Electronic device

Abstract

The application provides an electronic device, which belongs to the technical field of electronic device heat dissipation, and comprises a shell, a circuit board assembly, a heat sink and a sealing element. The shell has a sealed cavity inside, and a mounting hole is formed in the side wall of the sealed cavity; the circuit board assembly is arranged in the sealed cavity; the heat sink is arranged in the mounting hole, and the heat sink has a heat conduction end located in the sealed cavity and a heat dissipation end exposed outside the sealed cavity, the heat conduction end being in contact with a heat generating part of the circuit board assembly; and the sealing element is arranged between the heat sink and the shell and used for sealing the gap at the joint of the heat sink and the shell. In this way, the electronic device can directly conduct heat to the external environment through the heat sink, the heat dissipation dimension is expanded, the heat accumulation in the sealed cavity of the electronic device is avoided, and the heat dissipation efficiency of the electronic device is improved; and the sealing element is arranged between the heat sink and the shell, the sealing performance between the heat sink and the shell is improved, and the heat dissipation reliability and the sealing reliability of the electronic device are improved simultaneously.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices. In particular, it relates to an electronic device. Background Technology

[0002] This application relates to electronic devices, such as outdoor displays, industrial control panels, and outdoor communication base stations. These electronic devices need to operate in high-temperature, high-humidity, dusty, or corrosive environments and must meet IP65 or higher protection ratings for sealing performance. The electronic devices include a housing with a sealed cavity. Components such as light sources, power supplies, and processors are integrated within the sealed cavity. These components generate heat during operation, causing heat to accumulate within the sealed cavity.

[0003] In related technologies, thermal grease is placed between the heating element and the housing to transfer the heat generated by the heating element to the housing, which then dissipates heat to the outside. However, thermal grease has low heat dissipation efficiency, and heat tends to accumulate in the sealed cavity. Alternatively, a heat pipe is placed between the heating element and the housing to transfer the heat generated by the heating element to the housing, which then dissipates heat to the outside. However, since the condenser end of the heat pipe is located in the sealed cavity, the heat emitted from the condenser end tends to accumulate in the sealed cavity. Another option is to provide openings in the housing to dissipate the heat generated by the heating element to the external environment through thermal convection. However, the presence of these openings compromises the sealing performance of the electronic device.

[0004] Therefore, in related technologies, there are technical problems such as the easy accumulation of heat in electronic devices, resulting in low heat dissipation efficiency, or the incompatibility between the heat dissipation performance and sealing performance of electronic devices. Utility Model Content

[0005] This application provides an electronic device aimed at solving the technical problems of low heat dissipation efficiency and incompatibility between heat dissipation and sealing performance of electronic devices, thereby simultaneously improving the heat dissipation and sealing performance of electronic devices, and improving the heat dissipation reliability and sealing reliability of electronic devices.

[0006] This application provides an electronic device, including:

[0007] The housing has an internally defined sealed cavity, and the side wall of the housing has an installation hole communicating with the sealed cavity;

[0008] A circuit board assembly is disposed within the sealed cavity;

[0009] A heat sink is provided through the mounting hole, and the heat sink has a heat-conducting end located inside the sealed cavity and a heat-dissipating end exposed outside the sealed cavity, the heat-conducting end being in contact with the heat-generating part of the circuit board assembly;

[0010] A sealing element is disposed between the radiator and the housing and extends circumferentially along the mounting hole to seal the gap at the mating point of the radiator and the housing.

[0011] In this embodiment, by providing a heat sink in the electronic device, with the heat-conducting end of the heat sink located inside the sealed cavity and the heat-dissipating end exposed to the external environment, the heat dissipated by the heat-generating part of the electronic device can not only be indirectly conducted to the external environment through the casing, but also directly conducted to the external environment through the heat sink. This expands the heat dissipation dimension and avoids heat accumulation in the sealed cavity of the electronic device, thereby improving the heat dissipation efficiency of the electronic device. Furthermore, by providing a seal between the heat sink and the casing, the sealing performance between the heat sink and the casing is improved, thereby simultaneously improving the heat dissipation performance and sealing performance of the electronic device, and thus simultaneously improving the heat dissipation reliability and sealing reliability of the electronic device.

