to-one and distributed on the outer periphery of the main body 511, so that the fixed installation and vibration reduction of the air guide 51 have high reliability.

[0076] In some embodiments of this application, the airflow module 50 further includes an elastic buffer frame 55. The airflow generator 53 is mounted on the air guide 51 via the elastic buffer frame 55, thus the airflow generator 53 is indirectly and fixedly connected to the mounting housing module 20 via the air guide 51. The elastic buffer frame 55 may be an elastic silicone pad, a rubber pad, a spring pad, or other shapes such as columnar, cylindrical, etc. It may be clamped or fixed between the air guide 51 and the airflow generator 53 to buffer the impact vibration that occurs between the air guide 51 and the airflow generator 53.

[0077] As an example, the elastic buffer frame 55 includes a wrapping portion 551, which has an airflow hole 5511 communicating with an air guide cavity 5111. An airflow generator 53 is disposed within the airflow hole 5511, and the wrapping portion 551 surrounds the outer periphery of the airflow generator 53. Specifically, in this embodiment, the airflow generator 53 can be an axial flow fan, which generates airflow by disturbing the surrounding air during operation; in other examples, the airflow generator 53 can be a vortex fan, etc. The wrapping portion 551 is generally hollow and cylindrical, with its axis direction being approximately parallel or coincident with the axis direction of the airflow generator 53. The wrapping portion 551 wraps around the outer periphery of the airflow generator 53 and is interference-fitted with the airflow generator 53, thereby fixing the airflow generator 53. By wrapping the airflow generator 53 circumferentially 360°, the vibration and shock of the airflow generator 53 in multiple directions can be buffered, and its buffering and shock absorption effect is relatively good.

[0078] In some embodiments, the elastic buffer frame 55 further includes a plurality of elastic connecting portions 553, which are spaced apart on the outer periphery of the wrapping portion 551 and connected to the wrapping portion 551. The plurality of elastic connecting portions 553 are respectively fixed to the air guide member 51 by fasteners 555, thereby further improving the buffering and shock absorption effect between the airflow generator 53 and the air guide member 51. As a specific example, a plurality of connecting posts are provided on the end face of the first end 5113 of the air guide member 51, and the plurality of elastic connecting portions 553 are correspondingly sleeved on the plurality of connecting posts, so that the wrapping portion 551 is stacked on the end face of the first end 5113. Screws or other fasteners 555 are then used to fix the elastic connecting portions 553 and the connecting posts, which ensures a tight connection between the wrapping portion 551 and the air guide member 51, preventing air leakage at the connection point, and guaranteeing the effectiveness of shock absorption and buffering.

[0079] In summary, when the projection device 100 provided in this application embodiment is working, the light emitted by the light-emitting module 30 will pass through the imaging projection sheet 43, causing heat to easily concentrate on the imaging projection sheet 43, and the temperature of the imaging projection sheet 43 will rise. This application embodiment utilizes the airflow module 50 to promote airflow during operation. The flowing air flows into the airflow channel 201 and out through the airflow generator 53 and the air guide cavity 5111. Since the imaging projection sheet 43 is located in the airflow channel 201, its heat will be carried away by the flowing air, avoiding the phenomenon of excessively high operating temperature of the imaging projection sheet 43 and helping to extend the service life of the imaging projection sheet 43.

[0080] In this application specification, certain terms are used to refer to specific components. Those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. The specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "including but not limited to"; "generally" means that those skilled in the art can solve the technical problem within a certain margin of error and basically achieve the technical effect.

[0081] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the purpose of simplifying the description of this application and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0082] In this application, unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or merely surface contact. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0083] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0084] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A projection device, characterized in that, include: The mounting shell module is equipped with airflow channels; The light-emitting module is installed in the mounting shell module; An imaging module is located in the optical path of the light-emitting module; the imaging module includes an imaging projection sheet, which is located in the airflow channel; An airflow module is installed in the mounting housing module; the airflow module includes an air guide and an airflow generator, the air guide has an air guide cavity communicating with the airflow channel, and the airflow generator is located at one end of the air guide cavity and is used to deliver airflow to the airflow channel through the air guide cavity.

