3D uniform temperature plate with heat pipe connecting capillary ring

Abstract

The utility model discloses a 3D uniform temperature plate with heat pipe connecting capillary ring, it includes lower cover, lower capillary structure layer, upper cover, upper capillary structure layer and heat pipe. The top surface of upper cover is provided with a plurality of mounting seats that are inverted funnel shape, the upper capillary structure layer is covered on each copper powder capillary ring of lower cover setting, and the upper capillary structure layer is formed with the upturned edge along the inner wall of mounting seat and extends upward, a plurality of heat pipes are correspondingly inserted in a plurality of mounting seats, and the heat pipe includes pipe body and pipe mouth, and the pipe mouth is attached and communicated with the mounting seat, and the heat pipe in the cavity of uniform temperature plate is formed with the capillary structure that extends from the pipe body to the pipe mouth. Among them, the heat pipe connecting capillary ring is still fixed in the mounting seat, the heat pipe connecting capillary ring is in abutment with the inner wall of pipe mouth, and the upturned edge is in abutment on the inner wall of mounting seat, which constitutes the stable connection of heat pipe and capillary structure in the cavity, and liquid medium can flow to the heat pipe connecting capillary ring under the guidance of the funnel-shaped contour of pipe mouth, and then return to the cavity through the upper capillary structure layer.

Description

Technical Field

[0001] This utility model relates to the technical field of heat exchange plates, and in particular to a 3D heat exchange plate with heat pipe connecting capillary rings. Background Technology

[0002] A vapor chamber, also known as a heat-conducting plate or superconducting heat plate, works on a similar principle to a heat pipe. Based on the principle of phase change heat transfer, it rapidly transfers heat from the heat source to the entire heat dissipation surface through the evaporation and condensation cycle of the internal medium, achieving uniform temperature distribution. Its equivalent thermal conductivity far exceeds that of traditional metal heat sinks, resulting in extremely high heat dissipation efficiency.

[0003] With the development of the electronics industry, electronic devices are becoming increasingly powerful, generating more and more heat during operation. Traditional two-dimensional vapor chambers cannot meet the heat dissipation requirements. The industry has then developed 3D vapor chambers. Compared to traditional vapor chambers, 3D vapor chambers transform heat dissipation from a two-dimensional surface to a three-dimensional heat conduction system, greatly improving the heat dissipation capacity of electronic components. However, existing 3D vapor chambers lack a transitional connection between the capillary structure within the heat pipes and the capillary layer at the top cover. This means that the liquid medium condensing within the heat pipe capillary structure can only slowly drip back, making it difficult to directly reach the capillary layer at the top cover and flow back to the evaporation zone. This can easily lead to problems such as delayed liquid medium return in the evaporation zone, resulting in dry burning, poor heat dissipation efficiency, or even failure. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a 3D heat spreader with a heat pipe connected to a capillary ring to solve the above problems.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] This invention provides a 3D vapor chamber with a heat pipe connected to a capillary ring, comprising a lower cover plate, a lower capillary structure layer, an upper cover plate, an upper capillary structure layer, and a heat pipe. The lower cover plate has a recessed cavity, on which multiple supporting copper pillars are provided. Copper powder capillary rings are sleeved on the supporting copper pillars. The lower capillary structure layer passes through each copper powder capillary ring and covers the lower cover plate. The upper cover plate is connected to the lower cover plate to close the cavity. The bottom surface of the upper cover plate abuts against the top surface of each supporting copper pillar. The upper cover plate is provided with multiple mounting seats, which are inverted funnel-shaped. The upper capillary structure layer covers each copper powder capillary ring and extends upward along the inner wall of the mounting seat to form a raised edge. The raised edge has a clearance hole to avoid the corresponding mounting seat. Multiple heat pipes are inserted one-to-one into the multiple mounting seats. Each heat pipe includes a pipe body and a pipe opening. The pipe opening is attached to the mounting seat and communicates with the cavity. A capillary structure extending from the pipe body to the pipe opening is formed inside the heat pipe.

[0007] The mounting base also includes a heat pipe connecting capillary ring, which abuts against the inner wall of the pipe opening and presses the raised edge against the inner wall of the mounting base.

[0008] Preferably, the copper powder capillary ring is further covered with a support mesh, which is fixed to the bottom surface of the upper capillary structure layer. Each of the multiple heat pipe connecting capillary rings on the support mesh is provided with an upwardly extending limiting ring, and the heat pipe connecting capillary ring is sleeved on the outer periphery of the limiting ring.

