A device for improving the conductivity of clamps in horizontal pulse electroplating equipment

Abstract

This utility model discloses an improved conductivity device for clamps in horizontal pulse electroplating equipment, belonging to the technical field of horizontal electroplating equipment. It includes a turntable, multiple clamp bodies, and a dust collection mechanism. The clamp bodies are installed around the turntable, and each clamp body is equipped with a slider. A copper cylinder guide rail, which works in conjunction with the slider, is provided on one side of the turntable. By using corrosion-resistant heat-shrink tubing as the protective sleeve, the wires can be physically isolated and protected. By installing the dust collection mechanism at both ends of the copper cylinder guide rail, the dust inside the copper cylinder guide rail is carried by the slider to the dust collection mechanism for collection and cleaning. This ensures that there is no obvious dust inside the copper cylinder guide rail, resulting in good contact between the slider and the copper cylinder guide rail, guaranteeing stable current in the clamp body, and extending the service life of the slider and the copper cylinder guide rail, thus achieving a good effect in improving the conductivity of the clamps in horizontal pulse electroplating equipment.

Description

Technical Field

[0001] This utility model belongs to the technical field of horizontal electroplating equipment, specifically relating to a device for improving the conductivity of clamps in horizontal pulse electroplating equipment. Background Technology

[0002] Electroplating is a crucial process technology in printed circuit board (PCB) manufacturing. This technology enables electrical connections between different layers of the PCB, provides good conductivity, improves reliability, mechanical strength, solderability, corrosion resistance, and yield. Horizontal pulse electroplating equipment is a core component of high-end PCB manufacturing. Through the deep integration of pulse current technology and a horizontal conveyor system, it significantly improves the uniformity and reliability of plating layers on high-density interconnect (HDI) boards, carrier boards, and thick copper plates. For designs with fine conductors and narrow spacing, horizontal electroplating can precisely control the copper thickness of the lines, meeting the impedance consistency requirements of high-frequency signal transmission (e.g., reducing impedance fluctuations by 20% on G communication boards) and enhancing pad solderability. The core of the horizontal pulse electroplating equipment is the copper plating tank, which mainly consists of a pulse power supply, fixtures, and a titanium basket. After the PCB enters the copper tank, it is conveyed by inlet rollers to the fixture, where it runs through the copper until it exits. After copper plating, it is then conveyed back to the rollers.

[0003] However, the existing horizontal pulse electroplating equipment fixture conductive device has the following defects: 1. During use, the copper cylinder contains strong copper sulfate corrosion, which, under certain temperature conditions, corrodes the surrounding copper metal and wires. The copper wires on the fixture are easily damaged by corrosion, leading to poor contact and poor conductivity. 2. Existing horizontal pulse electroplating equipment lacks a dust recovery device in its fixture conductive device, resulting in significant dust accumulation on the copper cylinder guide rails. This severely damages the copper rails and fixture sliders, significantly impacting their lifespan and causing poor contact between the fixture slider and guide rails. Due to the large fixture current, this can easily lead to sparking and large current fluctuations. Therefore, to address the above problems, an improved conductive device for the horizontal pulse electroplating equipment fixture is proposed. Summary of the Invention

[0004] The purpose of this invention is to provide an improved conductive device for the fixture of a horizontal pulse electroplating equipment. By installing dust collection mechanisms at both ends of the copper cylinder guide rail, the dust inside the copper cylinder guide rail can be carried to the dust collection mechanism by the slider. The dust collection mechanism collects and cleans the dust, ensuring that there is no obvious dust inside the copper cylinder guide rail, thus ensuring good contact between the slider and the copper cylinder guide rail. This guarantees the stability of the main current of the fixture and extends the service life of the slider and the copper cylinder guide rail, achieving a good effect in improving the conductivity of the fixture of the horizontal pulse electroplating equipment, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An improved conductive device for clamps in horizontal pulse electroplating equipment includes a turntable, multiple clamp bodies, and a dust recovery mechanism; Multiple clamp bodies are installed around the turntable, and each clamp body is equipped with a slider. A copper cylinder guide rail that cooperates with the slider is provided on one side of the turntable. The dust recovery mechanism is located at the input and output ends of the copper cylinder guide rail.

[0006] Preferably, the turntable has limit grooves at both ends on one side, and the dust collection mechanism is installed in the limit grooves.

