Inductance-capacitance integrated motor pump

CN224733588UActive Publication Date: 2026-09-08WUXI WEIFU HIGH TECH CO LTD
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Patent Information

Application Number
CN202521773650.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-20
Publication Date
2026-09-08
Estimated Expiration
2035-08-20

AI Technical Summary

Technical Problem

[0003]本实用新型提供了一种电感电容集成式电机泵,用以解决背景技术中提及的传统电机泵散热效果差的技术问题

Benefits of technology

优化空间布局:将大电容和电感集成后外置,大大节省了PCB板的空间,为PCB板上其他电路元件的布局提供了更多空间,有利于电机泵的小型化和集成化设计。

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model relates to an inductor-capacitor integrated motor pump. It includes: a motor pump body, an inductor-capacitor integrated module, a circuit board, an electrical control housing, and a high-voltage connector. An electrical control cavity is located on the upper part of the motor pump body, and the electrical control housing is connected to the electrical control cavity. The circuit board and the inductor-capacitor integrated module are both installed between the electrical control cavity and the electrical control housing. The inductor-capacitor integrated module is connected to both the circuit board and the high-voltage connector, and the high-voltage connector is installed on the electrical control housing. The inductor-capacitor integrated module includes: a base plate, a capacitor, and an inductor. The capacitor and inductor are mounted on the base plate. The inner top surface of the electrical control housing has a capacitor heat dissipation surface and an inductor heat dissipation surface, with the capacitor heat dissipation surface in contact with the capacitor and the inductor heat dissipation surface in contact with the inductor. This utility model integrates the large capacitor and inductor externally, greatly saving PCB board space and providing more space for the layout of other circuit components on the PCB board, which is beneficial for the miniaturization and integration design of the motor pump.
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Description

Technical Field

[0001] This utility model relates to the field of vehicle suspension motor pump technology, and in particular to an inductor-capacitor integrated motor pump. Background Technology

[0002] Currently, most suspension system motor pumps directly solder large capacitors and inductors onto the PCB board. This layout has the following problems: First, large capacitors and inductors occupy a lot of PCB board space, limiting the layout of other circuit components on the PCB board and hindering the miniaturization design of the motor pump. Second, the heat generated by large capacitors and inductors during operation is superimposed on other heat-generating components on the PCB board, resulting in poor heat dissipation and affecting component lifespan and system stability. Third, independently installed large capacitors and inductors are prone to loose electrical connections under vibration, and maintenance and replacement require complex operations on the PCB board, increasing maintenance difficulty and cost. Summary of the Invention

[0003] This invention provides an integrated inductor-capacitor motor pump to solve the technical problem of poor heat dissipation in traditional motor pumps mentioned in the background art.

[0004] The technical solution of this utility model is as follows: An inductor-capacitor integrated motor pump includes: a motor pump body, an inductor-capacitor integrated module, a circuit board, an electrical control housing, and a high-voltage connector; An electrical control cavity is provided on the upper part of the motor pump body. The electrical control housing is connected to the electrical control cavity. The circuit board and the inductor-capacitor integrated module are both installed between the electrical control cavity and the electrical control housing. The inductor-capacitor integrated module is connected to the circuit board and the high-voltage connector respectively. The high-voltage connector is installed on the electrical control housing.

[0005] The inductor-capacitor integrated module includes: a base plate, a capacitor, and an inductor. The capacitor and inductor are disposed on the base plate. The inner top surface of the electronic control housing is provided with a capacitor heat dissipation surface and an inductor heat dissipation surface. The capacitor heat dissipation surface is in contact with the capacitor, and the inductor heat dissipation surface is in contact with the inductor.

[0006] Furthermore, a heat insulation layer is provided between the capacitor and the inductor.

[0007] Furthermore, the base plate is provided with a first connection terminal and a second connection terminal, the circuit board is provided with a first connection interface corresponding to the first connection terminal, and the high-voltage connector is provided with a second connection interface corresponding to the second connection terminal.

[0008] Furthermore, the electrical control housing has an internal mounting cavity, and the inductor-capacitor integrated module is installed inside the mounting cavity.