[0012] In some embodiments, the seal is disposed between the radiator and the peripheral wall of the mounting hole to seal the gap between the radiator and the peripheral wall of the mounting hole.

[0013] This design improves the sealing performance between the heat sink and the mounting hole, while also adaptively filling the offset gap caused by processing or installation, thereby further improving the sealing reliability of electronic equipment.

[0014] In some embodiments, the heat dissipation end of the heat sink has a mating base plate on the side near the housing, the mating base plate being located outside the housing and attached to the outer side wall of the housing;

[0015] The sealing element is disposed between the mating substrate and the outer side wall of the housing to seal the gap between the mating substrate and the corresponding outer side wall of the housing.

[0016] This configuration, combined with the substrate, increases the contact area between the heat sink and the housing, improving the bonding strength between them. The seal is positioned between the substrate and the outer wall of the housing, preventing direct contact between the seal and the housing's sealing cavity. This avoids direct contact between the heat generated in the heat-generating parts of the circuit board assembly and the seal, reducing the impact of high temperatures on the seal, preventing seal failure, and thus improving the seal's lifespan and the sealing reliability of the electronic device.

[0017] In some embodiments, an annular first limiting groove is formed on the outer side wall of the housing around the mounting hole, and a corresponding annular second limiting groove is formed on the mating substrate of the heat sink;

[0018] When the mating substrate is attached to the outer wall of the housing, the sealing element is located in the space formed by the docking of the first limiting groove and the second limiting groove, and abuts against the groove walls of the first limiting groove and the second limiting groove respectively.

[0019] This design not only fixes the seal but also restricts its deformation, thereby further reducing the sealing failure rate and improving the sealing reliability of electronic equipment. It also further protects the seal, avoiding the effects of high temperatures, extending the seal's service life, and improving the sealing reliability of electronic equipment.

[0020] In some embodiments, along the mating direction of the first limiting groove and the second limiting groove, the outer peripheral wall of the seal has at least two rings of protrusions spaced apart, at least one ring of the protrusions abuts against the groove sidewall of the first limiting groove, and at least another ring of the protrusions abuts against the groove sidewall of the second limiting groove.

[0021] With this configuration, a sealing lip shape is formed between two adjacent rings of protrusions to provide deformation space for each protrusion, and the recess between adjacent protrusions can form a vacuum sealing cavity to further improve the sealing effect of the seal.

[0022] In some embodiments, the electronic device further includes at least two threaded connections;

[0023] At least two threaded blind holes are provided on the outer side wall of the housing surrounding the mounting hole. A through hole is provided on the mating base plate at a position corresponding to each of the threaded blind holes, so that the threaded connector is threadedly connected through the through hole and the corresponding threaded blind hole.

[0024] This design improves the connection strength and reliability between the housing and the heat sink, and facilitates the disassembly of the housing and the heat sink, as well as the maintenance and repair of the heat sink and the circuit board assembly in the housing cavity.

[0025] In some embodiments, the heat-conducting end of the heat sink is a heat-conducting protrusion extending from the mating substrate into the sealed cavity. The side of the heat-conducting protrusion facing the circuit board assembly has a contact plane, and the contact plane is in contact with the heat-generating part of the circuit board assembly through a thermally conductive silicone layer.

[0026] This design allows the heat sink and the thermally conductive silicone layer to be in direct contact, thereby dissipating the heat generated by the heat-generating part to the external environment through direct heat conduction, thus improving the heat dissipation performance of the electronic device. Furthermore, the design of the contact plane increases the contact tightness and thermal conductivity area between the thermally conductive protrusion and the thermally conductive silicone layer, thereby improving the heat dissipation performance and reliability of the electronic device.

[0027] In some embodiments, the surface roughness Ra of the contact plane is less than 0.8 μm.

[0028] This configuration controls the surface roughness of the contact surface, further increasing the thermal conductivity area between the contact surface and the thermally conductive silicone layer, thereby improving the heat dissipation performance of the radiator.

