Mini LED display module and display

Abstract

The utility model discloses a kind of Mini LED display module and display, it is related to Mini LED display module technical field.The Mini LED display module includes glass backplane, Mini LED lamp bead and panel assembly, the panel assembly is laminated in the surface of the glass backplane, the surface of the glass backplane close to the panel assembly is equipped with mounting groove and circuit slot, the Mini LED lamp bead is installed in the mounting groove, the circuit slot is equipped with conductive circuit, and the conductive circuit is used to power supply to the Mini LED lamp bead.Through glass backplane replaces traditional metal or PCB material, reduce module thickness and weight, simultaneously utilize the thermal expansion coefficient similar to glass and Mini LED chip to reduce thermal stress, with the advantages of light and thin structure, high thermal reliability and simple assembly process.

Description

Technical Field

[0001] This utility model belongs to the field of Mini LED display module technology, and in particular relates to a Mini LED display module and display. Background Technology

[0002] Mini LED, as an emerging display technology, is widely used in high-end TVs, monitors, automotive displays and other fields due to its advantages such as high brightness, high contrast, wide color gamut and long lifespan.

[0003] Traditional Mini LED display modules typically use metal (such as aluminum) or printed circuit boards (PCBs) as the backplane. Mini LED chips are mounted on the backplane using surface mount technology (SMT), and a metal or plastic frame structure is used to secure the display panel (such as an LCD panel) and optical films. This traditional structure has the following inherent drawbacks: 1. Thickness and weight: The mid-frame structure itself occupies space, limiting the development of thinner and lighter modules.

[0004] 2. Poor thermal reliability: The thermal expansion coefficients of metal or PCB materials and Mini LED chips differ significantly, which can generate thermal stress during temperature cycling, leading to solder joint fatigue, circuit breakage, and affecting the long-term reliability of the module.

[0005] 3. Complex assembly process: The installation of the middle frame requires additional screws or clips, which increases the assembly steps and production costs, and reduces efficiency. Summary of the Invention

[0006] The technical problem to be solved by this utility model is to provide a Mini LED display module and display, which addresses the problems of large thickness and weight, poor thermal reliability and complex assembly process of existing Mini LED display modules.

[0007] To address the aforementioned problems, this utility model provides a Mini LED display module, the technical solution of which is as follows: It includes a glass backplate, Mini LED beads, and a panel assembly. The panel assembly is stacked on one surface of the glass backplate. The surface of the glass backplate near the panel assembly has a mounting groove and a wiring groove. The Mini LED beads are installed in the mounting groove, and conductive wires are arranged in the wiring groove to supply power to the Mini LED beads.

[0008] Furthermore, this application also proposes that the panel assembly includes a light guide plate, a film, and a display panel stacked together, with the light guide plate stacked on the surface of the glass back plate.

[0009] Furthermore, this application also proposes that the Mini LED display module further includes an adhesive, the outer edge of the display panel extends beyond the outer edge of the light guide plate and the film, and the display panel is attached to the glass back plate by the adhesive.

[0010] Furthermore, this application also proposes that the Mini LED display module further includes textured tape, which is adhered to the glass backplate and the outer edge sidewall of the panel assembly.

[0011] Furthermore, this application also proposes that the Mini LED display module further includes a decorative film, which is attached to the surface of the glass backplate away from the panel assembly, and the decorative film is printed with an aesthetic pattern.

[0012] Furthermore, this application also proposes that the glass backing plate be a soda-lime glass backing plate or an aluminosilicate glass backing plate.

[0013] On the other hand, this utility model embodiment provides a display, including a front frame, a rear shell, and the aforementioned MiniLED display module. The front frame and the rear shell can be assembled and connected to form a mounting cavity, and the MiniLED display module is installed inside the mounting cavity.

[0014] Furthermore, this application also proposes that the display further includes a protective cover, which is installed in the mounting cavity and has a receiving cavity, and the glass back plate is installed in the receiving cavity.

[0015] Furthermore, this application also proposes that the display further includes a circuit board mounted on the side of the protective cover away from the glass backplate, and the circuit board is electrically connected to conductive lines.