[0009] Furthermore, a threaded post is provided inside the mounting cavity, and the base plate is fixed to the threaded post by screws.

[0010] Furthermore, a thermally conductive medium is provided between the capacitor heat dissipation surface and the capacitor, and a thermally conductive medium is provided between the inductor heat dissipation surface and the inductor.

[0011] The beneficial effects of this utility model are: Optimized space layout: By integrating large capacitors and inductors and placing them externally, the space on the PCB board is greatly saved, providing more space for the layout of other circuit components on the PCB board, which is conducive to the miniaturization and integration design of motor pumps.

[0012] Improved heat dissipation performance: Independent integrated modules and optimized heat dissipation design enable the heat generated by large capacitors and inductors to be dissipated in a timely manner, reducing the operating temperature of components, extending the service life of large capacitors and inductors, and improving the stability and reliability of the system.

[0013] Easy to repair and replace: The plug-in connection terminal is used. When the independent integrated module fails, there is no need to perform complicated soldering operations on the PCB board. Simply unplug the integrated module from the connection interface for replacement, which greatly reduces the difficulty and cost of repair.

[0014] Improved versatility: Independent integrated modules can be flexibly configured and replaced according to the needs of different motor pumps, improving the product's versatility and adaptability. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the main body of the motor pump of this utility model.

[0017] Figure 3 This is a schematic diagram of the electrical control housing of this utility model.

[0018] Figure 4 This is a schematic diagram of the circuit board of this utility model.

[0019] Figure 5 This is a schematic diagram of the high-voltage connector of this utility model.

[0020] Figure 6 This is a schematic diagram of the structure of the inductor-capacitor integrated module of this utility model.

[0021] Figure 7 This is a schematic diagram of the bottom structure of the inductor-capacitor integrated module of this utility model. Detailed Implementation

[0022] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. The described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0023] In the technical solution of this utility model, Figures 1 to 7 This is a schematic diagram of the mechanism of an integrated inductor-capacitor motor pump according to the present invention, as shown in the figure. Figures 1 to 7 As shown, this utility model includes: The components include: motor pump body 1, inductor-capacitor integrated module 5, circuit board 3, electrical control housing 2, and high-voltage connector 4.

[0024] The pump head 11 is provided on one side of the motor pump body 1, and a motor component 12 is installed inside. An electronic control cavity 13 is provided on the upper part of the motor pump body 1.

[0025] The electrical control housing 2 is connected to the electrical control cavity 13, and the circuit board 3 and the inductor-capacitor integrated module 5 are both installed between the electrical control cavity 13 and the electrical control housing 2. Specifically, the circuit board 3 is disposed inside the electronic control cavity 13, and the inductor-capacitor integrated module 5 is disposed inside the electronic control housing 2. When the electronic control housing 2 and the electronic control cavity 13 are connected to form a complete installation space, the circuit board 3 and the inductor-capacitor integrated module 5 are placed in the installation space between the electronic control cavity 13 and the electronic control housing 2.

[0026] The inductor-capacitor integrated module 5 is connected to the circuit board 3 and the high-voltage connector 4, respectively, and the high-voltage connector 4 is mounted on the electrical control housing 2. The circuit board can specifically be a PCB board.

[0027] The inductor-capacitor integrated module 5 includes: a base plate 51, a capacitor 52 and an inductor 53. The capacitor 52 and the inductor 53 are disposed on the base plate 51. The inner top surface of the electronic control housing 2 is provided with a capacitor heat dissipation surface 23 and an inductor heat dissipation surface 24. The capacitor heat dissipation surface 23 is attached to the capacitor 52, and the inductor heat dissipation surface 24 is attached to the inductor 53.

[0028] A thermally conductive medium is disposed between the capacitor heat dissipation surface 23 and the capacitor 52, and a thermally conductive medium is disposed between the inductor heat dissipation surface 24 and the inductor 53. The thermally conductive medium can be thermally conductive silicone. The thermally conductive silicone improves heat transfer efficiency. The capacitor 52 and the inductor 43 are tightly bonded to the capacitor heat dissipation surface 23 and the inductor heat dissipation surface 24 of the electronic control housing 2 via the thermally conductive silicone for heat dissipation.

