A resin coating device for a high-frequency-resistant high-temperature sensor magnetic ring

Abstract

This utility model relates to the field of resin coating technology and discloses a resin coating device for a high-frequency, high-temperature resistant sensing magnetic ring. The device includes a base plate, with a conveying assembly inserted into the upper surface of the base plate. A mold, pressure plate, air pipe, and suction cup are inserted into the upper surface of the conveying assembly. This utility model has a reasonable structure. Workers place semiconductor chips into the storage slot of the placement seat. A moving motor drives a moving screw to rotate, causing a placement hydraulic rod to move within the placement seat. The placement hydraulic rod moves the suction cup downwards, holding the semiconductor chip firmly in place at its four corners. The placement hydraulic rod then moves the semiconductor chip above the mold and places it into the mold. This allows for convenient and quick movement and placement of semiconductor chips, making the operation simpler and more precise, thus reducing potential damage to the semiconductor chips during manual loading.

Description

Technical Field

[0001] This utility model relates to the field of resin coating technology, specifically to a resin coating device for a high-frequency and high-temperature resistant sensing magnetic ring. Background Technology

[0002] Semiconductor wafers, used as materials for semiconductors and electronic components, have structures such as those made of single-crystal materials like silicon, or those made of compounds containing multiple elements. These wafers are formed into cylindrical crystalline blocks and then cut into substrate shapes using a wire saw or similar tool. Further processing, such as grinding and etching, removes any warping or bending that occurred during cutting, resulting in a flat and thin shape. However, existing resin coating equipment is inconvenient for automatically feeding, spraying, and pressing semiconductor chips during use. Manual operation is inefficient and unstable, which may cause the resin-coated semiconductor chips to malfunction and become unusable. Therefore, we propose a new device to solve the above problems. Utility Model Content

[0003] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a resin coating device for a high-frequency, high-temperature resistant sensing magnetic ring, which solves the problems of inconvenience in automatically feeding, spraying, and pressing semiconductor chips in existing resin coating equipment, as well as low efficiency and instability due to manual labor.

[0004] (II) Technical Solution To achieve the above objectives, this utility model is implemented through the following technical solution: a resin coating device for a high-frequency and high-temperature resistant sensing magnetic ring, comprising a base plate, a conveying component inserted into the upper surface of the base plate, a mold inserted into the upper surface of the conveying component, a semiconductor chip disposed inside the mold, a magnetic ring disposed inside the semiconductor chip, a placement component inserted into the upper surface of the base plate, a fixing frame inserted into the upper surface of the base plate, a nozzle inserted into the lower surface of the fixing frame, a feed pipe inserted into one side of the nozzle, a feed component sleeved at one end of the feed pipe, and a shaping component inserted into the upper surface of the base plate.

[0005] Optionally, the conveying assembly includes a fixed base, a conveying motor, a drive shaft, a conveyor belt, a driven shaft, and a docking seat. The conveying motor is inserted into the fixed base, a drive shaft is sleeved at one end of the conveying motor, a conveyor belt is sleeved on the surface of the drive shaft, a driven shaft is provided inside the conveyor belt, and docking seats are sleeved at both ends of the driven shaft.

[0006] Optionally, the placement assembly includes a placement base, a moving motor, a moving lead screw, a placement hydraulic rod, a vacuum pump, an air pipe, and a suction cup. The moving motor is inserted into the interior of the placement base, and a moving lead screw is sleeved at one end of the moving motor. The placement hydraulic rod is slidably connected inside the placement base. A vacuum pump is inserted into the upper surface of the placement hydraulic rod, and an air pipe is inserted into one end of the vacuum pump. A suction cup is inserted into the lower surface of the placement hydraulic rod.

[0007] Optionally, a threaded hole is provided on one side of the hydraulic rod placement, and the movable lead screw passes through the threaded hole to allow the hydraulic rod to slide within the placement seat.

[0008] Optionally, a storage slot is provided on one side of the placement seat, and a suction cup is sleeved on one end of the air tube.