[0016] The Mini LED display module and display provided in this embodiment of the present invention have at least the following advantages compared with the prior art: The Mini LED display module includes a glass backplate, Mini LED chips, and a panel assembly. The panel assembly is stacked on one surface of the glass backplate. The surface of the glass backplate near the panel assembly is provided with a mounting groove and a wiring groove. The Mini LED chips are installed in the mounting groove, and conductive lines are arranged in the wiring groove. The conductive lines are used to supply power to the Mini LED chips. By replacing traditional metal or PCB materials with a glass backplate, the thickness and weight of the module are reduced. At the same time, the thermal expansion coefficient of glass is similar to that of Mini LED chips to reduce thermal stress. It has the advantages of thin and light structure, high thermal reliability, and simple assembly process. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a display provided in one embodiment of the present invention; Figure 2 for Figure 1 A sectional view of section AA; Figure 3 for Figure 1 Sectional views of sections BB, CC, and DD; Figure 4 This is a partial structural diagram of a display provided in one embodiment of the present invention. Figure 1 ; Figure 5 for Figure 4 Enlarged view of region A in the image; Figure 6 This is a partial structural diagram of a display provided in one embodiment of the present invention. Figure 2 ; Figure 7 for Figure 6 Enlarged view of region B in the image; Figure 8 This is a partial structural diagram of a display provided in one embodiment of the present invention. Figure 3 ; Figure 9 This is a schematic diagram of the structure of the glass back panel of a display provided in one embodiment of the present invention.

[0019] The reference numerals in the accompanying drawings are as follows: 100-Mini LED display module, 110-Glass backplate, 111-Mounting slot, 112-Cable slot, 120-Mini LED beads, 130-Panel assembly, 131-Light guide plate, 132-Film, 133-Display panel, 140-Adhesive, 150-Textured tape, 160-Decorative film, 200-Front frame, 300-Back cover, 400-Protective cover, 500-Circuit board. Detailed Implementation

[0020] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] In existing technologies, Mini LED display modules 100 generally use metal or printed circuit boards 500 as the backplane material, fix the LEDs using surface mount technology, and rely on the mid-frame structure to fix the display panel 133. This type of structure has problems such as excessive thickness and weight, solder joint fatigue due to differences in thermal expansion coefficients, and complex assembly processes, which restrict the development of thinner and lighter display devices and their long-term reliability.

[0024] To address the aforementioned issues, and considering the mismatch in thermal expansion coefficients between traditional backplane materials and LED chips, it is necessary to find an alternative material with good thermal stability. Simultaneously, eliminating the mid-frame structure to simplify the module hierarchy becomes a key breakthrough direction. Research into the physical properties of glass reveals that its thermal expansion coefficient is close to that of Mini LED chips, effectively reducing stress caused by temperature changes. Further consideration is given to directly fabricating functional structures on the glass substrate, achieving an integrated design of circuit integration and LED chip positioning.

[0025] Therefore, please refer to Figures 1 to 9 This application proposes a display module including a glass back plate 110, Mini LED beads 120 and a panel assembly 130. The panel assembly 130 is stacked on the surface of the glass back plate 110. The surface of the glass back plate 110 near the panel assembly 130 has a mounting groove 111 and a wiring groove 112. The LED beads are mounted in the mounting groove 111, and conductive lines are laid in the wiring groove 112 for power supply.

[0026] Please refer to Figure 2 and Figure 9 The glass backplate 110 refers to a substrate made of inorganic glass material, specifically soda-lime glass or aluminosilicate glass, whose coefficient of thermal expansion matches that of the Mini LED chip. The mounting groove 111 is a recessed structure for positioning the LED chips, specifically formed by chemical etching or laser engraving, with a depth adapted to the height of the LED chips. The wiring groove 112 is a channel structure for accommodating conductive lines, specifically processed simultaneously with the mounting groove 111, with its width determined by the cross-sectional area of ​​the wiring. The conductive lines refer to a network of metal wires, specifically formed using sputtered copper plating or printed silver paste processes to achieve low-impedance power supply connections. The panel assembly 130 is a composite structure including a light guide layer and a display layer, specifically bonded to the glass backplate 110 through a lamination process.

[0027] Specifically, the glass backplate 110 serves as the substrate, and mounting grooves 111 and wiring grooves 112 are formed through an etching process. Conductive wiring is laid within the wiring grooves 112 and then connected to the LED electrodes within the mounting grooves 111, forming a complete circuit. The panel assembly 130 is directly stacked on the surface of the glass backplate 110, achieving optical coupling through physical contact. The depth control of the mounting grooves 111 maintains a predetermined distance between the LED light-emitting surface and the light guide plate 131, ensuring uniform light diffusion. The routing design of the wiring grooves 112 avoids cross-interference with the mounting grooves 111 and shortens the power supply path.

