Processing carrier substrate
CN309218158SActive Publication Date: 2025-04-04TOKYO ELECTRON LTD
Patent Information
- Application Number
- CN202430460051.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-31
- Filing Date
- 2024-07-23
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2039-07-23
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product of this design: Processing carrier substrate. 2. Purpose of the product with this design: This product is a carrier for carrying, for example, multiple chips, semiconductor wafers, glass substrates, etc. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1. 5. Other matters requiring explanation Other explanations: Referring to FIG. 3 and the enlarged reference figure of part A, the part indicated by the oblique lines is transparent.
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Citation Information
Cited By
Carrier for holding an object
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