[0009] Preferably, the four corners of the support mesh are respectively provided with support sections extending to the adjacent copper powder capillary rings. The support sections overlap the corresponding copper powder capillary rings and are sleeved on the support copper pillars inside the corresponding copper powder capillary rings.

[0010] Preferably, the support net includes multiple connecting beams that are connected horizontally and vertically, and the limiting ring is located at the intersection of the connecting beams.

[0011] Preferably, the edges of the upper capillary layer overlap with the edges of the lower capillary layer.

[0012] Preferably, the inner wall of the heat pipe is provided with a plurality of grooves to form its capillary structure.

[0013] The main technical effects achieved by this utility model are as follows:

[0014] In the aforementioned 3D vapor chamber with heat pipe connecting capillary rings, the heat pipe connecting capillary rings are fixed in the mounting base, making them abut against the inner wall of the pipe opening. The raised edge of the upper capillary structure layer abuts against the inner wall of the mounting base. The heat pipe connecting capillary rings and the upper capillary structure layer extend into and are fixed within the heat pipe mounting structure. The heat pipe connecting capillary rings form a stable connection between the heat pipe and the capillary structure inside the cavity, allowing the liquid medium to flow back to the upper capillary structure layer via the heat pipe connecting capillary rings. Finally, it flows back to the lower capillary structure layer through the copper powder capillary rings supporting the outer periphery of the copper pillar or the overlapping structure between the capillary structure layers. This ensures that the fluid inside the cavity can be quickly drawn back without interruption during operation, avoiding problems such as dry burning, poor heat dissipation efficiency, or failure due to the liquid medium not flowing back to the evaporation zone in time. The mounting base and the nozzle are shaped like an inverted funnel, which helps guide the liquid medium to the junction of the heat pipe connecting capillary ring and the upper capillary structure layer, and provides the nozzle with a larger contact area, so that the nozzle can be tightly connected to the heat pipe connecting capillary ring. Attached Figure Description

[0015] Figure 1 A perspective view of a 3D heat spreader with a heat pipe connected to a capillary ring provided by this utility model.

[0016] Figure 2 This is a structural exploded view of the 3D heat spreader.

[0017] Figure 3 This is a schematic diagram showing the connection between the pipe opening and the mounting base in the 3D heat spreader.

[0018] Figure 4 A schematic diagram showing the support mesh in the 3D heat spreader covering the capillary rings of copper powder.

[0019] Figure 5 This is a schematic cross-sectional view of the support column in the 3D temperature distribution plate.

[0020] The reference numerals in the above figures are as follows:

[0021] Lower cover plate 1, cavity 10, supporting copper column 11, copper powder capillary ring 12;

[0022] Lower capillary layer 2;

[0023] Top cover plate 3, mounting base 31;

[0024] Upper capillary layer 4, curled edge 41;

[0025] Heat pipe 5, pipe body 51, pipe opening 52;

[0026] Heat pipe connection capillary ring 6;

[0027] 7. Support net 71. Limiting ring 72. Support section 73. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the drawings. The embodiments of this utility model shown in and described with reference to the drawings are merely exemplary, and this utility model is not limited to these embodiments.

[0029] To avoid obscuring the present invention with unnecessary details, only structures and / or processing steps closely related to the solution according to the present invention are shown in the accompanying drawings, while other details that are not closely related are omitted. For example, in Figure 3 and Figure 5 In this image, the background structure within the cavity, except for the cross-section, is omitted to more clearly show the structure at the cross-section. Figure 3 The circular frame area represents a magnified local structure. Figure 5 The omitted cavity extension structure is represented by a wavy line.

[0030] like Figure 1 and Figure 2As shown, this utility model embodiment provides a 3D heat spreader with a heat pipe connected to a capillary ring, which includes a lower cover plate 1, a lower capillary structure layer 2, an upper cover plate 3, an upper capillary structure layer 4, and a heat pipe 5.

[0031] Combination Figure 4 and Figure 5 As shown, a cavity 10 is formed in the recess of the lower cover plate 1, and a plurality of supporting copper pillars 11 are provided on the cavity 10. Copper powder capillary rings 12 are provided on the outer sleeve of the supporting copper pillars 11. The lower capillary structure layer 2 passes through each copper powder capillary ring 12 and covers the lower cover plate 1.

