High depth wear resistant laser welded diamond saw blade

Abstract

The utility model relates to diamond saw blade technical field, concretely is a kind of high-depth wear-resistant laser welding diamond saw blade, for improving the heat dissipation, chip removal effect in the work of saw blade and providing installation state indication.The saw blade includes matrix, the mounting hole is equipped in matrix center, outer edge is equipped with cutting face, matrix is opened and is equipped with the chip removal hole I and chip removal hole II of intercommunication, two side surfaces are equipped with annular chip pocket and oblique groove respectively, each groove is connected with chip removal hole II to form chip removal passage;The matrix two sides are also equipped with annular groove, its inside is equipped with indicating component, the component contains the pressing block that can be pushed by pressing plate, connecting plate with marking block and compression spring, and the pressing degree of pressing plate is reflected by the position change of marking block.The structure helps to improve the efficiency of chip removal and heat dissipation, while can be directly judged installation state, is favorable for extending saw blade life and guaranteeing operation safety.

Description

Technical Field

[0001] This utility model relates to the field of diamond saw blade technology, and in particular to a high-depth wear-resistant laser-welded diamond saw blade. Background Technology

[0002] In traditional diamond saw blade applications, especially in the field of high-depth wear-resistant laser-welded diamond saw blades, several problems urgently need to be addressed. On the one hand, saw blades generate a large amount of heat and chips during operation. However, the heat dissipation and chip removal structures of traditional saw blades are not adequately designed. Poor heat dissipation leads to excessively high saw blade temperatures, accelerating wear and reducing service life. Inadequate chip removal causes chips to accumulate at the cutting edge, affecting cutting accuracy and efficiency, and even potentially causing safety accidents. Furthermore, there is a lack of effective monitoring methods for the condition of the saw blade after installation, such as whether the pressure plate is tightly installed and whether the base is loose. This makes it difficult to detect and address problems early, posing potential risks to the stable operation of the equipment. Therefore, developing a high-depth wear-resistant laser-welded diamond saw blade with installation direction indication, excellent heat dissipation and chip removal performance, and installation status monitoring functions is of significant practical importance. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing saw blades, which generate a large amount of heat and chips during operation. Traditional saw blades suffer from inadequate heat dissipation and chip removal structures, leading to excessively high blade temperatures, accelerated wear, and reduced service life. Poor chip removal causes chip accumulation at the cutting edge, affecting cutting accuracy and efficiency, and even potentially causing safety accidents. Furthermore, the invention lacks effective monitoring methods for the condition of the saw blade after installation, such as the tightness of the pressure plate and the looseness of the base. Therefore, this invention proposes a high-depth wear-resistant laser-welded diamond saw blade.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A high-depth wear-resistant laser-welded diamond saw blade includes a base body with a mounting hole at its center and a cutting surface at its outer edge. The base body has several chip removal holes I extending from its outer wall and several chip removal holes II formed inside it, with the chip removal holes II communicating with the chip removal holes I. Both sides of the base body are recessed with annular chip grooves and several oblique grooves, with the annular chip grooves communicating with each of the oblique grooves, and the oblique grooves communicating with the chip removal holes II. Annular grooves are also formed on both sides of the base body, used for engaging with a pressure plate I, and containing an indicator component for indicating the tightness of the pressure plate installation.

[0006] In one possible design, the indicating component includes a vertical hole I formed in the bottom wall of the annular groove, a transverse groove formed in the interior of the substrate, and a vertical hole II formed in the side of the substrate, wherein the vertical hole I communicates with the transverse groove and the transverse groove communicates with the vertical hole II.

[0007] It also includes a connecting plate, a pressure block, and a marking block. The connecting plate is slidably disposed in the transverse groove. The pressure block is fixedly installed at end I of the connecting plate and slidably passes through the vertical hole I. The marking block is fixedly installed at the other end of the connecting plate and extends into the vertical hole II.