[0028] Compared to existing technologies, the glass backplate 110 replaces metal or PCB materials, reducing the difference in thermal expansion coefficient between it and the Mini LED chip by approximately 50%, significantly reducing stress caused by temperature cycling. The integrated processing of the mounting groove 111 and the wiring groove 112 eliminates the traditional mid-frame structure, reducing the module thickness by approximately 30%. Conductive lines are directly embedded in the glass substrate, avoiding the risk of interlayer connection failure associated with traditional flexible circuit boards 500.

[0029] Through the above technical solutions, this application achieves a frameless integrated structure for the display module, reducing overall weight and improving thermal reliability. The improved thermal matching between the glass substrate and the LED chips extends solder joint life, while the precise positioning of the slot structure enhances luminous efficacy consistency. The embedded conductive circuit design simplifies assembly processes, reducing production complexity and material costs.

[0030] Please see Figures 2 to 3 This application further proposes that the panel assembly 130 includes a light guide plate 131, a film 132 and a display panel 133 stacked together, with the light guide plate 131 stacked on the surface of the glass back plate 110.

[0031] The light guide plate 131 is an optical element used to convert a point light source into a surface light source. It can be injection molded from acrylic or polycarbonate materials, and its surface can be configured with microstructures to optimize the light propagation path. The diaphragm 132 is a functional laminated structure composed of multiple optical films, specifically a combination of diffusion films, brightness enhancement films, or prism films, used to improve display brightness and uniformity. The display panel 133 is a device used for image display, specifically a liquid crystal display panel 133 or an organic light-emitting diode panel, with backlighting provided by the light guide plate 131 to achieve image output.

[0032] Specifically, the light guide plate 131 is directly stacked on the surface of the glass back plate 110, achieving light transmission through physical contact. The diaphragm 132 is sequentially stacked between the light guide plate 131 and the display panel 133 to form optical coupling. The glass back plate 110 serves as a rigid support substrate, and the mounting grooves 111 and wiring grooves 112 on its surface form spatial isolation from the coverage area of ​​the light guide plate 131, preventing interference between optical components and conductive lines. The light guide plate 131, diaphragm 132, and display panel 133 form an integrated structure through interlayer bonding, eliminating the need for external frame fixation.

[0033] Compared with existing technologies, traditional solutions require a metal or plastic mid-frame to separately fix the light guide plate 131, the film 132, and the display panel 133, resulting in increased module thickness and complex assembly processes. This solution eliminates the space and weight occupation of the mid-frame structure by directly stacking the light guide plate 131 and the glass back plate 110, while utilizing the rigidity of the glass back plate 110 to replace the supporting function of the mid-frame.

[0034] Through the above technical solutions, this application achieves an integrated design of internal optical components and structural parts of the display module, reducing the number of parts and simplifying the assembly process. The direct contact between the light guide plate 131 and the glass back plate 110 improves heat dissipation efficiency and avoids deformation problems caused by the difference in thermal expansion coefficients between the metal frame and the glass material. The self-supporting characteristics of the stacked structure reduce the module's dependence on external fixing structures, which is beneficial for achieving ultra-thin display devices.

[0035] Please see Figure 2 This application further proposes that the Mini LED display module 100 also includes an adhesive 140, the outer edge of the display panel 133 extends beyond the outer edge of the light guide plate 131 and the film 132, and the display panel 133 is attached to the glass back plate 110 by the adhesive 140.

[0036] The adhesive component 140 refers to the fixing component used to bond the display panel 133 to the glass back plate 110. Specifically, it can be achieved by using double-sided tape or optically transparent adhesive, replacing the traditional mechanical fixing structure with adhesive bonding, thus avoiding the introduction of additional mid-frame components.

[0037] Wherein, the outer edge of the display panel 133 extends beyond the outer edge of the light guide plate 131 and the film 132, meaning that the circumferential edge area of ​​the display panel 133 extends to the outside of the light guide plate 131 and the film 132 in the stacking direction. Specifically, this can be achieved by adjusting the size or stacking position of the display panel 133, providing sufficient bonding area for the adhesive 140, while avoiding obstruction or compression of the optical areas of the light guide plate 131 and the film 132.