[0032] Combination Figure 2 and Figure 3 As shown, the upper cover plate 3 and the lower cover plate 1 are connected to seal the cavity 10. The bottom surface of the upper cover plate 3 abuts against the top surface of each supporting copper column 11. Multiple mounting seats 31 are provided on the upper cover plate 3, and each mounting seat 31 is in the shape of an inverted funnel. The height of the copper powder capillary ring 12 is lower than that of the supporting copper column 11. The upper capillary structure layer 4 covers each copper powder capillary ring 12. The upper capillary structure layer 4 extends upward along the inner wall of each mounting seat 31 to form a raised edge 41. The raised edge 41 has a clearance hole to avoid the corresponding mounting seat 31. Multiple heat pipes 5 are inserted one-to-one into the multiple mounting seats 31. Each heat pipe 5 includes a pipe body 51 and a pipe opening 52. The pipe opening 52 is attached to the mounting seat 31 and communicates with the cavity 10. A capillary structure extending from the pipe body 51 to the pipe opening 52 is formed inside the heat pipe 5.

[0033] Among them, such as Figure 3 As shown, a heat pipe connecting capillary ring 6 is also fixed inside the mounting base 31. The heat pipe connecting capillary ring 6 has a through hole for the medium to pass through. The heat pipe connecting capillary ring 6 abuts against the inner wall of the pipe opening 52 and abuts the raised edge 41 against the inner wall of the mounting base 31.

[0034] The working principle of the aforementioned 3D vapor chamber is as follows: the gaseous medium evaporated in the cavity 10 enters the heat pipe 5 through the through hole in the mounting base 31. The gaseous medium liquefies at the closed end above the pipe 51, and the liquid medium flows back to the pipe opening 52 along the capillary structure of the inner wall of the pipe 51. Since the pipe opening 52, which is attached to the mounting base 31, is inverted funnel shape, the liquid medium will flow towards the edge of the pipe opening 52 under the guidance of this shape contour. The heat pipe connecting capillary ring 6 abuts against the inner wall of the pipe opening 52, and the liquid medium can be transferred from the pipe opening 52 to the heat pipe connecting capillary ring 6, and then flow back to the cavity 10 through the raised edge 41 of the upper capillary structure layer 4 located below the heat pipe connecting capillary ring 6. Inside the cavity 10, each copper powder capillary ring 12 is sandwiched between the upper capillary structure layer 4 and the lower capillary structure layer 2. Therefore, the liquid medium in the upper capillary layer 4 can flow back to the lower capillary layer 2 through each copper powder capillary ring 12 to supply the evaporation zone.

[0035] For example, the heat pipe connecting capillary ring 6 is a sintered metal powder body, ensuring that it has sufficient capillary force to guide the liquid medium.

[0036] Combination Figure 2 , Figure 3 and Figure 4 As shown, a support mesh 7 is also provided on the copper powder capillary ring 12. The support mesh 7 is fixed to the bottom surface of the upper capillary structure layer 4. Each of the multiple heat pipe connecting capillary rings 6 on the support mesh 7 has an upwardly extending limiting ring 71, and the heat pipe connecting capillary ring 6 is sleeved on the outer periphery of the limiting ring 71. The support mesh 7 serves to support the limiting ring 71 and the heat pipe connecting capillary ring 6. The limiting ring 71 is used for sintering the heat pipe connecting capillary ring 6 on it. The supporting limiting ring 71 fixes the heat pipe connecting capillary ring 6 into the mounting base 31. The support mesh 7 presses the upper capillary structure layer 4 at the corresponding pipe opening 52 against the upper cover plate 3.

[0037] Furthermore, the four corners of the support net 7 are respectively provided with support sections 72 extending to the adjacent copper powder capillary rings 12. The support sections 72 overlap the corresponding copper powder capillary rings 12 and are fitted onto the support copper pillars 11 inside the corresponding copper powder capillary rings 12. Since the height of the copper powder capillary rings 12 is lower than that of the support copper pillars 11, by opening the support sections 72 at the four corners, fitting them onto the support copper pillars 11, and placing them on the copper powder capillary rings 12, the four corners of the support net 7 can be stably clamped by the contact between the upper cover plate 3 and the support copper pillars 11.

[0038] like Figure 2 and Figure 4 As shown, firstly, a supporting copper column 11 with sintered copper powder capillary rings 12 is laid on the lower cover plate 1, and the lower capillary structure layer 2 is covered on the lower cover plate 1. Then, the supporting mesh 7 is fitted onto the corresponding supporting copper column 11, and the upper capillary structure layer 4 is fitted onto each supporting copper column 11 through the clearance hole. The supporting mesh 7 and the upper capillary structure layer 4 are supported by each copper powder capillary ring 12. The heat pipe connecting capillary ring 6 inserted into the mounting base 31 folds the edge of the upper capillary structure layer 4 beyond the opening of the mounting base 31 upward and presses it to form a raised edge 41. Each heat pipe 5 is inserted into the mounting base 31 of the upper cover plate 3. Finally, the upper cover plate 3 and the lower cover plate 4 are connected and fastened to form a sealed cavity 10, completing the stable connection between the heat pipe 5 and the capillary structure in the cavity 10. The mounting base 31 can be sealed at the joint with the heat pipe 5 through high-temperature brazing and other processes.