[0007] Preferably, a wire is installed at the upper end of the clamp body. The wire is made of copper wire and a protective sleeve is fitted on the surface of the wire. The protective sleeve is a corrosion-resistant heat-shrink tubing.

[0008] Preferably, the dust collection mechanism includes a dust collection box one and a dust collection box two. The dust collection box one is installed in the limiting groove at the input end of the copper cylinder guide rail, and the dust collection box two is installed in the limiting groove at the output end of the copper cylinder guide rail.

[0009] Preferably, both the first dust collection box and the second dust collection box are L-shaped. One end of the first dust collection box and the second dust collection box are horizontally engaged in the limiting groove, and the other end of the first dust collection box and the second dust collection box are engaged in the inner side of the turntable and extend towards the inner side of the turntable.

[0010] Preferably, one end of the dust collection box is cut into the limiting groove and has a collection slot. A guide hole is provided at a symmetrical position in the collection slot. The other end of the dust collection box is fixedly connected to a vacuum pipe. The lower end of the vacuum pipe is connected to the guide hole.

[0011] Preferably, the dust collection box 2 has a collection slot 2 at one end that is snapped into the limiting groove, and a guide hole 2 is provided at a symmetrical position inside the collection slot 2. The other end of the dust collection box 2 is fixedly connected to a vacuum pipe 2, and the lower end of the vacuum pipe 2 communicates with the guide hole 2. Preferably, a limiting ring is fixedly connected to the lower end of the inner wall of vacuum pipe one and vacuum pipe two, and the limiting ring is located above guide hole one and guide hole two. Preferably, the outer edges of the upper ports of vacuum pipe one and vacuum pipe two are arc-shaped, and the diameters of vacuum pipe one and vacuum pipe two are set to 50 mm.

[0012] The present invention provides an improved conductive device for the fixture of a horizontal pulse electroplating equipment, which has the following advantages compared with the prior art: 1. This utility model provides a protective sleeve for the wires used on the fixture body. By using corrosion-resistant heat-shrink tubing as the protective sleeve, the wires can be physically isolated and protected. The addition of the protective sleeve not only increases the service life of the wires but also improves the conductivity of the fixture body. 2. This utility model, by installing dust collection mechanisms at both ends of the copper cylinder guide rail, can bring the dust inside the copper cylinder guide rail to the dust collection mechanism through the slider. The dust collection mechanism collects and cleans the dust, ensuring that there are no obvious dust particles inside the copper cylinder guide rail. This ensures good contact between the slider and the copper cylinder guide rail, guarantees the stability of the main current of the fixture, and extends the service life of the slider and the copper cylinder guide rail, thus achieving a good effect of improving the conductivity of the fixture in the horizontal pulse electroplating equipment. Attached Figure Description

[0013] Figure 1 This is a flowchart of the present invention; Figure 2 This is a schematic diagram of the main structure of the turntable and clamp of this utility model; Figure 3 This is a schematic diagram of the dust collection box of this utility model; Figure 4 This is a schematic diagram of the dust collection box of this utility model. Figure 5 This is a partial cross-sectional view of the wire and protective sleeve structure of this utility model.

[0014] In the diagram: 1. Turntable; 2. Fixture body; 3. Dust collection mechanism; 31. Dust collection box one; 311. Collection slot one; 312. Guide hole one; 313. Vacuum pipe one; 32. Dust collection box two; 321. Collection slot two; 322. Guide hole two; 323. Vacuum pipe two; 4. Slider; 5. Copper cylinder guide rail; 6. Limiting groove; 7. Wire; 8. Protective sleeve; 9. Limiting ring. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The specific embodiments described herein are only used to explain the present utility model and are not intended to limit the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] This utility model provides, for example Figures 1-5 The invention shown is a device for improving the conductivity of clamps in a horizontal pulse electroplating equipment, comprising a turntable 1, multiple clamp bodies 2, and a dust collection mechanism 3; Multiple clamp bodies 2 are installed around the turntable 1. Each clamp body 2 is equipped with a slider 4. A copper cylinder guide rail 5 that works with the slider 4 is provided on one side of the turntable 1. The dust collection mechanism 3 is located at the input and output ends of the copper cylinder guide rail 5.