[0009] Optionally, the suction cups are located at the four corners where the hydraulic rods are placed, and a transition tube is inserted between the suction cups.

[0010] Optionally, the feeding assembly includes a feeding box, a feeding cover plate, a rotary motor, a stirring shaft, and a feeding water pump. The feeding cover plate is inserted into the upper surface of the feeding box, the rotary motor is inserted into the inside of the feeding cover plate, one end of the rotary motor is sleeved with a stirring shaft, and the feeding water pump is inserted into the inside of the feeding box.

[0011] Optionally, the shaping assembly includes a support frame, a shaping hydraulic rod, a pressure plate, and a heating plate. The shaping hydraulic rod is inserted into the lower surface of the support frame, the pressure plate is sleeved on the lower surface of the shaping hydraulic rod, and the heating plate is inserted into the lower surface of the pressure plate.

[0012] In summary, the technical effects and advantages of this utility model are as follows: 1. This utility model has a reasonable structure. Workers place semiconductor chips into the storage slot of the placement base. A moving motor drives a moving screw to rotate, causing a placement hydraulic rod to move within the placement base. The placement hydraulic rod then moves a suction cup downwards, which holds the four corners of the semiconductor chip. A vacuum pump is activated, using an air pipe and transition pipe to remove air from the suction cup, ensuring the semiconductor chip is firmly held in place. The placement hydraulic rod then moves the semiconductor chip to the top of the mold and places it inside. The vacuum pump then shuts off the vacuum, and the placement hydraulic rod returns to hold the next semiconductor chip. This achieves convenient and quick movement and placement of semiconductor chips, making operation simpler and more precise. This reduces the potential damage to semiconductor chips caused by manual loading, thus improving product quality. A conveyor motor in the fixed base drives the drive shaft to rotate, causing the driven shaft in the docking seat to also rotate. This allows the semiconductor chips inside the mold to be transported by a conveyor belt, achieving convenient and quick transport of semiconductor chips, improving processing efficiency and continuity, and reducing mold misalignment and instability.

[0013] 2. In this utility model, the worker adds resin into the feeding tank through the feeding pipe. A rotary motor drives the stirring shaft to rotate, stirring the resin in the feeding tank. A water pump draws the resin from the feeding pipe into the nozzle, which sprays the resin into the moving mold to coat the semiconductor chip. This achieves convenient and quick resin addition and spraying, and facilitates stirring of the resin in the feeding tank, thus reducing the risk of resin stratification due to prolonged lack of stirring, which affects the quality of the sprayed resin. It also reduces the risk of inaccurate spraying volume during manual spraying. The mold is moved by a conveyor belt, heated by a heating plate, and the pressure plate is moved downward by a shaping hydraulic rod, pressing and shaping the pressure plate into the mold. This achieves convenient and quick resin pressing and shaping, maintaining uniform pressing force and ensuring proper resin coating, thereby reducing the risk of resin being squeezed out during manual pressing and shaping. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is an exploded view of the base plate structure of the equipment of this utility model; Figure 3 This is an exploded view of the structure of the conveying component of this utility model; Figure 4 This is an exploded view of the component structure of this utility model; Figure 5 This is a schematic diagram of the fixing frame structure of this utility model; Figure 6 This is an exploded view of the feeding assembly structure of this utility model; Figure 7 This is an exploded view of the shaping component structure of this utility model.