2. The projection device as described in claim 1, characterized in that, The air guide has a first end and a second end that are opposite to each other. The air guide cavity passes through the first end and the second end. The airflow generator is disposed at the first end. The second end is connected to the airflow channel and is disposed opposite to the imaging projection sheet. The direction from the first end to the second end is the air guide direction. The angle between the air guide direction and the plane where the imaging projection sheet is located is an acute angle.

3. The projection device as described in claim 2, characterized in that, The angle between the air guiding direction and the plane where the imaging projection sheet is located is less than or equal to 45 degrees; the diameter of the air guiding cavity at the first end is greater than the diameter at the second end.

4. The projection device as claimed in claim 1, characterized in that, The airflow module also includes an elastic buffer frame, and the airflow generator is mounted on the air guide through the elastic buffer frame. The air guide is fixedly connected to the mounting shell module.

5. The projection device as described in claim 4, characterized in that, The elastic buffer frame includes a wrapping part, the wrapping part is provided with an air flow hole, the air flow hole is connected to the air guide cavity, the air flow generator is disposed in the air flow hole, and the wrapping part surrounds and wraps around the outer periphery of the air flow generator; The elastic buffer frame also includes multiple elastic connecting parts, which are spaced apart on the outer periphery of the wrapping part and connected to the wrapping part; the multiple elastic connecting parts are respectively fixed to the air guide by fasteners.

6. The projection device as claimed in claim 1, characterized in that, The airflow module also includes a buffer and a connector. The air guide is connected to the mounting shell module through the connector, and the buffer is disposed between the connector and the mounting shell module.

7. The projection device as claimed in claim 6, characterized in that, The air guide includes a body portion and a mounting portion connected to each other. The air guide cavity is disposed in the body portion, and the mounting portion is provided with a mounting through hole. The buffer includes a first elastic pad, a second elastic pad, and a connecting pad. The connecting pad is connected between the first elastic pad and the second elastic pad and passes through the mounting through hole. The first elastic pad is stacked between the mounting shell module and the mounting portion. The second elastic pad is located on the side of the mounting portion away from the first elastic pad. The connecting member abuts against the second elastic pad and passes through the second elastic pad, the connecting pad, and the first elastic pad in sequence and is fixedly connected to the mounting shell module.

8. The projection device according to any one of claims 1 to 7, characterized in that, The light-emitting module includes a circuit board connected to the mounting shell module and a light-emitting element disposed on the circuit board; the projection device also includes a heat sink, which is in contact with the circuit board.

9. The projection device as claimed in claim 8, characterized in that, The mounting housing module includes a first mounting plate and a second mounting plate that are spaced apart from each other. The airflow channel is located between the first mounting plate and the second mounting plate. The imaging module is located on the second mounting plate. The heat sink is located on the side of the first mounting plate opposite to the airflow channel.

10. The projection device as claimed in claim 9, characterized in that, The mounting shell module further includes a third mounting plate, which is arranged side by side with the second mounting plate on the same side of the first mounting plate. The third mounting plate and the first mounting plate are spaced apart, and the first mounting plate, the second mounting plate, and the third mounting plate together define the airflow channel. The projection device further includes a drive module, which is disposed on the third mounting plate and is drively connected to the imaging projection sheet.

11. The projection device as claimed in claim 10, characterized in that, The imaging module includes a projection bracket with transmission teeth, and the imaging projection sheet is connected to the transmission teeth. The driving module includes a driving motor and a transmission gear set. The transmission gear set is mounted on the third mounting plate and located in the airflow channel, meshing with the transmission teeth. The driving motor is mounted on the side of the third mounting plate away from the airflow channel and is connected to the transmission gear set.

12. The projection device according to any one of claims 1 to 7, characterized in that, The projection device also includes a temperature sensor and a controller. The temperature sensor is disposed in the airflow channel, and the controller is electrically connected to the temperature sensor and the light-emitting module.

Images