[0017] Limiting grooves 6 are provided at both ends on one side of the turntable 1, and the dust collection mechanism 3 is installed in the limiting grooves 6. Before installing the dust collection mechanism 3, the limiting grooves 6 (pre-set installation grooves) at both ends on the turntable 1 near the copper cylinder guide rail 5 are positioned first, and then the corresponding parts of the dust collection mechanism 3 (such as the dust collection box) are accurately inserted into the limiting grooves 6. The dust collection mechanism 3 is fixed by the structural constraint of the limiting grooves 6. When the equipment is running, the turntable 1 rotates continuously and the slider 4 slides along the guide rail. Under the fixing action of the limiting grooves 6, the dust collection mechanism 3 always remains at the preset position at the input end and output end of the copper cylinder guide rail 5, and will not be displaced due to equipment vibration or component movement. During the operation of the horizontal pulse electroplating equipment, the conductive device is first integrated into the copper plating tank area of ​​the equipment. Multiple clamp bodies 2 are evenly installed around the turntable 1 to hold the PCB board to be electroplated. After the equipment is started, the turntable 1 drives the clamp bodies 2 around it to rotate synchronously. The slider 4 on each clamp body 2 will slide stably along the copper tank guide rail 5 preset on one side of the turntable 1. The PCB board enters the copper tank with the clamp body 2 to complete the copper plating process. At the same time, the dust collection mechanism 3 at the input end (the end where the PCB board enters the guide rail) and the output end (the end where the PCB board leaves the guide rail) of the copper tank guide rail 5 are started synchronously to treat the dust in the guide rail area in real time. The core defect of the existing horizontal pulse electroplating equipment's clamp conductive device lacking a dust collection device has been solved. By setting a dust collection mechanism 3 at a key position on the guide rail, the dust generated by the copper cylinder guide rail 5 can be actively handled, avoiding dust accumulation. Ensure good contact between slider 4 and copper cylinder guide rail 5 to prevent large fluctuations in spark current caused by poor contact, ensure stable current transmission in fixture body 2, and thus improve the uniformity of PCB board plating (such as meeting the impedance consistency requirements for high-frequency signal transmission). Extend the service life of slider 4 and copper cylinder guide rail 5, and reduce the frequency of component replacement due to wear caused by dust.

[0018] A wire 7 is installed at the upper end of the fixture body 2. The wire 7 is made of copper wire, and a protective sleeve 8 is sleeved on the surface of the wire 7. The protective sleeve 8 is a corrosion-resistant heat shrink tubing. When assembling the fixture body 2, a copper wire conductor 7 is connected to the conductive interface at the upper end of the fixture body 2 to transmit the pulse current required for electroplating. Then, a corrosion-resistant heat-shrinkable sleeve (protective sleeve 8) is fitted onto the surface of the conductor 7, and the heat-shrinkable sleeve is heated to make it fit tightly against the surface of the conductor 7. When the equipment is running, the fixture body 2 carries the conductor 7 into the copper tank. The copper sulfate solution (which is highly corrosive) in the copper tank comes into direct contact with the protective sleeve 8 on the surface of the conductor 7. The protective sleeve 8 isolates the copper wire conductor 7 from the corrosive environment, solving the problem that the copper conductor 7 of the existing fixture is easily corroded and damaged by copper sulfate. The corrosion-resistant heat-shrinkable sleeve forms a physical isolation barrier, effectively resisting the corrosion of copper sulfate and preventing the conductor 7 from breaking or becoming in poor contact due to corrosion.

[0019] The dust collection mechanism 3 includes a dust collection box 31 and a dust collection box 32. The dust collection box 31 is installed in the limiting groove 6 at the input end of the copper cylinder guide rail 5, and the dust collection box 32 is installed in the limiting groove 6 at the output end of the copper cylinder guide rail 5. When installing the dust collection mechanism 3, dust collection box 1 31 is installed in the limiting groove 6 at the input end of the copper cylinder guide rail 5, and dust collection box 2 32 is installed in the limiting groove 6 at the output end of the guide rail. When the equipment is running, when the slider 4 carries the PCB board into the guide rail input end (before electroplating begins), the dust carried on the surface of the slider 4 or the dust accumulated at the input end of the copper cylinder guide rail 5 will fall into dust collection box 1 31. When the slider 4 carries the electroplated PCB board out of the output end of the copper cylinder guide rail 5, the dust generated by the friction of the slider 4 at the output end of the copper cylinder guide rail 5 or the residual dust on the surface will fall into dust collection box 2 32, realizing dust collection throughout the input-output process. To prevent dust from accumulating at both ends of the guide rail and causing slider 4 to jam, ensure the smooth sliding of slider 4 throughout the guide rail, and reduce PCB board damage caused by slider 4 jamming. This further reduces the wear of dust on slider 4 and guide rail, extending their service life, while also reducing the impact of dust entering the copper tank on the purity of the plating solution and improving the electroplating yield.