[0029] In some embodiments, the heat sink has a plurality of spaced-apart heat dissipation fins at its heat dissipation end.

[0030] This design increases the heat conduction and convection area between the heat dissipation end and the external environment, thereby improving the heat dissipation efficiency of the heat sink and further enhancing the heat dissipation performance of electronic devices.

[0031] In some embodiments, the coefficient of thermal expansion of the radiator is 20–25 ppm / ℃, and the coefficient of thermal expansion of the housing is 25–30 ppm / ℃; and / or,

[0032] The housing includes a bottom shell and a top cover. The top cover is disposed on the bottom shell and is detachably and sealingly connected to the bottom shell to jointly enclose and form the sealed cavity. The mounting hole is opened on the top cover.

[0033] This design limits the coefficient of thermal expansion of the heat sink and housing, controlling their thermal deformation capabilities, reducing heat sink deformation, minimizing seal compression, and extending the lifespan of the heat sink, housing, and seals, thereby improving the overall lifespan of the electronic equipment. Furthermore, the housing includes a detachable, sealed bottom shell and top cover to ensure the sealing performance of the sealed cavity while facilitating maintenance and repair of the circuit board assemblies within the sealed cavity after disassembly. Attached Figure Description

[0034] To more clearly illustrate the implementation methods in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0035] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of this application from one viewpoint;

[0036] Figure 2 A schematic diagram of the electronic device provided in an embodiment of this application from another perspective;

[0037] Figure 3 A cross-sectional structural schematic diagram of an electronic device provided in an embodiment of this application;

[0038] Figure 4 for Figure 3 A magnified view of a section at point A in the middle;

[0039] Figure 5 An exploded view of an electronic device provided in an embodiment of this application;

[0040] Figure 6 A schematic diagram of the heat sink provided in an embodiment of this application from one view.

[0041] Figure 7 A schematic diagram of the heat sink provided in an embodiment of this application from another perspective;

[0042] Figure 8 A schematic diagram of the structure of the top cover provided in an embodiment of this application;

[0043] Figure 9 for Figure 8 A magnified view of a section at point B in the middle;

[0044] Figure 10 A schematic diagram of the structure of a sealing element provided in an embodiment of this application;

[0045] Figure 11 This is a cross-sectional structural diagram of a sealing element provided in an embodiment of this application.

[0046] Explanation of reference numerals in the attached figures:

[0047] 100 - Electronic devices;

[0048] 110 - Casing;

[0049] 111-Sealed cavity; 112-Mounting hole; 113-First limiting groove;

[0050] 114 - Threaded blind hole; 115 - Bottom shell; 116 - Top cover;

[0051] 120 - Circuit board assembly;

[0052] 121 - Heating element; 122 - Thermally conductive silicone layer;

[0053] 130 - Radiator;

[0054] 131 - Heat-conducting end; 132 - Heat-dissipating end; 133 - Matching substrate;

[0055] 134 - Second limiting groove; 135 - Through hole;

[0056] 1311 - Contact plane;

[0057] 140 - Seal;

[0058] 141 - Protrusion;

[0059] 150 - Threaded connector. Detailed Implementation

[0060] To make the objectives, implementation methods and advantages of this application clearer, the exemplary implementation methods of this application will be clearly and completely described below with reference to the accompanying drawings of the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only some embodiments of this application, and not all embodiments.

[0061] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0062] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclusively include, for example, a product or device that includes a series of components is not necessarily limited to those that are explicitly listed, but may include other components that are not explicitly listed or that are inherent to such product or device.

[0063] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0064] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0065] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0066] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0067] This application provides an electronic device, for example, the electronic device 100 includes, but is not limited to, outdoor displays, industrial control screens, outdoor communication base stations, etc.

[0068] like Figure 1 , Figure 2 and Figure 5 As shown, the electronic device 100 includes a housing 110, a circuit board assembly 120, and a heat sink 130.