[0015] In the diagram: 1. Equipment base plate; 2. Conveying assembly; 201. Fixed seat; 202. Conveying motor; 203. Drive shaft; 204. Conveyor belt; 205. Driven shaft; 206. Docking seat; 3. Mold; 4. Semiconductor chip; 5. Magnetic ring; 6. Placement assembly; 601. Placement seat; 602. Moving motor; 603. Moving lead screw; 604. Placement hydraulic rod; 605. Vacuum pump; 606. Air pipe; 607. Suction cup; 7. Fixed frame; 8. Nozzle; 9. Feed pipe; 10. Feeding assembly; 101. Feed box; 102. Feed cover plate; 103. Rotary motor; 104. Stirring shaft; 105. Feeding water pump; 11. Shaping assembly; 801. Support frame; 802. Shaping hydraulic rod; 803. Pressure plate; 804. Heating plate. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Example: Reference Figures 1-7 The resin coating device for a high-frequency and high-temperature resistant sensing magnetic ring shown includes a base plate 1, a conveying component 2 inserted into the upper surface of the base plate 1, a mold 3 inserted into the upper surface of the conveying component 2, a semiconductor chip 4 disposed inside the mold 3, a magnetic ring 5 disposed inside the semiconductor chip 4, a placement component 6 inserted into the upper surface of the base plate 1, a fixing frame 7 inserted into the upper surface of the base plate 1, a nozzle 8 inserted into the lower surface of the fixing frame 7, a feed pipe 9 inserted into one side of the nozzle 8, a feed component 10 sleeved at one end of the feed pipe 9, and a shaping component 11 inserted into the upper surface of the base plate 1.

[0018] As a preferred embodiment of this example, Figures 2 to 5As shown, a conveying assembly 2 is inserted into the upper surface of the equipment base plate 1. The conveying assembly 2 includes a fixed base 201, a conveying motor 202, a drive shaft 203, a conveyor belt 204, a driven shaft 205, and a docking seat 206. The conveying motor 202 is inserted into the fixed base 201. The drive shaft 203 is sleeved at one end of the conveying motor 202. The conveyor belt 204 is sleeved on the surface of the drive shaft 203. The driven shaft 205 is provided inside the conveyor belt 204. The docking seats 206 are sleeved at both ends of the driven shaft 205. A mold 3 is inserted into the upper surface of the conveying assembly 2. A semiconductor chip 4 is provided inside the mold 3. A magnetic ring 5 is provided inside the semiconductor chip 4. A placement assembly 6 is inserted into the upper surface of the equipment base plate 1. The placement assembly 6 includes a placement seat 601 and a moving motor 606. 02. A movable screw 603, a hydraulic rod 604, a vacuum pump 605, an air pipe 606, and a suction cup 607 are included. A movable motor 602 is inserted inside the placement base 601. One end of the movable motor 602 is fitted with a movable screw 603. The hydraulic rod 604 is slidably connected inside the placement base 601. A threaded hole is provided on one side of the hydraulic rod 604, through which the movable screw 603 passes, allowing the hydraulic rod 604 to slide within the placement base 601. A vacuum pump 605 is inserted into the upper surface of the hydraulic rod 604. The vacuum pump 605 is a device or equipment that uses mechanical, physical, chemical, or physicochemical methods to evacuate a container to obtain a vacuum. One end of the vacuum pump 605 is connected to an air pipe 606. The hydraulic rod 604... A suction cup 607 is inserted into the lower surface, and one end of the air pipe 606 is fitted with a suction cup 607. The suction cups 607 are located at the four corners of the placement hydraulic rod 604. A transition tube is inserted between the suction cups 607. A storage slot is opened on one side of the placement seat 601. During use, the operator puts the semiconductor chip 4 into the storage slot of the placement seat 601. The moving motor 602 drives the moving screw 603 to rotate, causing the placement hydraulic rod 604 to move within the placement seat 601. The placement hydraulic rod 604 moves the suction cups 607 downwards, and the suction cups 607 suck up the four corners of the semiconductor chip 4. The vacuum pump 605 is turned on to suck away the air in the suction cups 607 through the air pipe 606 and the transition tube, so that the semiconductor chip 4 is firmly adsorbed. The placement hydraulic rod 604 moves the semiconductor chip 4 above the mold 3, placing the semiconductor chip 4 into the mold 3. The vacuum pump 605 then shuts off the vacuum, allowing the placement hydraulic rod 604 to return and pick up the next semiconductor chip 4. This achieves convenient and quick movement and placement of the semiconductor chip 4, making the operation simpler and more precise. It reduces the potential damage to the semiconductor chip 4 caused by manual loading, thus minimizing impact on product quality. The transmission motor 202 within the fixed base 201 drives the drive shaft 203 to rotate, causing the driven shaft 205 within the docking base 206 to also rotate. This allows the semiconductor chip 4 within the mold 3 to be transported via the conveyor belt 204, achieving convenient and quick transport of the semiconductor chip 4.This improves processing efficiency and continuity, thereby reducing the instability and deviation of mold 3.