[0038] Specifically, after the light guide plate 131, the film 132, and the display panel 133 are stacked on the surface of the glass back plate 110, the circumferentially extended portion of the display panel 133 directly contacts the surface of the glass back plate 110 and is fixed by the adhesive 140. Since the outer edge of the display panel 133 extends beyond the light guide plate 131 and the film 132, the bonding area of ​​the adhesive 140 is limited to between the display panel 133 and the glass back plate 110, eliminating the need for an additional mid-frame structure. Therefore, the fixing process of the display panel 133 does not rely on screws or clips, simplifying the assembly steps and avoiding the increase in thickness caused by the mid-frame structure.

[0039] Compared to existing technologies, traditional solutions require the display panel 133 to be fixed by a mid-frame structure, resulting in increased module thickness and weight, and the installation of the mid-frame requires complex mechanical connection steps. This solution, however, directly eliminates the mid-frame structure by adhesively fixing the display panel 133 to its outer extension area, reducing the overall module thickness, simplifying the assembly process, and reducing the structural stress risk caused by the difference in thermal expansion coefficients between the mid-frame and the glass backplate 110.

[0040] Through the above technical solution, this application realizes the direct fixing of the display panel 133 and the glass back plate 110, eliminates the limitation of the middle frame structure on the module's thinness, reduces the assembly complexity, and avoids the risk of circuit breakage caused by the difference in thermal expansion coefficients between the middle frame and the glass back plate 110, thereby improving the long-term reliability of the module.

[0041] Please see Figure 3 , Figure 6 and Figure 7 This application further proposes that the Mini LED display module 100 also includes a textured tape 150, which is adhered to the outer edge sidewall of the glass back plate 110 and the panel assembly 130.

[0042] The textured tape 150 refers to an adhesive material layer with a textured surface, which can be achieved using pressure-sensitive tape or hot melt tape. The surface texture increases the friction with the contact surface. The outer edge sidewalls of the glass backplate 110 and the panel assembly 130 refer to the edge areas formed after the module is assembled. Specifically, a smooth bonding surface can be formed by laser cutting or machining.

[0043] Specifically, textured tape 150 is applied to the outer edge sidewalls of the laminated glass backplate 110 and panel assembly 130, covering the entire edge area of ​​the module. During assembly, the textured tape 150 is tightly bonded to the sidewalls of the glass backplate 110 and panel assembly 130 through hot or cold pressing processes, forming a continuous wrapping structure. This structure replaces the traditional mechanical fixing method of the mid-frame, eliminating the need for screws or clips, while the adhesive force of the tape itself restricts the displacement of each component layer in the edge area.

[0044] Compared to existing technologies, traditional modules rely on metal or plastic frames to fix the edges, requiring additional processing of the frame structure and adding assembly steps. This solution, however, uses textured tape 150 to directly adhere to the edges, reducing the number of independent frame components and avoiding stress concentration issues caused by the difference in thermal expansion coefficients between the frame and the glass back panel 110.

[0045] Through the above technical solution, this application achieves rapid fixation of the module edges, reduces assembly complexity, and avoids the negative impact of the mid-frame structure on the module thickness and weight. The continuous application of textured tape 150 further enhances the sealing of the edge area, preventing external dust or moisture from entering the module.

[0046] Please see Figure 8 This application further proposes attaching a decorative film 160 to the surface of the glass backplate 110 opposite to the panel assembly 130, the decorative film 160 being printed with an aesthetic pattern.

[0047] The decorative film 160 refers to a flexible thin film material covering the outer surface of the glass back panel 110. Specifically, it can be made of polyester film or polycarbonate film, and its surface is patterned by screen printing or digital printing. The decorative film 160 is bonded to the glass back panel 110 with optical adhesive or pressure-sensitive adhesive, which achieves aesthetic enhancement without affecting the mechanical strength of the back panel.

[0048] Specifically, the decorative film 160 is attached to the outer surface of the glass back panel 110, which faces the surface of the mounting panel assembly 130. The pattern layer of the decorative film 160 may include brand logos, textures, or gradient colors, and is formed directly on the film surface through a printing process. During the application process, the edges of the decorative film 160 are aligned with the contours of the glass back panel 110 to avoid bubbles or wrinkles. Thus, while fulfilling its display function, the exposed surface of the glass back panel 110 is visually enhanced through the decorative film 160, without the need for additional external decorative structures.