[0069] The housing 110 has a sealed cavity 111 inside, the circuit board assembly 120 is disposed in the sealed cavity 111, and the side wall of the housing 110 has a mounting hole 112 communicating with the sealed cavity 111. The mounting hole 112 can provide a window for maintenance and repair of the sealed cavity 111.

[0070] For example, the coefficient of thermal expansion of the housing 110 is 25–30 ppm / ℃, such as 25 ppm / ℃, 26 ppm / ℃, 27 ppm / ℃, 28 ppm / ℃, 29 ppm / ℃, or 30 ppm / ℃, to control the thermal deformation capability of the housing 110, reduce the deformation of the housing 110, and improve the service life of the housing 110, thereby improving the service life of the electronic device 100. The housing 110 is made of a polymer alloy material formed by physical blending or chemical grafting of 70% polycarbonate (PC) with acrylonitrile, butadiene, and styrene copolymer (ABS), and 30% glass fiber (GF).

[0071] Furthermore, such as Figure 3 and Figure 5As shown, the housing 110 includes a bottom shell 115 and a top cover 116. The top cover 116 is disposed on the bottom shell 115 and is detachably and sealingly connected to the bottom shell 115 to jointly enclose a sealed cavity 111. A mounting hole 112 is formed on the top cover 116. The detachable and sealing connection between the bottom shell 115 and the top cover 116 ensures the sealing performance of the sealed cavity 111 while facilitating maintenance and repair of the circuit board assembly 120 inside the sealed cavity 111 after disassembly.

[0072] For example, the detachable connection between the bottom shell 115 and the top cover 116 can be a bolt hole connection, a magnetic connection, a snap-fit ​​connection, etc.; and a sealing ring is provided between the two to improve the sealing performance between them and prevent dust and moisture from entering the sealing cavity 111. The material of the sealing ring can be fluorosilicone rubber, nitrile rubber, EPDM rubber, silicone rubber, polyurethane rubber, etc.

[0073] And such Figure 4 and Figure 5 As shown, the circuit board assembly 120 includes a board body and heat-generating components disposed on the board body. The heat-generating components include, but are not limited to, light sources, power supplies, processors, terminals, etc. These heat-generating components together form the heat-generating part 121 of the circuit board assembly 120.

[0074] Combination Figure 4 and Figure 5 As shown, the heat sink 130 passes through the mounting hole 112 and has a heat-conducting end 131 located inside the sealed cavity 111 and a heat-dissipating end 132 exposed outside the sealed cavity 111. The heat-conducting end 131 contacts the heat-generating part 121 of the circuit board assembly 120. For example, the material of the heat sink 130 can be aluminum, aluminum alloy, magnesium alloy, titanium alloy, etc., and the manufacturing process can be die casting, extrusion molding, etc. The coefficient of thermal expansion of the heat sink 130 is 20 to 25 ppm / ℃, for example, 20 ppm / ℃, 21 ppm / ℃, 22 ppm / ℃, 23 ppm / ℃, 24 ppm / ℃, 25 ppm / ℃, etc., to control the thermal deformation capability of the heat sink 130, reduce the deformation of the heat sink 130, and improve the service life of the heat sink 130, thereby improving the service life of the electronic device 100.

[0075] And combined Figure 4 and Figure 5 As shown, thermally conductive silicone is coated on the side of the heat-generating part 121 facing the heat sink 130 in the circuit board assembly 120 to form a thermally conductive silicone layer 122, so that the heat emitted by the heat-generating part 121 on the circuit board assembly 120 can be transferred to the heat sink 130 through the thermally conductive silicone layer 122, thereby increasing the thermally conductive area between the heat-generating part 121 and the circuit board assembly 120.