[0019] like Figures 5 to 7 As shown, in this embodiment, a fixing frame 7 is inserted into the upper surface of the equipment base plate 1, and a nozzle 8 is inserted into the lower surface of the fixing frame 7. A feed pipe 9 is inserted into one side of the nozzle 8, and a feed assembly 10 is sleeved at one end of the feed pipe 9. The feed assembly 10 includes a feed box 101, a feed cover plate 102, a rotary motor 103, a stirring shaft 104, and a feed water pump 105. The feed cover plate 102 is inserted into the upper surface of the feed box 101, and the rotary motor 103 is inserted into the inside of the feed cover plate 102. One end of the rotary motor 103... A stirring shaft 104 is fitted onto the feed box 101, and a feed water pump 105 is inserted inside the feed box 101. A feeding pipe is inserted into the upper surface of the feed box 101. A shaping assembly 11 is inserted into the upper surface of the equipment base plate 1. The shaping assembly 11 includes a support frame 801, a shaping hydraulic rod 802, a pressure plate 803, and a heating plate 804. The shaping hydraulic rod 802 is inserted into the lower surface of the support frame 801, the pressure plate 803 is fitted onto the lower surface of the shaping hydraulic rod 802, and the heating plate 804 is inserted into the lower surface of the pressure plate 803. During use... The resin is added to the feed tank 101 by the staff through the feeding pipe. The rotating motor 103 drives the stirring shaft 104 to rotate and stir the resin in the feed tank 101. The feeding water pump 105 draws the resin from the feeding pipe 9 into the nozzle 8, and the resin is sprayed into the moving mold 3 through the nozzle 8 to coat the semiconductor chip 4 with resin. This achieves convenient and quick addition and spraying of resin, and facilitates stirring of the resin in the feed tank 101, thereby reducing the resin separation caused by prolonged lack of stirring, which affects the quality of the sprayed resin. It also reduces the inaccuracy of spraying amount when manually spraying. The mold 3 is moved by the conveyor belt 204 and heated by the heating plate 804. The shaping hydraulic rod 802 moves the pressure plate 803 downward, so that the pressure plate 803 enters the mold 3 for pressing and shaping. This achieves convenient and quick pressing and shaping of resin, maintains uniform pressing force, and ensures that the resin coating is just right, thereby reducing the possibility of resin being squeezed out when manually pressing and shaping.

[0020] The working principle of this practical application is as follows: During use, the operator places the semiconductor chip 4 into the storage slot of the placement seat 601. The moving motor 602 rotates the moving screw 603, causing the placement hydraulic rod 604 to move within the placement seat 601. The suction cups 607 hold the four corners of the semiconductor chip 4, and the placement hydraulic rod 604 moves the semiconductor chip 4 above the mold 3, placing it into the mold 3. The conveyor motor 202 within the fixed base 201 rotates the drive shaft 203, causing the semiconductor chip 4 within the mold 3 to move via the conveyor belt 204. The process involves workers adding resin into the feed tank 101 via the feeding pipe. A rotary motor 103 rotates the stirring shaft 104 to stir the resin in the feed tank 101. A water pump 105 draws the resin from the feed pipe 9 into the nozzle 8, which sprays the resin into the moving mold 3 to coat the semiconductor chip 4. The mold 3 is then moved by the conveyor belt 204 and heated by the heating plate 804. The shaping hydraulic rod 802 moves the pressure plate 803 downward, causing the pressure plate 803 to be inserted into the mold 3 for pressing and shaping.