[0008] In one possible design, a compression spring is also included. There are two compression springs, which are symmetrically arranged between the connecting plate and the inner wall of the transverse groove. When the pressure plate is embedded in the annular groove and presses the pressure block, the connecting plate compresses the compression spring and drives the marking block to move in the vertical hole II to the first position indicating tight installation.

[0009] In one possible design, if the pressure plate becomes loose, the restoring force of the compression spring pushes the connecting plate back to its original position and moves the marking block to a second position indicating that the installation is loose.

[0010] In one possible design, the two side surfaces of the substrate are also provided with multiple indicator marks for indicating the installation direction.

[0011] In one possible design, the annular chip groove, the inclined groove, the chip removal hole II, and the chip removal hole I together form a channel for discharging debris and promoting heat dissipation.

[0012] In one possible design, the chip removal holes I are uniformly distributed around the outer periphery of the substrate.

[0013] In one possible design, the oblique groove extends obliquely from the annular chip groove toward the inside of the substrate.

[0014] In this application, during use, by mounting the device on the drive shaft, the setting of multiple indicator marks can help to understand the mounting direction of the base, the setting of multiple chip removal holes I and chip removal holes II can help the device dissipate heat and also help the chip removal process. The annular groove is connected to the oblique groove and then connected to the chip removal hole II to improve the chip removal effect.

[0015] After the base is installed, the pressure plate engages with the annular groove. At this time, the pressure plate enters the interior of the annular groove and pushes the pressure block. The pressure block drives the connecting plate to move. The connecting plate squeezes and compresses the spring. The connecting plate drives the marking block to move. The marking block enters the interior of the marking block. The marking block can be used to check whether the pressure plate is installed tightly and to determine whether the base is installed loosely.

[0016] Beneficial effects: Multiple indicator marks are set on both sides of the base, which can help operators clearly understand the installation direction of the base when the device is installed on the drive shaft, improve the accuracy and efficiency of installation, and reduce equipment failure or safety hazards caused by incorrect installation direction.

[0017] Multiple chip removal holes I and II are formed on the substrate, and the two are interconnected. This design not only helps dissipate the heat generated during operation, reducing the operating temperature and extending the service life, but also effectively removes chips generated during cutting, preventing chip accumulation from affecting the cutting effect and the normal operation of the device. Simultaneously, the annular groove connects with the inclined groove, and then connects to chip removal hole II, further optimizing the chip removal path, improving the chip removal effect, and ensuring efficient cutting operations.

[0018] After the base is installed, the pressure plate engages with the annular groove, pushing the pressure block and causing the connecting plate to move. As the connecting plate moves, it compresses the spring and moves the marker block. By observing the positional changes of the marker block, one can visually assess the tightness of the pressure plate installation and determine if the base is loose. This facilitates timely detection and resolution of installation problems, ensuring stable operation of the device and improving safety and reliability. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of a high-depth wear-resistant laser-welded diamond saw blade proposed in this utility model;

[0020] Figure 2 This is a three-dimensional structural diagram from a second perspective of a high-depth wear-resistant laser-welded diamond saw blade proposed in this utility model.

[0021] Figure 3 This is a three-dimensional cross-sectional view of a high-depth wear-resistant laser-welded diamond saw blade proposed in this utility model.

[0022] In the figure: 1. Matrix; 2. Cutting surface; 3. Chip removal hole I; 4. Indicator mark; 5. Chip removal hole II; 6. Mounting hole; 7. Annular groove; 8. Annular chip groove; 9. Angled groove; 10. Marker block; 11. Connecting plate; 12. Pressure block; 13. Compression spring; 14. Vertical hole I; 15. Horizontal groove; 16. Vertical hole II. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] In one embodiment: Refer to Figure 1-3 A saw blade, this high-depth wear-resistant laser-welded diamond saw blade mainly consists of a base 1. The base 1 is made of a high-strength, wear-resistant metal material to ensure it can withstand large cutting forces and friction during operation. A mounting hole 6 is provided in the middle of the base 1. The size of the mounting hole 6 is designed according to the actual diameter of the drive shaft used to ensure that the saw blade can be securely mounted on the drive shaft, achieving reliable connection and synchronous operation with the equipment.