[0020] Dust collection box 1 31 and dust collection box 2 32 are both L-shaped. One end of dust collection box 1 31 and dust collection box 2 32 is horizontally engaged in the limiting groove 6, and the other end of dust collection box 1 31 and dust collection box 2 32 is engaged in the inner side of turntable 1 and extends into the inner side of turntable 1. When installing dust collection boxes 31 and 32, their L-shaped structure is utilized: the lateral ends (long sides) of dust collection boxes 31 and 32 are precisely inserted into the limiting grooves 6 of the turntable 1 to achieve lateral fixation; the longitudinal ends (short sides) of dust collection boxes 31 and 32 are extended inwards towards the turntable 1, making them close to the contact area between the slider 4 and the guide rail; when the equipment is running, the dust generated by the sliding of the slider 4 will fall directly into the corner collection area of ​​the L-shaped structure due to gravity, the push of the slider 4, or the spring on the clamp body 2. The extended longitudinal ends can cover the area below the sliding path of the slider 4, preventing dust leakage.

[0021] The dust collection box 31 is snapped into the limiting groove 6 at one end with a beveled surface and a collection slot 311. A guide hole 312 is provided at a symmetrical position in the collection slot 311. The other end of the dust collection box 31 is fixedly connected to a vacuum pipe 313. The lower end of the vacuum pipe 313 is connected to the guide hole 312. When the slider 4, carrying the PCB board, enters from the input end of the copper cylinder guide rail 5, the dust carried on its surface slides into the collection slot 311. The guide hole 312 in the collection slot 311 is connected to the vacuum pipe 313 at the other end of the dust collection box. After the external vacuum equipment is started, the guide hole 312 generates negative pressure, which draws the dust in the collection slot 311 into the vacuum pipe 313, and finally discharges it through the vacuum equipment. The angle of the bevel (adapted to the sliding direction of slider 4) can guide slider 4 to naturally enter the copper cylinder guide rail 5.

[0022] The dust collection box 2 32 is snapped into the limiting groove 6. One end of the dust collection box 2 32 has a collection slot 2 321. A guide hole 2 322 is opened at a symmetrical position in the collection slot 2 321. The other end of the dust collection box 2 32 is fixedly connected to a vacuum pipe 2 323. The lower end of the vacuum pipe 2 323 is connected to the guide hole 2 322. When slider 4 exits from the output end of copper cylinder guide rail 5, the new dust generated by the friction of slider 4 at the output end of the guide rail, as well as the dust formed after the plating solution on the surface of slider 4 dries, will fall directly into the collection slot 321 of dust collection box 32. The guide hole 322 in the collection slot 321 is connected to the vacuum pipe 323. The external vacuum equipment generates negative pressure at the guide hole 322 through the vacuum pipe 323, which quickly sucks the dust in the slot into the pipe, thus completing the complete recovery of the dust at the output end. Since the dust at the output end may be mixed with a small amount of plating solution residue, the aperture of the guide hole 322 is designed to accommodate the mixture of dust and a small amount of liquid to avoid clogging. The cooperation between the second guide hole 322 and the second vacuum pipe 323 ensures that dust does not accumulate at the output end, maintains the smooth sliding of the slider 4 at the output end, avoids the slider 4 from getting stuck due to dust accumulation, and ensures the stability of PCB board transmission.

[0023] A limiting ring 9 is fixedly connected to the lower end of the inner wall of vacuum pipe 1 313 and vacuum pipe 2 323. The limiting ring 9 is located above the flow guide hole 1 312 and flow guide hole 2 322. When vacuum pipe 1 313 and vacuum pipe 2 323 are connected to external vacuum equipment, they prevent the pipes on the external vacuum equipment from being excessively inserted into vacuum pipe 1 313 and vacuum pipe 2 323, and avoid blocking the flow guide hole 1 312 and flow guide hole 2 322, thus providing a limiting function.