[0029] The base plate 51 is provided with a first connecting terminal 55 and a second connecting terminal 56. The circuit board 3 is provided with a first connecting interface 31 corresponding to the first connecting terminal 55. The high-voltage connector 4 is provided with a second connecting interface 41 corresponding to the second connecting terminal 56. The first connecting terminal connects to the first connecting interface to connect the base plate to the circuit board, and the second connecting terminal connects to the second connecting interface to connect the high-voltage connector 4 to the base plate. The first connecting terminal 55 and the second connecting terminal 56 need to be connected to inductors and capacitors.

[0030] The base plate 51 and the housings of the capacitors and inductors are made of materials with good insulation properties and mechanical strength, such as a composite material of polycarbonate PC and glass fiber reinforced materials.

[0031] The connection of the inductor-capacitor integrated module 5 is achieved by using a highly reliable high-voltage connector 4 to realize the electrical connection between the integrated module and the PCB board. The high-voltage connector 4 has the characteristics of being waterproof, dustproof, and vibration resistant, and its protection level reaches IP67 or above.

[0032] A heat insulation layer 54 is provided between the capacitor 52 and the inductor 53 to reduce heat conduction between the large capacitor 52 and the inductor 53.

[0033] In one embodiment of this utility model, the electrical control housing 2 is provided with a mounting cavity 21, and the inductor-capacitor integrated module 5 is installed in the mounting cavity 21.

[0034] In one embodiment of the present invention, a threaded post 22 is provided in the mounting cavity 21, and the base plate 51 is fixed to the threaded post 22 by screws.

[0035] This invention solves the problems of large space occupation, poor heat dissipation, and inconvenient maintenance caused by integrating large capacitors and inductors onto the PCB board, thereby improving the performance and reliability of the motor pump system.

[0036] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solution of this utility model and not to limit it. Although this utility model has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An inductor-capacitor integrated motor pump, characterized in that, include: The motor pump body (1), the inductor-capacitor integrated module (5), the circuit board (3), the electrical control housing (2), and the high-voltage connector (4); An electrical control cavity (13) is provided on the upper part of the motor pump body (1). The electrical control housing (2) is connected to the electrical control cavity (13). The circuit board (3) and the inductor-capacitor integrated module (5) are both installed between the electrical control cavity (13) and the electrical control housing (2). The inductor-capacitor integrated module (5) is connected to the circuit board (3) and the high voltage connector (4) respectively. The high voltage connector (4) is installed on the electrical control housing (2). The inductor-capacitor integrated module (5) includes: a base plate (51), a capacitor (52) and an inductor (53). The capacitor (52) and the inductor (53) are disposed on the base plate (51). The inner top surface of the electronic control housing (2) is provided with a capacitor heat dissipation surface (23) and an inductor heat dissipation surface (24). The capacitor heat dissipation surface (23) is attached to the capacitor (52), and the inductor heat dissipation surface (24) is attached to the inductor (53).

2. The inductor-capacitor integrated motor pump as described in claim 1, characterized in that, A heat insulation layer (54) is provided between the capacitor (52) and the inductor (53).

3. The inductor-capacitor integrated motor pump as described in claim 1, characterized in that, The base plate (51) is provided with a first connection terminal (55) and a second connection terminal (56), the circuit board (3) is provided with a first connection interface (31) corresponding to the first connection terminal (55), and the high voltage connector (4) is provided with a second connection interface (41) corresponding to the second connection terminal (56).

4. The inductor-capacitor integrated motor pump as described in claim 1, characterized in that, The electrical control housing (2) has an installation cavity (21) inside, and the inductor-capacitor integrated module (5) is installed in the installation cavity (21).

5. The inductor-capacitor integrated motor pump as described in claim 4, characterized in that, A threaded post (22) is provided in the mounting cavity (21), and the base plate (51) is fixed to the threaded post (22) by screws.

6. The inductor-capacitor integrated motor pump as described in claim 1, characterized in that, A heat-conducting medium is provided between the capacitor heat dissipation surface (23) and the capacitor (52), and a heat-conducting medium is provided between the inductor heat dissipation surface (24) and the inductor (53).