Optocoupler holder for increasing optocoupler isolation distance

Abstract

The utility model relates to a light coupling support technical field, especially a light coupling support for promoting light coupling insulation distance, the utility model discloses through adding the insulation enhancement subassembly on the input pin subassembly, the minimum spacing of first chip subassembly and second chip subassembly, the minimum spacing of first chip subassembly and output pin subassembly, the minimum spacing of input pin subassembly and second chip subassembly and the minimum spacing of input pin subassembly and output pin subassembly are systematically increased, break the fixed limit of traditional light coupling internal component relative position, the design expands the physical distance of key insulation path to above safety threshold under the premise of not changing chip layout and production mould, greatly improves the insulation withstand voltage strength, solves the problem of increased leakage current and signal crosstalk caused by insufficient insulation distance, significantly improves its reliability, solves the technical problem that the finished product light coupling insulation distance is short of the current light coupling support for producing light coupling.

Description

Technical Field

[0001] This utility model relates to the field of optocoupler bracket technology, and in particular to an optocoupler bracket for improving the insulation distance of optocouplers. Background Technology

[0002] In an optocoupler, the insulation distance is the shortest distance between the optocoupler signal input side and the optocoupler signal output side. If the optocoupler signal input side and the optocoupler signal output side are respectively an input pin assembly and an output pin assembly, and if a first chip assembly and a second chip assembly are respectively mounted on the base islands of the input pin assembly and the output pin assembly, where the first chip assembly converts electrical energy into light energy and the second chip assembly receives the light energy emitted by the first chip assembly and outputs electrical energy, then after packaging, there is a gap between the input pin assembly and the output pin assembly, and a gap between the input pin assembly and the second chip assembly. There is a gap between the first chip assembly and the output pin assembly. At this time, the insulation distance is the minimum value among these four distances. However, in the designed finished optocoupler, due to the design requirements of the optocoupler and the limitations of the molds already completed in the production process, the relative positions of the input pins, output pins, first chip assembly and second chip assembly inside the optocoupler are almost fixed. Therefore, it is difficult to change their insulation distance, which makes it difficult to further improve the insulation performance of the optocoupler and results in poor stability. Therefore, the optocoupler bracket currently used to produce this optocoupler cannot solve the defect of short insulation distance in the finished optocoupler. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides an optocoupler bracket for increasing the insulation distance of optocouplers, thus solving the technical problem that current optocoupler brackets used in optocoupler production struggle to achieve short insulation distances in finished optocouplers.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an optocoupler bracket for improving the insulation distance of optocouplers, comprising an IR bracket and a PT bracket. The IR bracket is provided with a plurality of input pin assemblies for mounting a first chip assembly. The PT bracket is provided with a plurality of output pin assemblies arranged in a sequentially opposite manner to the input pin assemblies. The output pin assemblies are used to mount a second chip assembly. The input pin assemblies are provided with insulation enhancement components to increase the minimum value among the following: the minimum distance between the first and second chip assemblies of the packaged optocoupler, the minimum distance between the first and output pin assemblies, the minimum distance between the input and second chip assemblies, and the minimum distance between the input and output pin assemblies.

[0005] Preferably, the input pin assembly includes several IR pins connected to external circuits, and an IR base island is provided in the package, with a bend between the IR base island and the IR pins.

[0006] Preferably, the insulation enhancement component is a chamfer located at the connection between the bent portion and the IR pin, near the side of the packaged output pin assembly.

[0007] Preferably, the chamfer is a rounded corner, and the radius of the rounded corner is greater than or equal to 0.25 mm.

[0008] Preferably, the insulation enhancement component is a mounting slot formed on the IR base island near the packaged output pin assembly.

[0009] By employing the above technical solution, this utility model provides an optocoupler bracket for increasing the insulation distance of optocouplers, which has at least the following beneficial effects: 1. This utility model systematically increases the minimum spacing between the first chip assembly and the second chip assembly, the minimum spacing between the first chip assembly and the output pin assembly, the minimum spacing between the input pin assembly and the second chip assembly, and the minimum spacing between the input pin assembly and the output pin assembly by adding an insulation enhancement component to the input pin assembly. This breaks through the limitation of the fixed relative positions of the internal components of the traditional optocoupler. Without changing the chip layout and production mold, this design extends the physical distance of the critical insulation path to above the safety threshold, significantly improves the insulation withstand voltage strength, solves the problem of increased leakage current and signal crosstalk caused by insufficient insulation distance, and significantly improves its reliability.

[0010] 2. To address the potential for tip discharge at the connection between the bent portion and the IR pin, this utility model provides a rounded corner structure with a radius greater than or equal to 0.25mm on the side near the output pin assembly, thereby increasing the insulation distance and thus improving the insulation withstand voltage strength.