[0049] Compared to existing technologies, the outer surface of the metal or PCB backplate of traditional display modules is usually a single metallic color or green, lacking decorative design. To achieve an aesthetically pleasing appearance, a plastic cover or spray coating needs to be added to the outside of the backplate, resulting in increased structural thickness and process complexity. This solution directly attaches a printed decorative film 160 to the glass backplate 110, maintaining the module's thin and light characteristics while avoiding additional assembly steps.

[0050] Through the above technical solution, this application solves the problem of the monotonous appearance of traditional display module back panels. Without changing the basic structure of the back panel, the product appearance can be customized through the 160 printing process of decorative film, while avoiding the increase in thickness or the complexity of assembly process caused by adding external decorative parts.

[0051] This application further proposes that the glass backing plate 110 is a soda-lime glass backing plate 110 or an aluminosilicate glass backing plate 110.

[0052] Among them, the soda-lime glass backplate 110 refers to a glass material with silicon dioxide, sodium oxide and calcium oxide as the main components. Specifically, it can be prepared by float glass process to achieve high flatness and surface smoothness. Its coefficient of thermal expansion is close to that of Mini LED chip, which can reduce the stress caused by temperature changes.

[0053] Among them, the aluminosilicate glass backplate 110 refers to a glass material containing alumina and silicon dioxide. Specifically, it can be chemically strengthened to improve mechanical strength. Its high temperature resistance and deformation resistance are better than ordinary glass, and it can meet the heat dissipation requirements of high-power Mini LEDs.

[0054] Specifically, the soda-lime glass backplate 110 or aluminosilicate glass backplate 110 matches the thermal expansion coefficient of the Mini LED beads 120 through material properties, reducing interface stress during temperature cycling and preventing solder joint cracking or circuit breakage. The soda-lime glass uses a float glass process to create a smooth surface, ensuring precise contact between the conductive lines and the mounting groove 111; the aluminosilicate glass is chemically strengthened to improve bending strength, reducing the risk of breakage of the glass backplate 110 during assembly or transportation. By replacing traditional metal or PCB with glass, an additional mid-frame structure is unnecessary; the mounting groove 111 and circuit groove 112 are directly formed through etching, simplifying the overall module thickness.

[0055] Compared to existing technologies, traditional metal or PCB backplanes suffer from thermal stress accumulation due to differences in their coefficients of thermal expansion. Sodium-calcium glass or aluminosilicate glass, however, have coefficients of thermal expansion closer to those of Mini LED chips, reducing the risk of interface failure. Metal backplanes require a mid-frame to fix the panel assembly 130, while the glass backplane 110 directly supports the optical film 132 and the display panel 133 through an integrated structure, reducing the number of components. Aluminosilicate glass also boasts superior mechanical strength compared to ordinary glass, avoiding the fragility issues associated with traditional glass.

[0056] Through the above technical solutions, this application solves the reliability problem caused by the mismatch of thermal expansion coefficients in traditional backplanes. At the same time, it reduces the overall weight of the module by using lightweight materials and utilizes the machinability of glass to achieve the integrated design of the mounting groove 111 and the wiring groove 112, simplifying the assembly process.

[0057] Please see Figure 1 and Figure 2 This application further proposes a display including a front frame 200, a rear shell 300, and a Mini LED display module 100, wherein the front frame 200 and the rear shell 300 can be assembled and connected to form a mounting cavity, and the Mini LED display module 100 is installed inside the mounting cavity.

[0058] The front frame 200 refers to the frame structure at the front of the monitor that supports the display area. It can be made of metal alloy or high-strength plastic and is connected to the rear shell 300 by snap-fit ​​or threaded connection.

[0059] Among them, the back shell 300 refers to the shell structure on the back of the display used to enclose the internal components. Specifically, it can be made of lightweight materials that are injection molded or stamped, forming a mechanical locking structure with the front frame 200.

[0060] The mounting cavity refers to the enclosed space formed by the assembly of the front frame 200 and the rear shell 300. Specifically, the cavity can be sealed by edge sealing strips or concave-convex interlocking structures to fix the display module and isolate it from the external environment.