[0021] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0022] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A resin coating device for a high-frequency high-temperature resistant sensing magnetic ring, comprising a device base plate (1), characterized in that: A conveying assembly (2) is inserted into the upper surface of the equipment base plate (1). A mold (3) is inserted into the upper surface of the conveying assembly (2). A semiconductor chip (4) is provided inside the mold (3). A magnetic ring (5) is provided inside the semiconductor chip (4). A placement assembly (6) is inserted into the upper surface of the equipment base plate (1). A fixing frame (7) is inserted into the upper surface of the equipment base plate (1). A nozzle (8) is inserted into the lower surface of the fixing frame (7). A feed pipe (9) is inserted into one side of the nozzle (8). A feed assembly (10) is sleeved at one end of the feed pipe (9). A shaping assembly (11) is inserted into the upper surface of the equipment base plate (1).

2. The resin coating device of a high-frequency resistant high-temperature sensing magnetic ring according to claim 1, characterized in that: The conveying assembly (2) includes a fixed base (201), a conveying motor (202), a drive shaft (203), a conveyor belt (204), a driven shaft (205), and a docking seat (206). The conveying motor (202) is inserted into the fixed base (201). The drive shaft (203) is sleeved at one end of the conveying motor (202). The conveyor belt (204) is sleeved on the surface of the drive shaft (203). The driven shaft (205) is provided inside the conveyor belt (204). The docking seats (206) are sleeved at both ends of the driven shaft (205).

3. The resin coating device for a high-frequency, high-temperature resistant sensing magnetic ring according to claim 1, characterized in that: The placement assembly (6) includes a placement seat (601), a moving motor (602), a moving screw (603), a placement hydraulic rod (604), a vacuum pump (605), an air pipe (606), and a suction cup (607). The moving motor (602) is inserted inside the placement seat (601), and the moving screw (603) is sleeved on one end of the moving motor (602). The placement hydraulic rod (604) is slidably connected inside the placement seat (601). The vacuum pump (605) is inserted into the upper surface of the placement hydraulic rod (604), and the air pipe (606) is inserted into one end of the vacuum pump (605). The suction cup (607) is inserted into the lower surface of the placement hydraulic rod (604).

4. The resin coating device of a high-frequency resistant high-temperature sensing magnetic ring according to claim 3, characterized in that: A threaded hole is provided on one side of the hydraulic rod (604), and the movable screw (603) passes through the threaded hole to allow the hydraulic rod (604) to slide within the mounting base (601).

5. The resin coating device for a high-frequency, high-temperature resistant sensing magnetic ring according to claim 3, characterized in that: A storage slot is provided on one side of the placement seat (601), and a suction cup (607) is sleeved on one end of the air pipe (606).

6. The resin coating device for a high-frequency, high-temperature resistant sensing magnetic ring according to claim 3, characterized in that: The suction cups (607) are located at the four corners where the hydraulic rods (604) are placed, and a transition tube is inserted between the suction cups (607).

7. The resin coating device for a high-frequency, high-temperature resistant sensing magnetic ring according to claim 1, characterized in that: The feeding assembly (10) includes a feeding box (101), a feeding cover plate (102), a rotary motor (103), a stirring shaft (104), and a feeding water pump (105). The feeding cover plate (102) is inserted into the upper surface of the feeding box (101). The rotary motor (103) is inserted into the inside of the feeding cover plate (102). The stirring shaft (104) is sleeved at one end of the rotary motor (103). The feeding water pump (105) is inserted into the inside of the feeding box (101).

8. The resin coating device for a high-frequency, high-temperature resistant sensing magnetic ring according to claim 1, characterized in that: The shaping component (11) includes a support frame (801), a shaping hydraulic rod (802), a pressure plate (803), and a heating plate (804). The lower surface of the support frame (801) is inserted with the shaping hydraulic rod (802), the lower surface of the shaping hydraulic rod (802) is sleeved with the pressure plate (803), and the lower surface of the pressure plate (803) is inserted with the heating plate (804).

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