[0025] The outer wall of the substrate 1 has a cutting surface 2, which is precision machined to have a smooth and flat surface. Its shape and angle are designed according to specific cutting requirements to ensure good cutting performance. Multiple chip removal holes I3 are also formed on the outer wall of the substrate 1. These chip removal holes I3 are evenly distributed on the outer wall of the substrate 1, and their size and shape are optimized according to the size and shape of the chips generated during the cutting process to facilitate smooth chip removal. Multiple chip removal holes II5 are formed inside the substrate 1, which are connected to the chip removal holes I3 to form a continuous chip removal channel, helping to accelerate the chip removal speed and prevent chip accumulation.

[0026] Both sides of the base 1 have annular chip grooves 8. The depth and width of the annular chip grooves 8 are designed according to the amount of chips generated during the cutting process and the cutting environment, and can accommodate a certain amount of chips to prevent chips from accumulating at the cutting area. At the same time, multiple inclined grooves 9 are formed on both sides of the base 1. The annular chip grooves 8 are connected to the multiple inclined grooves 9, and the inclined grooves 9 are connected to the chip removal holes II 5, forming a complete chip removal system. During operation, the chips generated by cutting first enter the annular chip grooves 8, then enter the chip removal holes II 5 through the inclined grooves 9, and finally exit from the chip removal holes I 3. This effectively improves the chip removal effect, reduces the impact of chip accumulation on cutting accuracy and efficiency, and reduces the risk of safety accidents. In addition, the setting of multiple chip removal holes I 3 and chip removal holes II 5 can also increase the air circulation area, help the device dissipate heat, reduce the temperature of the saw blade during operation, slow down the wear rate, and extend its service life.

[0027] Annular grooves 7 are formed on both sides of the base 1. The size of the annular grooves 7 matches the pressure plate, ensuring that the pressure plate can be tightly engaged with the annular grooves 7. An indicator component is set inside the annular groove 7. The specific structure of the indicator component is as follows: a vertical hole I 14 is formed on the inner wall of one side of the annular groove 7, and a transverse groove 15 is formed inside the base 1, with the vertical hole I 14 communicating with the transverse groove 15. Vertical holes II 16 are formed on both sides of the base 1, with the transverse groove 15 communicating with the vertical hole II 16. A connecting plate 11 is slidably connected inside the transverse groove 15. The connecting plate 11 is made of high-strength, wear-resistant material and can slide smoothly within the transverse groove 15. Two symmetrical compression springs 13 are set between one side of the connecting plate 11 and one side of the transverse groove 15. The elastic coefficient of the compression springs 13 is selected according to actual needs to ensure that sufficient elastic force is generated to move the connecting plate 11 when the pressure plate is installed and loosened. A pressure block 12 is fixedly installed on one side of the top of the connecting plate 11. The pressure block 12 slides through the vertical hole I 14, and its size is adapted to the vertical hole I 14 to ensure that the pressure block 12 can move flexibly within the vertical hole I 14. A marking block 10 is fixedly installed on the other side of the top of the connecting plate 11. The marking block 10 extends into the vertical hole II 16. The marking block 10 can be made of different colors or materials with clear markings to facilitate observation of its positional changes.

[0028] After the base 1 is installed, the pressure plate is engaged with the annular groove 7. When the pressure plate enters the annular groove 7, it pushes the pressure block 12, which in turn moves the connecting plate 11 within the transverse groove 15. During this movement, the connecting plate 11 compresses the compression spring 13, causing it to generate elastic force. Simultaneously, the connecting plate 11 moves the marker block 10, causing its position within the vertical hole II 16 to change. When the pressure plate is securely installed, the marker block 10 moves to a specific position, allowing the operator to determine if the pressure plate is securely installed by observing its position. If the base 1 becomes loose, the pressure of the pressure plate on the pressure block 12 decreases, and the elastic force of the compression spring 13 pushes the connecting plate 11 in the opposite direction, causing the marker block 10 to change position accordingly. By observing the change in the marker block 10's position, the operator can promptly detect any loosening of the base 1 and address it early, ensuring stable operation of the equipment.