[0039] In this embodiment, the support mesh 7 includes multiple connecting beams 73 that are connected horizontally and vertically, and the limiting ring 71 is located at the intersection of the connecting beams 73. The interlacing of the connecting beams 73 and the hollowing out of other areas help to ensure the stability of the support structure for the limiting ring 71 and the heat pipe connecting capillary ring 6 while reducing the area of ​​the upper capillary structure layer 4 that is obscured.

[0040] like Figure 5 As shown, the four edges of the upper capillary layer 4 overlap with the four edges of the lower capillary layer 2, thereby allowing the upper capillary layer 4 to transmit liquid media through the overlapping area with the lower capillary layer 2, in addition to the individual copper powder capillary rings 12.

[0041] In this embodiment, the inner wall of the heat pipe 5 is provided with a plurality of grooves to form its capillary structure, which is easy to adapt to the arrangement of the funnel-shaped pipe opening 52. Of course, as other embodiments, the capillary structure of the heat pipe 5 can also be a metal woven mesh and a powder sintered body.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0043] The above description is only a specific embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A 3D heat spreader with a heat pipe connected to a capillary ring, characterized in that, include: The lower cover plate (1) has a recessed cavity (10) and a plurality of supporting copper pillars (11) are provided on the cavity (10). The supporting copper pillars (11) are covered with copper powder capillary rings (12). The lower capillary structure layer (2) passes through each copper powder capillary ring (12) and covers the lower cover plate (1); The upper cover plate (3) is connected to the lower cover plate (1) to close the cavity (10). The bottom surface of the upper cover plate (3) abuts against the top surface of each supporting copper column (11). The upper cover plate (3) is provided with multiple mounting seats (31), and the mounting seats (31) are in the shape of an inverted funnel. Upper capillary structure layer (4) is applied to each copper powder capillary ring (12). The upper capillary structure layer (4) extends upward along the inner wall of the mounting base (31) to form a raised edge (41). The raised edge (41) has a clearance hole for avoiding the corresponding mounting base (31). A heat pipe (5) is inserted into a plurality of mounting bases (31) in a one-to-one correspondence. The heat pipe (5) includes a pipe body (51) and a pipe opening (52). The pipe opening (52) is attached to the mounting base (31) and communicates with the cavity (10). A capillary structure is formed inside the heat pipe (5) extending from the pipe body (51) to the pipe opening (52). The mounting base (31) is also fixed with a heat pipe connecting capillary ring (6), which abuts against the inner wall of the pipe opening (52) and abuts the raised edge (41) against the inner wall of the mounting base (31).

2. The 3D heat spreader with a heat pipe connected to a capillary ring according to claim 1, characterized in that, The copper powder capillary ring (12) is also covered with a support mesh (7). The support mesh (7) is fixed to the bottom surface of the upper capillary structure layer (4). The support mesh (7) is provided with an upwardly extending limiting ring (71) corresponding to a plurality of heat pipe connecting capillary rings (6). The heat pipe connecting capillary ring (6) is sleeved on the outer periphery of the limiting ring (71).

3. The 3D heat spreader with a heat pipe connected to a capillary ring according to claim 2, characterized in that, The four corners of the support mesh (7) are respectively provided with support sections (72) extending to the adjacent copper powder capillary rings (12). The support sections (72) overlap the corresponding copper powder capillary rings (12) and are sleeved on the support copper columns (11) inside the corresponding copper powder capillary rings (12).

4. The 3D heat spreader with a heat pipe connected to a capillary ring according to claim 2, characterized in that, The support net (7) includes multiple connecting beams (73) that are connected horizontally and vertically, and the limiting ring (71) is located at the intersection of the connecting beams (73).

5. The 3D heat spreader with a heat pipe connected to a capillary ring according to claim 1, characterized in that, The edges of the upper capillary layer (4) overlap with the edges of the lower capillary layer (2).

6. The 3D heat spreader with a heat pipe connected to a capillary ring according to claim 1, characterized in that, The inner wall of the heat pipe (5) is provided with a plurality of grooves to form its capillary structure.

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