[0076] Furthermore, in combination Figure 4 , Figure 6 and Figure 7 As shown, the heat-conducting end 131 of the heat sink 130 is a heat-conducting protrusion extending from the mating substrate 133 into the sealed cavity 111. The side of the heat-conducting protrusion facing the circuit board assembly 120 has a contact plane 1311, which contacts the heat-generating part 121 of the circuit board assembly 120 through a thermally conductive silicone layer 122. The provision of the heat-conducting protrusion allows the heat sink 130 and the thermally conductive silicone layer 122 to be in direct contact, thereby dissipating the heat generated by the heat-generating part 121 to the external environment through direct heat conduction, thus improving the heat dissipation performance of the electronic device 100. The contact surface between the heat-conducting protrusion and the thermally conductive silicone layer 122 is the contact plane 1311, which improves the contact tightness and heat conduction area between the heat-conducting protrusion and the thermally conductive silicone layer 122, thereby improving the heat conduction efficiency. Furthermore, the provision of the contact plane 1311 reduces the manufacturing difficulty by processing the contact surface of the heat sink 130 into an uneven contact surface that matches the heat-generating part 121.

[0077] For example, the surface roughness Ra of the contact plane 1311 is less than 0.8 μm, such as 0.7 μm, 0.6 μm, 0.5 μm, etc., to control the surface roughness of the contact plane 1311, thereby further improving the thermal conductivity area between the contact plane 1311 and the thermally conductive silicone layer 122, and further improving the heat dissipation performance of the heat sink 130. During the preparation of the contact plane 1311, the flatness of the contact plane 1311 can be improved by fine grinding.

[0078] like Figure 4 , Figure 6 and Figure 7 As shown, the heat dissipation end 132 of the heat sink 130 has multiple spaced heat dissipation fins to increase the heat conduction and convection area between the heat dissipation end 132 and the external environment, thereby increasing the heat dissipation efficiency of the heat sink 130 and further improving the heat dissipation performance of the electronic device 100. For example, the number of heat dissipation fins can be 10, 20, 25, 30, etc., which can be selected according to the size of the electronic device 100 and the required heat dissipation.

[0079] In addition, such as Figure 4 and Figure 5 As shown, the electronic device 100 also includes a seal 140.

[0080] The sealing element 140 is disposed between the radiator 130 and the housing 110, that is, between the radiator 130 and the top cover 116, and extends circumferentially along the mounting hole 112. It is used to seal the gap at the mating point of the radiator 130 and the housing 110, thereby improving the sealing performance between the radiator 130 and the housing 110 and compensating for the impact of the mounting hole 112 on the sealing performance of the sealing cavity 111.

[0081] For example, the material of the seal 140 can be fluorosilicone rubber, nitrile rubber, EPDM rubber, silicone rubber, polyurethane rubber, etc.

[0082] It should be noted that the pre-compression of the seal 140 is the product of the difference in thermal expansion coefficients between the radiator 130 and the housing 110, the temperature difference caused by the temperature change in the environment where the seal 140 is located, and the length of the seal 140. The addition of glass fiber to the housing 110 can reduce the thermal expansion coefficient of the housing 110, thereby reducing the difference in expansion coefficients between the housing 110 and the radiator 130, thus reducing the pre-compression of the seal 140, reducing the occurrence of sealing failure of the seal 140, and improving the sealing performance of the seal 140.

[0083] In this embodiment, by providing a heat sink 130 in the electronic device 100, with the heat-conducting end 131 of the heat sink 130 disposed within the sealed cavity 111 and the heat-dissipating end 132 of the heat sink 130 exposed to the external environment, the heat dissipated by the heat-generating part 121 of the electronic device 100 can not only be indirectly conducted to the external environment through the housing 110, but also directly conducted to the external environment through the heat sink 130, thus expanding the heat dissipation dimension and preventing heat accumulation in the sealed cavity 111 of the electronic device 100, thereby improving the heat dissipation efficiency of the electronic device 100; and by providing a sealing element 140 between the heat sink 130 and the housing 110, the sealing performance between the heat sink 130 and the housing 110 is improved, thereby simultaneously improving the heat dissipation performance and sealing performance of the electronic device 100, and thus simultaneously improving the heat dissipation reliability and sealing reliability of the electronic device 100.

[0084] In some embodiments, the seal 140 is disposed between the heat sink 130 and the peripheral wall of the mounting hole 112 to seal the gap between the heat sink 130 and the peripheral wall of the mounting hole 112. This improves the sealing performance between the heat sink 130 and the mounting hole 112 and can adaptively fill the offset gap between them caused by processing or installation, thereby further improving the sealing reliability of the electronic device 100.