[0029] This application can be used in the field of diamond saw blades, or in other fields applicable to this application.

[0030] In another embodiment: Reference Figure 1-3A high-depth wear-resistant laser-welded diamond saw blade is disclosed. In the field of diamond saw blades, multiple indicator marks 4 are formed on both sides of the base 1. These indicator marks 4 are made on the surface of the base 1 using laser engraving or printing methods, and are characterized by their clarity and wear resistance. The shape and position of the indicator marks 4 are designed according to the installation direction of the base 1. When installing the saw blade, operators can accurately understand the installation direction of the base 1 by observing the indicator marks 4, avoiding installation errors, reducing damage to the equipment caused by improper installation, and lowering maintenance costs and downtime.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high-depth wear-resistant laser-welded diamond saw blade, characterized in that, include: The base (1) has a mounting hole (6) at its center and a cutting surface (2) on its outer edge. The base (1) has a plurality of chip removal holes I (3) extending from its outer wall and a plurality of chip removal holes II (5) inside it. The chip removal holes II (5) are connected to the chip removal holes I (3). The two sides of the base (1) are recessed with annular chip grooves (8) and a plurality of oblique grooves (9). The annular chip grooves (8) are connected to each of the oblique grooves (9). The oblique grooves (9) are connected to the chip removal holes II (5). The two sides of the base (1) are also provided with annular grooves (7). The annular grooves (7) are used to engage with the I pressure plate and are provided with an indicator component for indicating the tightness of the pressure plate installation.

2. The high-depth wear-resistant laser-welded diamond saw blade according to claim 1, characterized in that, The indicating component includes a vertical hole I (14) formed on the bottom wall of the annular groove (7), a transverse groove (15) formed inside the substrate (1), and a vertical hole II (16) formed on the side of the substrate (1). The vertical hole I (14) is connected to the transverse groove (15), and the transverse groove (15) is connected to the vertical hole II (16). It also includes a connecting plate (11), a pressure block (12) and a marking block (10). The connecting plate (11) is slidably disposed in the transverse groove (15). The pressure block (12) is fixedly installed at one end of the connecting plate (11) and slidably passes through the vertical hole I (14). The marking block (10) is fixedly installed at the other end of the connecting plate (11) and extends into the vertical hole II (16).

3. The high-depth wear-resistant laser-welded diamond saw blade according to claim 2, characterized in that, It also includes compression springs (13), two of which are symmetrically arranged between the inner wall of the connecting plate (11) and the transverse groove (15). When the pressure plate is embedded in the annular groove (7) and presses the pressure block (12), the connecting plate (11) compresses the compression springs (13) and drives the marking block (10) to move in the vertical hole II (16) to the first position indicating tight installation.

4. The high-depth wear-resistant laser-welded diamond saw blade according to claim 3, characterized in that, If the pressure plate is loose, the restoring force of the compression spring (13) pushes the connecting plate (11) to reset and moves the marking block (10) to the second position indicating that the installation is loose.

5. The high-depth wear-resistant laser-welded diamond saw blade according to claim 1, characterized in that, The two sides of the substrate (1) are also provided with a number of indicator marks (4) for indicating the installation direction.

6. The high-depth wear-resistant laser-welded diamond saw blade according to claim 1, characterized in that, The annular chip groove (8), the inclined groove (9), the chip discharge hole II (5), and the chip discharge hole I (3) together form a channel for discharging debris and promoting heat dissipation.

7. The high-depth wear-resistant laser-welded diamond saw blade according to any one of claims 1 to 6, characterized in that, The chip removal holes I (3) are evenly distributed around the outer periphery of the substrate (1).

8. The high-depth wear-resistant laser-welded diamond saw blade according to claim 1, characterized in that, The oblique groove (9) extends obliquely from the annular chip groove (8) toward the inner side of the substrate (1).

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