[0061] Specifically, the front frame 200 and the rear shell 300 form a mounting cavity through a detachable connection, such as using a snap-fit ​​and positioning post structure, eliminating the need for additional fasteners during assembly. The Mini LED display module 100 is directly embedded inside the mounting cavity, and the glass back panel 110 contacts the inner wall of the mounting cavity through an elastic buffer pad to avoid rigid collisions. The size of the mounting cavity can be adjusted according to the module thickness, for example, by setting a limiting boss on the inner side of the cavity to constrain module displacement. During assembly, the mating edges of the front frame 200 and the rear shell 300 adopt a stepped interlocking design, eliminating the installation gap required by traditional mid-frames.

[0062] Compared to existing technologies, traditional displays rely on a metal frame to fix the display module, requiring multiple screw fixing points between the back panel and the frame. This solution, however, directly forms a mounting cavity between the front frame 200 and the rear shell 300, eliminating the need for a separate frame structure and reducing the number of components. In existing technologies, the difference in thermal expansion between the module and the frame can easily lead to deformation, while the elastic contact between the glass back panel 110 and the mounting cavity can alleviate thermal stress concentration.

[0063] Through the above technical solution, this application solves the problems of increased thickness and assembly complexity caused by the mid-frame structure of traditional displays. It achieves stable fixation of the module through an integrated mounting cavity, reduces the impact of assembly tolerances between components on the display effect, and reduces material consumption in the production process.

[0064] Please see Figure 2 , Figures 4 to 7 The present application further proposes that the display also includes a protective cover 400, which is installed in the mounting cavity and has a receiving cavity, and the glass back plate 110 is installed in the receiving cavity.

[0065] The protective cover 400 refers to the protective structure covering the Mini LED display module 100. It can be made of stamped metal or injection-molded plastic, and its edges can be equipped with snap-fit ​​structures or threaded holes to connect with the sidewall of the mounting cavity. The receiving cavity refers to the recessed space formed inside the protective cover 400, which can be formed by injection molding or machining. Its depth and contour dimensions match the glass backplate 110 to achieve a positioning function. The glass backplate 110 is installed in the receiving cavity, meaning the backplate is embedded in the recessed area of ​​the protective cover 400. It can be fixed using mounting brackets, positioning pins, or cushioning pads to form a stable support structure inside the display.

[0066] Specifically, the protective cover 400 is secured to the mounting cavity formed by the front frame 200 and the rear shell 300 via clips or screws. The recessed receiving cavity inside the cover is adapted to the thickness and shape of the glass back panel 110. During assembly, the glass back panel 110 is directly embedded into the recessed area of ​​the receiving cavity, and precise positioning is achieved through the engagement of the positioning pin holes with the raised structure of the protective cover 400. This structure eliminates the screw fixing process required by traditional mid-frames. A thermally conductive silicone layer can be provided on the contact surface between the glass back panel 110 and the protective cover 400 to transfer heat, while the cushioning material can absorb the impact of mechanical vibration on the glass back panel 110.

[0067] Compared to existing technologies, traditional displays use a metal frame to fix the glass back panel 110 with multiple sets of screws, which requires precise control of the screw tightening torque and poses a risk of thermal stress concentration. This solution integrates the fixing function of the glass back panel 110 into the structure of the protective cover 400 through the integrated design of the protective cover 400 and the receiving cavity. This reduces the number of independent frame components, and the back panel can be fixed with only a single positioning operation during assembly, effectively avoiding the risk of glass breakage caused by multiple assembly steps.

[0068] Through the above technical solution, this application solves the problem of low assembly efficiency caused by the complex frame structure of traditional displays. The integrated design of the protective cover 400 and the receiving cavity enables the rapid positioning and installation of the glass back plate 110. At the same time, the rigid structure of the protective cover 400 is used to disperse mechanical stress and improve the reliability of the display module in a vibration environment.

[0069] Please see Figure 2 This application further proposes that the display also includes a circuit board 500, which is mounted on the side of the protective cover 400 away from the glass back plate 110, and the circuit board 500 is electrically connected to conductive lines.