[0011] 3. This utility model, by opening an installation slot on the IR base island and installing the first chip assembly in a sunken manner, directly expands the distance between the first chip assembly and the output pin assembly and the second chip assembly, thereby improving the insulation distance and the insulation withstand voltage strength of the product. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the IR bracket of this utility model; Figure 2 This utility model Figure 1 Enlarged view of point A in the middle; Figure 3 This utility model Figure 1 Enlarged view of point C in the middle; Figure 4 This is a schematic diagram of the PT bracket of this utility model.

[0013] In the diagram: 1. IR bracket; 2. PT bracket; 3. Input pin assembly; 31. IR pin; 32. IR base island; 33. Bending section; 4. Output pin assembly; 5. Insulation reinforcement assembly. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] To address the technical problem of short insulation distances in finished optocouplers due to the limitations of current optocoupler brackets used in optocoupler production, this invention provides an optocoupler bracket for increasing the insulation distance. The bracket includes an IR bracket 1 and a PT bracket 2. The IR bracket 1 has several input pin assemblies 3 for mounting a first chip assembly. The PT bracket 2 has several output pin assemblies 4 arranged in a sequentially opposite manner to the input pin assemblies 3. The output pin assemblies 4 are used to mount a second chip assembly. An insulation enhancement component 5 is provided on the input pin assemblies 3 to increase the minimum values ​​among the following: the minimum spacing between the first and second chip assemblies, the minimum spacing between the first and output pin assemblies 4, the minimum spacing between the input pin assemblies 3 and the second chip assembly, and the minimum spacing between the input pin assemblies 3 and the output pin assemblies 4 after packaging. The specific principle of increasing the insulation distance through the insulation enhancement component 5 is further described in detail below. To provide a clearer explanation, the structure of the input pin assembly 3 is first broken down. The input pin assembly 3 includes several IR pins 31 that connect to external circuits. An IR base island 32 is provided inside the package, and a bending portion 33 is provided between the IR base island 32 and the IR pins 31. At this time, the insulation enhancement component 5 is a chamfer located at the connection between the bending portion 33 and the IR pins 31, close to the side of the packaged output pin assembly 4. By setting this chamfer, the sharp part at the original corner is eliminated, thereby increasing the insulation distance. By rounding the corner, the thickness at the corner can be made uniform, and the purpose of increasing the insulation distance can also be achieved. Moreover, after testing, before rounding the corner, the maximum withstand voltage of the product is 5000V. When the radius of the rounded corner is greater than or equal to 0.25mm, the maximum withstand voltage of the product increases to at least 6500V, which greatly improves the performance of the product.

[0016] In addition, the insulation reinforcement component 5 can also be a mounting slot opened on the IR base island 32 near the packaged output pin assembly 4, thereby increasing the distance between the surface of the IR base island 32 and the PT bracket, thereby increasing the insulation distance and improving the insulation withstand voltage performance of the product.

[0017] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0018] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An optocoupler bracket for increasing the insulation distance of optocouplers, comprising an IR bracket (1) and a PT bracket (2), wherein the IR bracket (1) is provided with a plurality of input pin assemblies (3) for mounting a first chip assembly, and the PT bracket (2) is provided with a plurality of output pin assemblies (4) arranged in a manner opposite to the input pin assemblies (3), the output pin assemblies (4) being used to mount a second chip assembly, characterized in that, The input pin assembly (3) is provided with an insulation enhancement component (5) to increase the minimum value among the following: the minimum spacing between the first and second chip assemblies of the packaged optocoupler, the minimum spacing between the first chip assembly and the output pin assembly (4), the minimum spacing between the input pin assembly (3) and the second chip assembly, and the minimum spacing between the input pin assembly (3) and the output pin assembly (4).

2. The optocoupler bracket for increasing the insulation distance of optocouplers according to claim 1, characterized in that, The input pin assembly (3) includes several IR pins (31) connected to external circuits. An IR base island (32) is provided in the package, and a bend (33) is provided between the IR base island (32) and the IR pins (31).

3. The optocoupler bracket for increasing the insulation distance of optocouplers according to claim 2, characterized in that, The insulation enhancement component (5) is a chamfer located at the connection between the bent portion (33) and the IR pin (31) on the side near the packaged output pin assembly (4).

4. The optocoupler bracket for increasing the insulation distance of optocouplers according to claim 3, characterized in that, The chamfer is a rounded corner, and the radius of the rounded corner is greater than or equal to 0.25mm.

5. An optocoupler bracket for increasing the insulation distance of optocouplers according to claim 1, characterized in that, The insulation enhancement component (5) is a mounting slot opened on the IR base island (32) on the side near the packaged output pin assembly (4).

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