[0085] In other embodiments, combined with Figure 5 , Figure 6 and Figure 7 As shown, the heat dissipation end 132 of the heat sink 130 has a mating substrate 133 on the side near the housing 110. The mating substrate 133 is located outside the housing 110 and is attached to the outer side wall of the housing 110. For example, the mating substrate 133 has a mating plane, which is attached to the outer side wall of the housing 110, thereby increasing the contact area between the two and improving the mating strength between them.

[0086] Furthermore, such as Figure 5As shown, the electronic device 100 also includes at least two threaded connectors 150. For example, the electronic device 100 includes two, four, six, eight, or other threaded connectors 150, and the threaded connectors 150 are bolts. Figure 8 and Figure 9 As shown, the housing 110, such as the top cover 116, has at least two threaded blind holes 114 on its outer side wall surrounding the mounting hole 112. Corresponding to each threaded blind hole 114, through holes 135 are provided on the base plate 133, allowing the threaded connector 150 to be threadedly connected to the corresponding threaded blind hole 114 via the through hole 135, thereby fixing the heat sink 130 to the housing 110 and improving connection strength and reliability. This also facilitates disassembly of the housing 110 and the heat sink 130, and facilitates maintenance and repair of the heat sink 130 and the circuit board assembly 120 within the accommodating cavity.

[0087] It should be noted that the number of threaded connectors 150, threaded blind holes 114, and through holes 135 is the same in the electronic device 100.

[0088] In addition, the seal 140 is disposed between the mating substrate 133 and the outer side wall of the housing 110 to seal the gap between the mating substrate 133 and the corresponding outer side wall of the housing 110. This avoids direct contact between the seal 140 and the sealing cavity 111 of the housing 110, thereby preventing the heat generated in the heating part 121 on the circuit board assembly 120 from directly contacting the seal 140, reducing the impact of high temperature on the seal 140, preventing the seal 140 from failing, and thus improving the service life of the seal 140 and improving the sealing reliability of the electronic device 100.

[0089] Furthermore, in combination Figure 4 , Figure 8 and Figure 9 As shown, an annular first limiting groove 113 is formed on the outer side wall of the housing 110 around the mounting hole 112, which is combined with Figure 4 and Figure 6 As shown, a second annular limiting groove 134 is correspondingly formed on the mating base plate 133 of the heat sink 130; combined with Figure 4 and Figure 5As shown, when the mating substrate 133 is attached to the outer wall of the housing 110, the sealing member 140 is located in the space formed by the mating of the first limiting groove 113 and the second limiting groove 134, and abuts against the groove walls of the first limiting groove 113 and the second limiting groove 134 respectively. The first limiting groove 113 and the second limiting groove 134 are provided to form an installation space for the sealing member 140, which not only fixes the sealing member 140, but also restricts the deformation of the sealing member 140, thereby further reducing the sealing failure rate of the sealing member 140 and improving the sealing reliability of the electronic device 100; and further protecting the sealing member 140 to avoid the influence of high temperature on the sealing member 140, thereby improving the service life of the sealing member 140 and improving the sealing reliability of the electronic device 100.

[0090] Furthermore, combining Figure 4 , Figure 10 and Figure 11 As shown, along the mating direction of the first limiting groove 113 and the second limiting groove 134, the outer peripheral wall of the sealing member 140 has at least two rings of protrusions 141 spaced apart. At least one ring of protrusions 141 abuts against the groove sidewall of the first limiting groove 113, and at least another ring of protrusions 141 abuts against the groove sidewall of the second limiting groove 134. In this way, a sealing lip shape is formed between two adjacent rings of protrusions 141 to provide deformation space for each protrusion 141. In addition, the recess between adjacent protrusions 141 can form a vacuum sealing cavity 111 to further improve the sealing effect of the sealing member 140.