[0024] The outer edges of the upper ports of vacuum pipe 1 313 and vacuum pipe 2 323 are arc-shaped, and the diameter of vacuum pipe 1 313 and vacuum pipe 2 323 is set to 50 mm; When connecting vacuum pipe 313 and vacuum pipe 323 to external vacuum equipment, the arc-shaped outer edge of the pipe port can prevent operators from being scratched by sharp edges during installation. At the same time, the arc-shaped structure has a higher fit with the interface of the vacuum equipment, which facilitates quick alignment and connection and reduces installation time. The 50mm pipe diameter, after flow calculation, can ensure that dust (including a small amount of dust clumps mixed with plating solution) can pass through the pipe smoothly. It will not cause dust blockage due to the pipe being too thin, nor will it affect the dust collection effect due to insufficient negative pressure caused by the pipe being too thick.

[0025] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for improving the conductivity of clamps in horizontal pulse electroplating equipment, characterized in that: It includes a turntable (1), multiple clamp bodies (2) and a dust collection mechanism (3); Multiple clamp bodies (2) are installed around the turntable (1), and each clamp body (2) is equipped with a slider (4). A copper cylinder guide rail (5) that cooperates with the slider (4) is provided on one side of the turntable (1). The dust recovery mechanism (3) is located at the input and output ends of the copper cylinder guide rail (5).

2. The device for improving the conductivity of a clamp in a horizontal pulse electroplating equipment according to claim 1, characterized in that: Limiting grooves (6) are provided at both ends of one side of the turntable (1), and the dust collection mechanism (3) is installed in the limiting grooves (6).

3. The device for improving the conductivity of a clamp in a horizontal pulse electroplating equipment according to claim 2, characterized in that: The upper end of the fixture body (2) is equipped with a wire (7), which is made of copper wire. A protective sleeve (8) is fitted on the surface of the wire (7), which is a corrosion-resistant heat shrink tubing.

4. The device for improving the conductivity of a clamp in a horizontal pulse electroplating equipment according to claim 3, characterized in that: The dust collection mechanism (3) includes a dust collection box one (31) and a dust collection box two (32). The dust collection box one (31) is installed in the limiting groove (6) at the input end of the copper cylinder guide rail (5), and the dust collection box two (32) is installed in the limiting groove (6) at the output end of the copper cylinder guide rail (5).

5. The device for improving the conductivity of a clamp in a horizontal pulse electroplating equipment according to claim 4, characterized in that: Both the first dust collection box (31) and the second dust collection box (32) are L-shaped. One end of the first dust collection box (31) and the second dust collection box (32) is horizontally engaged in the limiting groove (6), and the other end of the first dust collection box (31) and the second dust collection box (32) is engaged in the inner side of the turntable (1) and extends towards the inner side of the turntable (1).

6. The device for improving the conductivity of a clamp in a horizontal pulse electroplating equipment according to claim 5, characterized in that: The dust collection box (31) is snapped into the limiting groove (6) at one end with a beveled surface and a collection slot (311). A guide hole (312) is provided at a symmetrical position in the collection slot (311). The other end of the dust collection box (31) is fixedly connected to a vacuum pipe (313). The lower end of the vacuum pipe (313) is connected to the guide hole (312).

7. The device for improving the conductivity of a clamp in a horizontal pulse electroplating equipment according to claim 6, characterized in that: The dust collection box (32) is snapped into the limiting groove (6) at one end and has a collection slot (321) at one end. A guide hole (322) is provided at a symmetrical position in the collection slot (321). A vacuum pipe (323) is fixedly connected to the other end of the dust collection box (32). The lower end of the vacuum pipe (323) is connected to the guide hole (322).

8. The device for improving the conductivity of a clamp in a horizontal pulse electroplating equipment according to claim 7, characterized in that: A limiting ring (9) is fixedly connected to the lower end of the inner wall of the first vacuum pipe (313) and the second vacuum pipe (323), and the limiting ring (9) is located above the first guide hole (312) and the second guide hole (322).

9. The device for improving the conductivity of a clamp in a horizontal pulse electroplating equipment according to claim 8, characterized in that: The outer edges of the upper ports of the first vacuum pipe (313) and the second vacuum pipe (323) are arc-shaped, and the diameters of the first vacuum pipe (313) and the second vacuum pipe (323) are 50 mm.

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