[0070] In this context, circuit board 500 refers to a substrate with conductive lines, which can be implemented using a flexible circuit board 500 or a rigid circuit board 500, and is used to provide drive signals and power transmission functions. Protective cover 400 refers to a structural component covering the outside of the mounting cavity, which can be injection molded from aluminum alloy or ABS plastic, and is used to form a receiving cavity and support circuit board 500. Electrical connection refers to achieving electrical conduction through a conductive medium, which can be implemented using soldering, plug-in terminals, or conductive tape, and is used to establish a signal transmission path between circuit board 500 and the conductive lines.

[0071] Specifically, the circuit board 500 is fixed to the outside of the protective cover 400 and is electrically connected to the conductive lines in the wiring groove 112 of the glass back plate 110 via wires or connectors. The receiving cavity structure of the protective cover 400 spatially isolates the glass back plate 110 from the circuit board 500, preventing the heat generated by the circuit board 500 from causing thermal interference to the display module. The connection points between the conductive lines and the circuit board 500 can be located in the edge area of ​​the protective cover 400, and cross-area wiring can be achieved through perforations or side wall slots.

[0072] In some specific embodiments, the thickness of the protective cover 400 can be 0.5-2 mm, and positioning posts can be provided on its outer surface. Positioning holes are opened at corresponding positions on the circuit board 500 to achieve assembly. The connection between the conductive lines and the circuit board 500 can be achieved using a gold wire bonding process. For example, a solder pad area is provided at the edge of the glass back plate 110, and the connection is made to the copper foil lines of the circuit board 500 by thermoforming.

[0073] Compared to existing technologies, traditional solutions integrate the driving circuitry inside the metal backplate, resulting in increased backplate thickness and obstructed heat dissipation. This solution externalizes the circuit board 500 within the protective cover 400, maintaining a thin glass backplate 110 structure while utilizing the metal of the protective cover 400 as a heat dissipation carrier. Furthermore, the separate design of the circuit board 500 from the conductive lines reduces assembly difficulty, allowing for independent disassembly of the circuit board 500 during maintenance without affecting the main structure of the display module.

[0074] Through the above technical solution, this application solves the problems of thickness control difficulties and high maintenance complexity caused by the integration of traditional display driving circuits and back panels, realizes the independent layout of circuit modules, and improves the maintainability and thermal management efficiency of the display by utilizing the dual-support structure and heat dissipation function of the protective cover 400.

[0075] This application further proposes a method for fabricating a Mini LED display module 100, including the following steps: S10: Obtain the glass backplate 110 and etch a mounting groove 111 and a wiring groove 112 on one surface of the glass backplate 110.

[0076] The etching mounting groove 111 and the wiring groove 112 refer to the recessed areas formed on the surface of the glass backplate 110 through chemical etching or laser processing to accommodate the Mini LED beads 120 and the wiring channels for conductive lines. Specifically, hydrofluoric acid solution etching or ultraviolet laser etching processes can be used. This step reduces the module thickness by directly forming functional grooves on the glass substrate, replacing the traditional metal backplate and middle frame structure.

[0077] S20: Lay conductive lines in the mounting groove 111 and the wiring groove 112.

[0078] Laying conductive lines refers to depositing a conductive metal layer within the line groove 112 to form a power supply circuit. This can be achieved using vacuum evaporation, sputtering, or screen printing processes. The physical bonding between the conductive lines and the glass substrate avoids the thermal expansion differences between traditional PCB circuit boards and metal backplanes, thus improving thermal reliability.

[0079] S30: Install the Mini LED bead 120 into the mounting slot 111 and connect it to the conductive line.

[0080] Mini LED chips (50-200μm in size) are precisely mounted in slots within a glass backplate 110 using surface mount technology (SMT). The chips are connected to conductive circuitry using solder or conductive adhesive and then secured using a reflow soldering process.

[0081] S40: The panel assembly 130 is stacked and fixed to the surface of the glass back plate 110 where the mounting groove 111 and the wiring groove 112 are provided.

[0082] The stacked and fixed panel assembly 130 refers to sequentially attaching the light guide plate 131, the film 132, and the display panel 133 to the surface of the glass back plate 110, which can be achieved by optical adhesive lamination or hot pressing. By eliminating the middle frame structure and adopting a direct stacking method, the assembly process is simplified.

[0083] The specific steps are as follows: S41: The optical film 132 is laminated and bonded to the surface of the display panel 133 near the glass back plate 110; S42: The display panel 133 is attached to the glass back panel 110 via the adhesive 140.