[0091] For example, such as Figure 10 and Figure 11 As shown, the seal 140 is a fluorosilicone rubber sealing ring with an X-shaped cross-section, so that the seal 140 has two spaced-apart protrusions 141, with a compression ratio ranging from 25% to 30% and a permanent deformation of less than 8%. Of course, the cross-sectional shape of the seal 140 can also be multiple X-shaped sealing rings arranged side by side, so that the seal 140 has three, four, five, six, seven, or other numbers of spaced-apart protrusions 141.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0093] For ease of explanation, the above description has been provided in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Various modifications and variations can be obtained based on the above teachings. The selection and description of the above embodiments are for the purpose of better explaining the principles and practical applications, thereby enabling those skilled in the art to better utilize the described embodiments and various different variations of embodiments suitable for specific use considerations.

Claims

1. An electronic device, characterized in that, include: The housing has an internally defined sealing cavity, and the side wall of the housing has an installation hole communicating with the sealing cavity; A circuit board assembly is disposed within the sealed cavity; A heat sink is provided through the mounting hole, and the heat sink has a heat-conducting end located inside the sealed cavity and a heat-dissipating end exposed outside the sealed cavity, the heat-conducting end being in contact with the heat-generating part of the circuit board assembly; A sealing element is disposed between the radiator and the housing and extends circumferentially along the mounting hole to seal the gap at the mating point of the radiator and the housing.

2. The electronic device according to claim 1, characterized in that, The sealing element is disposed between the heat sink and the peripheral wall of the mounting hole to seal the gap between the heat sink and the peripheral wall of the mounting hole.

3. The electronic device according to claim 1, characterized in that, The heat dissipation end of the radiator has a mating base plate on the side near the housing, and the mating base plate is located outside the housing and is attached to the outer side wall of the housing; The sealing element is disposed between the mating substrate and the outer side wall of the housing to seal the gap between the mating substrate and the corresponding outer side wall of the housing.

4. The electronic device according to claim 3, characterized in that, The outer wall of the housing has an annular first limiting groove around the mounting hole, and the mating base plate of the heat sink has a corresponding annular second limiting groove. When the mating substrate is attached to the outer wall of the housing, the sealing element is located in the space formed by the docking of the first limiting groove and the second limiting groove, and abuts against the groove walls of the first limiting groove and the second limiting groove respectively.

5. The electronic device according to claim 4, characterized in that, Along the docking direction of the first limiting groove and the second limiting groove, the outer peripheral wall of the seal has at least two rings of protrusions spaced apart. At least one ring of the protrusions abuts against the groove sidewall of the first limiting groove, and at least the other ring of the protrusions abuts against the groove sidewall of the second limiting groove.

6. The electronic device according to any one of claims 3-5, characterized in that, The electronic device also includes at least two threaded connections; At least two threaded blind holes are provided on the outer side wall of the housing surrounding the mounting hole. A through hole is provided on the mating base plate at a position corresponding to each of the threaded blind holes, so that the threaded connector is threadedly connected through the through hole and the corresponding threaded blind hole.

7. The electronic device according to any one of claims 3-5, characterized in that, The heat-conducting end of the heat sink is a heat-conducting protrusion extending from the mating substrate into the sealed cavity. The side of the heat-conducting protrusion facing the circuit board assembly has a contact plane, and the contact plane is in contact with the heat-generating part of the circuit board assembly through a thermally conductive silicone layer.

8. The electronic device according to claim 7, characterized in that, The surface roughness Ra of the contact plane is less than 0.8 μm.

9. The electronic device according to any one of claims 1-5, characterized in that, The heat dissipation end of the radiator has multiple heat dissipation fins arranged at intervals.

10. The electronic device according to any one of claims 1-5, characterized in that, The coefficient of thermal expansion of the radiator is 20–25 ppm / ℃, and the coefficient of thermal expansion of the casing is 25–30 ppm / ℃; and / or, The housing includes a bottom shell and a top cover. The top cover is disposed on the bottom shell and is detachably and sealingly connected to the bottom shell to jointly enclose and form the sealed cavity. The mounting hole is opened on the top cover.

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