[0084] Specifically, the manufacturing process begins with surface treatment of the glass backplate 110, using an etching process to form mounting grooves 111 and wiring grooves 112 of predetermined depths. Subsequently, copper or silver material is deposited within the wiring grooves 112 to form conductive lines, and Mini LED beads 120 are fixed to the mounting grooves 111 using soldering or conductive adhesive. Finally, the light guide plate 131, optical film 132, and display panel 133 are sequentially stacked on the surface of the glass backplate 110 and fixed using adhesive. Throughout the process, the glass backplate 110 simultaneously serves as structural support and wiring carrier, eliminating the need for an additional metal frame.

[0085] Compared to existing technologies, traditional manufacturing methods rely on a combination of a metal backplate and a PCB circuit board, requiring a mid-frame to fix the display panel 133, which increases module thickness and introduces thermal stress issues. This method employs an integrated glass backplate 110 structure, directly forming functional grooves through etching. This not only eliminates the space occupied by the mid-frame but also utilizes the similar thermal expansion coefficient of glass to Mini LED chips to reduce structural deformation caused by temperature changes. Furthermore, the conductive lines are directly integrated onto the glass substrate, avoiding assembly errors between the circuit board and the backplate in traditional SMT processes.

[0086] Through the above technical solutions, this application solves the problem of excessive thickness caused by the metal backplate and mid-frame structure of traditional Mini LED modules, and achieves module thinning through glass substrate and etching process; eliminates the difference in thermal expansion coefficient between metal backplate and PCB circuit board, improves the reliability of module under temperature cycling conditions; simplifies the assembly process of display panel 133 and backplate, reduces the use of screw fixing or buckle structure, and reduces production cost.

[0087] Furthermore, the method for manufacturing the Mini LED display module 100 also includes the following steps: S50: Textured tape 150 is attached to the outer edge sidewall of the glass backplate 110 and the panel assembly 130 to form an edge fixing structure.

[0088] Textured tape (such as acrylic tape with a grid pattern) is used to adhere the glass back panel 110 and the outer edge sidewalls of the panel assembly 130. The tape width is 5-15mm, and a certain amount of pressure is applied during application to ensure a strong bond.

[0089] S60: A decorative film 160 is attached to the surface of the glass back panel 110 opposite to the panel assembly 130.

[0090] On the back of the glass back panel 110, a patterned film (such as PET film) is pasted on according to customer requirements. The film is pre-patterned using a printing process and then adhered to the glass back panel 110 using an adhesive.

[0091] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A Mini LED display module, characterized in that, The device includes a glass backplate, Mini LED beads, and a panel assembly. The panel assembly is stacked on one surface of the glass backplate. The surface of the glass backplate near the panel assembly has a mounting groove and a wiring groove. The Mini LED beads are mounted in the mounting groove, and conductive wires are arranged in the wiring groove to supply power to the Mini LED beads.

2. The Mini LED display module of claim 1, wherein, The panel assembly includes a light guide plate, a film, and a display panel stacked together, with the light guide plate stacked on the surface of the glass back plate.

3. The Mini LED display module of claim 2, wherein, The Mini LED display module also includes an adhesive, the outer edge of the display panel extends beyond the outer edge of the light guide plate and the film, and the display panel is attached to the glass back plate by the adhesive.

4. The Mini LED display module according to claim 1, characterized in that, The Mini LED display module also includes textured tape, which is adhered to the glass backplate and the outer edge sidewall of the panel assembly.

5. The Mini LED display module of claim 1, wherein, The Mini LED display module also includes a decorative film, which is attached to the surface of the glass backplate facing away from the panel assembly, and the decorative film is printed with an aesthetic pattern.

6. The Mini LED display module of claim 1, wherein, The glass backing is either a soda-lime glass backing or an aluminosilicate glass backing.

7. A display, characterized by The device includes a front frame, a rear shell, and a MiniLED display module as described in any one of claims 1 to 6, wherein the front frame and the rear shell are assembled together to form a mounting cavity, and the MiniLED display module is mounted inside the mounting cavity.

8. The display of claim 7, wherein, The display also includes a protective cover, which is installed in the mounting cavity and has a receiving cavity, and the glass back plate is installed in the receiving cavity.

9. The display of claim 8, wherein, The display also includes a circuit board mounted on the side of the protective cover away from the glass backplate, and the circuit board is electrically connected to the conductive lines.

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